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Ic - MCQ

The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

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etasuresh
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1K views

Ic - MCQ

The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

Uploaded by

etasuresh
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOC, PDF, TXT or read online on Scribd
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onolithic IC consists of: Both active and passive components Your Answer:

2.
In Monolithic IC: Performance depends on the substrate Your Answer:

3.
Oxidation is used for: Isolation Your Answer:

4.
Doping means: Addition of impurity material in semiconductor band structure Your Answer:

5.
Metallization is used for: Interconnection Your Answer:

6.
Packaging is used for: (c) Both (a) and (b) Your Answer:

7.
Testing is used for:

(c) Both (a) and (b) Your Answer:

8.
Optical masking is used: Pattern transfer Your Answer:

9.
Etching is used for: Selective removal of the unwanted surface Your Answer:

10.
System on chip means: It consists of both analog and digital IC Your Answer:

11.
Advantages of IC are: Your Answer: (blank)

12.
Inductor design in an IC: Is not possible Your Answer:

Monolithic IC consist s of:


Active components

Passive components Both active and passive components None of the above

In Monolithic IC:
Performance depends on the substrate Performance does not depend on the substrate Performance depends on interconnects Performance depends on packaging

Oxidation is used for:


Isolation Interconnection Doping None of the above

Doping means:
Addition of impurity material in semiconductor band structure Removing of impurity material in semiconductor band structure Cleaning the surface None of the above

Metallization is used for:


Interconnection Protection Packaging None of the above

Packaging is used for:


(a) Protection (b) Safety (c) Both (a) and (b) (d) None of the above

Testing is used for:


(a) Checking reliability (b) Quality control (c) Both (a) and (b) (d) None of the above

Optical masking is used:


Pattern transfer Protection Cleaning None of the above

Etching is used for:


Selective removal of the unwanted surface Cleaning Interconnection None of the above

System on chip means:


It consists of both analog and digital IC Only analog IC Only digital IC None of the above

Advantages of IC are:
Small size Low cost Packing density high None of the above

Inductor design in an IC:


Is not possible Is possible Is possible with discrete components None of the above

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