MLX90821

Relative Pressure Sensor IC

Features and Benefits Application Examples

▪ High accuracy relative pressure sensor ▪ Fuel vapor pressure sensor
▪ Ratiometric analog output or digital SENT output ▪ Crankcase ventilation pressure sensor
with available compensated ±1°C accurate NTC ▪ Pressure sensor for filter monitoring
temperature information
▪ System in a package: MEMS, analog front end
circuitry, 16 bit microcontroller, analog back end
circuitry, voltage regulators
▪ Large automotive temperature range (-40°C to
150°C)
▪ Automotive qualified and automotive diagnostic
features (clamping levels, broken track
diagnostics, multiple internal fault diagnostics)
▪ Factory calibrated or fully programmable or
reconfigurable through the connector for
customized calibration curves
▪ Back side exposed relative pressure sensor for
higher resistance to common automotive
media
▪ Assembled in a robust easy to seal package

Ordering Information
Product Code Temperature Package Option Code Packing
Code Code Form Code
MLX90821 L XG DBA-003 RE
MLX90821 L XG DBA-005 RE
MLX90821 L XG DBA-006 RE
MLX90821 V XG DBA-008 RE
MLX90821 L XG DBA-100 RE

Legend:
Temperature Code: L = -40°C to 150°C
V = -40°C to 115°C
Package Code: XG = SOIC16 WB cavity package
Option Code: DBA-003 = -0.06 to 0.26bar relative pressure / 0.5V to 4.5V analog output
DBA-005 = -0.05 to 0.05bar relative pressure / 0.5V to 4.5V analog output
DBA-006 = -0.2 to 0.5bar relative pressure / 4.5V to 0.5V analog output
DBA-008 = -0.0375 to 0.0125 bar relative pressure / 4.5 V to 0.5 V analog output
DBA-100 = -0.06 to 0.26bar relative pressure / 193 to 3896LSB SENT output / NTC
Packing Form: RE = Reel
Ordering example: MLX90821LXG-DBA-003-RE

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Functional Diagram General Description

The MLX90821 is a packaged, factory calibrated,
DSP Overvoltage &
Vsupply
relative pressure sensor delivering a ratiometric
reverse voltage

analog output or a digital signal using the SENT

Divided bridge
Sensor bias current protection
6/7 VDDA
Off chip temperature IV conversion Voltage regulator
sensor current output Gain & Offset POR
Temperature

Piezoresistive
sensing element
On chip temperature
sensor
Compensation
protocol.
Vbrg Pressure Linearization

InP
PGA

M
Vana

Programmable Filter
DAC
12 bits
Gain
Analog
Output
Using a best in class MEMS sensor enables reliably
OPA
U
X
ADC
16 bits
and accurately measuring very low pressures of a
SENT
InN InP, InN, VEXT
Rom
Output few tenths of millibars. An optimized architecture
EEPROM
NTC
Input
External NTC
interface
Ram
Test Test
and a high density CMOS technology imparts the
Oscillator Gnd
MLX90821 with best in class automotive EMC
performance. A DSP based architecture using a 16bit
Figure 1: Functional block diagram microcontroller provides outstanding performance
in terms of initial accuracy of both pressure and
optionally external NTC temperature.
A smart package and die assembly concept suits
applications with stringent automotive temperature
and stress conditions needing small drift over life.

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Contents
Features and Benefits ....................................................................................................................... 1
Application Examples ........................................................................................................................ 1
Ordering Information ........................................................................................................................ 1
Functional Diagram ........................................................................................................................... 2
General Description .......................................................................................................................... 2
Glossary of Terms ............................................................................................................................. 5
Absolute Maximum Ratings .............................................................................................................. 5
Pin Definitions and Descriptions ........................................................................................................ 6
General Electrical Specifications........................................................................................................ 7
Detailed General Description .......................................................................................................... 8
Default programmed settings ....................................................................................................... 10
Default Characteristics DBA-003 ............................................................................................... 13
Default Characteristics DBA-005 ............................................................................................... 13
Default Characteristics DBA-006 ............................................................................................... 14
Default Characteristics DBA-008 ............................................................................................... 14
Default Characteristics DBA-100 ............................................................................................... 15
Filters ........................................................................................................................................... 16
PFLT ........................................................................................................................................... 16
SSF ............................................................................................................................................. 16
Analog Front End .......................................................................................................................... 17
ADC .............................................................................................................................................. 19
Digital ........................................................................................................................................... 19
NTC Temperature Linearization..................................................................................................... 20
SENT Configuration ....................................................................................................................... 22
Fast Channel Configuration ....................................................................................................... 22
Slow Channel Configuration ...................................................................................................... 22
Wrong Connections Overview Analog Output ............................................................................... 27
Wrong Connections Overview SENT Output .................................................................................. 28
Diagnostics ................................................................................................................................... 29
Input Diagnostics....................................................................................................................... 29
Diagnostic Sources .................................................................................................................... 29

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Sent Output Fast and Slow Channel Diagnostics ....................................................................... 30

SENT Timings ................................................................................................................................ 35
Application Information ................................................................................................................ 36
Standard information regarding manufacturability of Melexis products with different soldering
processes ....................................................................................................................................... 37
ESD Precautions ............................................................................................................................ 37
Package Information ..................................................................................................................... 38
Contact ......................................................................................................................................... 39
Disclaimer ..................................................................................................................................... 39

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Glossary of Terms
Bar: Pressure unit (1bar = 100kPa)
POR: Power-on Reset
ADC: Analog to Digital Converter
DAC: Digital to Analog Converter
DSP: Digital Signal Processor
EMC: Electro Magnetic Compatibility
Vbrg: Sensor bridge supply
InP: Positive sensing element input
InN: Negative sensing element input
OV: Over Voltage
UV: Under Voltage
SENT: Single Edge Nibble Transmission
FC: SENT Fast Channel
FC1: SENT Fast Channel 1
FC2: SENT Fast Channel 2

Absolute Maximum Ratings

Parameter Value Units

Supply Voltage (overvoltage) 18 V
Reverse Voltage Protection -14 V
Positive output voltage 18 V
Reverse output voltage -0.5 V
Operating Temperature Range -40 to 150 °C
Storage Temperature Range -40 to 150 °C
Programming Temperature Range -40 to 125 °C
Burst pressure (Room Temperature) 3.75 Bar
Table 1: Absolute maximum ratings

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.

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Pin Definitions and Descriptions

Pin number Description Pin number Description
1 Not Connected 16 Not Connected
2 Not Connected 15 Not Connected
3 Not Connected 14 Not Connected
4 Not Connected 13 Not Connected
5 Ground 12 Test pin
6 NTC input 11 SENT output
7 Ground 10 Test pin
8 Analog output 9 Supply input
Table 2: Pin out definitions and descriptions

Figure 2: Package marking (top view)

Symbol Function / Description

ZZZZZZZZZZ Assembly lot number
YY Year of assembly
WW Calendar week of assembly
AAA MEMS and ASIC traceability letter
Table 3: Package marking definition

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General Electrical Specifications

DC Operating Parameters TA = -40°C to 150°C

Parameter Symbol Remarks Min Typ(1) Max Units

Nominal supply voltage Vdd 4.5 5 5.5 V
Nominal supply current Idd No output load connected, no NTC 8.5 11 mA
connected(2)
Decoupling capacitor on 47 100 nF
supply
Capacitive load on Cload 47 100 470 nF
analog output
Resistive load on analog Rload Pull up or Pull down 4.7 kOhm
output
Capacitive load on SENT Cload Pure capacitive load 2.2 nF
output CRC load circuit 1.1nF +
(C close to device + Series R + C close to 220Ω +
connector)
1.1nF
Resistive load on SENT Pull-up to Vdd at receiver(3) 10 55 kOhm
output
Supply programming Vdd_com Threshold to enter communication mode 6.2 7 7.8 V
entry level
Analog POR level (rising) 3.1 3.5 3.9 V

Analog POR hysteresis 100 500 mV

Digital POR level (rising) 2.05 2.3 2.7 V
Digital POR hysteresis 10 200 mV
Analog regulator VDDA -9% 3.5 +9% V
Nominal bridge supply Vbrg -9% 3 +9% V
voltage
Sensing element 55 mV/V/bar
sensitivity
ADC resolution 16 Bits
Diagnostic limits Diag low Pull-up ≥ 4.7kΩ 3 %Vdd
Pull-down ≥ 4.7kΩ 3
Diag high Pull-up ≥ 4.7kΩ 96 %Vdd
Pull-down ≥ 8kΩ 96
Clamping levels analog Clamp Programmable range with 7 bit resolution 0 12.5 %Vdd
output low for the low clamping level, 9 for the high

Clamp 50 100 %Vdd

high

1 Typical values are defined at T A = +25 °C and VDD = 5V.

2 Only applicable for SENT output and combination with NTC option.
3 As specified in the SENT standard

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Parameter Symbol Remarks Min Typ(1) Max Units

Analog saturation output Vsat high Pull-up ≥ 4.7kΩ 97 100 %Vdd
level Pull-down ≥ 4.7kΩ 96 100
Pull-down ≥ 10kΩ 97 100
Vsat low Pull-up ≥ 4.7kΩ 0 3 %Vdd
Pull-down ≥ 4.7kΩ 0 3
Power up time analog Time from reaching minimum allowed 1.3 ms
supply voltage of 4.5V till having the
output within specification
Power up time SENT Time from reaching minimum allowed 1.1 ms
supply voltage of 4.5V till the first falling
edge of the first SENT frame
Pressure response time Time needed for the output to change 1 ms
analog from an input pressure step to 90% of its
final value. Capacitive load 100nF.
Using default filter settings PFLT=0 and
SSF=1.
For response times using different filter
settings see Table 10.
Pressure response time Default filter setting PFLT = 0 and SSF = 1. 3 SENT
SENT(4) Tick time = 3us and Pause Pulse enabled. frames
For other configurations refer to Table 10
in chapter 12.1.
InP InN digital diagnostic Diagnostic thresholds of 25% of VDDA -16384 16384 lsb
levels (low) and 75% of VDDA (high)

Pressure output noise BW limited to 50kHz. 2 mVrms

analog
Input voltage range on 0 3.5 V
NTC pin
Table 4: Electrical specifications

Detailed General Description

The MLX90821 contains a pressure sensing element which consists of a square diaphragm realized in the
silicon chip by backside etching. The diaphragm reacts to a pressure difference between the top and bottom
side of the diaphragm. The internal strain increases, in particular at the border of the diaphragm. Here, the
piezoresistive elements have been implanted into the silicon diaphragm, which act as a transducer.

The sensor interface containing the readout circuit is integrated in the same package as the sensing element.
The electronics front end amplifies the signal from the bridge, performs a coarse offset compensation and
an ADC conversion. The DSP performs the compensations over temperature. Furthermore, the digital circuit
provides some filtering, the possibility to linearize the pressure signal and also implements the clamping
function. The analog back end consists of a 12 bit DAC and an output driver. This chip delivers an analog
output proportional to the pressure or a SENT output compliant with the rev 4 from April 2016 of the SAE
J2716 specification. An accurate factory calibrated external NTC temperature is also available on the SENT
output.

4 Number of SENT frames between pressure step and settled output (last frame containing stable pressure data)

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A broken wire detection block allows actively driving the output to one of the rails in case of a broken supply
or ground connection. Extensive protection of the supply lines allows the MLX90821 to handle extreme
overvoltage conditions and is immune to severe external disturbances. Several diagnostic functions (over -
voltage, under-voltage, overpressure, under pressure detections) have been implemented on the 90821 and
can be enabled by programming EEPROM settings. Figure 3 describes MLX90821 block diagram.

DSP Overvoltage &

reverse voltage Vsupply
Divided bridge
Sensor bias current protection
6/7 VDDA
Off chip temperature IV conversion Voltage regulator
sensor current output Gain & Offset POR
Temperature
On chip temperature Compensation
sensor
Piezoresistive
sensing element
Vbrg Pressure Linearization
PGA
Vana DAC Gain
Analog
InP M Programmable Filter 12 bits
Output
OPA
U ADC
16 bits
X

Rom SENT
InN InP, InN, VEXT Output
EEPROM
NTC External NTC Test Test
interface
Input Ram
Oscillator Gnd

Figure 3: MLX90821 block diagram

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Default programmed settings

The MLX90821 is calibrated at the final manufacturing test step. During the calibration, settings are stored in the
on chip EEPROM to define the pressure transfer curve as well as the output clamping levels. On MLX90821
devices using the SENT output, besides pressure, the internal temperature and optionally the NTC temperature
calibrations are performed. Together with the transfer functions, the IC filter values are set.

The analog output transfer curves as described below are valid assuming a supply voltage of 5V for the IC, the
analog output scales in a ratiometric way to the supply voltage.

Output

HCL
O2
εp

εo

O1 Relative Pressure
LCL in Bar

P1 P2

Figure 4: Pressure transfer function description at room temperature

Temperature Factor
Pressure Accuracy

Fe
Fc

-40 -20 10 35 60 85 110 135 150

Temperature (°C)
Fc
Fe

Figure 5: Pressure accuracy temperature factor (temperature code L)

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Temperature Factor
Pressure Accuracy

Fe
Fc

-40 -20 10 35 60 85 110 115

Temperature (°C)
Fc
Fe

Figure 6: Pressure accuracy temperature factor (temperature code V)

SENT Output
in LSB

4088

1 Temperature in °C

-73.025 437.85

Figure 7: NTC and internal temperature transfer function

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Temperature Accuracy
(°C)

εTe

εTc

-40 35 100 150 170

Temperature (°C)
εTc

εTe

Figure 8: NTC temperature accuracy

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Default Characteristics DBA-003

Transfer Curve
Symbol Remarks Value Unit
Parameter
Pressure 1 P1 See Figure 4: Pressure -0.06 Bar
transfer function
Pressure 2 P2 0.26 Bar
description at room
Output 1 O1 temperature 0.5 V
Output 2 O2 4.5 V
Low clamping level LCL 0.25 V
High clamping level HCL 4.75 V
Pressure Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
expressed as output -60 60 mV
Output accuracy εo value (FS range from -1.5 1.5 %FS
0.5V to 4.5V)
Overall accuracy
Pressure accuracy εp expressed as pressure -4.8 4.8 mBar
value
Center temperature See Figure 5: Pressure
Fc accuracy temperature 1
accuracy factor
factor
Extended temperature
Fe 1.5
accuracy factor
Table 5: DBA-003 Default configuration

Default Characteristics DBA-005

Transfer Curve
Symbol Remarks Value Unit
Parameter
Pressure 1 P1 See Figure 4: Pressure -0.05 Bar
transfer function
Pressure 2 P2 0.05 Bar
description at room
Output 1 O1 temperature 0.5 V
Output 2 O2 4.5 V
Low clamping level LCL 0.5 V
High clamping level HCL 4.5 V
Pressure Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
expressed as output -100 100 mV
Output accuracy εo value (FS range from -2.5 2.5 %FS
0.5V to 4.5V)
Overall accuracy
Pressure accuracy εp expressed as pressure -2.5 2.5 mBar
value
Center temperature See Figure 5: Pressure
Fc accuracy temperature 1
accuracy factor
factor
Extended temperature
Fe 1.5
accuracy factor
Table 6: DBA-005 Default configuration

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Default Characteristics DBA-006

Transfer Curve
Symbol Remarks Value Unit
Parameter
Pressure 1 P1 See Figure 4: Pressure -0.2 Bar
transfer function
Pressure 2 P2 0.5 Bar
description at room
Output 1 O1 temperature 4.5 V
Output 2 O2 0.5 V
Low clamping level LCL 0.3 V
High clamping level HCL 4.7 V
Pressure Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
expressed as output -40 40 mV
Output accuracy εo value (FS range from -1 1 %FS
0.5V to 4.5V)
Overall accuracy
Pressure accuracy εp expressed as pressure -7 7 mBar
value
Center temperature See Figure 5: Pressure
Fc accuracy temperature 1
accuracy factor
factor
Extended temperature
Fe 1.5
accuracy factor
Table 7: DBA-006 Default configuration

Default Characteristics DBA-008

Transfer Curve
Symbol Remarks Value Unit
Parameter
Pressure 1 P1 See Figure 4: Pressure -0.0375 Bar
transfer function
Pressure 2 P2 0.0125 Bar
description at room
Output 1 O1 temperature 4.5 V
Output 2 O2 0.5 V
Low clamping level LCL 0.3 V
High clamping level HCL 4.7 V
Pressure Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
expressed as output -160 160 mV
Output accuracy εo value (FS range from -4 4 %FS
0.5V to 4.5V)
Overall accuracy
Pressure accuracy εp expressed as pressure -2 2 mBar
value
Center temperature See Figure 6: Pressure
Fc accuracy temperature 1
accuracy factor
factor (temperature
Extended temperature code V)
Fe 1.5
accuracy factor
Table 8: DBA-008 Default configuration

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Default Characteristics DBA-100

Transfer Curve
Symbol Remarks Value Unit
Parameter
Pressure 1 P1 See Figure 4: Pressure -0.06 Bar
transfer function
Pressure 2 P2 0.26 Bar
description at room
Output 1 O1 temperature 193 LSB
Output 2 O2 3896 LSB
Low clamping level LCL 1 LSB
High clamping level HCL 4088 LSB
Pressure Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
expressed as output -55 55 LSB
Output accuracy εo value (FS range from -1.5 1.5 %FS
193 to 3896)
Overall accuracy
Pressure accuracy εp expressed as pressure -4.8 4.8 mBar
value
Center temperature See Figure 5: Pressure
Fc accuracy temperature 1
accuracy factor
factor
Extended temperature
Fe 1.5
accuracy factor
NTC Accuracy
Symbol Remarks Min Typ Max Unit
Parameter
Overall accuracy
using the default NTC
Center NTC as described in Table
εTc 13
-1 1 °C
temperature accuracy
See Figure 8: NTC
temperature accuracy
Extended NTC
εTe -2 2 °C
temperature accuracy
Table 9: DBA-100 Default configuration

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Filters
There are two filters available to filter the pressure signal. The first filter is a Small Signal Filter which can be
disabled or enabled. The second filter is a first order low pass filter for the pressure signal which has a
programmable depth.

PFLT
PFLT is a programmable first order low pass filter. The depth of this filter can be selected. This filter can be
configured to select the optimal trade-off between response time and output noise.

The low pass filter is implemented according to the following formula:

𝐹𝑖𝑙𝑡𝑒𝑟𝑖𝑛𝑝𝑢𝑡 (𝑘) − 𝐹𝑖𝑙𝑡𝑒𝑟𝑜𝑢𝑡𝑝𝑢𝑡 (𝑘 − 1)

𝐹𝑖𝑙𝑡𝑒𝑟𝑜𝑢𝑡𝑝𝑢𝑡 (𝑘) = + 𝐹𝑖𝑙𝑡𝑒𝑟𝑜𝑢𝑡𝑝𝑢𝑡 (𝑘 − 1)
2𝑃𝐹𝐿𝑇

The PFLT parameter in the formula is set in EEPROM and can have a value between 0 and 9. An overview of
typical response times when applying a step on the input using different PFLT filter settings can be found in Table
10. Filter setting 0 disables the PFLT.

Analog output SENT output Response

PFLT setting
Response time in ms(5) time in SENT frames(6)
0 0.93 3
1 1.25 3
2 2 5
3 3.7 8
4 7.1 13
5 13.7 24
6 27.0 45
7 53.8 88
8 106.8 176
9 203.8 350
Table 10: Filter settings and typical response times

SSF
The SSF (Small Signal Filter) is a digital filter which is designed not to have an impact on the response time of a
fast changing pressure signal like a pressure step. When a large signal change at the input is present, the filter is
bypassed and not filtering the signal. For small signal changes, which are in most cases noise, the filter is used
and filtering the pressure signal.

The Small Signal Filter can be enabled or disabled in EEPROM. It is advised not to use the SSF in combination with
the PFLT enabled.

5 Time needed for the output to change from an input pressure step to 90% of its final value.
6 Tick time is set to 3us and Pause Pulse is enabled.

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Analog Front End

The analog front end of the MLX90821 consists of a chopping stage and 3 amplification stages as can be seen in
Figure 9. There are also several input diagnostics integrated into this front end to be able to detect a broken InP
or InN connection or an input which is out of range. This diagnostic information is transferred to the
microcontroller to handle further action for example flagging a diagnostic message.

G = 1.25 or 3.5
G = 4.5 to 10.5 CSOF: 1/3 to 2/3
3 bits of VDDA G = 1.6, 3.2 or 6.4

InP

Input
Diag OPA OPA
nostics

InN Chopping Stage 1: Stage 2: Stage 3:

1us/phase Instrumentation amplifier Differential amplifier Integrator

Figure 9: Analog front end block diagram

The first stage is an instrumentation amplifier of which the gain can be programmed using 3 bits to cover a gain
range between 4.5 and 10.6.
Transfer equation:
OUTP1 – OUTN1 = Gst1*(InP – InN) in phase 1
OUTP1 – OUTN1 = Gst1*(InN – InP) in phase 2

The second stage is a fully differential amplifier. The gain of the amplifier can be calibrated using 1 bit.
Transfer equation:
OUTP2 – OUTN2 = -Gst2*(OUTP1 – OUTN1) – Gst2*(CSOF1 – CSOF2) in phase 1
OUTP2 – OUTN2 = -Gst2*(OUTN1 – OUTP1) – Gst2*(CSOF2 – CSOF1) in phase 2

The CSOF1 and CSOF2 signals are generated by the coarse offset DAC with the following transfer functions:
 2 1  VDDA CO[6 : 0]
+ (− 1) *  −  *
VDDA
CSOF1 =
CO 7
*
2  3 3 2 127
CO 7  2 1  VDDA CO[6 : 0]
− (− 1) *  −  *
VDDA
CSOF 2 = *
2  3 3 2 127

CO[6:0] fixes the DAC output. CO7 is used for the polarity.

The third stage is an integrator which is controlled using 2 bits to set a gain between 1.6 and 6.4
Transfer equation at the outputs of the amplifier:
OUTP3 – OUTN3 = -N*(C1/C2)*(OUTP2 – OUTN2)
OUTP3_common_mode and OUTN3_common_mode = VCM = VDDA/2
In this equation N represents the number of integration cycles which is a fixed value of N = 40.
C2 is a fixed feedback capacitor of approximately 5pF. C1 can have 3 different values: 0.2pF, 0.4pF or 0.8pF.

Transfer equation after the ADC:

Pressure_ADC = ((OUTN3 – OUTP3)*216/VDDA) + 32768

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An overview of all possible values for Gst1, Gst2 and Gst3 can be found in Table 11 below.
The input stage is designed to work with an input common-mode voltage range between 42%Vbrg and 58%Vbrg.

Gain Total FS Differential

Gst1 Gst2 Gst3
setting gain input signal
[V/V] [V/V] [V/V]
[-] [V/V] [mV]
0 4.49 -1.25 1.6 -9.0 ± 195
1 5.06 -1.25 1.6 -10.1 ± 173
2 5.8 -1.25 1.6 -11.6 ± 151
3 6.52 -1.25 1.6 -13.0 ± 134
4 7.43 -1.25 1.6 -14.9 ± 118
5 8.37 -1.25 1.6 -16.7 ± 105
6 9.35 -1.25 1.6 -18.7 ± 94
7 10.6 -1.25 1.6 -21.2 ± 83
8 4.49 -3.5 1.6 -25.1 ± 70
9 5.06 -3.5 1.6 -28.3 ± 62
10 5.8 -3.5 1.6 -32.5 ± 54
11 6.52 -3.5 1.6 -36.5 ± 48
12 7.43 -3.5 1.6 -41.6 ± 42
13 8.37 -3.5 1.6 -46.9 ± 37
14 9.35 -3.5 1.6 -52.4 ± 33
15 10.6 -3.5 1.6 -59.4 ± 29
16 4.49 -3.5 3.2 -50.3 ± 35
17 5.06 -3.5 3.2 -56.7 ± 31
18 5.8 -3.5 3.2 -65.0 ± 27
19 6.52 -3.5 3.2 -73.0 ± 24
20 7.43 -3.5 3.2 -83.2 ± 21
21 8.37 -3.5 3.2 -93.7 ± 19
22 9.35 -3.5 3.2 -104.7 ± 17
23 10.6 -3.5 3.2 -118.7 ± 15
24 4.49 -3.5 6.4 -100.6 ± 17
25 5.06 -3.5 6.4 -113.3 ± 15
26 5.8 -3.5 6.4 -129.9 ± 13
27 6.52 -3.5 6.4 -146.0 ± 12
28 7.43 -3.5 6.4 -166.4 ± 11
29 8.37 -3.5 6.4 -187.5 ±9
30 9.35 -3.5 6.4 -209.4 ±8
31 10.6 -3.5 6.4 -237.4 ±7
Table 11: Gain and input signal range of the analog front end

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ADC
The 16 bit differential ADC has a range from –VDDA/2 to +VDDA/2.

There are 7 different ADC channels. Channel 0 is not used. Table 12 below describes all the channels.

ADC Signal Remarks

SIN[2:0]
0 - Nothing connected
1 P Pressure
2 Tint Internal Temperature
3 Vsup External Supply
Multiplexing between Positive/Negative Sensor
4 InP/InN Output
5 Vdig Digital Regulator
6 Tntc NTC Output
7 Text External Temperature
Table 12: ADC channels

The different channels are converted in a constantly repeating sequence. A new ADC conversion is done every
50us following the sequence shown below in Figure 10. This is resulting in an updated pressure output value
every 200us.

P Tint P Text P Tntc P Vsup P Tint P Text P Tntc P InP/InN P Tint P ...

Figure 10: ADC sequence

Digital
The digital is built around a 16-bit microcontroller. It contains besides the processor also ROM, RAM and EEPROM
and a set of user and system IO registers.

Temperature compensation of the pressure signal and pressure linearization is handled by the microcontroller.
For the pressure compensation there are EEPROM parameters allocated to be able to cover a large variety of
calibration approaches.
Both for gain and offset of the pressure signal, there is a separate temperature dependency programmable
ranging from a temperature independence to a first order, second order and finally a third order compensation.
This is reflected in EEPROM parameters for the offset (O0, O1, O2 and O3) and for the gain (G0, G1, G2 and G3).
If required, the linearity of the pressure signal can also be compensated without a temperature dependency or
with a first order temperature dependency through EEPROM parameters L0 and L1.

Linearization of the NTC temperature is also covered partially by the microcontroller. More information in this
topic can be found in chapter 16.

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NTC Temperature Linearization

The linearization of the NTC temperature signal is split up in several stages. A schematic overview of these steps
can be seen in Figure 11.

VDDA

3 or 4 points
MLX calibration
@ 3 temp
Rs

Vdiv LUT
ADC_raw[15:0] ADC_comp[15:0]
Calibration
VDDA/2 ADC &
Compensation
ADC_ROM
=>
Rntc Tntc

Figure 11: Block diagram NTC linearization

The complete system can be divided into 5 separate stages.

1. A resistor divider with internal resistor Rs is used to linearize Rntc into a voltage.
2. A fully differential amplifier with unity gain is used to drive the ADC.
3. The 16-bit ADC is being used to convert the analog resistor divider output voltage into a digital signal
called ADC_raw.
4. With the help of calibration data saved in EEPROM the microcontroller will perform a first compensation
on ADC_raw converting in to ADC_comp. This new value is targeted to be as close as possible to the value
ADC_ROM.
5. Finally a look up table (LUT) will be used to convert the ADC_ROM values into the Tntc value which is the
desired linearized NTC temperature.

The default NTC characteristic which is calibrated on option code DBA-100 can be found in Table 13. When using
an NTC which does not match the coefficients described above, it is advised to contact Melexis.

The EEPROM coefficients which are used for the conversion from ADC_raw to ADC_comp are N0 to N3,
N0_Diff_Low to N3_Diff_Low, N0_Diff_High to N3_Diff_High and TEMP1 to TEMP3.

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T (°C) RT/R25 R (Ω) T (°C) RT/R25 R (Ω)

-55 53.68 268400 75 0.18779 938.95
-50 39.112 195560 80 0.16261 813.05
-45 28.817 144085 85 0.14131 706.55
-40 21.459 107295 90 0.12324 616.2
-35 16.142 80710 95 0.10783 539.15
-30 12.259 61295 100 0.094663 473.315
-25 9.3959 46979.5 105 0.083361 416.805
-20 7.2644 36322 110 0.073638 368.19
-15 5.6633 28316.5 115 0.06524 326.2
-10 4.4503 22251.5 120 0.057964 289.82
-5 3.5236 17618 125 0.05164 258.2
0 2.8102 14051 130 0.046128 230.64
5 2.2567 11283.5 135 0.041309 206.545
10 1.8243 9121.5 140 0.037085 185.425
15 1.4841 7420.5 145 0.033373 166.865
20 1.2147 6073.5 150 0.030102 150.51
25 1 5000 155 0.027213 136.065
30 0.82785 4139.25 160 0.024654 123.27
35 0.689 3445 165 0.022384 111.92
40 0.57639 2881.95 170 0.020364 101.82
45 0.48457 2422.85 175 0.018564 92.82
50 0.40931 2046.55 180 0.016955 84.775
55 0.34731 1736.55 185 0.015515 77.575
60 0.29599 1479.95 190 0.014223 71.115
65 0.25332 1266.6 195 0.013063 65.315
70 0.21768 1088.4 200 0.012017 60.085
Table 13: Default NTC characteristic

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SENT Configuration
The SENT output is designed to be compliant with the SAE J2716 rev. Apr 2016 SENT standard. The tick time is
configurable in EEPROM using parameter TICK_DIV. The available tick time settings are 3us, 4us, 6us, 10us, 12us
and 16us. A pause pulse can also be enabled to have a fixed frame length of 282 ticks. This can be done using
parameter PAUSE. The default configuration for option code DBA-100 is 3us tick time and pause pulse enabled.

Fast Channel Configuration

On the fast channel, 8 different options are available to configure channel 1 and channel 2. An overview of these
different options and how to configure them can be found in Table 14.

FC_CFG
# Fast Channel 1 Fast Channel 2 Remark
setting
1 0 Pressure (3x 4 bit) Inverse of Pressure (3x 4 bit)
2 1 Pressure (3x 4 bit) Rolling counter (2x 4 bit) and
inverse of MSN of Pressure
(1x 4 bit)
3 2 Pressure (3x 4 bit) Medium temperature Media temperature can either be
(3x 4 bit) NTC or sensing element temperature.
(Tmedium_Select).
Default for option code DBA-100.
4 3 Pressure (3x 4 bit) Internal temperature Internal temperature can either be
(3x 4 bit) PTAT or sensing element
temperature (Tinternal_Select).
5 4 Pressure only (3x 4 bit) /
6 5 Pressure only (4x 3 bit) /
7 6 Data indicated by pointer 1 Data indicated by pointer 2 In this mode no diagnostics are
(3x 4 bit) (3x 4 bit) available. FC configuration only used
by Melexis.
8 7 Pressure (3x 4 bit) 0 (3x 4 bit)

Table 14: Fast channel configuration options

The selection of the fast channel output mode can be done by changing the parameter ‘FC_CFG’ in the EEPROM.

In case Medium temperature is selected to be available on fast channel 2, the type of media can be defined in
EEPROM using parameter ‘Tmedium_Select’. When selecting 0, linearized NTC temperature will be available.
Selecting 1 enables sensing element temperature. Sensing element temperature is not calibrated by default.

For Internal temperature, also two options are available defined in EEPROM parameter ‘Tinternal_Select’ where
0 corresponds to on chip factory calibrated PTAT temperature and 1 corresponds to sensing element
temperature. The same comment regarding the calibration of the sensing element temperature calibration as
made above applies here.

Slow Channel Configuration

The Slow Serial Channel is implemented according to the Enhanced Serial Message Format using 12 bit data and 8
bit message ID as described in the reference SENT protocol standard SAE J2716 rev. Apr 2016.

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An overview of the different slow channel messages which are available in the MLX90821 can be found in Table
15. From this table 16 messages can be configured completely in EEPROM. The 12 bit data content of these
messages can be configured freely. The ID of programmable message PR0, PR1, PR2 and PR3 is copied from
EEPROM (2x 4 bit). The ID of PR5 is 1 bit higher than of PR4. The same is valid for the other pairs: PR6-7, PR8-9, …,
PR14-15. This programmable ID is indicated in Table 15 as 0xYZ.

All programmable messages can also be enabled and disabled, but not all independently of each other:
• PR0, PR1, PR2 and PR3 can be each independently enabled or disabled
• PR4 and PR5 are together enabled or disabled
• PR6 and PR7 are together enabled or disabled
• PR8, PR9, PR10 and PR11 are together enabled or disabled
• PR12, PR13, PR14 and PR15 are together enabled or disabled

# Type ID Description Data Rep

0 RAM 0x01 Diagnostic codes Error_flags (See chapter 20 Diagnostics) Y
1 EEPROM 0x03 Sensor Type Configurable 0 to 15 N
2 EEPROM 0x04 Configuration code Configurable 0 to 4095 N
3 EEPROM 0x05 Manufacturer Code Configurable 0 to 4095 N
4 RAM 0x06 SENT revision Selectable by bit in EEPROM N
Data = 3 or 4
5 RAM 0x07 Fast channel 1 Fast channel 1 Characteristic Configuration N
Characteristic X1 Enable / disable shared with MID08
6 RAM 0x08 Fast channel 1 Fast channel 1 Characteristic Configuration N
Characteristic X2 Enable / disable shared with MID07
7 EEPROM 0xYZ Fully Programmable Programmable ID: N
message 0 8 bit
Programmable Data:
12 bit
8 RAM 0x23 Internal Temperature According to default linear temperature transfer Y
characteristic in SAE J2716 standard
9 RAM 0x09 Fast channel 1 Fast channel 1 Characteristic Configuration N
Characteristic Y1 Enable / disable shared with MID0A
10 RAM 0x0A Fast channel 1 Fast channel 1 Characteristic Configuration N
Characteristic Y2 Enable / disable shared with MID09
11 ROM 0x0B Fast channel 2 If FC2 is pressure (FC_CFG = 0): ID0B = ID07 N
Characteristic X1 If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic X1: Fixed
value: 233
Enable / disable shared with MID0C / 0D / 0E
12 ROM 0x0C Fast channel 2 If FC2 is pressure (FC_CFG = 0): ID0C = ID08 N
Characteristic X2 If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic X2: Fixed
value: 423
Enable / disable shared with MID0B / 0D / 0E

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# Type ID Description Data Rep

13 ROM 0x0D Fast channel 2 If FC2 is pressure (FC_CFG = 0): ID0D = ID09 N
Characteristic Y1 If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic Y1: Fixed
value: 264
Enable / disable shared with MID0B / 0C / 0E
14 ROM 0x0E Fast channel 2 If FC2 is pressure (FC_CFG = 0): ID0E = ID0A N
Characteristic Y2 If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic Y2: Fixed
value: 1784
Enable / disable shared with MID0B / 0C / 0D
15 EEPROM 0x29 Sensor ID #1 Programmable Data: 12 bit N
Enable / disable shared with MID2A / 2B / 2C
16 EEPROM 0xYZ Fully Programmable Programmable ID: 8 bit N
message 1 Programmable Data: 12 bit
17 EEPROM 0x2A Sensor ID #2 Programmable Data: 12 bit N
Enable / disable shared with MID29 / 2B / 2C
18 EEPROM 0x2B Sensor ID #3 Programmable Data: 12 bit N
Enable / disable shared with MID29 / 2A / 2C
19 EEPROM 0x2C Sensor ID #4 Programmable Data: 12 bit N
Enable / disable shared with MID29 / 2A / 2B
20 EEPROM 0xYZ Fully Programmable Programmable ID: 8 bit N
message 2 Programmable Data: 12 bit
21 EEPROM 0xYZ Fully Programmable Programmable ID: 8 bit N
message 3 Programmable Data: 12 bit
22 EEPROM 0xYZ Programmable message 4 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
message 5
23 EEPROM 0xYZ Programmable message 5 Message ID = ID programmable message 4 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
message 4
24 EEPROM 0xYZ Programmable message 6 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
message 7
25 EEPROM 0xYZ Programmable message 7 Message ID = ID programmable message 6 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
message 6

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# Type ID Description Data Rep

26 EEPROM 0xYZ Programmable message 8 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 9 / 10 / 11
27 EEPROM 0xYZ Programmable message 9 Message ID = ID programmable message 8 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 8 / 10 / 11
28 EEPROM 0xYZ Programmable message 10 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 8 / 9 / 11
29 EEPROM 0xYZ Programmable message 11 Message ID = ID programmable message 10 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 8 / 9 / 10
30 EEPROM 0xYZ Programmable message 12 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 13 / 14 / 15
31 EEPROM 0xYZ Programmable message 13 Message ID = ID programmable message 12 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 12 / 14 / 15
32 EEPROM 0xYZ Programmable message 14 Programmable ID: 8 bit N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 12 / 13 / 15
33 EEPROM 0xYZ Programmable message 15 Message ID = ID programmable message 14 + 1 N
Programmable Data: 12 bit
Enable / disable shared with programmable
messages 12 / 13 / 14
34 RAM 0x10 Medium Temperature According to default linear temperature transfer Y
characteristic in SAE J2716 standard
35 RAM 0xE1 Device start-up check Start-up self-check result data N

Table 15: Slow channel messages

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Messages which have a “Y” in the column Rep of Table 15 can be selected to have a higher occurrence in the slow
channel message sequence. Their repetition rate can be configured as indicated in Table 16.

The repeatable messages MID01h, MID10h and MID23h can be configured individually to have their own
repetition rate. The repetition factor setting can be done in respectively “SENT_REP_FACT_ID_01”,
“SENT_REP_FACT_ID_10” and “SENT_REP_FACT_ID_23”.

Repetition Factor Setting Real Repetition Factor

0 Message repetition disabled
1 Message repeat every 2 messages
2 Message repeat every 3 messages
3 Message repeat every 4 messages
4 Message repeat every 5 messages
5 Message repeat every 6 messages
6 Message repeat every 7 messages
7 Message repeat every 8 messages
8 Message repeat every 9 messages
9 Message repeat every 10 messages
10 Message repeat every 12 messages
11 Message repeat every 16 messages
12 Message repeat every 20 messages
13 Message repeat every 24 messages
14 Message repeat every 28 messages
15 Message repeat every 30 messages
Table 16: Repetition rate settings

Once a message is configured to be repeatable, it will automatically have the highest priority. Therefore it will
appear first in the slow message sequences.
The priority order between MID01, MID10 and MID23 can also be configured using EEPROM parameter
“SC_R_O”:
• SC_R_O = 0: Priority order: ID01h > ID10h > ID23h
• SC_R_O = 1: Priority order: ID10h > ID23h > ID01h

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Wrong Connections Overview Analog Output

Table 17 provides an overview of the behavior of the MLX90821 when different combinations of connections to
GND, VDD and OUT are made.

Action after wrong

GND VDD Analog out Effect on output
connection
0V 5V Pull-down or Pull-up Normal operation Normal operation
Disconnected 5V Pull-down or Pull-up High Fault Band Normal operation
0V Disconnected Pull-down or Pull-up Low Fault Band Normal operation
0V 5V Disconnected Low Fault Band for Normal operation
Pull-down
High Fault Band for
Pull-up
0V 5V 0V Low Fault Band Normal operation
0V 5V 5V High Fault Band Normal operation
0V 5V 18V 18V Normal operation
0V 0V Pull-down or Pull-up Low Fault Band Normal operation
0V 18V Pull-down or Pull-up Low Fault Band for Normal operation
Pull-down
High Fault Band for
Pull-up
5V 5V Pull-down or Pull-up High Fault Band Normal operation
5V 0V Pull-down or Pull-up Normal operation
Table 17: Wrong connections overview

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Wrong Connections Overview SENT Output

Table 18 provides an overview of the behavior of the MLX90821 when different combinations of connections to
GND, VDD and OUT are made.

Action after wrong

GND VDD SENT out Effect on output
connection
0V 5V SAE Standard Normal operation Normal operation
Load Circuit
Disconnected 5V SAE Standard No communication Normal operation
Load Circuit
0V Disconnected SAE Standard No communication Normal operation
Load Circuit
0V 5V Disconnected No communication Normal operation

0V 5V 0V 0V – No Normal operation
communication
0V 5V 5V 5V – No Normal operation
communication
0V 5V 18V 18V – No Normal operation
communication
0V 0V SAE Standard No communication Normal operation
Load Circuit
0V 18V SAE Standard No communication Normal operation
Load Circuit
5V 5V SAE Standard No communication Normal operation
Load Circuit
5V 0V SAE Standard No communication Normal operation
Load Circuit
Table 18: Wrong connections overview

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Diagnostics
Input Diagnostics
An overview of the different input diagnostics conditions and their corresponding fault band and diagnostic
source can be found in Table 19.

Analog Output SENT Output Diagnostic

Condition
Fault Band Fast Channel Code Source(7)
Vbrg disconnected Low 4090 ERR_EN_SPSN
GND (sensor) Low 4090 ERR_EN_SPSN
disconnected
InP disconnected Low 4090 ERR_EN_BW
InN disconnected Low 4090 ERR_EN_BW
Vbrg shorted to GND Low 4090 ERR_EN_SPSN
InP shorted to GND Low 4090 ERR_EN_SPSN
InN shorted to GND Low 4090 ERR_EN_SPSN
InP shorted to Vbrg Low 4090 ERR_EN_SPSN
InN shorted to Vbrg Low 4090 ERR_EN_SPSN
Table 19: Input diagnostics

Diagnostic Sources
The MLX90821 product has several internal checks which monitor the status of device. These checks or
diagnostic sources can be enabled or disabled based on the sensor module requirements. An overview of the
different diagnostic sources, their enable/disable parameter and the explanation of their functionality can be
found below in Table 20. The default diagnostic configuration for the different option codes can be found in Table
21.

Bit Parameter Error condition

10 ERR_EN_TINT The Internal temperature could not be measured/calculated
9 ERR_EN_IO RAM configuration error
8 ERR_EN_SPSN SP or SN pin voltage out of range
7 ERR_EN_PV The pressure value could not be measured/calculated
6 ERR_EN_PP Pressure parameter error
5 ERR_EN_BW A broken wire is detected in the pressure sensor path
4 ERR_EN_TMED The Medium temperature could not be measured/calculated
2 ERR_EN_VSUPH The supply voltage is too high
1 ERR_EN_VSUPL The supply voltage is too low
0 ERR_EN_TCHIP The chip temperature out of range
Table 20: Diagnostic sources

7 See tables 22 to 24 for more information on the errors

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DBA- DBA- DBA- DBA- DBA-

Parameter
003 005 006 008 100
ERR_EN_TINT     
ERR_EN_IO ✓ ✓ ✓ ✓ ✓
ERR_EN_SPSN ✓ ✓ ✓ ✓ ✓
ERR_EN_PV ✓ ✓ ✓ ✓ ✓
ERR_EN_PP ✓ ✓ ✓ ✓ ✓
ERR_EN_BW ✓ ✓ ✓ ✓ ✓
ERR_EN_TMED     
ERR_EN_VSUPH     
ERR_EN_VSUPL     
ERR_EN_TCHIP ✓ ✓ ✓ ✓ ✓

Table 21: Default diagnostic configuration

The level of the over and under voltage diagnostics can be configured according to the ranges described in Table
22.
Parameter Min Max Units Comment
Optional and Programmable
Under voltage detection
3.25 5.74 V with 8 bits in parameter
threshold range VSUP_LOW
Optional and
Overvoltage detection 4.25 6.74 V Programmable with 8 bits in
threshold range parameter VSUP_HIGH
Over-/Under-voltage
200 mV
detection accuracy
Table 22: MLX90821 under and overvoltage detection

Sent Output Fast and Slow Channel Diagnostics

There are two values reserved to show an error diagnostic mode in the fast channel. These values are 4090 and
4091. According to the type of diagnostic flag, one of the values will be transmitted if enabled. Internal errors like
for example PRESS_BROKEN_W or PRESS_PAR use 4090 to indicate an error condition on the fast channel.
Errors conditions which can be linked to external influences can be configured to either transmit 4090 or 4091.
These errors are VSUP_HIGH, VSUP_LOW and T_CHIP.
For both VSUP_HIGH and VSUP_LOW fast channel overwriting using an error message can even be disabled. This
allows you to still decode properly the pressure or optionally temperature information in case of an over voltage
or under voltage condition. The OV or UV condition can still be monitored using the status bits for FC1 and FC2
and the slow channel diagnostic message MID01.
An overview of the fast channel error configuration can be found in Table 23. The EEPROM parameters V_ERR,
FCE_VSUP and FCE_TCHIP handle this configuration.

Fast Fast
Parameter Parameter
Channel Channel
ERR_VSUP V_ERR FCE_VSUP ERR_TCH FCE_TCHIP
No change 0 Not applicable 4091 0
4091 1 0 4090 1
4090 1 1
Table 23: Fast channel error configuration

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The diagnostic slow channel message (MID 1) can be enabled or disabled independent of the other slow channel
messages and it has an adjustable repetition factor (2, 4, .., 30).

More information on the different diagnostics shown in SENT, their fast channel, slow channel and status bit
mapping can be found in the tables below.

Multiple diagnostic errors can be flagged in the range 8xxh – FFFh in case parameter DIAG_INT is set to 0.

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ERROR_ENABLE FC_CFG = 0 FC_CFG = 1 FC_CFG = 2 FC_CFG = 3

ERROR
parameter FC1 FC2 St[0] St[1] FC1 FC2 St[0] St[1] FC1 FC2 St[0] St[1] FC1 FC2 St[0] St[1]
cnt &
N.A. no error P ~P 0 0 P 0 0 P Tmed 0 0 P Tint 0 0
~MSN(P)
- not calibrated 4095 4095 1 1 4095 nc 1 nc 4095 4095 1 1 4095 4095 1 1

DIAG_INT initialization error 4090 4090 1 1 4090 nc 1 nc 4090 4090 1 1 4090 4090 1 1

ERR_EN_TINT T_INT nc nc nc nc nc nc nc nc nc nc nc nc nc 4090 nc 1

ERR_EN_IO RAM_IO_CFG 4090 4090 1 1 4090 nc 1 nc 4090 4090 1 1 4090 4090 1 1

ERR_EN_SPSN SPSN 4090 4090 1 1 4090 nc 1 nc 4090 nc 1 nc 4090 nc 1 nc

ERR_EN_PV PRESS 4090 4090 1 1 4090 nc 1 nc 4090 nc 1 nc 4090 nc 1 nc

ERR_EN_PP PRESS_PAR 4090 4090 1 1 4090 nc 1 nc 4090 nc 1 nc 4090 nc 1 nc

ERR_EN_BW PRESS_BROKEN_W 4090 4090 1 1 4090 nc 1 nc 4090 nc 1 nc 4090 nc 1 nc

ERR_EN_TMED T_MED nc nc nc nc nc nc nc nc nc 4090 nc 1 nc nc nc nc

ERR_EN_TCHIP T_CHIP ERR_TCHIP ERR_TCHIP 1 1 ERR_TCHIP nc 1 nc ERR_TCHIP ERR_TCHIP 1 1 ERR_TCHIP ERR_TCHIP 1 1

ERR_EN_VSUPH VSUP_HIGH ERR_VSUP ERR_VSUP 1 1 ERR_VSUP nc 1 nc ERR_VSUP ERR_VSUP 1 1 ERR_VSUP ERR_VSUP 1 1

ERR_EN_VSUPL VSUP_LOW ERR_VSUP ERR_VSUP 1 1 ERR_VSUP nc 1 nc ERR_VSUP ERR_VSUP 1 1 ERR_VSUP ERR_VSUP 1 1

DIAG_P1 P @ FC1 = 1 nc 1 nc 1 nc 1 nc 1 nc 1 nc 1 nc 1 nc

DIAG_P1 P @ FC1 = 4088 nc 1 nc 4088 nc 1 nc 4088 nc 1 nc 4088 nc 1 nc

DIAG_P2 P @ FC1 = < Y1 nc nc nc < Y1 nc nc nc < Y1 nc nc nc < Y1 nc nc nc

DIAG_P2 P @ FC1 = >Y2 nc nc nc >Y2 nc nc nc >Y2 nc nc nc >Y2 nc nc nc

DIAG_T1 T @ FC2 = nc 1 nc 1 nc 1 nc 1

DIAG_T1 T @ FC2 = nc 4088 nc 1 nc 4088 nc 1

DIAG_T2 T @ FC2 = nc <=186 nc 1 nc <=186 nc 1

DIAG_T2 T @ FC2 = nc >=2266 nc 1 nc >=2266 nc 1

Table 24: Diagnostics in fast channel configuration 0 - 3

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ERROR_ENABLE FC_CFG = 4 FC_CFG = 5 FC_CFG = 6 FC_CFG = 7

ERROR
parameter FC1 St[0] FC1 St[0] FC1 FC2 St[0] St[1] FC1 FC2 St[0] St[1]

N.A. no error P (3x 4b) 0 P (4x 3b) 0 [fc0_ptr] [fc1_ptr] 0 0 P 0 0 0

- not calibrated 4095 1 4095 1 nc nc nc nc 4095 nc 1 nc

DIAG_INT initialization error 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_TINT T_INT nc nc nc nc nc nc nc nc nc nc nc nc

ERR_EN_IO RAM_IO_CFG 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_SPSN SPSN 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_PV PRESS 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_PP PRESS_PAR 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_BW PRESS_BROKEN_W 4090 1 4090 1 nc nc nc nc 4090 nc 1 nc

ERR_EN_TMED T_MED nc nc nc nc nc nc nc nc nc nc nc nc

ERR_EN_TCHIP T_CHIP ERR_TCHIP 1 ERR_TCHIP 1 nc nc nc nc ERR_TCHIP nc 1 nc

ERR_EN_VSUPH VSUP_HIGH ERR_VSUP 1 ERR_VSUP 1 nc nc nc nc ERR_VSUP nc 1 nc

ERR_EN_VSUPL VSUP_LOW ERR_VSUP 1 ERR_VSUP 1 nc nc nc nc ERR_VSUP nc 1 nc

DIAG_P1 P @ FC1 = 1 1 1 1 nc nc 1 nc 1 nc 1 nc

DIAG_P1 P @ FC1 = 4088 1 4088 1 nc nc 1 nc 4088 nc 1 nc

DIAG_P2 P @ FC1 = < Y1 nc < Y1 nc nc nc nc nc < Y1 nc nc nc

DIAG_P2 P @ FC1 = >Y2 nc >Y2 nc nc nc nc nc >Y2 nc nc nc

DIAG_T1 T @ FC2 = nc nc nc nc

DIAG_T1 T @ FC2 = nc nc nc nc

DIAG_T2 T @ FC2 = nc nc nc nc

DIAG_T2 T @ FC2 = nc nc nc nc

Table 25: Diagnostics in fast channel configuration 4 - 7

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ERROR_ENABLE
ERROR Slow channel diagnostic
parameter

N.A. no error 000h

- not calibrated nc = no change

003h (only once when reinit passes after reset)
DIAG_INT initialization error (Remark: in contrary to the other errors, DIAG_INT is used here to enable/disable the complete check and not only the
customized slow channel error reporting)
ERR_EN_TINT T_INT A05h if DIAG_INT=1, else set bit 11 & 10

ERR_EN_IO RAM_IO_CFG A05h if DIAG_INT=1, else set bit 11 & 9

ERR_EN_SPSN SPSN A05h if DIAG_INT=1, else set bit 11 & 8

ERR_EN_PV PRESS A05h if DIAG_INT=1, else set bit 11 & 7

ERR_EN_PP PRESS_PAR A05h if DIAG_INT=1, else set bit 11 & 6

ERR_EN_BW PRESS_BROKEN_W A05h if DIAG_INT=1, else set bit 11 & 5

ERR_EN_TMED T_MED A05h if DIAG_INT=1, else set bit 11 & 4

ERR_EN_TCHIP T_CHIP A05h if DIAG_INT=1, else set bit 11 & 0

021h / 901h if DIAG_VSUP = 0 / 1, but set bit 11 & 2 if also other errors are reported in the fast channel
ERR_EN_VSUPH VSUP_HIGH
and if DIAG_INT=0 (if DIAG_INT=1 and other errors, then A05h)
020h / 900h if DIAG_VSUP = 0 / 1, but set bit 11 & 1 if also other errors are reported in the fast channel
ERR_EN_VSUPL VSUP_LOW
and if DIAG_INT=0 (if DIAG_INT=1 and other errors, then A05h)
DIAG_P1 P @ FC1 = 002h if DIAG_PCL = 0 / 812h if DIAG_PCL = 1

DIAG_P1 P @ FC1 = 001h if DIAG_PCL = 0 / 811h if DIAG_PCL = 1

DIAG_P2 P @ FC1 = 002h

DIAG_P2 P @ FC1 = 001h

DIAG_T1 T @ FC2 = 005h

DIAG_T1 T @ FC2 = 004h

DIAG_T2 T @ FC2 = 805h (Remark: value 186 matches with -50 degC)

DIAG_T2 T @ FC2 = 804h (Remark: value 2266 matches with +210 degC)

Table 26: Diagnostics in slow channel

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SENT Timings

Parameter Symbol Comment Min Typ Max Unit

SENT frame period tframe Shortest message (without pause 154 282 ticks
pulse) and longest message 462 846(8) µs
(pause pulse enabled).
Example in µs calculated using a
3µs tick time.
Start-up time tsu1 Based on default settings. 0.7 1 1.1 ms
(to first falling edge)
Start-up time tsu2 First SENT frame contains valid 1.946(8) ms
(up to first data pressure data. Calculation based
received) on 3µs tick time.
Table 27: Start-up timings

tsu2

tsu1 tframe

OUT Data Data Data

VDD

Figure 12: Start-up timings

8 Using nominal tick time, excluding tick time variations.

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Application Information

MLX90821 Application Schematic Analog

1 16

2 15

3 14

4 13

GND 5 12

100nF 6 11 100nF

7 10

OUT 8 9 VDD

Figure 13: Basic application schematic analog output

MLX90821 Application Schematic SENT

1 16

2 15

3 14

4 13
2.2nF
GND 5 12

6 11 OUT
NTC optional 10nF NTC
If not used 7 10
connect pin 6
to GND 8 9 VDD
100nF

Figure 14: Basic application schematic SENT output

These recommendations for external components are only providing a basic protection. Depending on the
module design and the EMC speciation requirements different configurations can be needed.

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Standard information regarding manufacturability of Melexis products

with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

▪ IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
▪ EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

▪ EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
▪ EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)

▪ EN60749-15
Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

▪ EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed
upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the
use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx

ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

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Package Information

Figure 15: MLX90821 package drawing

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Contact
For the latest version of this document, go to our website at www.melexis.com.

For additional information, please contact our Direct Sales team and get help for your specific needs:

Europe, Africa Telephone: +32 13 67 04 95

Email : [email protected]

Americas Telephone: +1 603 223 2362

Email : [email protected]

Asia Email : [email protected]

Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-
infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a
particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the In formation does not grant, explicitly or implicitly, to
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This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be
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The Product(s) may not be used for the following applications subject to export control regulations: the development, product ion, processing, operation, maintenance, storage,
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The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-
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This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.

Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)

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