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Chapter Six

This document discusses logic circuit technologies, including TTL and CMOS. It provides details on: 1) The two major semiconductor technologies used for digital circuits - TTL and CMOS. While the logic functions are the same, they differ in electrical characteristics like power, speed, and inputs/outputs. 2) Characteristics of TTL technology, including a supply voltage of 5V, fan-out of 10, noise margins of 0.4V, propagation delays ranging from nanoseconds to femtoseconds depending on the subfamily, and power dissipation calculated as voltage times current. 3) Examples of TTL subfamilies like 74xxx, 74Lxxx, 74Sxxx, and 74LS

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159 views

Chapter Six

This document discusses logic circuit technologies, including TTL and CMOS. It provides details on: 1) The two major semiconductor technologies used for digital circuits - TTL and CMOS. While the logic functions are the same, they differ in electrical characteristics like power, speed, and inputs/outputs. 2) Characteristics of TTL technology, including a supply voltage of 5V, fan-out of 10, noise margins of 0.4V, propagation delays ranging from nanoseconds to femtoseconds depending on the subfamily, and power dissipation calculated as voltage times current. 3) Examples of TTL subfamilies like 74xxx, 74Lxxx, 74Sxxx, and 74LS

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yunus memon
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CHAPTER SIX

Logic Circuits Technologies


1. Major Technologies:
All digital devices and circuits are manufactured as Integrated Circuits ( ICs). Two major
semiconductor technologies are used to manufacture digital devices:
a. TTL ( Transistor-Transistor Logic) technology.
b. CMOS ( Complementary Metal-Oxide Semiconductor ) technology.
Each technology has a number of subfamilies.
In terms of basic use, there is no difference between these technologies, i.e. for example
an AND gate manufactured using TTL has the same truth table as an AND gate
manufactured using CMOS. And so for all digital circuits.
The differences between these technologies are in the ICs pin assignment and in the
electrical operational characteristics and parameters like power dissipation, switching
speeds, input/outputs currents, etc.
2. Basic Operational Characteristics and Parameters for TTL Technology:
2.1 DC Supply Voltage:
Nominal dc supply voltage for TTL is +5v ( usually connected to the Vcc terminal).
2.2 Input/Output Currents and Fan-Out:
The fan-out

for a subfamily is defined as the number of gate inputs of the same

subfamily that can be connected to a single gate output without exceeding the current
ratings of the gate. A typical fan-out for most TTL subfamilies is 10.

Ex: For 74xxx subfamily( like 7400) IOH = 400 A ( the source current which is going
out of the gate when its output is High).
Also, for 74xxx subfamily IIH = 40 A ( the input current requirement by the gate for the
High condition). So,

400
Fan-out = --------- = 10
40

For 74xxx subfamily IOL = 16 mA ( the sink current which is going into the gate when its
output is Low and sink to the ground).
Also, for 74xxx subfamily IIL = 1.6 mA ( the current which going out of the gate input
when it is Low). So,

16
Fan-out = --------- = 10
1. 6

So, fan-out for both High and Low conditions is the same.
2.3 Input/Output Voltages and Noise Margin:
Ex: For 74xxx subfamily( like 7400):
VOL = 0v but, typically = 0.2v and maximum value is 0.4v.
VIL = 0v and maximum 0.8v.(The input voltage to the gate to be considered Low).
VOH = 5v but, typically = 3.4v and minimum value is 2.4v.
VIH = 5v and minimum is 2v.(The input voltage to the gate to be considered High).
VIL(max) - VOL(max) = 0.8v - 0.4v = 0.4v ( the noise margin for TTL 74xxx subfamily)
VOH(min) VIH(min) = 2.4v - 2v = 0.4v ( the noise margin for TTL 74xxx subfamily)
The noise margin for a subfamily is the maximum allowable noise amplitude above
which the noise may change the normal operation of the digital circuit.
The noise is unwanted voltage that is induced in the circuit and may change its normal
operation. Noise results from high-frequency electromagnetic radiation or from power
line voltage fluctuations( low-frequency noise).
2.4 Propagation Delay and Switching Frequency:
Propagation delay ( tp )is the time delay between the change in the input logic level of a
logic device and the change in its output logic level.

Switching frequency is the maximum frequency with which the gate can operate. The
propagation delay limits the switching frequency. The lower the propagation delay for a
logic device , the higher will be its the switching frequency which is required for most
digital systems. A gate with ( t p =3ns) has higher switching frequency (faster) than a gate
with ( tp =10ns).
2.5 Power Dissipation:
It is the power dissipated ( consumed ) by an IC. This power is supplied by the dc supply,
so
Power dissipation ( PD) = Vcc X Icc (av)
Logic devices with low PD are better.
2.6 Speed-Power Product:
For a logic device, speed-power product = tp x PD (in picojoule or picowatt.second)
Logic devices with low speed-power products are better, because they can operate on
high frequencies and they consume low power.
3. TTL subfamilies:
Some of the existing TTL subfamilies are;
a. 74xxx ( Ex: 7404 , 74121).
b. 74Lxxx Low power TTL ( Ex: 74L04, 74L121)
Has half power dissipation of 74xxx, but with double propagation delay.
c. 74Sxxx Schottky TTL (Ex: 74S04, 74S121)
Has a very low propagation delay, but double power dissipation compared with
74xxx.
d. 74LSxxx Low-power Schottky TTL (Ex: 74LS04, 74LS121)
Has a low propagation delay and a low power dissipation compared with 74xxx.
e. 74ALSxxx Advanced Low-power Schottky TTL (Ex: 74ALS04, 74ALS121)
Has a low propagation delay and a very low power dissipation.

f. 74Fxxx Fast TTL (Ex: 74F04, 74F121)


Has a very low propagation delay and a low power dissipation.
4. CMOS subfamilies:
Some of the existing CMOS subfamilies are;
a. 40xx and the improved 40xxB ( Ex: 4020 , 4020B).
They have very low power dissipation, but much slower than TTL subfamilies.
b. 40Hxx ( Ex: 40H20)
Has a very low power dissipation and faster than 40xx subfamily, but slower than
TTL LS subfamily.
c. 74HCxx and 74HCTxx ( Ex: 74HC04 , 74HCT04)
They are pin compatible with TTL and have very low power dissipation and same
speed as TTL LS subfamily.
d. 74ABTxx and 74BCTxx ( BiCMOS) ( Ex: 74ABT04 , 74BCT04)
They are pin compatible with TTL and have very low power dissipation and very low
propagation delay.
5. Comparing Logic Families:
The following table shows the typical single-gate performance specifications for different
logic subfamilies:
Logic Subfamily

Propagation

74
74S
74LS
74ALS
74F
40xxB(CMOS)
74HC (CMOS)
74BCT (BiCMOS)

( ns )
10
3
9
4
2.7
105
10
2.9

Delay Power

Dissipation Speed-Power

( mw )
10
20
2
1
4
1 at 1MHz
1.5 at 1MHz
0.0003 to 7.5

Product (pw.s)
100
60
18
4
11
105
15
0.00087 to 22

Note: There are also other differences between these subfamilies like in noise margins,
fan-outs , etc. By using data sheets we can know all the exact specifications of each
subfamily.
6. Handling MOS Devices:

All MOS devices should be handled carefully, because they can be easily damaged by
Electrostatic Discharges.

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