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Advanced Packaging Workshop 2009

This document provides information about an upcoming workshop on advanced packaging technologies and future interconnection trends to be held from October 4-8, 2009 at the Town and Country Resort and Convention Center in San Diego, CA. The workshop will be instructed by Joseph Fjelstad from Verdant Electronics and will cover topics such as the role of IC packaging technologies in electronics assembly, new 3D packaging concepts, and trends in further integrating ICs, packages, and PCB substrates. It will examine the evolution of electronic assembly and packaging technologies and their growing impact on the global electronics industry.

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Sam Hong
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248 views5 pages

Advanced Packaging Workshop 2009

This document provides information about an upcoming workshop on advanced packaging technologies and future interconnection trends to be held from October 4-8, 2009 at the Town and Country Resort and Convention Center in San Diego, CA. The workshop will be instructed by Joseph Fjelstad from Verdant Electronics and will cover topics such as the role of IC packaging technologies in electronics assembly, new 3D packaging concepts, and trends in further integrating ICs, packages, and PCB substrates. It will examine the evolution of electronic assembly and packaging technologies and their growing impact on the global electronics industry.

Uploaded by

Sam Hong
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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October 4 - 8, 2009

The Town and Country Resort and Convention Center


San Diego, CA

Workshop Preview
Advanced Packaging Technologies and
Future Interconnection Trends
Instructor
Joseph Fjelstad
Verdant Electronics
Advanced Packaging… Who Cares?
Everyone in the global electronic industry is significantly
impacted by decisions routinely made by the electronic
packaging community. Nowhere is that impact more deeply
felt than in the realm of surface mount technology
The simple truth is that IC packaging has long lead the
march of interconnection technology and it will likely
continue to do so in the foreseeable future
We are now in the midst of significant change, where once
bright lines between the different levels of the electronic
interconnection hierarchy are blurring. With that change
comes both challenge and opportunity
Some time based perspective helps to appreciate this
change and perhaps help us chart a successful course
The Evolution of Electronic Assembly

?
Performance\Density

Stacked chips & packages


Embedded passives
Higher performance materials

Area Array & CSP packages


Smaller passives
HDI/build-up Multilayers

ICs in SMT packages


Smaller PTHs
Multilayer PCBs

ICs in DIP packages


PTH technology
Two metal layer PCBs

Discrete transistors
Single sided PCB

Vacuum tubes
Discrete wire interconnections

~1940 2009
Workshop Topics
Role of IC packaging technologies in electronics assembly
Construction & manufacturing processes for common IC packages
Impact of IC package design on the assembly processes
Chip scale and Wafer Level packaging types
Reliability testing & electrical performance of CSPs
The continuing impact of lead-free & alternative approaches
Interconnection substrate challenges and solutions
IC testing structures and strategies
New and evolving 3-D packaging concepts (JISSO)
What’s new, & where IC packaging technology is headed
Trends in the integration of the IC, the package & PCB substrate
The future of IC packaging and interconnections
Where and When?
The Town and Country Resort
and Convention Center
San Diego, CA
Sunday, October 4, 2009
1:30pm – 5:00pm

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