[AK09911]

= Short Datasheet =
AK09911
3-axis Electronic Compass

1. Features
 A 3-axis electronic compass IC with high sensitive Hall sensor technology.
 Best adapted to pedestrian city navigation use for cell phone and other portable appliance.

 Functions:
 3-axis magnetometer device suitable for compass application
 Built-in A to D Converter for magnetometer data out
 14-bit data out for each 3-axis magnetic component
 Sensitivity: 0.6 µT/LSB (typ.)
 Serial interface
 I2C bus interface
Standard, Fast and High-speed mode (up to 2.5 MHz) compliant with Philips I2C specification Ver.2.1
 Operation mode
 Power-down, Single measurement, Continuous measurement, Self-test and Fuse ROM access
 DRDY function for measurement data ready
 Magnetic sensor overflow monitor function
 Built-in oscillator for internal clock source
 Power on Reset circuit
 Self test function with internal magnetic source

 Operating temperatures:
 -30˚C to +85˚C
 Operating supply voltage:
 Analog power supply +2.4V to +3.6V
 Digital Interface supply +1.65V to analog power supply voltage
 Current consumption:
 Power-down: 3 µA (typ.)
 Measurement:
 Average current consumption at 100 Hz repetition rate: 2.4 mA (typ.)

 Package:
 AK09911C 8-pin WL-CSP (BGA): 1.2 mm × 1.2 mm × 0.5 mm (typ.)

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2. Overview
AK09911 is 3-axis electronic compass IC with high sensitive Hall sensor technology.
Small package of AK09911 incorporates magnetic sensors for detecting terrestrial magnetism in the X-axis, Y-axis, and
Z-axis, a sensor driving circuit, signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor.
Self test function is also incorporated. From its compact foot print and thin package feature, it is suitable for map heading
up purpose in GPS-equipped cell phone to realize pedestrian navigation function.

AK09911 has the following features:

(1) Silicon monolithic Hall-effect magnetic sensor with magnetic concentrator realizes 3-axis magnetometer on a
silicon chip. Analog circuit, digital logic, power block and interface block are also integrated on a chip.
(2) Wide dynamic measurement range and high resolution with lower current consumption.
 Output data resolution: 14-bit (0.6 µT/LSB)
 Measurement range: ±4900 µT
 Average current at 100 Hz repetition rate: 2.4 mA (typ.)
(3) Digital serial interface
 I2C bus interface to control AK09911 functions and to read out the measured data by external CPU. A
dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V.
(4) DRDY register informs to system that measurement is end and set of data in registers are ready to be read.
(5) Device is worked by on-chip oscillator so no external clock source is necessary.
(6) Self test function with internal magnetic source to confirm magnetic sensor operation on end products.

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3. Table of Contents
1. Features ..............................................................................................................................1
2. Overview..............................................................................................................................2
3. Table of Contents.................................................................................................................3
4. Circuit Configration ..............................................................................................................4
4.1. Block Diagram ..............................................................................................................4
4.2. Block Function ..............................................................................................................4
4.3. Pin Function ..................................................................................................................5
5. Overall Characteristics ........................................................................................................6
5.1. Absolute Maximum Ratings ..........................................................................................6
5.2. Recommended Operating Conditions ..........................................................................6
5.3. Electrical Characteristics ..............................................................................................6
5.3.1. DC Characteristics .................................................................................................6
5.3.2. AC Characteristics .................................................................................................7
5.3.3. Analog Circuit Characteristics ................................................................................8
5.3.4. I2C Bus Interface ....................................................................................................9
6. Function Explanation .........................................................................................................12
6.1. Power States ...............................................................................................................12
6.2. Reset Functions ..........................................................................................................12
6.3. Operation Mode ..........................................................................................................13
7. Example of Recommended External Connection .............................................................14
8. Package.............................................................................................................................15
8.1. Marking .......................................................................................................................15
8.2. Pin Assignment ...........................................................................................................15
8.3. Outline Dimensions.....................................................................................................16
8.4. Recommended Foot Print Pattern ..............................................................................16
9. Relationsip between the Magnetic Field and Output Code ..............................................17

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4. Circuit Configration
4.1. Block Diagram

3-axis
Hall Chopper Pre-
SW AMP Integrator＆ADC
sensor
MUX

OSC
HE-Drive SCL

Interface Logic SDA

& Register
Timing
Control
VREF RSTN
Magnetic source

POR FUSE ROM

TST CAD VSS VDD VID

4.2. Block Function

Block Function
3-axis Hall sensor Monolithic Hall elements.
MUX Multiplexer for selecting Hall elements.
Chopper SW Performs chopping.
HE-Drive Magnetic sensor drive circuit for constant-current driving of sensor.
Pre-AMP Fixed-gain differential amplifier used to amplify the magnetic sensor signal.
Intergrator & ADC Integrates and amplifies pre-AMP output and performs analog-to-digital
conversion.
OSC Generates an operating clock for sensor measurement.
POR Power On Reset circuit. Generates reset signal on rising edge of VDD.
VREF Generates reference voltage and current.
Interface Logic Exchanges data with an external CPU.
& I2C bus interface using two pins, namely, SCL and SDA. Standard, Fast and
Register High-speed modes are supported. The low-voltage specification can be supported
by applying 1.65V to the VID pin.
Timing Control Generates a timing signal required for internal operation from a clock generated by
the OSC.
Magnetic Source Generates magnetic field for self test of magnetic sensor.
FUSE ROM Fuse for adjustment.

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4.3. Pin Function
Pin No. Pin name I/O Power Type Function
supply
A1 VDD - - Power Positive power supply pin.
A2 CAD I VDD CMOS Slave address input pin.
Connect to VSS or VDD,
A3 TST I/O VDD CMOS Test pin.
Pulled down by 100kΩ internal resister. Keep this pin
electrically non-connected.
B1 VSS - - Power Ground pin.
B3 SCL I VID CMOS Control data clock input pin
Input: Schmidt trigger
C1 VID - - Power Digital interface positive power supply pin.
C2 RSTN I VID CMOS Reset pin.
Resets registers by setting to “L”.
C3 SDA I/O VID CMOS Control data input/output pin
Input: Schmidt trigger, Output: Open drain

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5. Overall Characteristics
5.1. Absolute Maximum Ratings
Vss=0V
Parameter Symbol Min. Max. Unit
Power supply voltage V+ -0.3 +4.3 V
(Vdd, Vid)
Input voltage VIN -0.3 （V+）+0.3 V
Input current IIN - ±10 mA
Storage temperature Tst -40 +125 ˚C
(Note 1) If the device is used in conditions exceeding these values, the device may be destroyed. Normal operations are
not guaranteed in such exceeding conditions.

5.2. Recommended Operating Conditions

Vss=0V
Parameter Remark Symbol Min. Typ. Max. Unit
Operating temperature Ta -30 +85 ˚C
Power supply voltage VDD pin voltage Vdd 2.4 3.0 3.6 V
VID pin voltage Vid 1.65 Vdd V

5.3. Electrical Characteristics

The following conditions apply unless otherwise noted:
Vdd=2.4V to 3.6V, Vid=1.65V to Vdd, Temperature range=-30˚C to 85˚C

5.3.1. DC Characteristics
Parameter Symbol Pin Condition Min. Typ. Max. Unit
High level input voltage 1 VIH1 RSTN 70%Vid Vid+0.3 V
SCL 70%Vid
SDA
Low level input voltage 1 VIL1 RSTN -0.3 30%Vid V
SCL
SDA
High level input voltage 2 VIH2 TST 70%Vdd Vdd+0.3 V
Low level input voltage 2 VIL2 CAD -0.3 30%Vdd V
Input current 1 IIN1 RSTN Vin=Vss or Vid -10 +10 µA
SCL
SDA
CAD Vin=Vss or Vdd -10 +10
Input current 2 IIN2 TST Vin=Vdd 100 µA
Hysteresis input voltage VHS SCL Vid≥2V 5%Vid V
(Note 2) SDA Vid<2V 10%Vid
Low level output voltage VOL SDA IOL≤+3mA 0.4 V
(Note 3) Vid≥2V
IOL≤+3mA 20%Vid
Vid<2V
Current consumption IDD1 VDD Power-down mode 3 6 µA
(Note 4) VID Vdd=Vid=3.0V
IDD2 When magnetic sensor 3 6 mA
is driven
IDD3 Self-test mode 5 8 mA
IDD4 (Note 5) 0.1 5 µA

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(Note 2) Schmitt trigger input (reference value for design)
(Note 3) Output is open-drain. Connect a pull-up resistor externally. Maximum capacitive load: 400pF (Capacitive load
of each bus line for I2C bus interface).
(Note 4) Without any resistance load. It does not include the current consumed by external loads (pull-down resister, etc.).
RSTN, SDA, SCL = Vid or 0V. CAD = Vdd or 0V.
(Note 5) (case 1) Vdd=ON, Vid=ON, RSTN pin = “L”. (case 2) Vdd=ON, Vid=OFF (0V), RSTN pin = “L”. (case 3)
Vdd=OFF (0V), Vid=ON.

5.3.2. AC Characteristics
Parameter Symbol Pin Condition Min. Typ. Max. Unit
Power supply rise time PSUP VDD Period of time that VDD (VID) 50 ms
(Note 6) VID changes from 0.2V to Vdd (Vid).
POR completion time PORT Period of time after PSUP to 100 µs
(Note 6) Power-down mode (Note 7)
Power supply turn off SDV VDD Turn off voltage to enable POR to 0.2 V
voltage (Note 6) VID restart (Note 7)
Power supply turn on PSINT VDD Period of time that voltage lower 100 µs
interval (Note 6) VID than SDV needed to be kept to
enable POR to restart (Note 7)
Wait time before mode Twat 100 µs
setting
(Note 6) Reference value for design.
(Note 7) When POR circuit detects the rise of VDD/VID voltage, it resets internal circuits and initializes the registers.
After reset, AK09911 transits to Power-down mode.

Power-down mode Power-down mode

VDD/(VID)

PORT
SDV

0V
PSUP
PSINT

Parameter Symbol Pin Condition Min. Typ. Max. Unit

Reset input effective pulse width (“L”) tRSTL RSTN 5 µs

tRSTL

VIL

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5.3.3. Analog Circuit Characteristics
Parameter Symbol Condition Min. Typ. Max. Unit
Measurement data output bit DBIT - 14 - bit
Time for measurement TSM Single measurement mode 7.2 8.5 ms
Magnetic sensor sensitivity (Note 8) BSE Tc = 25 ˚C 0.57 0.6 0.63 µT/LSB
Magnetic sensor measurement range BRG Tc = 25 ˚C ±4912 µT
(Note 9)
Magnetic sensor initial offset Tc = 25 ˚C -500 +500 LSB
(Note 10)
(Note 8) Value after sensitivity is adjusted using sensitivity fine adjustment data stored in Fuse ROM.
(Note 9) Reference value for design
(Note 10) Value of measurement data register on shipment without applying magnetic field on purpose.

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2
5.3.4. I C Bus Interface
I2C bus interface is compliant with Standard mode, Fast mode and High-speed mode. Standard/Fast mode is selected
automatically by fSCL.

 Standard mode
fSCL≤100kHz
Symbol Parameter Min. Typ. Max. Unit
fSCL SCL clock frequency 100 kHz
tHIGH SCL clock “High” time 4.0 µs
tLOW SCL clock “Low” time 4.7 µs
tR SDA and SCL rise time 1.0 µs
tF SDA and SCL fall time 0.3 µs
tHD:STA Start Condition hold time 4.0 µs
tSU:STA Start Condition setup time 4.7 µs
tHD:DAT SDA hold time (vs. SCL falling edge) 0 µs
tSU:DAT SDA setup time (vs. SCL rising edge) 250 ns
tSU:STO Stop Condition setup time 4.0 µs
tBUF Bus free time 4.7 µs

 Fast mode
100Hz≤fSCL≤400kHz
Symbol Parameter Min. Typ. Max. Unit
fSCL SCL clock frequency 400 kHz
tHIGH SCL clock “High” time 0.6 µs
tLOW SCL clock “Low” time 1.3 µs
tR SDA and SCL rise time 0.3 µs
tF SDA and SCL fall time 0.3 µs
tHD:STA Start Condition hold time 0.6 µs
tSU:STA Start Condition setup time 0.6 µs
tHD:DAT SDA hold time (vs. SCL falling edge) 0 µs
tSU:DAT SDA setup time (vs. SCL rising edge) 100 ns
tSU:STO Stop Condition setup time 0.6 µs
tBUF Bus free time 1.3 µs
tSP Noise suppression pulse width 50 ns

[I2C bus interface timing]

1/fSCL

VIH2
SCL
VIL2

VIH2
SDA
VIL2
tBUF tLOW tR tHIGH tF
tSP
VIH2
SCL
VIL2

tHD:STA tHD:DAT tSU:DAT tSU:STA tSU:STO

Stop Start Start Stop

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 High-speed mode (Hs-mode)

 Cb≤100pF (Cb: load capacitance)
fSCLH≤2.5MHz
Symbol Parameter Min. Typ. Max. Unit
fSCLH SCLH clock frequency 2.5 MHz
tHIGH SCLH clock “High” time 110 ns
tLOW SCLH clock “Low” time 220 ns
tR_CL SCLH rise time 10 40 ns
SCLH rise time after a repeated START
tR_CL1 10 80 ns
condition and after an acknowledge bit
tR_DA SDAH rise time 10 80 ns
tF_CL SCLH fall time - 40 ns
tF_DA SDAH fall time - 80 ns
tHD:STA Start Condition hold time 160 ns
tSU:STA Start Condition setup time 160 ns
tHD:DAT SDAH hold time (vs. SCLH falling edge) 0 ns
tSU:DAT SDAH setup time (vs. SCLH rising edge) 10 ns
tSU:STO Stop Condition setup time 160 ns
tSP Noise suppression pulse width 10 ns

 Cb≤400pF
fSCLH≤1.7MHz
Symbol Parameter Min. Typ. Max. Unit
fSCLH SCLH clock frequency 1.7 MHz
tHIGH SCLH clock “High” time 120 ns
tLOW SCLH clock “Low” time 320 ns
tR_CL SCLH rise time 20 80 ns
SCLH rise time after a repeated START
tR_CL1 20 160 ns
condition and after an acknowledge bit
tR_DA SDAH rise time 20 160 ns
tF_CL SCLH fall time - 80 ns
tF_DA SDAH fall time - 160 ns
tHD:STA Start Condition hold time 160 ns
tSU:STA Start Condition setup time 160 ns
tHD:DAT SDAH hold time (vs. SCLH falling edge) 0 ns
tSU:DAT SDAH setup time (vs. SCLH rising edge) 10 ns
tSU:STO Stop Condition setup time 160 ns
tSP Noise suppression pulse width 10 ns

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 [AK09911]
[I2C bus interface timing of Hs-mode]
1/fSCL

VIH
SCL
VIL

START START STOP

Tr_D
Tf_D

VIH2
SDAH
VIL2

tHD;DAT
tSU;STA tSU;STO
tHD;STA tSU;DAT

VIH2
SCLH
VIL2
tf_CL
Tr_CL1
tr_CL1 Tr_CL

tHIGH tLOW tHIGH

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6. Function Explanation
6.1. Power States
When VDD and VID are turned on from Vdd=OFF (0V) and Vid=OFF (0V), all registers in AK09911 are initialized by
POR circuit and AK09911 transits to Power-down mode.

All the states in the table below can be set, although the transition from state 2 to state 3 and the transition from state 3 to
state 2 are prohibited.

Table 6.1. Power state

State VDD VID Power state
1 OFF (0V) OFF (0V) OFF (0V).
It doesn’t affect external interface.Digital
input pins other than SCL and SDA pin
should be fixed to “L”(0V).
2 OFF (0V) 1.65V to 3.6V OFF (0V)
It doesn’t affect external interface.
3 2.4V to 3.6V OFF (0V) OFF(0V)
It doesn’t affect external interface. Digital
input pins other than SCL and SDA pin
should be fixed to “L”(0V).
4 2.4V to 3.6V 1.65V to Vdd ON

6.2. Reset Functions

When the power state is ON, always keep Vid≤Vdd.
Power-on reset (POR) works until Vdd reaches to the operation effective voltage (about 1.1V: reference value for design)
on power-on sequence. After POR is deactivated, all registers are initialized and transits to Power-down mode.

When Vdd=2.4 to 3.6V, POR circuit and VID monitor circuit are active. When Vid=0V, AK09911 is in reset status and it
consumes the current of reset state (IDD4).

AK09911 has four types of reset;

(1) Power on reset (POR)
When Vdd rise is detected, POR circuit operates, and AK09911 is reset.
(2) VID monitor
When VID is turned OFF, AK09911 is reset.
(3) Reset pin (RSTN)
AK09911 is reset by Reset pin. When Reset pin is not used, connect to VID.
(4) Soft reset
AK09911 is reset by setting SRST bit. When AK09911 is reset, all registers are initialized and AK09911 transits to
Power-down mode.

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6.3. Operation Mode
AK09911 has following nine operation modes:
(1) Power-down mode
(2) Single measurement mode
(3) Continuous measurement mode 1
(4) Continuous measurement mode 2
(5) Continuous measurement mode 3
(6) Continuous measurement mode 4
(7) Self-test mode
(8) Fuse ROM access mode

By setting CNTL2 register MODE[4:0] bits, the operation set for each mode is started.
A transition from one mode to another is shown below.

MODE[4:0]=“00001” Single measurement mode

Power-down MODE[4:0]=“00000” Sensor is measured for one time and data is output.
mode Transits automatically Transits to Power-down mode automatically after
measurement ended.

MODE[4:0]=“00010” Continuous measurement mode 1

Sensor is measured periodically in 10Hz.
MODE[4:0]=“00000”
Transits to Power-down mode by writing MODE[4:0]
= “00000”.

MODE[4:0]=“00100” Continuous measurement mode 2

Sensor is measured periodically in 20Hz.
MODE[4:0]=“00000”
Transits to Power-down mode by writing
MODE[4:0]=“00000”.

MODE[4:0]=“00110” Continuous measurement mode 3

Sensor is measured periodically in 50Hz.
MODE[4:0]=“00000” Transits to Power-down mode by writing
MODE[4:0]=“00000”.

Continuous measurement mode 4

MODE[4:0]=“01000” Sensor is measured periodically in 100Hz.
MODE[4:0]=“00000” Transits to Power-down mode by writing
MODE[4:0]=“00000”.

MODE[4:0]=“10000” Self-test mode

Sensor is self-tested and the result is output. Transits
MODE[4:0]=“00000”
to Power-down mode automatically.
Transits automatically

MODE[4:0]=“11111” Fuse ROM access mode

Turn on the needed to read out Fuse ROM. Transits
MODE[4:0]=“00000” to Power-down mode by writing
MODE[4:0]=“00000”.

Figure 6.1. Operation mode

When power is turned ON, AK09911 is in Power-down mode. When a specified value is set to MODE[4:0], AK09911
transits to the specified mode and starts operation. When user wants to change operation mode, transit to Power-down mode
first and then transit to other modes. After Power-down mode is set, at least 100 µs (Twat) is needed before setting another
mode

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7. Example of Recommended External Connection

VID VDD
POWER 1.65V to Vdd POWER 2.4V to 3.6V
Host CPU

Power for I/F

GPIO 0.1µF

SDA RSTN VID

C
2
I C I/F AK09911C 0.1µF
SCL VSS
B
(Top view)

TST CAD VDD

A

3 2 1

Slave address select

CAD address
VSS 0 0 0 1 1 0 0 R/W
VDD 0 0 0 1 1 0 1 R/W

Pins of dot circle should be kept non-connected.

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8. Package
8.1. Marking
 Date code: X1X2X3X4X5
 X1 = ID
 X2 = Year code
 X3X4 = Week code
 X5 = Lot
 Product name: 9911

X1X2X3X4X5

9911
<Top view>

8.2. Pin Assignment

3 2 1
C SDA RSTN VID
B SCL VSS
A TST CAD VDD
<Top view>

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 [AK09911]
8.3. Outline Dimensions
[mm]

1.19±0.03
0.8

3 2 1 1 2 3

C
1.19±0.03

0.4

0.8
B

0.4
0.24±0.03

0.40 0.57 max.

0.13 0.05 C
C

8.4. Recommended Foot Print Pattern

[mm]
3 2 1

0.4
B

0.4
0.23

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9. Relationsip between the Magnetic Field and Output Code

The measurement data increases as the magnetic flux density increases in the arrow directions.

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Important Notice
0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the information contained in this
document without notice. When you consider any use or application of AKM product stipulated in this document
(“Product”), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products.
1. All information included in this document are provided only to illustrate the operation and application examples of AKM
Products. AKM neither makes warranties or representations with respect to the accuracy or completeness of the
information contained in this document nor grants any license to any intellectual property rights or any other rights of
AKM or any third party with respect to the information in this document. You are fully responsible for use of such
information contained in this document in your product design or applications. AKM ASSUMES NO LIABILITY FOR
ANY LOSSES INCURRED BY YOU OR THIRD PARTIES ARISING FROM THE USE OF SUCH INFORMATION
IN YOUR PRODUCT DESIGN OR APPLICATIONS.
2. The Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of
quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious
property damage or serious public impact, including but not limited to, equipment used in nuclear facilities, equipment
used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation,
traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and
escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for the
above use unless specifically agreed by AKM in writing.
3. Though AKM works continually to improve the Product’s quality and reliability, you are responsible for complying with
safety standards and for providing adequate designs and safeguards for your hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of the Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption.
4. Do not use or otherwise make available the Product or related technology or any information contained in this document
for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of
nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). When exporting the
Products or related technology or any information contained in this document, you should comply with the applicable
export control laws and regulations and follow the procedures required by such laws and regulations. The Products and
related technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
5. Please contact AKM sales representative for details as to environmental matters such as the RoHS compatibility of the
Product. Please use the Product in compliance with all applicable laws and regulations that regulate the inclusion or use
of controlled substances, including without limitation, the EU RoHS Directive. AKM assumes no liability for damages or
losses occurring as a result of noncompliance with applicable laws and regulations.
6. Resale of the Product with provisions different from the statement and/or technical features set forth in this document
shall immediately void any warranty granted by AKM for the Product and shall not create or extend in any manner
whatsoever, any liability of AKM.
7. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of
AKM.

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