DeepCoolAI Launches 1.4MW Liquid-Cooled Load Bank for AI Factories

AI chips are running hotter than ever — as Microsoft notes in their recent article on microfluidic liquid cooling (collaborating with our friends at Corintis), which is just one part of their broader effort to optimize every layer of the stack in the data center. At Arieca, we’re addressing another layer of the stack with our LMEE (Liquid Metal Embedded Elastomer) TIM1 and TIM1.5 materials, delivering liquid-metal-level performance with the reliability and usability that data centers demand. Don’t let heat be the barrier to performance. Learn more about our LMEE products for data centers at https://lnkd.in/ebTsivQg. #thermalmanagement #DataCenters #LMEE https://lnkd.in/gd8vrn9x

AI data centers are being built bigger, faster, and more concentrated than ever. These sites do not just use massive power. They draw it in ways the grid was never designed for, with rapid swings that can destabilize local nodes and the wider system. For our customers, speed and reliability are the only moats. They need power systems that let them scale without breaking the grid. That is where AI UPS™ comes in. For data centers: it delivers perfect power quality across the full facility, protecting GPUs and cooling systems. It lowers construction cost, raises total system reliability, and enables grid-interactive operation when required. For the grid: it serves as a validated interface with ISOs and utilities, eliminates transients, improves voltage ride-through, and provides flexibility when the system is most strained. Result: data centers that are cheaper to build, safer to operate, more reliable, faster to connect, more flexible for the grid and safer for all consumers. Learn more: https://lnkd.in/e98h8cRY

AI’s energy problem isn’t just about how many operations per second we can run. It’s about how often we move data to make those operations possible. For many AI workloads, data movement burns more energy than the compute itself. That’s why compute-in-memory (CIM) is gaining traction. By performing calculations where the data already lives, CIM attacks the biggest efficiency bottleneck. At ISSCC 2024, researchers reported hybrid analog-digital CIM designs pushing 80+ TFLOPS/W. Challenges remain — noise, precision, scaling — but the shift is clear: future accelerators will be measured not just in FLOPS, but in FLOPS per watt of data moved. Read more: IOPLUS: Watt matters in AI hardware — https://lnkd.in/gX-mcT3N Journal of Semiconductors (ISSCC 2024): Energy-efficient ML accelerators — https://lnkd.in/gc6pnvQW #AI #Semiconductors #Accelerators #EnergyEfficiency #ComputeInMemory #AIHardware #EdgeAI #SustainableTech #EmergingTech #MachineLearning

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6040ssuE2 #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6040t6jTg #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6049s7pZN #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6044s7pFi #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6041s7MlP #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6047sCx6T #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter

Variable AI workloads demand more than traditional data center designs. Phillip Marangella from EdgeConneX and Kyle Keeper from Vertiv discuss how power, cooling, and system-level innovations make high-density racks and evolving AI roadmaps manageable. Learn why working closely with AI providers, chip makers, and technology partners is critical for building future-ready data centers: http://ms.spr.ly/6040sC0eK #UPSsystems #powersystem #NextGenInfrastructure #AIInfrastructure #AIDataCenter