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IGBT Technical Specifications

This document provides specifications for an insulated gate bipolar transistor (IGBT) from International Rectifier. The IRF4PC50WPbF IGBT is designed for switch-mode power supply and power factor correction applications. It features low switching and conduction losses, allowing for efficient operation up to 150 kHz. Absolute maximum ratings, electrical characteristics, switching characteristics and package details are provided.

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0% found this document useful (0 votes)
47 views8 pages

IGBT Technical Specifications

This document provides specifications for an insulated gate bipolar transistor (IGBT) from International Rectifier. The IRF4PC50WPbF IGBT is designed for switch-mode power supply and power factor correction applications. It features low switching and conduction losses, allowing for efficient operation up to 150 kHz. Absolute maximum ratings, electrical characteristics, switching characteristics and package details are provided.

Uploaded by

elecompinn
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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PD - 94858

IRG4PC50WPbF
INSULATED GATE BIPOLAR TRANSISTOR

Features
Designed expressly for Switch-Mode Power Supply and PFC (power factor correction) applications Industry-benchmark switching losses improve efficiency of all power supply topologies 50% reduction of Eoff parameter Low IGBT conduction losses Latest-generation IGBT design and construction offers tighter parameters distribution, exceptional reliability Lead-Free
C

VCES = 600V
G E

VCE(on) max. = 2.30V


@VGE = 15V, IC = 27A

n-channel

Benefits

Lower switching losses allow more cost-effective operation than power MOSFETs up to 150 kHz ("hard switched" mode) Of particular benefit to single-ended converters and boost PFC topologies 150W and higher Low conduction losses and minimal minority-carrier recombination make these an excellent option for resonant mode switching as well (up to >300 kHz) Parameter
VCES IC @ TC = 25C IC @ TC = 100C ICM ILM VGE EARV PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Gate-to-Emitter Voltage Reverse Voltage Avalanche Energy Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 screw.

Absolute Maximum Ratings

TO-247AC

Max.
600 55 27 220 220 20 170 200 78 -55 to + 150 300 (0.063 in. (1.6mm from case ) 10 lbfin (1.1Nm)

Units
V A

V mJ W C

Thermal Resistance
Parameter
RJC RCS RJA Wt Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient, typical socket mount Weight

Typ.
0.24 6 (0.21)

Max.
0.64 40

Units
C/W g (oz)

www.irf.com

1
11/26/03

IRG4PC50WPbF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES V(BR)CES
V(BR)CES/TJ

VCE(ON) VGE(th) VGE(th)/TJ gfe ICES IGES

Parameter Min. Typ. Max. Units Conditions Collector-to-Emitter Breakdown Voltage 600 V VGE = 0V, IC = 250A Emitter-to-Collector Breakdown Voltage 18 V VGE = 0V, IC = 1.0A Temperature Coeff. of Breakdown Voltage 0.41 V/C VGE = 0V, IC = 5.0mA 1.93 2.3 IC = 27A VGE = 15V Collector-to-Emitter Saturation Voltage 2.25 IC = 55A See Fig.2, 5 V 1.71 IC = 27A , TJ = 150C Gate Threshold Voltage 3.0 6.0 VCE = VGE, IC = 250A Temperature Coeff. of Threshold Voltage -11 mV/C VCE = VGE, IC = 1.0mA Forward Transconductance 27 41 S VCE = 100 V, IC = 27A 250 VGE = 0V, VCE = 600V Zero Gate Voltage Collector Current A 2.0 VGE = 0V, VCE = 10V, TJ = 25C 5000 VGE = 0V, VCE = 600V, TJ = 150C Gate-to-Emitter Leakage Current 100 nA VGE = 20V

Switching Characteristics @ TJ = 25C (unless otherwise specified)


Qg Qge Qgc t d(on) tr td(off) tf Eon Eoff Ets t d(on) tr t d(off) tf E ts LE Cies Coes Cres Notes: Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Min. Typ. Max. Units Conditions 180 270 IC = 27A 24 36 nC VCC = 400V See Fig.8 63 95 VGE = 15V 46 33 TJ = 25C ns 120 180 IC = 27A, VCC = 480V 57 86 VGE = 15V, RG = 5.0 0.08 Energy losses include "tail" 0.32 mJ See Fig. 9, 10, 14 0.40 0.5 31 TJ = 150C, 43 IC = 27A, VCC = 480V ns 210 VGE = 15V, RG = 5.0 62 Energy losses include "tail" 1.14 mJ See Fig. 10,11, 14 13 nH Measured 5mm from package 3700 VGE = 0V 260 pF VCC = 30V See Fig. 7 68 = 1.0MHz

Repetitive rating; VGE = 20V, pulse width limited by


max. junction temperature. ( See fig. 13b )

VCC = 80%(VCES), VGE = 20V, L = 10H, RG = 5.0,


(See fig. 13a)

Pulse width 80s; duty factor 0.1%. Pulse width 5.0s, single shot.

Repetitive rating; pulse width limited by maximum


junction temperature.

www.irf.com

IRG4PC50WPbF
100 For both:

Triangular wave:

80

Duty cycle: 50% TJ = 125C Tsink = 90C Gate drive as specified

Load Current ( A )

Power Dissipation = 40W

Clamp voltage: 80% of rated

60 Square wave: 60% of rated voltage 40

20

Ideal diodes

0 0.1 1 10 100

A
1000

f, Frequency (kHz)

Fig. 1 - Typical Load Current vs. Frequency


(Load Current = IRMS of fundamental)

1000

1000

I C , Collector-to-Emitter Current (A)

I C, Collector-to-Emitter Current (A)

100

100

TJ = 150 C

TJ = 150 C TJ = 25 C

TJ = 25 C
10

10

V GE = 15V 20s PULSE WIDTH


1 10

V CC = 50V 5s PULSE WIDTH


5 6 7 8 9 10 11

VCE , Collector-to-Emitter Voltage (V)

VGE , Gate-to-Emitter Voltage (V)

Fig. 2 - Typical Output Characteristics

Fig. 3 - Typical Transfer Characteristics

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IRG4PC50WPbF
60
3.0

50

40

VCE , Collector-to-Emitter Voltage(V)

VGE = 15V 80 us PULSE WIDTH

Maximum DC Collector Current(A)

IC = 54 A
2.0

30

IC = 27 A IC =13.5 A

20

10

25

50

75

100

125

150

1.0 -60 -40 -20

20

40

60

80 100 120 140 160

TC , Case Temperature ( C)

TJ , Junction Temperature ( C)

Fig. 4 - Maximum Collector Current vs. Case Temperature

Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature

Thermal Response (Z thJC )

0.50 0.20 0.1 0.10 0.05 0.02 0.01 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.0001 0.001 0.01 0.1 1

0.001 0.00001

t1 , Rectangular Pulse Duration (sec)

Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case

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IRG4PC50WPbF
8000

VGE , Gate-to-Emitter Voltage (V)


100

VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc

20

VCC = 400V I C = 27A

C, Capacitance (pF)

6000

16

Cies
4000

12

2000

Coes Cres

10

VCE , Collector-to-Emitter Voltage (V)

40

80

120

160

200

QG , Total Gate Charge (nC)

Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage

Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage

3.0

Total Switching Losses (mJ)

Total Switching Losses (mJ)

V CC = 480V V GE = 15V TJ = 25 C I C = 27A

10

RG = Ohm 5.0 VGE = 15V VCC = 480V IC = 54 A

2.0

IC = 27 A IC = 13.5 A

1.0

0.0

R , Gate Resistance ) RG G , GateResistance ((Ohm)

10

20

30

40

50

0.1 -60 -40 -20

20

40

60

80 100 120 140 160

TJ , Junction Temperature ( C )

Fig. 9 - Typical Switching Losses vs. Gate Resistance

Fig. 10 - Typical Switching Losses vs. Junction Temperature

www.irf.com

IRG4PC50WPbF
3.0

2.0

I C , Collector-to-Emitter Current (A)

Total Switching Losses (mJ)

RG TJ VCC VGE

= Ohm 5.0 = 150 C = 480V = 15V

1000

VGE = 20V T J = 125 oC

100

1.0

10

0.0

10

20

30

40

50

60

SAFE OPERATING AREA


1 10 100 1000

I C , Collector-to-emitter Current (A)

VCE , Collector-to-Emitter Voltage (V)

Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current

Fig. 12 - Turn-Off SOA

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IRG4PC50WPbF
L 50V 1000V VC *
0 - 480V

D.U.T.
RL =

480V 4 X I C@25C

480F 960V

* Driver same type as D.U.T.; Vc = 80% of Vce(max) * Note: Due to the 50V power supply, pulse width and inductor will increase to obtain rated Id.

Fig. 13a - Clamped Inductive


Load Test Circuit

Fig. 13b - Pulsed Collector


Current Test Circuit

IC L Driver* 50V 1000V VC D.U.T.

Fig. 14a - Switching Loss


Test Circuit
* Driver same type as D.U.T., VC = 480V

c d
90%

e
VC 90%

10%

t d(off)

Fig. 14b - Switching Loss


Waveforms

10% I C 5% t d(on)

tr E on E ts = (Eon +Eoff )

tf t=5s E off

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IRG4PC50WPbF
TO-247AC Package Outline
15.90 (.626) 15.30 (.602) -B3.65 (.143) 3.55 (.140) -A0.25 (.010) M D B M 5.50 (.217) 20.30 (.800) 19.70 (.775) 1 2 3 -C14.80 (.583) 14.20 (.559) 4.30 (.170) 3.70 (.145) 0.80 (.031) 3X 0.40 (.016) C A S 2.60 (.102) 2.20 (.087)

Dimensions are shown in millimeters (inches)


-D5.30 (.209) 4.70 (.185)

2.50 (.089) 1.50 (.059) 4

2X

5.50 (.217) 4.50 (.177)

NOTES: 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION : INCH. 3 CONFORMS TO JEDEC OUTLINE TO-247-AC.

2.40 (.094) 2.00 (.079) 2X 5.45 (.215) 2X

1.40 (.056) 3X 1.00 (.039) 0.25 (.010) M 3.40 (.133) 3.00 (.118)

LEAD ASSIGNMENTS Hexfet IGBT 1 -LEAD ASSIGNMENTS Gate 1 - Gate 1 - GATE2 - Collector 2 - Drain 2 - DRAIN 3 - Source 3 - Emitter 3 - SOURCE 4 - Drain DRAIN - Collector 4 4-

TO-247AC Part Marking Information


EXAMPLE: T HIS IS AN IRFPE30 WIT H ASSEMBLY LOT CODE 5657 ASSEMBLED ON WW 35, 2000 IN THE AS SEMBLY LINE "H"
Note: "P" in assembly line position indicates "Lead-Free"

INT ERNATIONAL RECT IFIER LOGO ASSEMBLY LOT CODE

PART NUMBER
IRFPE30
56 035H 57

DAT E CODE YEAR 0 = 2000 WEEK 35 LINE H

Data and specifications subject to change without notice.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.11/03

www.irf.com

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