0% found this document useful (0 votes)
77 views4 pages

9T15GH Power MOSFET Datasheet

This document provides specifications for an N-channel enhancement mode power MOSFET from Advanced Power Electronics Corp. It includes maximum ratings, electrical characteristics, thermal data and timing diagrams. Key specifications include a drain-source breakdown voltage of 20V, on-resistance of 50mΩ, continuous drain current of 12.5A, and gate charge of 5-8nC. The MOSFET is suitable for low voltage power switching applications up to 150°C.

Uploaded by

Mariah Reed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
77 views4 pages

9T15GH Power MOSFET Datasheet

This document provides specifications for an N-channel enhancement mode power MOSFET from Advanced Power Electronics Corp. It includes maximum ratings, electrical characteristics, thermal data and timing diagrams. Key specifications include a drain-source breakdown voltage of 20V, on-resistance of 50mΩ, continuous drain current of 12.5A, and gate charge of 5-8nC. The MOSFET is suitable for low voltage power switching applications up to 150°C.

Uploaded by

Mariah Reed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 4

AP9T15GH/J

Pb Free Plating Product

Advanced Power
Electronics Corp.

N-CHANNEL ENHANCEMENT MODE


POWER MOSFET

Low Gate Charge

Capable of 2.5V gate drive


Single Drive Requirement

RoHS Compliant

BVDSS

20V

RDS(ON)

50m

ID

12.5A

Description
The Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, ultra low on-resistance and
cost-effectiveness.

TO-252(H)

TO-251(J)

Absolute Maximum Ratings


Symbol

Parameter

Rating

Units

VDS

Drain-Source Voltage

20

VGS

Gate-Source Voltage

16

ID@TC=25

Continuous Drain Current, V GS @ 4.5V

12.5

ID@TC=100

Continuous Drain Current, V GS @ 4.5V

60

12.5

IDM

Pulsed Drain Current

PD@TC=25

Total Power Dissipation

0.1

W/

TSTG

Linear Derating Factor


Storage Temperature Range

-55 to 150

TJ

Operating Junction Temperature Range

-55 to 150

Thermal Data
Symbol

Parameter

Value

Units

Rthj-c

Thermal Resistance Junction-case

Max.

10

/W

Rthj-a

Thermal Resistance Junction-ambient

Max.

110

/W

Data and specifications subject to change without notice

200908052-1/4

AP9T15GH/J
o

Electrical Characteristics@Tj=25 C(unless otherwise specified)


Symbol

Parameter

Test Conditions

Typ.

Max. Units

20

BVDSS

Drain-Source Breakdown Voltage

BVDSS/Tj

Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA

0.02

V/

RDS(ON)

Static Drain-Source On-Resistance

VGS=4.5V, ID=6A

50

VGS=2.5V, ID=5.2A

80

VDS=VGS, ID=250uA

0.5

1.5

VDS=5V, ID=10A

10

Drain-Source Leakage Current (Tj=25 C)

VDS=20V, VGS=0V

uA

Drain-Source Leakage Current (Tj=150oC)

VDS=16V ,VGS=0V

25

uA

Gate-Source Leakage

VGS=16V

100

nA

ID=10A

nC

VGS(th)

Gate Threshold Voltage

gfs

Forward Transconductance

IDSS

IGSS

VGS=0V, ID=250uA

Min.

Qg

Total Gate Charge

Qgs

Gate-Source Charge

VDS=16V

nC

Qgd

Gate-Drain ("Miller") Charge

VGS=4.5V

nC

td(on)

Turn-on Delay Time

VDS=10V

ns

tr

Rise Time

ID=10A

55

ns

td(off)

Turn-off Delay Time

RG=3.3,VGS=5V

10

ns

tf

Fall Time

RD=1

ns

Ciss

Input Capacitance

VGS=0V

360

580

pF

Coss

Output Capacitance

VDS=20V

70

pF

Crss

Reverse Transfer Capacitance

f=1.0MHz

50

pF

Rg

Gate Resistance

f=1.0MHz

1.67

Min.

Typ.

Source-Drain Diode
Symbol

Parameter
2

Test Conditions

Max. Units

VSD

Forward On Voltage

IS=10A, VGS=0V

1.3

trr

Reverse Recovery Time

IS=10A, VGS=0V,

17

ns

Qrr

Reverse Recovery Charge

dI/dt=100A/s

nC

Notes:
1.Pulse width limited by safe operating area.
2.Pulse width <300us , duty cycle <2%.

2/4

AP9T15GH/J
40

50

T C = 150 o C

T C =25 C
ID , Drain Current (A)

ID , Drain Current (A)

5.0V
4.5V

40

30

3.5V
20

2.5V

30

5.0V
4.5V

20

3.5V

10

2.5V

10

V G =1.5V

V G =1.5V
0

0
0

V DS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics

Fig 2. Typical Output Characteristics

1.8

45

I D = 5.2 A

43

I D =6A
V G =4.5V

1.6

Normalized RDS(ON)

T C =25 o C
RDS(ON) (m )

V DS , Drain-to-Source Voltage (V)

41

39

37

1.4

1.2

1.0

0.8

35

0.6

33
0

-50

10

V GS , Gate-to-Source Voltage (V)

50

100

150

T j , Junction Temperature ( C)

Fig 3. On-Resistance v.s. Gate Voltage

Fig 4. Normalized On-Resistance


v.s. Junction Temperature
2.0

10

Normalized VGS(th) (V)

IS(A)

T j =150 o C

T j =25 o C

1.5

1.0

0.5
2

0.0

0
0

0.2

0.4

0.6

0.8

V SD , Source-to-Drain Voltage (V)

Fig 5. Forward Characteristic of

Reverse Diode

1.2

-50

50

100

150

T j , Junction Temperature ( o C)

Fig 6. Gate Threshold Voltage v.s.


Junction Temperature
3/4

AP9T15GH/J
f=1.0MHz
14

1000

I D =10A
C iss

V DS =10V
V DS =12V
V DS =16V

10

C (pF)

VGS , Gate to Source Voltage (V)

12

100

C oss
C rss

10
0

10

12

13

17

21

25

29

V DS , Drain-to-Source Voltage (V)

Q G , Total Gate Charge (nC)

Fig 7. Gate Charge Characteristics

Fig 8. Typical Capacitance Characteristics

Normalized Thermal Response (Rthjc)

100

100us
ID (A)

10

1ms
10ms
100ms
DC

T c =25 C
Single Pulse

Duty factor = 0.5

0.2

0.1

0.1
0.05

0.02

PDM

0.01

t
T

Single Pulse

Duty Factor = t/T


Peak Tj = PDM x Rthjc + T C

0.01

0.1
0.1

10

100

0.00001

0.0001

V DS , Drain-to-Source Voltage (V)

Fig 9. Maximum Safe Operating Area

0.001

0.01

0.1

t , Pulse Width (s)

Fig 10. Effective Transient Thermal Impedance

VG

VDS
90%

QG
4.5V
QGS

QGD

10%
VGS
td(on) tr

td(off)tf

Fig 11. Switching Time Waveform

Charge

Fig 12. Gate Charge Waveform

4/4

You might also like