Channel-Length Modulation
The pinch-off point moves toward the source as VDS increases.
The length of the inversion-layer channel becomes shorter with increasing VDS.
ID increases (slightly) with increasing VDS in the saturation region of operation.
L VDS VDSsat
1
1 L
I Dsat
1
L L L
L
1
W
2
I D, sat nCox VGS VTH 1 VDS VD,sat
2
L
is the channel length modulation coefficient.
and L
The effect of channel-length modulation is less for a longchannel MOSFET than for a short-channel MOSFET.
Velocity Saturation
In state-of-the-art MOSFETs, the channel is very short (<0.1m);
hence the lateral electric field is very high and carrier drift
velocities can reach their saturation levels.
The electric field magnitude at which the carrier velocity saturates is Esat.
v
vsat
8 106 cm/s for electrons in Si
6
6
10
cm/s for holes in Si
Impact of Velocity Saturation
Recall that I D WQinv ( y)v( y)
If VDS > EsatL, the carrier velocity will saturate and hence the
drain current will saturate:
I D,sat WQinvvsat WCox VGS VTH vsat
ID,sat is proportional to VGSVTH rather than (VGS VTH)2
ID,sat is not dependent on L
ID,sat is dependent on W
Short-Channel MOSFET ID-VDS
P. Bai et al. (Intel Corp.),
Intl Electron Devices Meeting, 2004.
ID,sat is proportional to VGS-VTH rather than (VGS-VTH)2
VD,sat is smaller than VGS-VTH
Channel-length modulation is apparent (?)
Drain Induced Barrier Lowering (DIBL)
In a short-channel MOSFET, the source & drain regions each support
a significant fraction of the total channel depletion charge QdepWL
VTH is lower than for a long-channel MOSFET
As the drain voltage increases, the reverse bias on the body-drain PN
junction increases, and hence the drain depletion region widens.
VTH decreases with increasing drain bias.
(The barrier to carrier diffusion from the source into the channel is reduced.)
ID increases with increasing drain bias.
NMOSFET in OFF State
We had previously assumed that there is no channel current
when VGS < VTH. This is incorrect!
As VGS is reduced (toward 0 V) below VTH, the potential barrier to
carrier diffusion from the source into the channel is increased.
ID becomes limited by carrier diffusion into the channel, rather
than by carrier drift through the channel.
(This is similar to the case of a PN junction diode!)
ID varies exponentially with the potential barrier height at the
source, which varies directly with the channel potential.
Sub-Threshold Leakage Current
Recall that, in the depletion (sub-threshold) region of operation,
the channel potential is capacitively coupled to the gate potential.
A change in gate voltage (VGS) results in a change in channel
voltage (VCS):
VCS
Cox
VGS / m
VGS
C C
dep
ox
Therefore, the sub-threshold current (ID,subth) decreases
exponentially with linearly decreasing VGS/m
ID
Sub-threshold swing:
log (ID)
VGS
VGS
d (log10 I DS )
S
dVGS
S mVT ln (10) 60mV/dec
VTH Design Trade-Off
Low VTH is desirable for high ON-state current:
ID,sat (VDD - VTH)
1<<2
But high VTH is needed for low OFF-state current:
log ID
Low VTH
High VTH
IOFF,low VTH
VTH cannot be
reduced aggressively.
IOFF,high VTH
0
VGS