HI-SINCERITY Spec. No.
: HE6857
Issued Date : 1994.01.25
MICROELECTRONICS CORP. Revised Date : 2002.10.25
Page No. : 1/2
HMBD2003\C\S
Description
The HMBD2003\C\S are general purpose diodes fabricated in planar
technology, and encapsulated in small plastic SMD SOT-23 package.
Features
SOT-23
• Small plastic SMD package
• Switching speed: max. 50 nS
• General application:
Continuous reverse voltage: Max. 200 V
Repetitive peak reverse voltage: Max. 250 V
Repetitive peak forward current: Max. 625 mA
Absolute Maximum Ratings (Ta=25°C)
Characteristic Symbol Value Unit
HMBD2003 Repetitive Peak Reverse Voltage 250
HMBD2003C Repetitive Peak Reverse Voltage VRRM 250 V
HMBD2003S Repetitive Peak Reverse Voltage 250
HMBD2003 Continuous reverse voltage 200
HMBD2003C Continuous reverse voltage VR 200 V
HMBD2003S Continuous reverse voltage 200
Forward Continuous Current at Ta=25°C lF 225 mA
Repetitive Peak Forward Current at Ta=25°C IFRM 625 mA
Surge Forward Current at t =1mS, Ta=25°C IFSM 1 A
Power Dissipation PD 250 Max mV
Junction Temperature Tj 150 °C
Storage Temperature Range Tstg -65~+150 °C
Characteristics (Ta=25°C)
Characteristic Symbol Condition Min Max Unit
VF(1) IF=100mA - 1
Forward Voltage V
VF(2) IF=200mA - 1.25
HMBD2003 Reverse Current VR=200V - 100
HMBD2003C Reverse Current IR VR=200V - 100 nA
HMBD2003S Reverse Current VR=200V - 100
Total Capacitance CT VR=0V, f=1MHz 5 - pF
IF=30mA to IR=30mA
Reverse Recovery Time Trr RL=100Ω measured at 50 - nS
IR=3mA
BVR BVR IR=100uA 250 - V
HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification
HI-SINCERITY Spec. No. : HE6857
Issued Date : 1994.01.25
MICROELECTRONICS CORP. Revised Date : 2002.10.25
Page No. : 2/2
SOT-23 Dimension
Diagram: Marking:
A
3
L
A82
1 2
1 2
3 HMBD2003 HMBD2003
3 3
B S C3C C3S
1 2 1 2 1 2
HMBD2003C HMBD2003S HMBD2003C HMBD2003S
V G
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
D H K J
*: Typical
Inches Millimeters Inches Millimeters
DIM DIM
Min. Max. Min. Max. Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification
