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Telecom Engineering Internship Report

This document summarizes the processes used at InCap Service Pvt. Ltd in Tumkur, India. It discusses that InCap is a subsidiary of Incap Corporation in Finland and has operations in Finland, Estonia, and India. The main technologies used in PCB stuffing and testing are surface mount technology, auxiliary insertion, wave soldering, manual defect analysis, in-circuit component testing, and functional testing. It then outlines the steps for receiving components, mounting them onto PCBs, soldering, testing, and packing of finished circuit boards for shipment. Worker safety measures are also summarized.

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Harsh Ravi
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566 views10 pages

Telecom Engineering Internship Report

This document summarizes the processes used at InCap Service Pvt. Ltd in Tumkur, India. It discusses that InCap is a subsidiary of Incap Corporation in Finland and has operations in Finland, Estonia, and India. The main technologies used in PCB stuffing and testing are surface mount technology, auxiliary insertion, wave soldering, manual defect analysis, in-circuit component testing, and functional testing. It then outlines the steps for receiving components, mounting them onto PCBs, soldering, testing, and packing of finished circuit boards for shipment. Worker safety measures are also summarized.

Uploaded by

Harsh Ravi
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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SIDDAGANGA INSTITUTE OF TECHNOLOGY

DEPARTMENT OF TELECOMMUNICATION ENGINEERING

InCap Service Pvt. Ltd, Tumkur


Supervised by : Mr. Venkatesh T K Submitted by HARSH RAVI RANJAN Regn No-1SI09TE014 SIT,TUMKUR

It is a subsidiary of Incap Corporation, Finland.

It has operations in Finland, Estonia and India.


The name is shortened from the term "Investment

Capital" .

The electronics contract manufacturer Incap Electronics and The furniture contract manufacturer Incap Furniture.

The company uses many technologies to accomplish PCB

stuffing and testing. The main technologies are


Surface Mount Technology (SMT). Auxilarry insertion (AIM). Wave soldering. Manual defect analyzer (MDA). Incircuit Component Testing (ICCT). Functional Testing (FT).

Paste FIFO sticker on each packet. Handover the DC to the in charge for further processing Keep the material in the location with ID tag. Verify the DC received after counting. Check the PO and quantity, if not ok, keep the document in discrepancy file. Accepted material move to Holding stores along with GRN copy.

In this section the components form holding stores are

received and mounted onto the PCB

Small components which are not possible to be stuffed manually are done using Surface Mount Technology (SMT).

The components like resistors, and other similar

components are stuffed using auxiliary Insertion Machines


(AIM)

Flux acidity test Solder quality analysis

Lead Cutting
Touch up and inspection

Quality Instructions

Different techniques for testing are..


Manual defect analyzer (MDA).
Incircuit Component Testing (ICCT), Functional Testing (FT).

Check points of packing are..


Any wrong polarity of connectors, capacitors, ICs or diodes. Any lifting components.

Overflow, solder balls or cut leads on PCB


Cleaning wherever masking & touchup done

To provide mask.
To provide goggles. Hand gloves. Shoe or slippers. Medical check up (blood, urine & general check up). Awareness of process impact to air, water & land.

THANK YOU

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