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Low Power Design Methodologies and Flows

The document discusses low power design methodologies and flows. It addresses key issues like power characterization and modeling, power analysis, and power reduction techniques. It provides examples of low power design flows at the system, RTL, and implementation levels. The goals are to minimize power, time, and effort while avoiding complications in timing and verification. Power analysis should be done early and often to identify reduction opportunities and check against budgets. Techniques used should be optimized for the design and abstraction level.

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Sumanth Varma
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© © All Rights Reserved
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0% found this document useful (0 votes)
157 views

Low Power Design Methodologies and Flows

The document discusses low power design methodologies and flows. It addresses key issues like power characterization and modeling, power analysis, and power reduction techniques. It provides examples of low power design flows at the system, RTL, and implementation levels. The goals are to minimize power, time, and effort while avoiding complications in timing and verification. Power analysis should be done early and often to identify reduction opportunities and check against budgets. Techniques used should be optimized for the design and abstraction level.

Uploaded by

Sumanth Varma
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 52

Chapter 12

Low Power Design Methodologies and Flows

Low Power
Design Methodologies and Flows

Jerry Frenkil
Jan M. Rabaey

Slide 12.1
Low Power Design Methodology Motivations

Minimize power
Reduce power in various modes of device operation
Dynamic power, leakage power, or total power

Minimize time
Reduce power quickly
Complete the design in as little time as possible
Prevent downstream issues caused by LPD techniques
Avoid complicating timing and functional verification

Minimize effort
Reduce power efficiently
Complete the design with as few resources as possible
Prevent downstream issues caused by LPD techniques
Avoid complicating timing and functional verification

Slide 12.2
Methodology Issues
Power Characterization and Modeling
How to generate macro-model power data?
Model accuracy
Power Analysis
When to analyze?
Which modes to analyze?
How to use the data?
Power Reduction
Logical modes of operation
For which modes should power be reduced?
Dynamic power versus leakage power
Physical design implications
Functional and timing verification
Return on Investment
How much power is reduced for the extra effort? Extra logic? Extra area?
Power Integrity
Peak instantaneous power
Electromigration
Impact on timing

Slide 12.3
Some Methodology Reflections

Generate required models to support chosen methodology


Analyze power early and often
Employ (only) as many LPD techniques as needed to
reach the power spec
Some techniques are used at only one abstraction level; others are
used at several
Clock Gating: multiple levels
Timing-slack redistribution: only physical level
Methodology particulars dependent upon choice of
techniques
Power gating versus Clock gating
Very different methodologies
No free lunch
Most LPD techniques complicate the design flow
Methodology must avoid or mitigate the complications

Slide 12.4
Power Characterization and Modeling

Objective: Build models to support low-


power design methodology
Power consumption models
Current waveform models
Voltage-sensitive timing models
Issues
Model formats, structures, and complexity
Example: Liberty-power
Run times
Accuracy
[Ref: Liberty]

Slide 12.5
Power Characterization and Modeling

Process Spice Library Model


Model Netlists Params Templates

VDD Power Characterization


(using a circuit or power simulator)

IL

I sc Characterization
CL Database
(raw power data)
I leakage

Power Modeler

Power
Models

[Ref: J. Frenkil, Kluwer02]

Slide 12.6
Generalized Low-Power Design Flow
Design Phase Low-Power Design Activities

Explore architectures and algorithms for power efficiency


Map functions to s/w and/or h/w blocks for power efficiency
System-Level Design Choose voltages and frequencies
Evaluate power consumption for different operational modes
Generate budgets for power, performance, area

Generate RTL to match system-level model


Select IP blocks
RTL Design Analyze and optimize power at module level and chip level
Analyze power implications of test features
Check power against budget for various modes

Synthesize RTL to gates using power optimizations


Implementation Floorplan, place, and route design
Optimize dynamic and leakage power
Verify power budgets and power delivery

Slide 12.7
Power-Analysis Methodology

Motivation
Determine ASAP if the design will meet the power spec
Identify opportunities for power reduction, if needed

Method
Set up regular, automatic power analysis runs (nightly, weekly)
Run regular power analysis regressions as soon as a simulation
environment is ready
Initially can re-use functional verification tests
Add targeted mode- and module-specific tests to increase coverage
Compare analysis results against design spec
Check against spec for different operational modes (idle, xmit, rcv)
Compare analysis results against previous analysis results
Identify power mistakes - changes/fixes resulting in increased power
Identify opportunities for power reduction

Slide 12.8
Power Analysis Methodology Issues

Development phases
System
Description available early in the design cycle
Least accurate but fastest turn around times (if synthesizing ESL to RTL)
Design
Most common design representation
Easy to identify power-saving opportunities
Power results can be associated with specific lines of code
Implementation
Gate-level design available late in the design cycle
Slowest turn around times (due to lengthy gate-level simulations) but most
accurate results
Difficult to interpret results for identifying power-saving opportunities
cant see the forest for the trees

Availability of data
When are simulation traces available?
When is parasitic data available?

Slide 12.9
System-Phase Analysis Methodology

ESL
ESL IP
IP sim
sim ESL
ESL IP
IP power
power Env.
Env. Tech.
Tech.
stimulus
stimulus models
models Code
Code models
models Data
Data Data
Data

ESL Simulation ESL Synthesis

RTL
Code

Trans. RTL Power Analysis


traces

Power
Reports

Slide 12.10
Design-Phase Analysis Methodology

mode 1
mode 2
S mode n IP power Env. Tech.
RTL
S models Data
RTL Design Data
Stimulus

RTL Simulation

mode 1
mode 2
A mode n
RTL Power Analysis
A
Activity
Data

P
R P
R Power
Reports

Slide 12.11
Implementation-Phase Analysis

mode 1
mode 2
S mode n RTL IP power Env. Tech.
S RTL Design models Data Data
Stimulus

RTL Simulation RTL Synthesis

mode 1
mode 2 gate
A mode n Gate-level
Gate level
netlist
A
Activity
Power Analysis
Data

P
R P
R Power
Reports

Slide 12.12
Power Analysis over Project Duration

Weekly power regression results

[Courtesy: Tensilica, Inc.]

Slide 12.13
System-Phase Low-Power Design
Primary objectives: minimize feff and VDD

Modes
Modes enable power to track workload
Software programmable; set/controlled by OS
Hardware component needed to facilitate control
Software timers and protocols needed to determine when to change
modes and how long to stay in a mode

Parallelism and Pipelining


VDD can be reduced, since equivalent throughput can be achieved
with lower speeds

Challenges
Evaluating different alternatives

Slide 12.14
Power-Down Modes Example

Modes control clock frequency, VDD, or both


Active mode: maximum power consumption
Full clock frequency at max VDD
Doze mode: ~10X power reduction from active mode
Core clock stopped
Nap mode: ~ 50% power reduction from doze mode
VDD reduced, PLL & bus snooping stopped
Sleep mode: ~10X power reduction from nap mode
All clocks stopped, core VDD shut off

Issues and Trade-offs


Determining appropriate modes and appropriate controls
Trading off power reduction for wake-up time
[Ref: S. Gary, D&T94]

Slide 12.15
Parallelism and Pipelining Example
Concept: maintain performance with reduced VDD
Total area increases but each data path works less in each cycle
VDD can be reduced such that the work requires the full cycle time
Cycle time remains the same, but with reduced VDD
Pipelining a data path
Power can be reduced by 50% or more
Modest area overhead due to additional registers
Paralleling a data path
Power can be reduced by 50% or more
Significant area overhead due to paralleled logic
Multiple CPU cores
Enables multi-threaded performance gains with a constrained VDD

Issues and Trade-offs


Application: can it be paralleled or threaded?
Area: what is the area increase for the power reduction?
Latency: how much can be tolerated?

[Ref: A. Chandrakasan, JSSC92]

Slide 12.16
System-Phase Low-Power Design Flow

Create design in C / C++

Transmitter Area Symbol Throughput Min. Freq to Avg. Power


Design (mm2) Latency (cycle/symbol) Achieve Req. (mW)
Simulate C / C++ under typical (IFFT Block) (cycles) Rate
work loads Avg. Power

Combinational 4.91 10 4 1.0 MHz 3.99

Pipelined 5.25 12 4 1.0 MHz 4.92

Folded (16 Bfly4s) 3.97 12 4 1.0 MHz 7.27


Create /vsynthesize different
Folded (8 Bfly4s) 3.69 15 6 1.5 MHz 10.9
versions
Folded (4 Bfly4s) 2.45 21 12 3.0 MHz 14.4

Folded (2 Bfly4s) 1.84 33 24 6.0 MHz 21.1

Folded (1 Bfly4) 1.52 57 48 12.0 MHz 34.6


Evaluate power of each version
Example: Exploration of IFFT block for 802.11a
transmitter using BlueSpecSystemVerilog
[Ref: N. Dave, Memocode06]
Choose lowest power version

Slide 12.17
Design-Phase Low-Power Design

Primary objective: minimize feff

Clock gating
Reduces / inhibits unnecessary clocking
Registers need not be clocked if data input hasnt changed

Data gating
Prevents nets from toggling when results wont be used
Reduces wasted operations

Memory system design


Reduces the activity internal to a memory
Cost (power) of each access is minimized

Slide 12.18
Clock Gating
Power is reduced by two mechanisms
Clock net toggles less frequently, reducing feff
Registers internal clock buffering switches less often

d q dout enF FSM


din
en qn
clk clk
enE Execution
Unit

din d q dout
Memory
qn enM
en Control
clk
clk clk

Local Gating Global Gating

Slide 12.19
Clock-Gating Insertion

Local clock gating: Three methods


Logic synthesizer finds and implements local
gating opportunities
RTL code explicitly specifies clock gating
Clock-gating cell explicitly instantiated in RTL

Global clock gating: Two methods


RTL code explicitly specifies clock gating
Clock-gating cell explicitly instantiated in RTL

Slide 12.20
Clock Gating Verilog Code
Conventional RTL Code
//always clock the register
always @ (posedge clk) begin // form the flip-flop
if (enable) q = din;
end

Low-Power Clock-Gated RTL Code


//only clock the register when enable is true
assign gclk = enable && clk; // gate the clock
always @ (posedge gclk) begin // form the flip-flop
q = din;
end

Instantiated Clock-Gating Cell


//instantiate a clock-gating cell from the target library
clkgx1 i1 .en(enable), .cp(clk), .gclk_out(gclk);
always @ (posedge gclk) begin // form the flip-flop
q = din;
end

Slide 12.21
Clock Gating: Glitchfree Verilog

Add a Latch to Prevent Clock Glitching


L1

enable d q en_out
LATCH

gn G1

clk gclk

Clock-Gating Code with Glitch Prevention Latch


always @ (enable or clk) begin
if !clk then en_out = enable // build latch
end
assign gclk = en_out && clk; // gate the clock

Slide 12.22
Data Gating

Objective
Reduce wasted operations reduce feff

Example
Multiplier whose inputs change X
every cycle, whose output
conditionally feeds an ALU

Low-Power Version
Inputs are prevented from
rippling through multiplier, X
if multiplier output is not
selected

Slide 12.23
Data-Gating Insertion

Two insertion methods


Logic synthesizer finds and implements data-
gating opportunities
RTL code explicitly specifies data gating
Some opportunties cannot be found by synthesizers

Issues
Extra logic in data path slows timing
Additional area due to gating cells

Slide 12.24
Data-Gating Verilog Code: Operand Isolation

Conventional Code
assign muxout = sel ? A : A*B ; // build mux
B
X
muxout
A
sel
Low-Power Code
assign multinA = sel & A ; // build and gate
assign multinB = sel & B ; // build and gate
assign muxout = sel ? A : multinA*multinB ;

B
X
muxout
A
sel

Slide 12.25
Memory System Design

Primary objectives: minimize feff and Ceff


Reduce number of accesses or (power) cost of
an access
Power Reduction Methods
Memory banking / splitting
Minimization of number of memory accesses
Challenges and Trade-offs
Dependency upon access patterns
Placement and routing

Slide 12.26
Split Memory Access

16K x 32
din
RAM
32
addr dout

write
noe
15 addr[14:0]
d q
pre_addr
addr[14:1]
dout
clock noe

write
32
addr dout

din
RAM
16K x 32
addr[0]

Slide 12.27
Implementation Phase Low-Power Design

Primary objective: minimize power consumed by individual instances

Low-power synthesis
Dynamic power reduction via local clock gating insertion, pin-swapping

Slack redistribution
Reduces dynamic and/or leakage power

Power gating
Largest reductions in leakage power

Multiple supply voltages


The implementation of earlier choices

Power integrity design


Ensures adequate and reliable power delivery to logic

Slide 12.28
Slack Redistribution
Objective
Reduce dynamic Power or leakage power
or both by trading off positive timing slack
Physical-level optimization
Best optimized post-route
Must be noise-aware Post-optimized
Number of Paths

Dynamic power reduction by cell resizing


Cells along non-speed critical path resized
Usually downsized, sometimes upsized Pre-optimized
Power reduction of 1015%
Leakage power reduction by VTH
assignment
Cells along non-speed critical path set to High
VTH
Leakage reduction of 2060%
Dynamic & leakage power can be Available Stack
optimized independently or together

[Ref: Q. Wang, TCAD02]

Slide 12.29
Dynamic Power Optimization: Cell Resizing
Positive-Slack Trade-Off for Reduced Dynamic Power
Objective: reduce dynamic power where speed is not needed
Optimization performed post-route for optimum results
Cells along paths with positive slack replaced with lower-drive cells
Switching currents, input capacitances, and area are all reduced
Incremental re-route required new cells may have footprints
different from the previous cells

2x 1x

2x 1x
2x 2x
2x 2x 2x
2x 2x 2x
2x 2x
2x 2x

High speed, high power Reduced speed, lower power

Slide 12.30
Leakage Power Optimization: Multi-VTH
Trade Off Positive Slack for Reduced Leakage Power
Objective: reduce leakage power where speed is not needed
Optimization performed post-route for optimum results
Cells along paths with positive slack replaced with High-VTH cells
Leakage currents reduced where timing margins permit
Re-routing not required new cells have same footprint as
previous cells

L H

L H
L L
L L
L L L L
L L
L L

High speed, high leakage Reduced speed, low leakage

Slide 12.31
Slack Redistribution Flows

Place & Route Place & Route

Check Timing Check Timing

Fix Timing OK Fix Timing OK


n n

y y

Check Noise OR Check Noise

Fix Noise Fix Noise


n OK n OK
(timing-aware)
y y

Check Pwr Check Pwr

Reduce Power
Reduce Pwr OK (timing-and OK
n n
noise-aware)
y y

Slide 12.32
Slack Redistribution: Trade-Offs and Issues

Yield
Slack redistribution effectively turns non-critical paths into critical
or semi-critical paths
Increased sensitivity to process variation and speed faults
Libraries
Cell resizing needs a fine granularity of drive strengths for best
optimization results more cells in the library
Multi-VTH requires an additional library for each additional VTH
Iterative loops
Timing and noise must be re-verified after each optimization
Both optimizations increase noise and glitch sensitivities
Done late in the design process
Difficult to predict in advance how much power will be saved
Very much dependent upon design characteristics

Slide 12.33
Power Gating

Objective
Reduce leakage currents by inserting a switch transistor (usually
high-VTH) into the logic stack (usually low-VTH)
Switch transistors change the bias points (VSB ) of the logic transistors
Most effective for systems with standby operational modes
1 to 3 orders of magnitude leakage reduction possible
But switches add many complications
VDD
Logic
VDD Cell

Logic
Cell
Virtual
Ground

sleep Switch
Cell

Slide 12.34
Power Gating: Physical Design
Switch placement
In each cell?
Very large area overhead, but placement and routing is easy
Grid of switches?
Area-efficient, but a third global rail must be routed
Ring of switches?
Useful for hard layout blocks, but area overhead can be significant

Global Supply
Virtual Grounds

Virtual
Module Supply

Switch
Switch Integrated Cells
Within Each Cell Switch Cell

Switch-in-cell Grid of Switches Ring of Switches

[Ref: S. Kosonocky, ISLPED01]

Slide 12.35
Power Gating: Switch Sizing

Trade-off between area, performance, leakage


Larger switches less voltage drop, larger leakage, more area
Smaller switches larger voltage drop, less leakage, less area

Switch
Cell
Area
(m2)

I LKG

tD
Vvg_max (mV)

Lvg_max (m)

[Ref: J. Frenkil, Springer07]

Slide 12.36
Power Gating: Additional Issues
Library design: special cells are needed
Switches, isolation cells, state retention flip-flops (SRFFs)
Headers or Footers?
Headers better for gate leakage reduction, but ~ 2X larger
Which modules, and how many, to be power gated?
Sleep control signal must be available, or must be created
State retention: which registers must retain state?
Large area overhead for using SRFFs
Floating signal prevention
Power-gate outputs that drive always-on blocks must not float
Rush currents and wake-up time
Rush currents must settle quickly and not disrupt circuit operation
Delay effects and timing verification
Switches affect source voltages which affect delays
Power-up & power-down sequencing
Controller must be designed and sequencing verified

Slide 12.37
Power Gating Flow

Design power
power-gating
gating
Determine floorplan
library cells

Determine which blocks Power gating aware


to power gate placement

Determine state
retention mechanism Clock tree synthesis

Determine rush current


control scheme Route

Design power-gating
power gating virtual-rail
Verify virtual rail
controller electrical
characteristics

Power gating aware


synthesis
Verify timing

Slide 12.38
Multi-V DD

Objective
Reduce dynamic power by reducing theVDD2 term
Higher supply voltage used for speed-critical logic
Lower supply voltage used for non-speed-critical logic

Example
MemoryVDD = 1.2 V
LogicVDD = 1.0 V
Logic dynamic power
savings = 30%

Slide 12.39
Multi-VDD Issues

Partitioning
Which blocks and modules should use which voltages?
Physical and logical hierarchies should match as much as possible
Voltages
Voltages should be as low as possible to minimize CVDD2f
Voltages must be high enough to meet timing specs
Level shifters
Needed (generally) to buffer signals crossing islands
May be omitted if voltage differences are small, ~ 100 mV
Added delays must be considered
Physical design
Multiple VDD rails must be considered during floorplanning
Timing verification
Sign-off timing verification must be performed for all corner cases across
voltage islands
For example, for two voltage islands Vhi,Vlo
Number of timing-verification corners doubles

Slide 12.40
Multi-VDD Flow
Determine which blocks
run at which VDD

Multi-voltage
synthesis

Determine floorplan

Multi-voltage placement

Clock tree synthesis

Route

Verify timing

Slide 12.41
Power Integrity Methodologies

Motivation
Ensure that the power delivery network will not
adversely affect the intended performance of the IC
Functional operation
Performance speed and power
Reliability
Method
Analyze specific voltage drop parameters
Effective grid resistances
Static voltage drop
Dynamic voltage drop
Electromigration
Analyze impact of voltage drop upon timing and noise

Slide 12.42
Power Integrity Verification Flow

Floorplan, Power Grid


Distribution

Placement, Power
Routing

Check Effective Stimulus Selection


Resistances (Vectorless or simulation based)
Static Voltage Drop
Extracted
Analysis Grid RLC
Dynamic Voltage Drop
Analysis & Optimization Voltage Drop & EM analyses Package
(Compute time-varying currents) Model

Routing
Instance
Currents
Dynamic Voltage Drop
& EM Analysis
Voltage Drop optimization
(Spread peak currents, Decap
Dynamic Voltage Drop insert & optimize decaps) Models
Optimization
Voltage-Aware
Timing & SI Analysis Voltage-aware STA/SI
(Compute voltage drop effects
Power Grid Sign-off on timing & SI)

Slide 12.43
Power Integrity: Effective Resistance Check

Resistance Histogram

Motivation
Verify connectivity of all
circuit elements to the
power grid
Are all elements
connected?
Are all elements
connected to the grid
with a low resistance?

Method
Extract power grid to
obtain R
Isolate and analyze R
in the equation
V (t ) = I(t )*R + C*dv/dt *R + L*di/dt
Well formed distribution Unexpected outliers
of resistances indicates indicate poorly
well-connected connected (high R)
instances Instances.

Slide 12.44
Power Integrity: Stimulus Selection

Slide 12.45
Power Integrity: Static Voltage Drop

Motivation
Verify first-order voltage drop
Is grid sufficient to handle
average current flows?
Static voltage drop should
only be a few % of the supply
voltage
0% drop

Method 2.5% drop


5% drop
Extract power grid to 7.5% drop
obtain R 10% drop

Select stimulus
Compute time-averaged
power consumption for a Typical static voltage drop bulls-eye of
typical operation to obtainI an appropriately constructed power grid.
But 10% static voltage drop is very high.
Compute: V = IR
Non time-varying

Slide 12.46
Power Integrity: Dynamic Voltage Drop

Motivation
Verify dynamic voltage drop
Are current and voltage transients within spec?
Can chip function as expected in external RLC environment?

Method
Extract power grid to obtain on-chip R and C
Include RLC model of the package and bond wires
Select stimulus
Compute time-varying power for specific operation to obtain I(t)
Compute V(t) = I(t)*R + C*dv/dt*R + L*di/dt

Time step 1 @ 20 ps Time step 2 @ 40 ps Time step 3 @ 60 ps Time step 4 @ 80 ps

Slide 12.47
Voltage Drop Mitigation with Decoupling Caps

Explicit decoupling caps can be added to the power


delivery network
Effectiveness highly dependent upon proximity to supply noise aggressor
DECAP

Rpkg Lpkg On-chip R V DD


C
Cpkg

Package + Rdecap
bond-wire Cn-well Ron
Ccoupling
Kmutual

Cdecap
Ccell
Rsignal
Rdecap
Cp-well Ron
Csignal

Rpkg Lpkg RVss


VSS
CVss
Cpkg

Slide 12.48
Decoupling Cap Effectiveness

30
Number of Instances (x1000)

25

20

15

10

0
0.7 0.8 0.9 1.0
Effective Voltage (V V )

47 mV improvement
improv
imp roveme nt after
ement after
Decaps placement Decaps optimized decap
p placement
decap p cem
pla cement
ent optimization
opt
p imi
imizat
zation
ion
based upon placement based
available space upon dynamic
voltage drop

Slide 12.49
Dynamic Voltage Drop Impact
Timing analysis without voltage drop finds no negative slack paths
Timing analysis with voltage drop uncovers numerous timing violations

Without Voltage Drop With Voltage Drop


4500
4000
3500
Number of paths

3000
2500
90000 2000
80000 1500
Number of paths

70000
1000
60000
500
50000
0
40000 2 1.5 1 0.5 0 0.5
30000
20000
10000
0
2

10

11

12

13

14

15
0

8
1

Slack(ns)

Slide 12.50
Summary Low Power Methodology Review

Characterization and modeling for power


Required for SoC cell-based design flows

Power analysis
Run early and often, during all design phases

Power reduction
Multiple techniques and opportunities during all phases
Most effective opportunities occur during the early design phases

Power integrity
Voltage drop analysis is a critical verification step
Consider the impact of voltage drop upon timing and noise

Slide 12.51
Some Useful References
Books and Book Chapters
A. Chandrakasan and R. Brodersen, Low Power Digital CMOS Design, Kluwer Academic Publishers, 1995.
D. Chinnery and K. Keutzer, Closing the Power Gap Between ASIC and Custom, Springer, 2007.
J. Frenkil, Tools and Methodologies for Power Sensitive Design, in Power Aware Design Methodologies, M. Pedram
and J. Rabaey, Kluwer, 2002.
J. Frenkil and S. Venkatraman, Power Gating Design Automation, in Closing the power crap Between
ASIC and custom, Chapter 10, Springer2007.
M. Keating et al., Low Power Methodology Manual For System-on-Chip Design, Springer, 2007.
C. Piguet, Ed., Low-Power Electronics Design, Ch. 3842, CRC Press, 2005

Articles and Web Sites


Cadence Power Forward Initiative, http://www.cadence.com/partners/power_forward/index.aspx
A. Chandrakasan, S. Sheng and R. W. Brodersen, "Low-power digital CMOS design," IEEE Journal of Solid-State
Circuits, pp. 473484, Apr. 1992.
N. Dave, M. Pellauer and S. Gerding, Arvind, 802.11a transmitter: A case study in microarchitectural exploration,
MEMOCODE, 2006.
S. Gary, P. Ippolito, G. Gerosa, C. Dietz, J. Eno and H., Sanchez, PowerPC603, a microprocessor for portable
computers, IEEE Design and Test of Computers, 11(4), pp. 1423, Winter 1994.
S. Kosonocky, et. al., Enhanced multi-threshold (MTCMOS) circuits using variable well bias, ISLPED Proceedings,
pp. 165169, 2001.
Liberty Modeling Standard, http://www.opensourceliberty.org/resources_ccs.html#1
Sequence PowerTheater, http://www.sequencedesign.com/solutions/powertheater.php
Sequence CoolTime,
http://www.sequencedesign.com/solutions/coolproducts.php
Synopsys Galaxy Power Environment, http://www.synopsys.com/products/solutions/galaxy/power/power.html
Q. Wang and S. Vrudhula, Algorithms for minimizing standby power in deep submicrometer, dual-Vt CMOS circuits,
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 21(3), pp 306318, Mar.
2002.

Slide 12.52

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