TB2959HQ

Bi-CMOS Linear Integrated Circuit Silicon Monolithic

TB2959HQ
Maximum Power 47W BTL  4-ch Audio Power IC

1. Description
The TB2959HQ is a four-channel BTL power amplifier for car
audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (POUT MAX) of 47W.
It includes a standby switch, mute function and various
protection features.

2. Applications Weight: 7.7 g (typ.)

Power IC developed for car audio applications.

3. Features
 High output power, low distortion, and low noise property (for details, refer to the Table 1)
 Build-in AUX-IN (pin25)
 Built-in various mute functions (low voltage, standby on/off)
 Built-in standby switch (pin4)
 Built-in mute switch (pin22)
 Built-in various protection circuits (thermal shut down, over-voltage, short to GND, short to VCC, and output to
output short)
Table1 typical Characteristics
(Note1,Note2)

Condition Typ. Unit

Output power (POUT)

VCC = 15.2 V, JEITA max 47
VCC = 14.4 V, JEITA max 42
W
VCC = 14.4 V, THD = 10% 27
THD = 10% 23

Total harmonic distortion (THD)

POUT = 5 W 0.005 %

Output noise voltage (VNO) (Rg = 0 Ω),

BW = 20 Hz to 20 kHz 50 µV

Operating Supply voltage range (VCC)

RL = 4 Ω 6 to 18 V

Note1: Typical test conditions: VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, GV = 26 dB, Ta = 25°C; unless otherwise specified.
Note2: Rg: signal source resistance

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4. Block Diagram

Note3: Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.In the following explanation, a "channel" is a circuit which consists of INx, OUTx (+), OUTx (-),
and PW-GNDx. (x:1 to 4)

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5. Pin Configuration and Function Descriptions

5.1 Pin Configuration (top view)

AUX-IN
PW-GND4
OUT4(－)
Mute
OUT4(＋)
Vcc１
OUT3(－)
PW-GND3
OUT3(＋)
AC-GND
IN3
IN4
Pre－GND
IN2
IN1
Ripple
OUT１(＋)
PW-GND1
OUT1(－)
Vcc2
OUT2(＋)
Stby
OUT2(－)
PW-GND2
TAB

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5.2 Pin Function Descriptions
Pin Symbol I/O Description

１ TAB ― TAB (Always connect with GND)

２ PW-GND2 ― Ground for Rear Left output
３ OUT2(-) OUT Rear Left output-
４ Stby VST-IN Standby voltage input
５ OUT2(+) OUT Rear Left output+
６ VCC2 VCC-IN Supply voltage 2
７ OUT1(-) OUT Front Left output-
８ PW-GND1 ― Ground for Front Left output
９ OUT1(+) OUT Front Left output+
10 Ripple ― Ripple voltage
11 IN1 IN Front Left input
12 IN2 IN Rear Left input
13 Pre-GND ― Signal ground
14 IN4 IN Rear Right input
15 IN3 IN Front Right input
16 AC-GND ― Common reference voltage for all input
17 OUT3(+) OUT Front Right output+
18 PW-GND3 ― Ground for Front Right output
19 OUT3(-) OUT Front Right output-
20 VCC1 VCC-IN Supply voltage 1
21 OUT4(+) OUT Rear Right output+
22 Mute VmuteIN Mute voltage input
23 OUT4(-) OUT Rear Right output-
24 PW-GND4 ― Ground for Rear Right output
25 AUX-IN IN_Beep BEEP sound or voice synthesizer signal input

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6. Detailed Description

Recomm Effect (Note4)

Component
ended Pin Purpose
Name Lower than Recommended Value Higher than Recommended Value
Value
C1 0.22 μF INx(x:1 to 4) To eliminate DC Cut-off frequency becomes higher Cut-off frequency becomes lower
Turn on/off time and turn-on diag. Turn on/off time and turn-on diag.
C2 10 μF Ripple To reduce ripple
cycle shorter cycle longer
VCC1, VCC2 To provide sufficient
C3 0.1 μF Reduces noise and provides sufficient oscillation margin
oscillation margin
High pop noise. Duration until
Low pop noise. Duration until mute
C4 1uF Mute To reduce pop noise mute function is turned on/off is
function is turned on/off is long.
short.
C5 3900 μF VCC1, VCC2 Ripple filter Power supply ripple filtering
Common reference
C6 1 μF AC-GND Pop noise is suppressed when C1: C6 = 1:4. (Note5)
voltage for all input
AUX-IN Cut-off frequency is increased in Cut-off frequency is reduced in
C7 0.22μF To eliminate DC
AUX AUX.
High pop noise. Duration until
Low pop noise. Duration until mute
R1 47kΩ Mute To reduce pop noise mute function is turned on/off is
function is turned on/off is long.
short.

Note4: When the unrecommended value is used, please examine it enough by system evaluation.

Note5: Since “AC-GND” pin is a common reference voltage for all input, this product needs to set the ratio of an
input apacitance (C1) and the AC-GND capacitance (C6) to 1:4.

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7. Standby Switch
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is
set at about 3 VBE (typ.). The power supply
current is about 0.01 A (typ.) in the standby ON
Power 10 k
state. 4
OFF
20 k
to Bias
Table1 Standby Control Voltage (VSB)
60 k

Stand-by Power VSB (V) 3 k

ON OFF 0 to 0.9
OFF ON 2.2 to VCC
Figure1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.

Benefits of the Standby Switch

(1) VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.

(2) Since the control current is minuscule, a low-current-rated switching relay can be used.

Relay
High-current-rated switch
Battery Battery

VCC VCC From

microcontroller

– Conventional Method –

Low-current-rated switch From microcontroller

Battery Battery

Standby VCC Standby VCC

– Using the Standby Switch –

Figure 2 Standby Switch

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8. Mute switch
The audio mute switch is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute. The time constant affects pop noise generated when power or the mute is turned on or off; thus, it
must be determined on a per-application basis.
The value of the external pull-up resistor is determined, based on pop noise value.

For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V/5 V  47 k  31 k

ATT – VMUTE
20

(dB)
20

Mute attenuation ATT

40

5V
60

1 k
22 80
R1
C4 Mute On/Off
100
control
120
0 0.5 1 1.5 2 2.5 3

Pin 22 control voltage: VMUTE E (V)

Figure 3 Mute Function Figure 4 Mute Attenuation VMUTE (V)

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9. Mute Mode
The mute mode in this product is a mute at standby on/off, an internal mute for low voltage. If the mute is
turned off before charging C1 and C4 is finished, pop noise occurs because of input offset. Set “mute-off” with
sufficient margin in considering a charge time.

9.1 Low Voltage Mute

Low Voltage Mute is operated inside the IC the Ripple pin voltage becomes about under the about
5.6V.

9.2 Standby off Mute

A mute operation starts automatically inside the IC after standby-low until the Ripple pin voltage
becomes about 1/2 Vcc-0.7V.

Standby Off
Ripple pin voltage
Standby “Hi”

Ripple pin
Voltage
1/2Vcc 
1/2Vcc-0.7V 

Standby off Mute Off

Operation period of Standby mute

Figure5 Standby Off Mute

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10. AUX-Input
The pin 25 is for input terminal of AUX amplifier. The total gain is 0dB by using of AUX amplifier.
Therefore, the -COM can directly drive the AUX amplifier. BEEP sound or voice synthesizer signal can be
input to pin 25 directly.
When AUX function is not used, this pin must be connected to PRE-GND (pin 13) via a capacitor.

20dB
－20dB

IN

OUT ()

OUT ()
AUX AMP
AUX-IN
microcomputer 25

-20dB

Figure6 AUX-Input

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11. Protection Functions

This product has internal protection circuits such as thermal shut down, over-voltage, out to VCC, out to
GND, and out to out short circuit protections.

(1) Thermal shut down

It operates when junction temperature exceeds 150°C (typ.).

When it operates, it is protected in the following order.

1. An Attenuation of an output starts first and the amount of attenuation also increases according
to a temperature rising,
2. All outputs become in a mute state, when temperature continues rising in spite of output
attenuation.
3. Shutdown function starts, when a temperature rise continues though all outputs are in a mute
state.

In any case if temperature falls, it will return automatically.

(2) Over-voltage

It operates when voltage exceeding operating range is supplied to VCC pin. If voltage falls, it will
return automatically. When it operates, output bias is turned off and an output is intercepted.

(3) Short to VCC, Short to GND, Output to output short

It operates when each pin is in irregular connection. If irregular connection is canceled, it will return
automatically.
Short circuit protection can operate for each channel.
When it operates, output bias of corresponding output is turned off and an output is intercepted.
Example) If channel 1 output shorts, channel 1 is protected but other channels 2 to 4 are available.

(4) Prevention of speaker damage (in case of a layer short-circuit of the speaker)

When the DC resistance between the OUT and OUT pins falls below 1 , the output current exceeds
4 A. At this time, the protection circuit is activated to limit the current draw into the speaker.
This feature prevents the speaker from being damaged, as follows:

< Speaker damaging scenario >

A DC current of over 4 V is applied to the speaker due to an external circuit failure (Note 6).
(Abnormal DC output offset)

The speaker impedance becomes 1  or less due to a layer short.

A current of over 4 A flows into the speaker, damaging the speaker.

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Current into the speaker

The short-circuit protection is activated

Less than 4 A

Speaker Impedance
About 1  4

Figure 7 Prevention of speaker damage

Note 6: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage
current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines.

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12. Absolute Maximum Ratings

(Ta = 25°C unless otherwise specified)

Characteristics Condition Symbol Rating Unit

supply voltage (surge) max0.2s VCC (surge) 50 V

supply voltage (DC) VCC (DC) 25 V
supply voltage (operation) VCC (opr) 18 V
output current (peak) IO (peak) 9 A
power dissipation (Note7) PD 125 W
Operating temperature range Topr -40 to 85 °C
Storage temperature Tstg -55 to 150 °C

Note7: Package thermal resistance Rth(j-t) = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)

The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not
be exceeded during operation, even for an instant.
If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with
exceeded ratings may cause break down, damage, and/or degradation to any other equipment. Applications using
the device should be designed such that each maximum rating will never be exceeded in any operating conditions.
Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth
in this document.

12.1 Power Dissipation

PD (max) – Ta
120
(1) Infinite heat sink
(W)

Rth(j-t) = 1C/W
100 (2) Heat sink (Rth(HS) = 3.5C/W)
Rth(j-t) + Rth(HS) = 4.5C/W
PD (max)

(3) No heat sink

80
Rth(j-a) = 39C/W
(1)
60
Power Dissipation

40

20 (2)
(3)
0
0 25 50 75 100 125 150

Ambient Temperature Ta (°C)

13. Operating Ranges

Characteristics Symbol Condition Min Typ. Max Unit

Supply voltage VCC RL=4Ω 6 ― 18 V

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14. Electrical Characteristics

(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, GV=26dB, Ta = 25°C unless otherwise specified)
Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
Quiescent supply current ICCQ  VIN  0  160 300 mA
POUT MAX (1)  VCC  15.2 V, max POWER  47 
POUT MAX (2)  VCC  14.4 V, max POWER  42 
Output power W
POUT (1)  VCC  14.4 V, THD  10%  27 
POUT (2)  THD  10% 21 23 
Total harmonic distortion THD  POUT  5 W  0.005 0.07 %
Voltage gain GV  VOUT  0.775 Vrms 25 26 27 dB
Channel-to-channel voltage
GV  VOUT  0.775 Vrms 1.0 0 1.0 dB
gain
VNO (1)  Rg  0 , DIN45405  50 
Output noise voltage Vrms
VNO (2)  Rg  0 , BW  20 Hz to 20 kHz  50 70
frip  100 Hz, Rg  620 (Note9)
Ripple rejection ratio R.R.  50 70  dB
Vrip  0.775 Vrms
Rg  620 
Crosstalk C.T.   80  dB
POUT  4 W
Output offset voltage VOFFSET   90 0 90 mV
Input resistance RIN    90  k
Standby current ISB  Standby condition, V4  0, V22  0  0.01 1 A
VSB H  POWER: ON 2.2  VCC
Standby control voltage V
VSB L  POWER: OFF 0  0.9
VM H  MUTE: OFF 2.2  Vcc
Mute control voltage V
VM L  MUTE: ON, R1  47 k 0  0.9
MUTE: ON, DIN_AUDIO
Mute attenuation ATT M  85 100  dB
VOUT  7.75 Vrms  Mute: OFF

Upper cut-off frequency Fth  GV  26dB, 3dB down  400  kHz

Note9: fRIP Ripple frequency

VRIP Ripple signal voltage (AC fluctuations in the power supply)

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15. Test Circuit

Components in the test circuits are only used to obtain and confirm the device characteristics.

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16. Characteristic Chart

16.1 Total Harmonic Distortion vs. Output Power
THD – POUT (ch1) THD – POUT (ch2)
100 100
VCC = 13.2 V VCC = 13.2 V
50 50
GV = 26dB GV = 26dB
30 RL = 4  30 RL = 4 
Filter Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
10 10
1 kHz : 400 Hz to 30 kHz 1 kHz : 400 Hz to 30 kHz
5 10 kHz : 400 Hz to 5 10 kHz : 400 Hz to
(%)

(%)
3 20 kHz : 400 Hz to 3 20 kHz : 400 Hz to
THD

THD
1 1
Total harmonic distortion

Total harmonic distortion

0.5 0.5
0.3 20 kHz 0.3 20 kHz

0.1 0.1
10 kHz 10 kHz
0.05 0.05
0.03 0.03
100 Hz
100 Hz

0.01 0.01

0.005 f = 1 kHz 0.005

f = 1 kHz
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

THD – POUT (ch3) THD – POUT (ch4)

100 100
VCC = 13.2 V VCC = 13.2 V
50 50
GV = 26dB GV = 26dB
30 RL = 4  30 RL = 4 
Filter Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
10 10
1 kHz : 400 Hz to30 kHz 1 kHz : 400 Hz to 30 kHz
5 10 kHz : 400 Hz to 5 10 kHz : 400 Hz to
(%)

(%)

3 20 kHz : 400 Hz to 3 20 kHz : 400 Hz to

THD

THD

1 1
Total harmonic distortion

Total harmonic distortion

0.5 0.5
0.3 20 kHz 0.3

20 kHz
0.1 0.1
10 kHz 10 kHz
0.05 0.05
0.03 0.03
100 Hz 100 Hz

0.01 0.01

0.005 f = 1 kHz 0.005 f = 1 kHz

0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

Figure 11-1 Total Harmonic Distortion of Each Frequency (RL = 4 )

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THD – POUT (ch1) THD – POUT (ch2)

100 100
GV = 26dB GV = 26dB
50 RL = 4  50 RL = 4 
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
(%)

(%)
3 3
THD

THD
1 1
Total harmonic distortion

Total harmonic distortion

0.5 0.5
0.3 0.3

VCC = 6.0 V 16.0 V VCC = 6.0 V 16.0 V

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

THD – POUT (ch3) THD – POUT (ch4)

100 100
GV = 26dB GV = 26dB
50 RL = 4  50 RL = 4 
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
(%)

(%)

3 3
THD

THD

1 1
Total harmonic distortion

Total harmonic distortion

0.5 0.5
0.3 0.3

VCC = 6.0 V 16.0 V VCC = 6.0 V 16.0 V

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

Figure 11-2 Total Harmonic Distortion by Power-supply Voltage (RL = 4 )

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16.2 Various Frequency Characteristics
THD – f
3

(%)
VCC = 13.2 V
1 RL = 4 

THD
POUT = 5 W
0.3 Filter nothing

Total harmonic distortion

0.1
16 V

0.03

13.2 V
0.01 8V

0.003

0.001
0.01 0.1 1 10 100

Frequency f (kHz)

Figure 11-3 Frequency Characteristics of Total Harmonic Distortion

GV – f ATTMUTE – f
28 0
VCC = 13.2 V
(dB)

RL = 4 
20 V
OUT = 7.75 Vrms (20dBm)
(dB)

ATTMUTE

26
1ch to 4ch
40
GV

24 60
Voltage gain

Mute attenuation

80
1ch~4ch
22
VCC = 13.2 V
100
RL = 4 
VOUT = 0.775 Vrms (0dBm)
20 120
0.01 0.1 1 10 100 0.01 0.1 1 10 100
Frequency f (kHz) Frequency f (kHz)

Figure 11-4 Frequency Characteristics of Voltage Gain and Mute Attenuation

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R.R. – f (GV = 26dB)

0
VCC = 13.2 V

(dB)
RL = 4 
RG = 620 
20 Vrip = 0.775 Vrms (0dBm)

R.R.
GV = 26dB

Ripple rejection rate

40

2ch
1ch
4ch
60

3ch
80
0.01 0.1 1 10 100

Frequency f (kHz)

Figure 11-5 Frequency Characteristics of Ripple Rejection Rate

C.T. – f (ch1) C.T. – f (ch2)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4  RL = 4 
f = 1 kHz f = 1 kHz
20 VOUT = 0.775 Vrms (0dBm) 20 VOUT = 0.775 Vrms (0dBm)
(dB)

(dB)

RG = 620  RG = 620 

40 40 1ch

C.T.

C.T.

2ch
Cross talk

Cross talk

4ch
60 60
4ch

3ch
80 80

3ch

100 100
0.01 0.1 1 10 100 0.01 0.1 1 10 100

Frequency f (kHz) Frequency f (kHz)

C.T. – f (ch3) C.T. – f (ch4)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4  RL = 4 
f = 1 kHz f = 1 kHz
20 VOUT = 0.775 Vrms (0dBm) 20 VOUT = 0.775 Vrms (0dBm)
(dB)

(dB)

RG = 620  RG = 620 

40 40
C.T.

C.T.

4ch
Cross talk

Cross talk

1ch
60 60
2ch
2ch 1ch 3ch

80 80

100 100
0.01 0.1 1 10 100 0.01 0.1 1 10 100

Frequency f (kHz) Frequency f (kHz)

Figure 11-6 Frequency Characteristics of Cross Talk

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16.3 Output Power Characteristics to Input Voltage
POUT (ch1) – VIN POUT (ch2) – VIN
50 50

100 Hz 100 Hz
(W)

(W)
40 40
POUT

POUT
30 30
1 kHz f = 20 kHz 10 kHz 1 kHz f = 20 kHz 10 kHz
Output power

Output power
20 20

10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4  RL = 4 
Filter nothing Filter nothing
0 0
0 1 2 3 4 5 0 1 2 3 4 5

Input voltage VIN (rms) (V) Input voltage VIN (rms) (V)

POUT (ch3) – VIN POUT (ch4) – VIN

50 50

100 Hz 100 Hz
(W)

(W)

40 40
POUT

POUT

30 30
1 kHz f = 20 kHz 10 kHz 1 kHz f = 20 kHz 10 kHz
Output power

Output power

20 20

10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4  RL = 4 
Filter nothing Filter nothing
0 0
0 1 2 3 4 5 0 1 2 3 4 5

Input voltage VIN (rms) (V) Input voltage VIN (rms) (V)

16.4 Power Dissipation vs. Output Power

PD – POUT (RL = 4 )
80
f = 1 kHz
RL = 4 
(W)

4ch drive
60 18 V
PD
Power dissipation

40

13.2 V
20

6.0 V
0
0 5 10 15 20 25

Output power POUT (W)

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16.5 Other Characteristic

VNO – Rg ICCQ – VCC

150 250
VCC = 13.2 V VIN = 0 V
RL = 4 
(V)

(mA)
RL = 
f = 1 kHz
200
Filter
VNO

to 20 kHz

ICCQ
100
150
Output noise voltage

Quiescent Current
1ch~4ch
100
50

50

0 0
10 100 1k 10 k 100 k 0 5 10 15 20 25

Signal source resistance Rg () Supply voltage VCC (V)

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17. Package Dimensions

Weight: 7.7g (typ.)

About solderability, following conditions were confirmed.

(1) Use of Sn-37Pb solder Bath

 solder bath temperature = 230°C
 dipping time = 5 seconds
 the number of times = once
 use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

 solder bath temperature = 245°C
 dipping time = 5 seconds
 the number of time = once
 use of R-type flux

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18. 4ch Power IC Evaluation Board

This drawing is a component side, and a schematic diagram of evaluation board “RP-2024 for 4ch power
IC using HZIP25-P-1.00F (SPP25), a solder side.

Note: This board can be shared with some products.

Please confirm external parts of the evaluated product beforehand when you unite the evaluation board.

 Component side

Figure 18-1 Pattern of Evaluation Board (component side)

 Solder side

Figure 18-2 Pattern of Evaluation Board (solder side)

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19. Attention in Use

 Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke
or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate
settings, such as fuse capacity, fusing time and insertion circuit location, are required.
 If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF. For
details on how to connect a protection circuit such as a current limiting resistor or back electromotive
force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause
injury, smoke or ignition.
 Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
 Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator. If there is a large amount of
leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If
this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure
can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In
particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs
output DC voltage to a speaker directly.
 Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under
all circumstances. If the Over current protection circuits operate against the over current, clear the over
current status immediately. Depending on the method of use and usage conditions, such as exceeding
absolute maximum ratings can cause the over current protection circuit to not operate properly or IC
breakdown before operation. In addition, depending on the method of use and usage conditions, if over
current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
 Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
 Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any
time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
 Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC
chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of
silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and
heat sink installation, refer to individual technical datasheets or IC databooks.

23 2011-11-08
 TB2959HQ
RESTRICTIONS ON PRODUCT USE
 Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
 This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
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programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
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including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.

24 2011-11-08