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Copper MIM Parts: Specs & Applications

This document discusses copper metal injection molding (Cu MIM) materials and applications. It provides specifications for Cu MIM powder including chemical composition and material properties. Potential applications mentioned include heat sinks, connectors, and leads where copper's thermal conductivity is valuable. Examples of Cu MIM parts shown are a heat sink and cold plate for power electronics. Cu MIM is assessed to have advantages over wrought, cast, and machined copper in net shape production capability.

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Ramachandra Kulkarni
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260 views12 pages

Copper MIM Parts: Specs & Applications

This document discusses copper metal injection molding (Cu MIM) materials and applications. It provides specifications for Cu MIM powder including chemical composition and material properties. Potential applications mentioned include heat sinks, connectors, and leads where copper's thermal conductivity is valuable. Examples of Cu MIM parts shown are a heat sink and cold plate for power electronics. Cu MIM is assessed to have advantages over wrought, cast, and machined copper in net shape production capability.

Uploaded by

Ramachandra Kulkarni
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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(Cu-MIM)

Corporate Presentation

Indo-MIM Confidential
Contents

• Copper MIM (Cu MIM) Material specification

• Potential Applications for Copper MIM parts

• Copper MIM parts examples

Indo-MIM Confidential
Copper MIM materials
Following Copper material offered by INDO-MIM
MIM Cu :

Chemical Composition:

Material Designation Nominal Chemical Composition, % - Copper

Cu

MIM-Cu 99.8 Minimum

100.0 Maximum

Other Elements: 0.2% max, excluding silver.

Indo-MIM Confidential
MIM Cu
Material Properties:
TYPICAL VALUES
Tensile Properties
Density Thermal Ultimate Yield Strength Elongation
Conductivity Strength (0.2%) (in 25mm)
(at 25 °c)
g/cm3 W/(m-K) MPa MPa %
8.75 360 207 69 30

Coefficient of Thermal Expansion (CTE):


From 20 °F TO: Average CTE (X 10-6/ °C)
38 °C 15.7
66 °C 16.0
93 °C 16.4
121 °C 16.7
149 °C 16.9

In accordance with ASTM E228 & using a push rod dilatometer.


MIM Cu
Microstructure:
Sintered

Magnification : 200X

Microstructure reveals homogenous microstructure with little to no evidence of


oxides or contaminants with uniformly distributed porosity.

Indo-MIM Confidential
Other Copper alloy grades through MIM
Cu [ Ni Sn Fe Cr Mn Si O C Other

> -- -- -- -- -- -- -- -- -- --

Cu999
< Bal. -- -- 0.1 -- -- -- 0.05 -- --

> -- -- 7.0 -- -- -- -- -- -- --

CuSn8
< Bal. 9.0 -- -- -- -- -- -- 0.2

> -- 8.5 5.5 -- -- -- -- -- -- --

CuNi9Sn6
< Bal. 9.5 6.5 -- -- -- -- -- -- 0.3

> -- 14.5 7.5 -- -- -- -- -- -- --

CuNi15Sn8
< Bal. 15.5 8.5 -- -- -- -- -- -- 0.3

Tailor-made grades with specific requirement of chemical composition are feasible


through MIM.
Indo-MIM Confidential
Potential Applications for Copper MIM Parts

• Mainly the parts for thermal management application like Heat Sinks for
LED & High power chips, specifically for IGBT.

• Copper parts are therefore the markets Parts for Electro technology, E-
mobility, and renewable energy.

• Connector, leads for electrical applications.

Indo-MIM Confidential
Copper MIM Parts

Indo-MIM Confidential
Copper MIM Parts

*Development of Copper MIM Powders for Thermal Management Applications.


R. Zauner, R. Nagel), E. Neubauer, K. Portschy1, P.A Davies, M.A.Kearns.
Indo-MIM Confidential
Copper MIM Parts
Comparison of Copper Materials for Heat Sink Applications

MIM Wrought Cast Cast


C11000 C81100 C83400
Density
(g/cm3) 8.5 8.9 8.9 8.7

Thermal 320-330 380-390 340-350 180-190


Conductivity
(W/Mk)
Net-Shape Excellent Difficult to Difficult to Good
Capability Machine Cast

*Metal Injection Molding Of Heat Sinks, Number 4, Volume 10.

Indo-MIM Confidential
Cold Plate MIM Part for IGBT Application

Cold Plates used in the IGBT system which helps the heat to dissipate have been
developed using MIM Technology in Copper material.
Indo-MIM Confidential
Complexity Simplified

Indo-MIM Confidential

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