Moxa Embedded Solution on
IEC 61850
Moxa Systems
August, 2009
Theme
IEC 61850 with Smart Grid
Substation Automation Empowered
By IEC 61850
Moxa Solution
Summary
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Future of Power: Smart Grid
Everything is now based on electricity
Computers, Networks, Telecom, Medical,
Electric grid produces at least 40% of CO2
emissions
Aging electric grid contributes a 20% power
loss while delivering to end user
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Smart Grid Infrastructure
Substation Automation
Advanced Metering Infrastructure
Power
Generation Customers
Electricity Dispatching Transmission Distribution
Control Center
Distributed Energy Integrated
Source: EPRI Intelligrid
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Substation Automation in Smart Grid
Electricity consumption, switchboard
operation, information gathering, station
decision making feedback
Electricity Dispatching Substation
Control Center
Grid intelligence strategic decision,
T&D automated management
Source: EPRI Intelligrid
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Current Power Automation Protocols
DNP 3.0
IEC 60870-5
DNP 3.0
ModBus
ModBus
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Protocol Trend for Power Automation
Newton Evans: 2005-2007
IEC 61850 is the
trend
Migrating to
Ethernet-based
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Future Power Automation Protocols
DNP 3.0
LAN
IEC
IEC60870-5
61850
DNP 3.0
ModBus
ModBus/TCP LAN
ModBus
ModBus/TCP
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Substation Automation Empowered
By IEC 61850
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Benefits of IEC 61850 Power
Substation
Protocol Integration
Easy
Time to Market
Maintenance IEC 61850
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Moxa Offering
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Moxa Embedded Solution
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Lead with IEC61850-3 Certified
Embedded Computer DA-681
PASS!
DA-681-I-DPP-T
IEC 61850-3 Test
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Using DA-681 in IEC61850-3 Substation
Requirements
IEC61850-3 certified hardware
Multiple LANs to connect IED device and communicate
dispatch control center
Requires 100-240 AC/DC power input
19-inch rackmount, fanless design
Benefits
The DA-681 has 6 LANs for network redundancy and
centralized communication
Excellent patented heat dissipation design for use in
-40 ~ 75C environments
Serial port with isolation protection for integrating legacy RTU
into IEC 61850 substation
Dual power design to connect simultaneously to 100 VDC and
240 VAC power sources
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Features Briefing
Intel x86 1GHz CPU with 910GMLE chipset
Built-in DDR2 SDRAM and industrial-grade
DOM
19-inch rackmount installation, 1U high
6 Ethernet ports for network redundancy
2 USB 2.0 Host, supporting system boot up
4 Serial 232 & 8 RS-485 ports (wide baud rate)
CF/SATA interfaces for storage expansion
100 to 240V AC/DC power input
Dual power for redundant application (DP/DPP
model only)
Fanless and low power consumption design
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Challenges to Certify IEC 61850-3
Function Test
EMC Test
Wide Temperature Test
Anti-Vibration Test
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Unique Design to Conquer EMC Test
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Wide Temperature Know-How
Thermal Placement
Optimization of
Components Natural-Convection
Chamber to Test
Wide Temperature
Components Database
Optimal Heat Transfer
Methods
Self Warming System
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Special Heat Dissipation Design
L-Type for Heat Dissipation
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System Throttling Design
High Temperature Solution: Dynamic Throttling Technique
Sa
User fe
Configurable
inside BIOS
time
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120 hours Uninterrupted Testing
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Production Quality Management
(Dynamic Burn-in)
High temp. (55~75dc) Room temp. (30~40dc) Wide temp. (-40~85 dc)
Pilot Run 24~48hrs Mass Production 4~24hrs W/T Product screen 24 hrs
Over 80% function test items are covered during burn-in test program.
Monitoring programs control the entire burn-in status,
and show the data for analysis.
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Anti-Vibration Tolerance Test
50 G Anti-Shock
5-500 MHz Anti-Vibration
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Summary
IEC 61850 is the trend in modern power substation
to integrate different standards in
Relay, Control, and Metering equipments
DA-681 is the best solution to fit in
Communication Processor and Back-end Host
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Thanks!
Confidential
