Verizon NEBSTM Compliance: Thermal

Management Requirements for

Improved Energy Efficiency of
Telecommunications Equipment
Verizon Technical Purchasing Requirements
VZ.TPR.9208
Issue 2, July 2010

© Verizon 2010 All Rights Reserved

Information contained herein is subject to change without notice.
CHANGE CONTROL RECORD:

Version Date Action* Reason for Revision

Issue 1 7/15/2009 New New Document

Issue 2 7/27/2010 Change Removed ITL validation requirement

* New, Add, Delete, Change, Reissue

Trademark Acknowledgement – NEBS is a trademark of Telcordia Technologies, Inc.

© Verizon 2010 All Rights Reserved

Information contained herein is subject to change without notice.
PREPARED BY:

Name, Title, Organization Date

Mark A. Ali 6/1/09
DMTS – NEBS Compliance and Quality Assurance
Verizon Corporate Network and Technology Organization
Systems Integration and Testing Department
320 St. Paul Place, Floor 14
Baltimore, MD 21202
Phone: 410-736-5907; Fax: 410-736-5144
Email: [email protected]

APPROVED BY:

Name, Title, Organization Date

Ludwig C. Graff 6/2/09
Director, NEBS Compliance and Quality Assurance
Verizon Corporate Network and Technology Organization
Systems Integration and Testing
320 St. Paul Place, Floor 14
Baltimore, MD 21202
Phone: 410-736-5904; Fax: 410-736-5144
Email: [email protected]

VZ.TPR.9208 Page - 3 of 19
© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
 Table of Contents

1.0  PURPOSE .......................................................................................................................... 5 

2.0  SCOPE ............................................................................................................................... 5 
3.0  REFERENCES.................................................................................................................. 6 
4.0  ACRONYMS ..................................................................................................................... 6 
5.0  DEFINITIONS .................................................................................................................. 7 
6.0  APPLICABILITY ............................................................................................................. 7 
7.0  BACKGROUND ............................................................................................................... 8 
8.0  GENERAL EQUIPMENT THERMAL MANAGEMENT REQUIREMENTS ........ 8 
9.0  SPECIFIC EQUIPMENT THERMAL MANAGEMENT REQUIREMENTS ....... 10 
Table 1 – Thermal Management Requirements .................................................................. 11 

VZ.TPR.9208 Page - 4 of 19
© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
1.0 PURPOSE

The purpose of this Verizon Technical Purchasing Requirement (VZ.TPR) document

is to introduce the next phase of Verizon’s drive to procure more energy efficient
network equipment from equipment suppliers. The new initiative entitled “Thermal
Modeling, Simulation and Testing Certification Program (TMST)” will be
administered by the NEBS and Quality Assurance team. This TPR specifies Thermal
Modeling, Simulation and Testing requirements for Telecommunications Equipment
purchased by Verizon. A product’s energy consumption will decrease when (i) the
internal airflow impedance is lowered, (ii) heat-producing components are spread over
a wider area/volume, and (iii) the amount and directionality of airflow delivered to
heat-producing components within the chassis is optimized. Achieving these measures
will reduce the power delivered to the internal fans used to cool components within the
chassis.

2.0 SCOPE

This VZ.TPR document specifies the Verizon Thermal Modeling, Simulation and
Testing requirements to help improve the Energy Efficiency of Telecommunications
Equipment purchased by Verizon. The equipment covered is for use in either
Controlled (Central Office and CEV) or Uncontrolled (OSP and RT) environment
applications.

The TMST program requires that thermal management be used as part of an integrated
equipment design process to effectively and efficiently minimize and remove the heat
generated by the equipment when it is powered up and in operation. This ensures that
products function efficiently within the installation environment, have correctly sized
fans (if so equipped) to evacuate heat, and that embedded discrete components inside
the chassis operate within their OEM-specified thermal envelopes. The overall goal is
to reduce energy consumption while maintaing equipment reliability.

Suppliers and/or ITLs may use any of the many commercially available Computational
Fluid Dynamics (CFD) software programs to execute the heat flow calculations based
on a representative physical model of the equipment. Thermal Modeling, Simulation
and Testing of the equipment can be done by the equipment manufacturer or by a
selected Verizon certified Independent Test Laboratory (ITL). The supplier-selected
ITL shall document all test results using Table 1 - Thermal Management Requirements
of this document. The equipment supplier shall provide Table 1 to Verizon as an
addendum to the TCG NEBS Compliance Report.

VZ.TPR.9208 Page - 5 of 19
© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
 In all instances of test planning and test execution, the specified version of the
referenced GR document shall be used. Where no version is specified, the most recent
and accepted version of the referenced GR document shall be used.
3.0 REFERENCES

GR-63-CORE NEBSTM Requirements: Physical Protection Issue 3, March 2006

Generic Physical Design Requirements for Telecommunications
GR-78-CORE
Products and Equipment Issue 1, September 1997
Generic Requirements for Assuring the Reliability of Components
GR-357-CORE
Used in Telecommunications Equipment Issue 1, March 2001
Generic Requirements for Electronic Equipment Cabinets, Issue 2,
GR-487-CORE
March 2000
Electromagnetic Compatibility and Electrical Safety, Generic
GR-1089-CORE Criteria for Network Telecommunications Equipment Issue 4, June
2000
Generic Requirements for Passive Optical Components Issue 3,
GR-1209-CORE
March 2001
Generic Reliability Assurance Requirements for Passive Optical
GR-1221-CORE
Components Issue 2, January 1999.
Energy Efficiency Requirements for Telecommunications
VZ.TPR.9205
Equipment, Issue 3, September 2008
NEBS Requirements for the Physical Design and Manufacture of
VZ.TPR.9306 Telecommunication Products and Equipment Issue 1, November
2008

4.0 ACRONYMS

CAD Computer Aided Design

CAE Computer Aided Engineering
CFD Computational Fluid Dynamics
CEV Controlled Environmental Vault
CO Central Office
EUT Equipment Under Test
ITL Independent Testing Laboratory
OEM Original Equpment Manufacturer
OSP Outside Plant
PB Printed Board (Bare, unpopulated board)
PBA Printed Board Assembly (PCB also used)
RT Remote Terminal

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© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
5.0 DEFINITIONS
Thermal Management: The use of various temperature sensors and cooling methods such as
forced air flow within an electrical component, printed board assembly or electronic system to
control overall temperature of the devices, PBAs and internal cabinet temperatures.
Heat Flow: The amount of energy transferred per unit of time. In SI units, heat flow is
measured in Joules per second or Watts.
Modeling: A mathematical or physical representation of system relationships. Modeling may
apply broadly to device structure, equipment and management systems.
Computational fluid dynamics: A branch of fluid mechanics that uses numerical methods
and algorithms to analyze and solve problems that involve fluid flows.
Enclosure Thermal Impedance: The resistance to airflow within an enclosure caused by
obstructions in the flow path between inlet and outlet. Thermal impedance is measured in
cubic feet per minute at a given static pressure in inches of water.
Natural Convection: The process of heat removal from a hot object by vertical movement of
air rising from the hot object as a result of the air expanding when heated and becoming less
dense.
Forced Air Cooling: The process of heat removal from a hot object by vertical or horizontal
airflow over the hot object driven by electrically powered fans or other means.
Fan Characteristic Curve: A graph for a given fan showing the airflow in cubic feet per
minute as a function of the static pressure drop in inches of water.
Enclosure Characteristic Curve: A graph for a given enclosure showing the airflow
through the enclosure as a function of the static pressure.
System Operating Point: The intersection of the fan and the enclosure characteristic curves
when these are plotted on the same graph.

6.0 APPLICABILITY

Thermal management for improved energy efficiency and reliability of electronic equipment
is applicable during the design phase of components, printed board assemblies (PBA), shelves
and frame-level systems. This document currently addresses requirements from the PBA level
and above. It applies to stand-alone circuit packs as well as to fully populated shelves,
cabinets and other enclosures employing either natural convection or forced-air cooling. It
does not currently apply to the internal thermal design of a component, e.g., a packaged
semiconductor device. In particular:

1. The TMST program is applicable to new products designed, manufactured, and

marketed to Verizon after July 1, 2010.
2. The TMST program is applicable to previously designed, manufactured, and marketed
products that have been modified so as to alter any operational feature or characteristic
that may affect components’ and chassis temperatures. Suppliers shall work with an

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© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
 ITL to determine the impact of all modifications and to determine the necessary TMST
regression testing needed to recertify the product.
3. The TMST program requirements are not applicable to Customer Premises Equipment
such as television Set Top Boxes and Broadband Home Routers and modems.

7.0 BACKGROUND

The total cost to operate a piece of electronic equipment can be broken down into two parts.
The first is the cost to operate the equipment when it is powered up and executing its intended
design function and the second is the cost to remove the heat generated by the equipment from
the room into which the generated heat is released. This document addresses the former and
not the latter part of the total operating cost equation.

This document requires that thermal management be used as part of an integrated equipment
design process to effectively and efficiently minimize and remove the heat generated by the
equipment when it is powered up and in operation – see flowcharts 1 & 2 in Appendix A-2.
This ensures the equipment functions at its optimum thermal operating point, has correctly
sized fans for heat removal, if applicable, and results in the constituent components operating
within their specific thermal constraints. The overall goal is to help reduce energy
consumption and assure equipment reliability.

This document requires the use of any of the many commercially available Computational
Fluid Dynamics (CFD) software programs to execute the heat flow calculations based on a
representative physical model of the equipment. Thermal Modeling, Simulation and Testing of
the equipment shall be performed by either the equipment manufacturer or an ITL. The
equipment manufacturer shall verify conformance to the requirements and shall provide these
results to an ITL for documenting into Table 1 - Thermal Management Requirements of this
document. The equipment supplier shall provide Table 1 to Verizon as an addendum to the
TCG NEBS Compliance Report.

8.0 GENERAL EQUIPMENT THERMAL MANAGEMENT REQUIREMENTS

Verizon requires that manufacturers submit Thermal Management Requirements results for
their equipment to a Verizon certified ITL. The results will be used to show conformance to
the thermal modeling requirements specified in this document. For a list of Verizon certified
laboratories and locations, consult the Verizon web page at:
http://www.verizonnebs.com/tcppage.html.

R8-1 [1] The equipment manufacturer shall establish and implement a thermal management
program for all equipment supplied to Verizon.

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Information contained herein is subject to change without notice.
R8-2 [2] Thermal management shall be accomplished by thermal modeling and computer
simulation of the EUT using any of the many commercially available 3D Computational Fluid
Dynamics (CFD) software programs. Some examples of these software programs are given in
Appendix A-1 of this document.

R8-3 [3] The Thermal Modeling, Simulation and Testing reports provided to the selected ITL
shall contain the predicted values based on the simulated information from the PBA level to
the shelf, cabinet or other enclosure level to demonstrate that the equipment design has been
optimized for maximum thermal efficiency. Evidence that this requirement has been satisfied
includes provision of thermal simulation data, PBA and enclosure airflow temperature
profiles, PBA and enclosure airflow velocity profiles, and enclosure inlet air and outlet air
temperatures. Processes for obtaining this information include the following requirements:

R8-4 [4] As part of, or subsequent to completing the appropriate circuit and logic design to
accomplish the desired electronic function, the equipment manufacturer shall iteratively adjust
the component placement and physical board layout to optimize the thermal efficiency of each
PBA when it is mounted in its intended orientation and executing its intended function.

R8-5 [5] As part of, or subsequent to completing architectural layout and system level
integration, the equipment manufacturer shall optimize the heat removal from all power
generating components, printed board assemblies and other heat generating elements by
implementing a Thermal Modeling, Simulation and Testing program for:

1. All stand-alone PBAs in the orientation to be used in the equipment

2. The fully populated shelf, rack, cabinet or other enclosure that will be used

R8-6 [6] The equipment manufacturer shall provide its selected ITL with the Thermal
Modeling, Simulation and Testing reports for all PBAs (circuit packs or plug-ins) as well as a
similar report for the fully populated enclosure to be used. These reports shall include:

1. Temperature and airflow velocity profile of each PBA in its intended orientation
2. The surface temperature of all components
3. The surface temperature of all printed boards
4. The air temperature and velocity profile within the enclosure
5. The minimum airflow required within the enclosure for conformity to requirements in
this TPR

R8-7 [7] If the equipment manufacturer generates its own Thermal Modeling, Simulation and
Testing reports, it shall identify which CFD program was used and specify the boundary
conditions and assumptions used as inputs to the CFD program.

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© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
R8-8 [8] Conformance to the requirements of this TPR shall be documented in Table 1 -
Thermal Management Requirements of this document. The equipment manufacturer shall
provide this report to Verizon as an addendum to the TCG NEBS Compliance report.

9.0 SPECIFIC EQUIPMENT THERMAL MANAGEMENT REQUIREMENTS

Thermal Management Requirements for Telecommunications Equipment purchased by

Verizon are detailed below and in Table 1 - Thermal Management Requirements. Table 1 is
designed to not only provide the required tests and declarations but to also provide the
required format for reporting the design values and summarizing their conformance status.

9.1 Thermal Management Requirements at the Component Level

R9-1 [9] There is currently no thermal management requirements internal to the component.
However, for all electrical components selected by the equipment manufacturer, the Thermal
Modeling, Simulation and Testing reports shall contain information to demonstrate
conformance to the materials and component level requirements external to the component
specified in Table 1 of this document.

9.2 Thermal Management Requirements at the PBA Level

R9-2 [10] After completing the appropriate circuit and logic design to accomplish the desired
electronic function, the equipment manufacturer shall iteratively adjust the component
placement and physical layout of the board to optimize the thermal efficiency of the PBA
while maintaining the desired functionality.

R9-3 [11] For all PBAs, the Thermal Modeling, Simulation and Testing reports shall contain
information to demonstrate conformance to the PBA level requirements specified in Table 1
of this document.

9.3 Thermal Management Requirements at the Enclosure Level

R9-4 [12] After system integration into the end use enclosure, the Thermal Modeling,
Simulation and Testing reports shall contain information to demonstrate conformance to the
enclosure level requirements specified in Table 1 of this document.

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© Verizon 2010 All Rights Reserved
Information contained herein is subject to change without notice.
 Please use Table 1 below to document and report test
results to Verizon.
Table 1 – Thermal Management Requirements

Material Level Thermal Criteria/Declarations

Note 1: Conformance to these requirements may be satisfied by suppler attestation using material manufacturers’
datasheets.
Note 2: Conforming materials shall be verified but need not be reported herein. Only nonconforming materials shall be
reported.
Item List of Nonconforming
Parameter/Test Item Test Method /
Ref. Material with Associated
Item Source Ref. Required Value
# Design Value
1. TG : Glass transition temperature of all TPR-9306 > 95oC
polymeric materials and GR-1221:
R4-24
2. THDT : Heat distortion temperature of all TPR-9306 > 150oC
polymeric materials and This
document
3. OIT: Oxidative Induction Time of all TPR-9306 20 minutes minimum after
polymeric materials ASTM D aging at 90°C for 14 days
3895
and
GR-20[138]
4. Melt Flow/Melt Volume Index of all This Verify conformity to
polymeric materials document specification per ASTM
D1238
5. Thermal Aging of all polymeric GR-771: 90°C for 30 days;
materials 6.4.1 and GR- 1. No visible
771: R5- deterioration,
11[85] deformation, melting or
cracking
2. < 20% degradation in
mechanical properties
6. Component outer encapsulation material TPR-9306 Shall withstand 85°C
GR-78: [695, minimum.
696]
7. Printed board laminates, solder masks, This Shall withstand 85°C
legend and marking inks, repair polymer document minimum.
and adhesive materials
8. Glass Transition temperature of Label 1221: R4-24 > 95oC
Attach Adhesives TG

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Information contained herein is subject to change without notice.
Printed Board Assembly (PBA) Level Criteria/Declarations
Item
Parameter/Test Item Test Method /
Ref. Declared Value
Item Source Ref. Required Value
#
9. Maximum PBA laminate surface This Shall not exceed
temperature document the maximum rated
laminate surface
temperature
10. Hot spot (a localized area exceeding the This Hot spot temperature
maximum laminate surface temperature) document shall not exceed 10°C
at the surface of PBA laminate above the maximum rated
laminate surface
temperature
11. Maximum outer surface or case This Shall not exceed
temperature of components document the maximum rated outer
surface temperature as
detailed on the
component data sheet
12. High power dissipating components This Identify and report the
document top five (5) components
dissipating more 1.0 Watt
or operating at a surface
power density ≥ 1.0
W/cm2
13. Surface temperature of the top five (5) This Record simulated values
high power dissipating components document for each component
identified above when measured in the
intended PBA orientation plane
14. Temperature and airflow profiles (speed This The thermal simulation
and direction) for each PBA document report shall include the
temperature and airflow
profiles of both sides of
the PBA

Enclosure (Shelf, Rack or Cabinet) Level Criteria/Declarations

Item
Parameter/Test Item Test Method /
Ref. Declared Value
Item Source Ref. Required Value
#
15. System Power dissipation (measured This The manufacturer shall
power based upon maximum operating document specify the worst case
condition) power dissipation in
watts of all electronics
within the fully equipped
enclosure
16. Airflow required GR-1209: The manufacturer and/or
Sect. 3.7.3.3 ITL shall calculate the

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Information contained herein is subject to change without notice.
 Table 3-1 airflow required, in cubic
feet per minute, to
remove the above
specified worst case heat
dissipation at:
1. Inlet air temperature:
= 30°C for CO and
= 65°C for OSP
17. System Airflow Impedance This The manufacturer and/or
document ITL shall derive the
system impedance curve
by measuring the static
pressure in inches of
water within the fully
equipped enclosure at:
1. Calculated required
airflow in cu ft/min
and
2. At ± 50% of 1 above
18. Fan Selection This The manufacturer shall
document specify the type of fan
selected to provide the
required airflow through
the fully equipped
enclosure at an inlet air
temperature of:
1. 40°C for CO
2. 65°C for OSP
19. System Operating Point This The manufacturer and/or
document the ITL shall derive the
system operating point
from the intersection of
the above System
Impedance Curve and the
Fan Characteristic Curve
of the selected fan. This
point shall be positioned
midway within the
operating range of the fan
consistent with:
1. The required airflow &
2. The static pressure at
the system operating
point
20. Enclosure internal ambient temperature GR-1209: The equipment
Sect.3.7.3.3 manufacturer or the ITL
Table 1 shall record the simulated
ambient temperature
profile and values
internal to the enclosure
at external ambients of

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Information contained herein is subject to change without notice.
 40°C (CO and CEV
applications) and 65°C
(OSP applications)

21. Fan Failure This Thermal modeling reports

document provided by the
equipment manufacturer
or generated by the ITL
shall include the effect of
fan failure on component
temperature and internal
ambient temperature of
enclosure.
22. Airflow Distribution This Thermal modeling reports
document provided by the
equipment manufacturer
or generated by the ITL
shall include (i) the
airflow within the
enclosure (ii) in each card
slot (iii) the highest
temperature in single card
slot, all under different
card configurations and
the following conditions:
1. With all fans
operational
2. With fans failing
sequentially
3. With fan modules
removed for a service
period of 3 minutes
4. With air filter(s)
blocked at a detectable
arrestance level
23. Airflow distribution under single fan This The manufacturer and/or
failure condition document ITL shall calculate the net
airflow required through
the shelf, in cubic feet per
minute, to remove the
above specified worst
case heat dissipation
under a single fan failure
condition at an inlet air
temperature:
= 40°C for CO and
= 65°C for OSP
24. Airflow distribution during fan module This The manufacturer and/or
replacement document ITL shall simulate and
calculate the net airflow
required through the

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Information contained herein is subject to change without notice.
 shelf, in cubic feet per
minute, to remove the
above specified worst
case heat dissipation
while a fan module is
removed for servicing.
The maximum period for
replacement of the
module shall be three (3)
minutes.
Inlet air temperature:
= 40°C for CO and
= 65°C for OSP
25. Airflow distribution test for blocked air This The manufacturer and/or
filter document ITL shall simulate and
calculate the net airflow
required through the
shelf, in cubic feet per
minute, to remove the
above specified worst
case heat dissipation
while a the air filter is
clogged to 85% or the
maximum allowed limit.
If the system has a means
of detecting filter
blockage, this test shall
be performed at the
threshold blockage. If the
system does not have an
automatic filter blockage
detection feature, this test
shall be performed at 0 to
100% blocked conditions.
Inlet air temperature:
= 40°C for CO and
= 65°C for OSP

Operating Environment References: the following data points are provided for
information purposed only.
Controlled Environments (CO & CEV)
Ambient Operating GR-78: [694] +5°C to +40°C
Temperature Range GR-63: [72]
GR-1209:
Section 3.7 &
Table 3-1
Ambient Operating GR-1209: 5% to 85% RH
Humidity Range Section 3.7 &

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Information contained herein is subject to change without notice.
 Table 3-1
Ambient Storage GR-1209: -40°C to +85°C
Temperature Range Section 3.7 &
Table 3-1
Un-Controlled Environments (OSP, RT & Cabinets without Fans)
Ambient Operating GR-78: [695] -40°C to +65°C
Temperature Range GR-1209:
Section 3.7 &
Table 3-1
Ambient Operating GR-1209: 5% to 85% RH
Humidity Range Section 3.7 &
Table 3-1
Ambient Storage GR-1209: -40°C to +85°C
Temperature Range Section 3.7 &
Table 3-1

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 Appendix A-1
Some Examples of Commercially Available
CFD Thermal Modeling Software

1. WinTherm from Thermo Analytics Inc. - Calumet, MI

2. RadTherm from Thermo Analytics Inc. - Calumet, MI
3. SINDA/FLUENT from Cullimore and Ring Technologies – Littleton, CO
4. ITT/TAS from Harvard Thermal Inc. – Harvard, MA
5. SAUNA from Thermal Solutions Inc. Ann Arbor, MI
6. COOLIT from DAAT Research Hanover, NH
7. COSMOS FloWorks from ACI Technologies Toronto, Canada
8. FloTherm from Flomerics/Mentor Graphics Wilsonville, OR
9. ICEPAK from Fluent/Anysys Canonsburg, PA
10. Phoenetics/STAR from CD-Adapco Melville NY
11. Siemens PLM Software NX I-deas ESC
12. STAR-CCM+ from CD-adaptco – Plymouth, MI

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Information contained herein is subject to change without notice.
 Appendix A-2: Flowcharts

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 Equipment Manufacturer, ITL and
Verizon Interfaces
3. Equipment Manufacturer Runs Simulation and Validation; ITL Generates Final Report

Equipment Manufacturer ITL Verizon

Input Design CFD Y Build Physical Validate Generate Final Report and
Requirements Requirements Yes
Requirements Product Simulation Prototype Requirements Report Product Deployment
Met? Met?

No
No

4. Equipment Manufacturer engages ITL to Run Simulation; ITL Generates Final Report

Equipment
Equipment Manufacturer ITL Manufacturer ITL Verizon

Input Design CFD Y Build Physical Validate Generate Final Report and
Requirements Requirements Yes Report
Requirements Product Simulation Prototype Requirements Product Deployment
Met? Met?

No
No

END OF THERMAL MANAGEMENT REQUIREMENTS DOCUMENT

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Information contained herein is subject to change without notice.