ZXMP M721

Multi-transmission Platform Compact WDM

Equipment
Product Descriptions

Version: V1.10

ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://ensupport.zte.com.cn
E-mail: [email protected]
LEGAL INFORMATION
Copyright © 2012 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by
contractual confidentiality obligations.
All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History

Revision No. Revision Date Revision Reason

R1.0 2010–10–18 ZXMP M721(V1.10) First version issued

Serial Number: SJ-20121018165824-001

Publishing Date: 2012–10–18(R1.0)

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 Table of Contents
About This Manual ......................................................................................... I
Chapter 1 Product Characteristics ........................................................... 1-1
1.1 Product Technical Characteristics ........................................................................ 1-1
1.1.1 Forward Error Correction .......................................................................... 1-1
1.1.2 APSD/APR Function................................................................................. 1-1
1.1.3 EDFA Technology..................................................................................... 1-2
1.1.4 Integration of DWDM and CWDM .............................................................. 1-2
1.2 Upgrade and Maintenance Characteristics ........................................................... 1-3
1.2.1 Master/Slave Subrack............................................................................... 1-3
1.2.2 Compatibility ............................................................................................ 1-3
1.2.3 Smooth Expansion and Upgrade ............................................................... 1-3
1.2.4 Online Upgrade........................................................................................ 1-3
1.2.5 SFP/XFP ................................................................................................. 1-3

Chapter 2 Interfaces ................................................................................... 2-1

2.1 DC Subrack Motherboard ................................................................................... 2-1
2.2 AC Subrack Motherboard.................................................................................... 2-2
2.3 Board Interfaces................................................................................................. 2-3

Chapter 3 Technical Specifications .......................................................... 3-1

3.1 Physical Specifications ....................................................................................... 3-1
3.1.1 Dimensions and Weights .......................................................................... 3-1
3.1.2 Load-Bearing Requirements for the Equipment Room ................................ 3-3
3.2 Power Supply Specifications ............................................................................... 3-3
3.2.1 Power Supply Requirements ..................................................................... 3-3
3.2.2 Power Consumptions ............................................................................... 3-3
3.3 Grounding Requirements .................................................................................... 3-5
3.4 Environment Specifications ................................................................................. 3-6
3.4.1 Storage Environment................................................................................ 3-6
3.4.2 Transportation Environment ...................................................................... 3-8
3.4.3 Operating Environment ............................................................................. 3-9
3.5 Lightning Protection Requirements .....................................................................3-11
3.6 Electro-Magnetic Compatibility Requirements .................................................... 3-12
3.6.1 Electro-Magnetic Susceptibility................................................................ 3-13
3.6.2 Electro-magnetic Interference ................................................................. 3-13

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 3.7 Requirements for Operating Wavelength............................................................ 3-13
3.7.1 Continuous Wavelength Allocation .......................................................... 3-13
3.7.2 Noncontinuous Wavelength Allocation ..................................................... 3-15
3.8 Service Access and Convergence Subsystem Specifications .............................. 3-16
3.8.1 Optical Transponder Unit Specifications................................................... 3-16
3.8.2 Convergence Unit Specifications ............................................................. 3-18
3.9 Optical Mux/DeMux Subsystem Specifications .................................................. 3-28
3.9.1 Fixed Add/Drop Multiplexer Unit Specifications......................................... 3-28
3.9.2 Multiplex/Demultiplex Unit Specifications ................................................. 3-31
3.9.3 Group Mux/DeMux Unit Specifications..................................................... 3-35
3.10 Optical Amplification Subsystem Specifications ............................................... 3-35
3.10.1 M2SEOA Board Specifications .............................................................. 3-35
3.11 Protection Subsystem Specifications................................................................ 3-38
3.11.1 SOP Board Specifications ..................................................................... 3-38
3.11.2 SOPCS Board Specifications................................................................. 3-39
3.11.3 SOPMS Board Specifications ................................................................ 3-40
3.12 Supervision Subsystem Specifications ............................................................. 3-41
3.12.1 NCP Board Specifications ..................................................................... 3-41
3.13 Power Subsystem Specifications ..................................................................... 3-41
3.13.1 FAN Board Specifications ..................................................................... 3-41
3.13.2 PW-DC Board Specifications................................................................. 3-42
3.13.3 PW-AC Board Specifications ................................................................. 3-42
3.14 DCM Specifications ........................................................................................ 3-42

List of Figure................................................................................................... I
List of Table................................................................................................... III
Glossary .........................................................................................................V

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 About This Manual
Purpose
This manual provides information about Unitrans ZXMP M721 (V1.10) multi-transmission
platform compact WDM equipment (ZXMP M721 in short hereinafter).

Intended Audience
This manual is intended for:
l Network planning engineers
l Debugging engineers
l Network monitoring engineers
l Maintenance engineers

What Is in This Manual

This manual contains the following chapters:

Chapter Summary

Chapter 1, Product Describes the product characteristics of ZXMP M721, including technical
Characteristics characteristics, upgrade and maintenance characteristics.

Chapter 2, Describes the interfaces of ZXMP M721 equipment, including service interfaces
Interfaces and non-service interfaces.
Description

Chapter 3, Lists the parameters and technical specifications of the ZXMP M721 equipment,
Technical including physical parameters, power supply requirements, environment
Specifications requirements, lightning protection requirements, electromagnetic compatibility
requirements, operating wavelengths and specifications of each sub-system.

Related Documentation
The following documentation is related to this manual:

l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment

Product Descriptions
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
System Descriptions
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Hardware Descriptions (Volume I)
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Hardware Descriptions (Volume II)
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Installation Manual

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 l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Maintenance Manual (Volume I) Routine Maintenance
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Maintenance Manual (Volume II) Alarm and Performance
l Unitrans ZXMP M721(V1.10)Multi-transmission Platform Compact WDM Equipment
Maintenance Manual (Volume III) Troubleshooting

Conventions
This manual uses the following typographical conventions:

Typeface Meaning

Italics Variables in commands. It may also refer to other related manuals and documents.

Bold Menus, menu options, function names, input fields, option button names, check boxes,
drop-down lists, dialog box names, window names, parameters, and commands.

Constant Text that you type, program codes, filenames, directory names, and function names.
width

[] Optional parameters.

{} Mandatory parameters.

| Separates individual parameter in series of parameters.

Danger: indicates an imminently hazardous situation. Failure to comply can result in

death or serious injury, equipment damage, or site breakdown.

Warning: indicates a potentially hazardous situation. Failure to comply can result in

serious injury, equipment damage, or interruption of major services.

Caution: indicates a potentially hazardous situation. Failure to comply can result in

moderate injury, equipment damage, or interruption of minor services.

Note: provides additional information about a certain topic.

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 Chapter 1
Product Characteristics
Table of Contents
Product Technical Characteristics...............................................................................1-1
Upgrade and Maintenance Characteristics .................................................................1-3

1.1 Product Technical Characteristics

1.1.1 Forward Error Correction
The ZXMP M721 equipment provides the forward error correction function. This function
can improve the error tolerance capability of transmission signals, reduce the requirements
of the system for OSNR, and extend the transmission distance. There are two types of
forward error correction functions: ordinary Forward Error Correction (FEC) and Advanced
Forward Error Correction (AFEC).
For descriptions about the FEC function of the ZXMP M721, refer to Table 1-1.

Table 1-1 Descriptions About the FEC Function of the ZXMP M721

Type Description Board

FEC The frame structure complies with the ITU-T G.975/G.709 MQA1, MQM1
Recommendation. In the 10 G system, the rate of the coded
STM-64 service signal is 10.709 Gbit/s, and the rate of the
coded 10 GE service signal is 11.1 Gbit/s. In the 2.5 G system,
the rate of the coded service signal is 2.66 Gbit/s. Ordinary
FEC can improve OSNR by 5 dB to 6 dB.

AFEC It employs the improved FEC coding/decoding algorithm. In TS2C,TD2C,MQA2,M-

the 10 G system, the rate of the coded STM-64 service signal QM2
is 10.709 Gbit/s, and the rate of the coded 10 GE service signal
is 11.1 Gbit/s. The 2.5 G system does not support the AFEC
function. AFEC can improve OSNR by 7 dB to 9 dB.

1.1.2 APSD/APR Function

With the cooperation of the EMS software, ZXMP M721 supports two modes of auto
power control functions: Automatic Power Shutdown (APSD) and Automatic Power
Reduction (APR). When there is no optical input power detected by the board with the
optical performance detection function (such as the downstream M2SEOPA board), the

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ZXMP M721 Product Descriptions

detection board sends messages to the NCP board. And then the NCP board controls
the execution board (such as the M2SEOBA board) to automatically reduce or shut down
the power, so as to prevent human eyes from being hurt by the laser. The system will be
automatically or manually recovered after the fault is removed. The APSD/APR function
needs to be set on the EMS.

1.1.3 EDFA Technology

The ZXMP M721 adopts the Erbium Doped Fiber Amplifier (EDFA) technology to improve
the transmission distance of the system without the electric regenerator. The EDFA
technology replaces the traditional optical-electrical-optical (O-E-O) regeneration, and
implements the simultaneous amplification of the multiple-channel optical signals in
the fiber. This technology can greatly reduce the cost of the optical regeneration, and
implement the coupling with the transmission fiber. It also provides various benefits, for
example, high gain, low noise, large bandwidth, high output power, high pump efficiency,
low insertion loss, and insensitivity to polarization .

1.1.4 Integration of DWDM and CWDM

The ZXMP M721 equipment supports the integration of Dense Wavelength Division
Multiplexing (DWDM) and Coarse Wavelength Division Multiplexing (CWDM). Users can
construct DWDM or CWDM networks as required.
The integration of DWDM and CWDM makes network construction more flexible, reduces
subrack quantity and board quantity at the intersected nodes.
Figure 1-1 shows a mixed network of DWDM and CWDM.

Figure 1-1 A Mixed Network of DWDM and CWDM

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 Chapter 1 Product Characteristics

1.2 Upgrade and Maintenance Characteristics

1.2.1 Master/Slave Subrack
The ZXMP M721 equipment supports master and slave subracks. Each end is only
configured with one master subrack. Each master subrack supports up to eight cascaded
slave subracks.

Note:
A master subrack refers to a subrack configured with an NCP board, while a slave subrack
refers to a subrack without an NCP board.

1.2.2 Compatibility
Through the optical supervisory channel, the ZXMP M721 can exchange ECC information
with the ZXMP M720, ZXMP M820 or ZXWM M920 equipment.

1.2.3 Smooth Expansion and Upgrade

The ZXMP M721 equipment supports the function of multi-subrack management, and
provides the ability of smooth expansion and upgrade described as follows:ZXMP M721
can smoothly upgrade a system to the system with 40 wavelengths by adding optical
transponder boards and other boards.

1.2.4 Online Upgrade

The ZXMP M721 equipment supports the ability of online upgrade described as follows:
l ZXMP M721 implements the online upgrade for the EMS software and the embedded
software in each board without interrupting services.
l The system with 8/16 wavelengths can be upgraded to the system with 40
wavelengths.

1.2.5 SFP/XFP
For the optical interfaces of signals at client side with the rate at 10 Gbit/s
(STM-64/OC-192/10 GE/10G FC), ZXMP M721 supports the pluggable optical module
(XFP). For the optical interfaces of signals at client side with the rate at 4.25 Gbit/s or
below, ZXMP M721 supports the pluggable optical module (SFP). The pluggable optical
module supports the position testing for optical modules.

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 Chapter 2
Interfaces
Table of Contents
DC Subrack Motherboard...........................................................................................2-1
AC Subrack Motherboard ...........................................................................................2-2
Board Interfaces.........................................................................................................2-3

2.1 DC Subrack Motherboard

There are two types of DC subrack motherboards: 2U DC subrack motherboard and 1U
DC subrack motherboard.
As an internal communication platform for various boards, a DC subrack motherboard
provides power supply sockets and signal sockets for boards.

Motherboard Slot Layout

The slot layout of the 2U DC subrack motherboard is shown in Figure 2-1.
The slot layout of the 1U DC subrack motherboard is shown in Figure 2-2.

Figure 2-1 Slot Layout of the 2U DC Subrack Motherboard

Figure 2-2 Slot Layout of the 1U DC Subrack Motherboard

The slot layouts in DC subracks are described as follows:

l 2U DC subrack: Slots 28 and 29 are for DC power boards. Slot 1 and slot 2 are for
NCP boards. Slot 30 is for the fan board. Slots 3 to 10 are for other boards.

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l 1U DC subrack: Slots 28 and 29 are for DC power boards. Slot 1 is for the NCP
board. Slot 30 is for the fan board. Slots 2 to 4 are for other boards.

Note:
You can generate a subrack number by setting the DIP switch on the NCP board.

2.2 AC Subrack Motherboard

There are two types of AC subrack motherboards: 2U AC subrack motherboard and 1U
AC subrack motherboard.
As an internal communication platform for various boards, an AC subrack motherboard
provides power supply sockets and signal sockets for boards.

Motherboard Slot Layout

The slot layout of the 2U AC subrack motherboard is shown in Figure 2-3.

The slot layout of the 1U AC subrack motherboard is shown in Figure 2-4.

Figure 2-3 Slot Layout of a 2U AC Subrack Motherboard

Figure 2-4 Slot Layout of an 1U AC Subrack Motherboard

The slot layouts in AC subracks are described as follows:

l 2U AC subrack: Slots 28 and 29 are for AC power boards. Slot 1 and slot 2 are for
NCP boards. Slot 30 is for the fan board. Slots 3 to 8 are for other boards.
l 1U AC subrack: Slot 28 is for AC power boards. Slot 1 is for the NCP board. Slot 30
is for the fan board. Slots 2 to 4 are for other boards.

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 Chapter 2 Interfaces

Note:
You can generate a subrack number by setting the DIP switch on the NCP board.

2.3 Board Interfaces

l NCP
The interface on the NCP board that outputs the board debugging information is
RS232.

l Other Boards
The optical interfaces on other boards are all LC/PC connectors.

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 Chapter 3
Technical Specifications
Table of Contents
Physical Specifications ...............................................................................................3-1
Power Supply Specifications ......................................................................................3-3
Grounding Requirements ...........................................................................................3-5
Environment Specifications ........................................................................................3-6
Lightning Protection Requirements...........................................................................3-11
Electro-Magnetic Compatibility Requirements ..........................................................3-12
Requirements for Operating Wavelength ..................................................................3-13
Service Access and Convergence Subsystem Specifications ...................................3-16
Optical Mux/DeMux Subsystem Specifications ........................................................3-28
Optical Amplification Subsystem Specifications .......................................................3-35
Protection Subsystem Specifications ........................................................................3-38
Supervision Subsystem Specifications .....................................................................3-41
Power Subsystem Specifications..............................................................................3-41
DCM Specifications ..................................................................................................3-42

3.1 Physical Specifications

3.1.1 Dimensions and Weights
Table 3-1 and Table 3-2 illustrate the dimensions and weights of the structural parts of the
ZXMP M721.

Table 3-1 Dimensions and Weights of Structural Parts of ZXMP M721

Structural Part Dimensions (Unit: mm) Weight (kg)

ZTE transmission equipment 2000 (height) × 600 (width) × 300 (depth) 58.50
cabinet
2200 (height) × 600 (width) × 300 (depth) 64.50

2600 (height) × 600 (width) × 300 (depth) 76.00

2U Subrack 89 (height) × 442 (width) × 238 (depth) 4.00

1U Subrack 44 (height) × 445 (width) × 238 (depth) 3.00

Fiber coiling box 45 (height) × 440 (width) × 265 (depth) 2.50

PW-DC 20 (height) × 95 (width) 0.20

PW-AC 40 (height) × 95 (width) 0.80

EI board Front panel: 43.8 (height)× 114.7 (width) 0.50

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Structural Part Dimensions (Unit: mm) Weight (kg)

Full-height board Front panel (two slots): 29.8 (height) ×345.6 (width) Table 3-2 illustrates the
Front panel (four slots): 59.6 (height) × 345.6 (width) weights of boards.

Semi-height board Front panel: 25.1 (height) × 155.6 (width) Table 3-2 illustrates the
weights of boards.

• The subrack dimensions do not include the dimensions of mounting flanges and the front door. The subrack weight
listed in the table is the weight of an empty subrack.

Table 3-2 ZXMP M721 Board Weight

Board Board Code Weight (kg)

Muxponder of 4 ports any rate to OTU1 MQA1 0.5

Muxponder of 4 ports any rate to OTU2 MQA2 0.6

Muxponder of 6 ports any rate to Back Plane MJA 0.5

Muxponder of 4 ports multi-service to OTU1 MQM1 0.5

Muxponder of 4 ports multi-service to OTU2 MQM2 0.6

Muxponder of 6 ports multi-service to main board MJM 0.5

Transponder of 2 ports 10 Gbit/s (Type C) TD2C 0.6

Transponder of 1 port 10 Gbit/s (Type C) TS2C 0.6

Transponder of 1 port 10 Gbit/s with Line Side 1+1 TS2CP 0.6

Protection (Type C)

Network Control Processor NCP 0.4

External Interface EI 0.4

External Interface board EIC 0.3

Time synchronization board BITSB 0.5

2U Fan Control Board FAN 0.5

1U Fan Control Board FAN 0.3

Power Board of DC PW-DC 0.4

Power Board of AC PW-AC 0.9

2U DC Back Plane MB2U-DC 0.4

2U AC Back Plane MB2U-AC 0.4

Enhanced Optical Amplifier M2SEOA 0.5

Smart Optical Protection SOP 0.6

Smart Optical Protection for Channel Shared SOPCS 0.6

Smart Optical Protection for Multiplex Section SOPMS 0.6

Shared

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Board Board Code Weight (kg)

Smart Supervisory Division Multiplexing Board SSMD 0.6

Smart Optical Add-Drop of 4 wavelengths SOAD4 0.6

Smart Optical Group Multiplex De-multiplex SOGMD 0.6

Smart CWDM Optical Add-Drop SCOAD 0.6

Smart CWDM Optical Multiplex De-multiplex SCOMD 0.6

Optical De-Multiplexing Unit ODU 0.8

Optical Multiplexing Unit OMU 0.8

3.1.2 Load-Bearing Requirements for the Equipment Room

The load-bearing capacity of the equipment room should be greater than 450 kg/m2 to hold
the ZXMP M721 equipment.

3.2 Power Supply Specifications

3.2.1 Power Supply Requirements
The power supply requirements of ZXMP M721 are described as follows:
l DC

à Input voltage: -48 VDC

à Allowable fluctuation range: -60 VDC to –40 VDC
à Input voltage: -60 VDC
à Allowable fluctuation range: -40 VDC to -72 VDC
l AC
à Input voltage: 220 VAC/110 VAC
à Allowable fluctuation range of voltage: 110 VAC to 240 VAC
à Allowable fluctuation range of frequency: 45 Hz to 65 Hz

3.2.2 Power Consumptions

Table 3-3 illustrate the power consumptions of boards and units of ZXMP M721.

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Table 3-3 Power Consumptions of Boards and Units of ZXMP M721

Board/Unit Name Board ID Maximum Power Maximum Power Remark

Consumption Consumption
℃) (W)
(25℃ ℃) (W)
(55℃

Transponder of 2 ports 10Gb/s TD2C 28 30 -

(Type C)

Transponder of 1 ports 10Gb/s TS2C 18 20 -

(Type C)

Transponder of 1 port 10Gb/s TS2CP 26 28 -

with line Side 1+1 protection

Muxponder of 4 ports any rate to M1MQA1 30.5 32.6 M1 version

OTU1
M2MQA1 38.1 40.7 M2 version

Muxponder of 4 ports any rate to M1MQA2 35 38 M1 version

OTU
M2MQA2 M2 version

Muxponder of 6 ports any rate to M1MJA 28.5 30.6 M1 version

Back Plane
M2MJA 36.8 39.8 M2 version

Muxponder of 4 ports MQM1 27.7 30.5 -

multi-service to OTU1

Muxponder of 4 ports MQM2 38.6 40.2 -

multi-service to OTU2

Muxponder of 6 ports MJM 27.6 29.9 -

multi-service to main board

Smart enhanced optical pre M2SEOPA17/ 11 15 -

amplifier 17

M2SEOPA22/ 11 15 -
17

M2SEOPA27/ 11 15 -
17
Smart enhanced optical booster M2SEOBA17/ 11 15 -
amplifier 17

M2SEOBA22/ 13 18 -
20

M2SEOBA25/ 13 18 -
20

Smart supervisory division SSDM 4 5 -

multiplexing board

Smart CWDM optical multiplex SCOMD 4 5 -

de-multiplex

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Board/Unit Name Board ID Maximum Power Maximum Power Remark

Consumption Consumption
℃) (W)
(25℃ ℃) (W)
(55℃

Smart optical group multiplex SOGMD 5 6 -

de-multiplex

Optical Multiplexing Unit OMU 8 5 -

Optical De-Multiplexing Unit ODU 8 5 -

Smart optical add drop unit of 2 SOAD2 4 5 -

ports

Smart optical add drop unit of 4 SOAD4 5 6 -

ports

Smart CWDM optical add-drop SCOAD 4 5 -

Smart optical protection SOP 5 6 -

Smart optical protection for SOPCS 3 4 -

channel shared

Network control processor NCP 13 14 -

External interface EI 4 5 -

Expansion interface board (Type EIC 8.2 9.2 If the board is

C) configured with the
POE telephone
function, the power
consumption is
added with 3 W.

Time synchronization board BITSB -

1U fan control board 1U FAN 8 12 -

2U fan control board 2U FAN 14 23 -

2U power board of DC 2U PW-DC 8 14 -

2U power board of AC 2U PW-AC 10 16 -

3.3 Grounding Requirements

Grounding Requirements for the Equipment
l The cabinet, the subrack cases, and boards are connected to the protection ground
(PGND) .

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Note:
One end of the subrack PGND cable is connected to the grounding terminal at the left
side in the subrack, and the other end is connected to the PGND in the cabinet.

l Make sure there is no electrical connection inside each board.

Grounding Requirements for the Equipment Room

l AC working ground resistance ≤ 4 Ω
l DC working ground resistance ≤ 4 Ω
l Security protection ground resistance ≤ 4 Ω
l Lightning protection ground resistance ≤ 4 Ω
l Joint grounding resistance ≤ 1 Ω
l If the equipment room provides both the working ground and the PGND, the working
ground and PGND of the ZXMP M721 equipment should be connected to the
corresponding grounding copper busbars.
l If the equipment room provides only one grounding copper busbar, the working ground
and the PGND of the ZXMP M721 equipment can be jointed for grounding.

3.4 Environment Specifications

The environment requirements for the ZXMP M721 equipment can be classified into the
storage environment, the transportation environment, and the operating environment.

3.4.1 Storage Environment

Climate Requirements
The climate requirements for the storage of the ZXMP M721 equipment are described in
Table 3-4.

Table 3-4 Climate Requirements (Storage Environment)

Item Specification

Altitude ≤4000 m

Air pressure 70 kPa to 106 kPa

Temperature -40 ℃ to +70 ℃

Temperature variance ratio ≤1 ℃/min

Relative humidity 5% to 100%

Solar radiation ≤1120 W/s2

Hot radiation ≤600 W/s2

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Item Specification

Wind speed ≤20 m/s

Water-Proof Requirements
l Keep the equipment indoor. If the equipment has been unpacked, it must be mounted
indoor, and the room must be well-ventilated. In a damp and wet environment
dehumidification measures must be taken.
l Ensure that there is no water on the storage room floor, and no water is leaked on the
packing container of the equipment. The storage position should be far away from the
places prone to leaking, such as the automatic fire fighting equipment and the heating
system.
l If the equipment must be stored outside, the requirements are listed as follows:
à Ensure that the packing of the equipment is in good conditions without any
damage.
à Rainwater-proof measures should be taken, so that the rainwater will not damage
the packing of the equipment.
à Ensure there is no water on the floor or in the packing container of the equipment.
à Do not expose the packing to direct sunlight.

Biology Environment Requirements

l Avoid the propagation of the microorganism, such as the fungi or the mould.
l Avoid rodents (such as mice) to damage the equipment.

Air Cleanness Requirements

l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of the mechanical activity material is illustrated in Table 3-5.
l The concentration of the chemical activity material is illustrated in Table 3-6.

Table 3-5 Concentration of the Mechanical Activity Material (Storage Environment)

Mechanical Activity Material Content

Suspended dust ≤5.00 mg/m3

Degraded dust ≤20.0 mg/m2•h

Sand ≤300 mg/m3

Table 3-6 Concentration of the Chemical Activity Material (Storage Environment)

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

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Chemical Activity Material Content

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

3.4.2 Transportation Environment

Climate Requirements
The climate requirements for the transportation of the ZXMP M721 equipment are
described in Table 3-7.

Table 3-7 Climate Requirements (Transportation Environment)

Item Specification

Altitude ≤4000 m

Air pressure 70 kPa to 106 kPa

Temperature -40 ℃ to +70 ℃

Temperature variance ratio ≤1 ℃/min

Relative humidity 5% to 100%

Solar radiation ≤1120 W/s2

Hot radiation ≤600 W/s2

Wind speed ≤20 m/s

Water-Proof Requirements
l Ensure that the packing of the equipment is in good conditions without any damage.
l The transportation tools should have measured, so that the rainwater will not damage
the packing of the equipment.
l Ensure there is no water in the conveyance.

Biology Environment Requirements

l Avoid the propagation of the microorganism, such as the fungi or the mould.
l Avoid rodents (such as mice) to damage the equipment.

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Air Cleanness Requirements

l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of the mechanical activity material is illustrated in Table 3-8.
l The concentration of the chemical activity material is illustrated in Table 3-9.

Table 3-8 Concentration of the Mechanical Activity Material (Transportation

Environment)

Mechanical Activity Material Content

Suspended dust No special requirements

Degraded dust ≤3.0 mg/m2•h

Sand ≤100 mg/m3

Table 3-9 Concentration of the Chemical Activity Material (Transportation Environment)

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

3.4.3 Operating Environment

Climate Requirements
The environment temperature requirements and the relative humidity requirements for
the operation of the ZXMP M721 equipment are described in Table 3-10. Other climate
requirements are described in Table 3-11.

Table 3-10 Requirements for Temperature and Humidity (Operating Environment)

Item Specification

Ambient temperature Long term operation: 0 ºC to +45 ºC

Short term operation: -5 ºC to +50 ºC

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Item Specification

Relative humidity (35 ºC) Long term operation: 10% to 90%

Short term operation: 5% to 95%

• The temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipm
ent.
• The short-term operation means that the equipment operates continuously for no more than 96 hours
and operates for no more than 15 days in one year.

Table 3-11 Requirements for Other Climate Factors (Operating Environment)

Item Specification

Altitude ≤4000 m

Air pressure 70 kPa to 106 kPa

Temperature variance ratio ≤30 ℃/h

Solar radiation ≤700 W/s2

Hot radiation ≤600 W/s2

Wind speed ≤5 m/s

Biology Environment Requirements

l Avoid the propagation of the microorganism, such as the fungi or the mould.
l Avoid the rodent (such as mice) to damage the equipment.

Air Cleanness Requirements

l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of the mechanical activity material is illustrated in Table 3-12.
l The concentration of the chemical activity material is illustrated in Table 3-13.

Table 3-12 Concentration of the Mechanical Activity Material (Operating Environment)

Mechanical Activity Material Content

Dust particle ≤3×105/m3

Suspended dust ≤0.2 mg/m3

Degraded dust ≤15 mg/m2•h

Sand ≤100 mg/m3

Table 3-13 Concentration of the Chemical Activity Material (Operating Environment)

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

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Chemical Activity Material Content

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤3.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

NOx ≤0.5 mg/m3

3.5 Lightning Protection Requirements

The typical power supply lightning protection can be divided in to three classes as shown
in Table 3-14.

Table 3-14 Typical Power Supply Lightning Protection Classification

Class Parameter Location of Lightning

Protection Circuit

Class B 40 kA (8 μs /20 μs) AC power distribution board/unit

Class C 20 kA (8 μs/20 μs) DC power cabinet

Class D 6000 V (combination wave) -48 V power rectifier

ZXMP M721 must meet the following lightning protection requirements:

l In the central equipment room:

à AC power cables should be laid underground.

à Because the AC power distribution board/unit and the DC power cabinet might be
in the same equipment room, the distance between Class B and Class C lightning
protection units should meet the following decoupling distance requirements:
When the protection grounding cable is laid out separately, the distance between
class B and class C lightning protection units should be no less than 5 m.

When the protection grounding cable and the power cable are laid in parallel, the
distance between class B and class C lightning protection units should be no less
than 15 m.

à If the required decoupling distance cannot be satisfied due to some condition

restrictions in the equipment room, the additional decoupling inductance should
be installed before the class C lightning protection unit by 1.5μH/m.

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à The grounding cables of class B and class C lightning protection units should
employ bunched copper wires to connect with Main Earthing Terminal (MET)
or the Floor Equipotential Earthing terminal Board (FEB). Keep the length of
grounding cables as short as possible. Connection cable of lightning protection
units and cross-sectional area of the ground cable are determined by external
power cables of the power distribution box. For detailed descriptions, refer to
Table 3-15.

Table 3-15 Requirements for Connection Cable of Lightning Protection Units

and Cross-Sectional Area of The Ground Cable

Cable Type ）
Cross-Sectional Area （ mm²）

External power ≤ 35 50 ≥ 70
cable of the power
distribution box

Connection cable: 10 16 25
Connection cable
between the
lightning protection
unit and L (phase
line) or N(neutral
wire)

Ground cable: ≥ 16 25 ≥ 35
The connection
cable between the
lightning protection
unit and protection
ground.

l The lightning requirements of ZXMP M721 ports (such as the network interface, alarm
and orderwire) are listed in Table 3-16.

Table 3-16 Lightning Requirements of the ZXMP M721 Port

Port Requirement

DC power input port 1 kV (1.2/50 µs)

Signal input/output port 1 kV (1.2/50 µs)

3.6 Electro-Magnetic Compatibility Requirements

Electro-Magnetic compatibility requirements can be divided into Electro-Magnetic
Susceptibility (EMS) and Electro-Magnetic Interference (EMI).

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3.6.1 Electro-Magnetic Susceptibility

The Electro-Magnetic Susceptibility (EMS) specifications of the ZXMP M721 equipment
are illustrated in Table 3-17.

Table 3-17 Electro-Magnetic Susceptibility Specifications

Test Item Standard

Electronic Static Discharge Susceptibility GB/T 17626.2 or IEC 61000-4-2

RF Electromagnetic Radiation Susceptibility GB/T 17626.3 or IEC 61000-4-3

Electrical Fast Transient Susceptibility GB/T 17626.4 or IEC 61000-4-4

Surge Susceptibility GB/T 17626.5 or IEC 61000-4-5

RF Filed Conduct Susceptibility GB/T 17626.6 or IEC 61000-4-6

3.6.2 Electro-magnetic Interference

Electro-magnetic Interference (EMI) specifications of ZXMP M721 include conducted
disturbance and radiation disturbance, both of which comply with GB 9254 or CISPR 22
(A-level ITE).

3.7 Requirements for Operating Wavelength

3.7.1 Continuous Wavelength Allocation
This section describes the wavelength allocations of the ZXMP M721 system with 40
wavelengths and that with 18 wavelengths.
The ZXMP M721 system with 40 wavelengths works in band C, with a channel spacing of
100 GHz. Table 3-18 lists the wavelength allocation.

Table 3-18 Wavelength Allocation of the 40 CH/100 GHZ System in Band C

Wavelength No. Nominal Central Nominal Central Wavelength No. Nominal Central Nominal Central
Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm)

1 192.1 1560.61 21 194.1 1544.53

2 192.2 1559.79 22 194.2 1543.73

3 192.3 1558.98 23 194.3 1542.94

4 192.4 1558.17 24 194.4 1542.14

5 192.5 1557.36 25 194.5 1541.35

6 192.6 1556.55 26 194.6 1540.56

7 192.7 1555.75 27 194.7 1539.77

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Wavelength No. Nominal Central Nominal Central Wavelength No. Nominal Central Nominal Central
Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm)

8 192.8 1554.94 28 194.8 1538.98

9 192.9 1554.13 29 194.9 1538.19

10 193.0 1553.33 30 195.0 1537.4

11 193.1 1552.52 31 195.1 1536.61

12 193.2 1551.72 32 195.2 1535.82

13 193.3 1550.92 33 195.3 1535.04

14 193.4 1550.12 34 195.4 1534.25

15 193.5 1549.32 35 195.5 1533.47

16 193.6 1548.51 36 195.6 1532.68

17 193.7 1547.72 37 195.7 1531.9

18 193.8 1546.92 38 195.8 1531.12

19 193.9 1546.12 39 195.9 1530.33

20 194.0 1545.32 40 196.0 1529.55

When ZXMP M721 equipment is used in a CWDM system, the number of wavelengths
is 18 with a channel spacing of 20 nm. Table 3-19 lists the wavelength allocation of the
18-wavelength system.

Table 3-19 Wavelength Allocation (18-Wavelength System)

Wavelength No. Central Wavelength (nm)

1 1471

2 1491

3 1511

4 1531

5 1551

6 1571

7 1591

8 1611

9 1271

10 1291

11 1311

12 1331

13 1351

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Wavelength No. Central Wavelength (nm)

14 1371

15 1391

16 1411

17 1431

18 1451

3.7.2 Noncontinuous Wavelength Allocation

When the SOGMD board serves for multiplexing/demultiplexing, some wavelengths
are unavailable due to the limitation of filter on the SOGMD board. These unavailable
wavelengths are referred to as black wavelengths.
The system works in band C, with 100 GHz spacing of wavelength. When the system
uses the SOGMD board for multiplexing/demultiplexing, the bandwidth contains 40
wavelengths, but only 32 wavelengths are available. This wavelength allocation is referred
to as noncontinuous wavelength allocation. Table 3-20 lists the noncontinuous wavelength
allocation, among which the cells highlighted grey are unavailable wavelengths.

Table 3-20 Noncontinuous Wavelength Allocation

Wavelength No. Nominal Nominal Wavelength No. Nominal Central Nominal Central
Central Central Frequency Wavelength
Frequency Wavelength (THz) (nm)
(THz) (nm)

1 192.1 1560.61 21 194.1 1544.53

2 192.2 1559.79 22 194.2 1543.73

3 192.3 1558.98 23 194.3 1542.94

4 192.4 1558.17 24 194.4 1542.14

5 192.5 1557.36 25 194.5 1541.35

6 192.6 1556.55 26 194.6 1540.56

7 192.7 1555.75 27 194.7 1539.77

8 192.8 1554.94 28 194.8 1538.98

9 192.9 1554.13 29 194.9 1538.19

10 193 1553.33 30 195 1537.4

11 193.1 1552.52 31 195.1 1536.61

12 193.2 1551.72 32 195.2 1535.82

13 193.3 1550.92 33 195.3 1535.04

14 193.4 1550.12 34 195.4 1534.25

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Wavelength No. Nominal Nominal Wavelength No. Nominal Central Nominal Central
Central Central Frequency Wavelength
Frequency Wavelength (THz) (nm)
(THz) (nm)

15 193.5 1549.32 35 195.5 1533.47

16 193.6 1548.51 36 195.6 1532.68

17 193.7 1547.72 37 195.7 1531.9

18 193.8 1546.92 38 195.8 1531.12

19 193.9 1546.12 39 195.9 1530.33

20 194 1545.32 40 196 1529.55

3.8 Service Access and Convergence Subsystem

Specifications
3.8.1 Optical Transponder Unit Specifications
3.8.1.1 TD2C/TS2C Board Specifications

TD2C/TS2C Board Specifications

The specifications of the TD2C/TS2C optical interface at line-side and client-side comply
with Y/D-T 1274-2003 Technical requirements of optical wavelength division multiplexing
(WDM) 160×10Gbits/s, 80×10Gbits/s parts. The detailed specifications of the TD2C/TS2C
board are listed in Table 3-21.

Table 3-21 TD2C/TS2C Board Technical Specifications

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity (BER≤10-12) dBm <-14 (I64.1)

<-16 (S64.2b)

<-14 (10GBASE-LR/LW)

<-16 (10GBASE-ER/EW)

Receiver reflection dB >14 (I64.1)

>27(S64.2b)

>14 (10GBASE-LR/LW)

>27(10GBASE-ER/EW)

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Item Unit Specification

Overload optical power dBm >0 (I64.1)

>-1 (S64.2b)

>0 (10GBASE-LR/LW)

>-1 (10GBASE-ER/EW)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (Sn point)

Maximum -20 dB bandwidth nm 0.3

Minimum side mode compression dB 35

ratio (SMCR)

Nominal central frequency THz 192.1 to 196.0 (wavelength spacing is 100

GHz)

Central frequency deviation GHz ≤±12.5 (wavelength spacing is 100 GHz)

Mean optical power dBm -5 to 0

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Eye diagram - Complies with ITU-T G.691

Parameters of input interface (Rn point)

Receiver sensitivity (BER≤10-12) dBm <-14 (PIN)

<-21 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (R point)

Mean launched power dBm -6 to -1 (I64.1)

-1 to 2 (S64.2b)

-6 to -1(10GBASE-LR/LW)

-1 to 2 (10GBASE-ER/EW)

Minimum extinction ratio dB 6 (I64.1)

8.2 (S64.2b)

6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

Eye diagram - Complies with ITU-T G.691

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Jitter Specifications
The TD2C/TS2C board adopts the specific filter. The maximum jitter value measured within
one minute should not exceed the reference listed in Table 3-22.

Table 3-22 Jitter Specifications

Interface Testing Bandwidth Peak-Peak Value

(UIpp)
High-Pass Filter (kHz) Low-Pass Filter (MHz)

STM-64 (optical) 20 80 0.3

4000 80 0.1

1. For the transfer functions of the high-pass filter and the low-pass filter, refer to clause 35 in ITU-T
G.825.
2. For STM-64, 1 UI = 0.10 ns.
3. For the testing time and the principle, refer to clause 5 in ITU-T G.825.

Jitter Transfer Specifications

Repeater Jitter transfer specifications are in compliance with ITU-T G.783. The Jitter
transfer specifications of the optical interface at 3R line side, carrying SDH signals, are
described in Table 3-23. The jitter transfer characteristic is shown in Figure 3-1.

Table 3-23 Jitter Transfer Specifications at 3R Line Side

Interface fL (kHz) fC(kHz) fH (kHz) P (dB)

STM-64 10 1000 80000 0.1

Figure 3-1 Jitter Transfer Specifications of the Optical Interface at Line Side

3.8.2 Convergence Unit Specifications

3.8.2.1 MQA1 Board Specifications
The MQA1 board can be used in both the DWDM system and the CWDM system.
Technical specifications of MQA1 board are listed in Table 3-24.

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Table 3-24 MQA1 Board Technical Specifications (DWDM)

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

Parameters of output interface (Sn point)

Nominal optical source type - DFB-LD

Maximum -20 dB bandwidth nm 0.2 (EA)

0.4 (DM)

Minimum side mode compression dB 35

ratio (SMCR)

Nominal central frequency THz 192.1 to 196.0 (wavelength spacing is 100

GHz)

Central frequency deviation GHz ≤±12.5 (wavelength spacing is 100 GHz)

Mean optical power dBm -10 to 0

Minimum extinction ratio dB 10 (EA)

8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)

3200/6400 (DM)

Eye diagram - Complies with ITU-T G.957

Parameters of input interface (Rn point)

Receiver sensitivity dBm <-18 (PIN)

<-25 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (R point)

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Item Unit Specification

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

Table 3-25 MQA1 Board Technical Specifications (CWDM)

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

Parameters of output interface (Sn point)

Nominal optical source type - DFB-LD

Maximum -20 dB bandwidth nm 1

Minimum side mode compression dB 30

ratio (SMCR)

Nominal central frequency nm 1270/1290/1330/1350/1370/

1390/1410/1430/1450/1470/
1490/1510/1530/1550/1570/
1590/1610±3

Central frequency deviation nm ≤±6.5

Mean optical power dBm 0 to 5 (the mean optical power can be

lower than 0 dBm in the short-distance
transmission)

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 1600

Eye diagram - Complies with ITU-T G.957

Parameters of input interface (Rn point)

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Item Unit Specification

Receiver sensitivity (BER≤10-12) dBm <-18 (PIN)

<-25 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1265 to 1617

Parameters of output interface (R point)

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

3.8.2.2 MQA2 Board Specifications

Technical specifications of the MQA2 board are listed in Table 3-26.

Table 3-26 MQA2 Board Technical Specifications

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity FC dBm -18

2G FC -18

4G FC -18

GE -19

Overload optical power 1G FC dBm 0

2G FC 0

4G FC 0

GE -3

Parameters of output interface (Sn point)

Maximum -20 dB bandwidth nm 0.3

Minimum side mode compression ratio (SMCR) dB 35

Nominal central frequency THz 192.1 to 196.0

Central frequency deviation GHz ≤±12.5 (wavelength spacing is 100

GHz)

Mean optical power dBm -4.7 to 4.0

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Item Unit Specification

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 800

Eye diagram - Complies with ITU-T G.691

Parameters of input interface (Rn point)

Receiver sensitivity dBm <-14 (PIN)

<-21 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (R point)

Mean launched power 1G FC dBm -4.5

2G FC -4.5

4G FC -4.5

GE -11 to 0

3.8.2.3 MJA Board Specifications

Technical specifications of the MJA board are listed in Table 3-27.

Table 3-27 MJA Board Technical Specifications

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

<-19 (100-SM-LL-I)

<-20 (200-SM-LL-I)

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Item Unit Specification

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

>-3 (100-SM-LL-I)

>0 (200-SM-LL-I)

Parameters of output interface (R point)

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-9 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)

3.8.2.4 MQM1 Board Specifications

The MQM1 board can be used in both the DWDM system and the CWDM system.
Technical specifications of MQM1 board are listed in Table 3-28.

Table 3-28 MQM1 Board Technical Specifications (DWDM)

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

Parameters of output interface (Sn point)

Nominal optical source type - DFB-LD

Maximum -20 dB bandwidth nm 0.2 (EA)

0.4 (DM)

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Item Unit Specification

Minimum side mode compression dB 35

ratio (SMCR)

Nominal central frequency THz 192.1 to 196.0 (wavelength spacing is 100

GHz)

Central frequency deviation GHz ≤±12.5 (wavelength spacing is 100 GHz)

Mean optical power dBm -10 to 0

Minimum extinction ratio dB 10 (EA)

8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)

3200/6400 (DM)

Eye diagram - Complies with ITU-T G.957

Parameters of input interface (Rn point)

Receiver sensitivity dBm <-18 (PIN)

<-25 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (R point)

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

Table 3-29 MQM1 Board Technical Specifications(CWDM)

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

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Item Unit Specification

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

Parameters of output interface (Sn point)

Nominal optical source type - DFB-LD

Maximum -20 dB bandwidth nm 1

Minimum side mode compression dB 30

ratio (SMCR)

Nominal central frequency nm 1270/1290/1330/1350/1370/

1390/1410/1430/1450/1470/
1490/1510/1530/1550/1570/
1590/1610±3

Central frequency deviation nm ≤±6.5

Mean optical power dBm 0 to 5 (the mean optical power can be

lower than 0 dBm in the short-distance
transmission)

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 1600

Eye diagram - Complies with ITU-T G.957

Parameters of input interface (Rn point)

Receiver sensitivity (BER≤10-12) dBm <-18 (PIN)

<-25 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1265 to 1617

Parameters of output interface (R point)

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

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3.8.2.5 MQM2 Board Specifications

Technical specifications of the MQM2 board are listed in Table 3-30.

Table 3-30 MQM2 Board Technical Specifications

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity FC dBm -18

2G FC -18

4G FC -18

GE -19

Overload optical power 1G FC dBm 0

2G FC 0

4G FC 0

GE -3

Parameters of output interface (Sn point)

Maximum -20 dB bandwidth nm 0.3

Minimum side mode compression ratio (SMCR) dB 35

Nominal central frequency THz 192.1 to 196.0

Central frequency deviation GHz ≤±12.5 (wavelength spacing is 100

GHz)

Mean optical power dBm -4.7 to 4.0

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 800

Eye diagram - Complies with ITU-T G.691

Parameters of input interface (Rn point)

Receiver sensitivity dBm <-14 (PIN)

<-21 (APD)

Receiver reflection dB >27

Overload optical power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280 to 1565

Parameters of output interface (R point)

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Item Unit Specification

Mean launched power 1G FC dBm -4.5

2G FC -4.5

4G FC -4.5

GE -11 to 0

3.8.2.6 MJM Board Specifications

Technical specifications of the MJM board are listed in Table 3-31.

Table 3-31 MJM Board Technical Specifications

Item Unit Specification

Parameters of input interface (S point)

Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-20 (1000BASE-LH1)

<-22 (1000BASE-ZX)

<-19 (100-SM-LL-I)

<-20 (200-SM-LL-I)

Overload optical power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)

>-3 (1000BASE-LH1)

>-3 (1000BASE-ZX)

>-3 (100-SM-LL-I)

>0 (200-SM-LL-I)

Parameters of output interface (R point)

Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-9 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)

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3.9 Optical Mux/DeMux Subsystem Specifications

3.9.1 Fixed Add/Drop Multiplexer Unit Specifications
3.9.1.1 SOAD Board Specifications
Technical specifications of the SOAD1 board, SOAD2 board, and the SOAD4 board in
band C are illustrated in Table 3-32, Table 3-33, and Table 3-34.

Table 3-32 Technical Specifications of the SOAD1 Board in Band C

Item Unit Specification

Central frequency range THz 192.1 to 196.0

Wavelength range nm 1529.55 to 1560.61

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.20

Channel spacing GHz 100

Isolation IN-D1@ other channels dB >25

IN-MID1@ drop channel dB >14

IN-OUT@ drop channel dB >28

Optical return loss dB >40

Insertion loss Drop wavelength (IN-D1) dB <3

Add wavelength (A1-OUT) dB <3

Pass-through wavelength dB <3

(IN-OUT)

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

Table 3-33 Technical Specifications of the SOAD2 Board in Band C

Item Unit Specification

Central frequency range THz 192.1 to 196.0

Wavelength range nm 1529.55 to 1560.61

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.20

Channel spacing GHz 100

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Item Unit Specification

Isolation IN-D1/D2@ adjacent channels dB >25

IN-D1/D2@ nonadjacent channel dB >35

IN-MID1@ drop channel dB >14

IN-OUT@ drop channel dB >28

Optical return loss dB >40

Insertion loss Drop wavelength (IN-D1/D2) dB <3

Add wavelength (A1/A2-OUT) dB <3

Pass-through wavelength dB <4

(IN-OUT)

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

Table 3-34 Technical Specifications of the SOAD4 Board in Band C

Item Unit Specification

Central frequency range THz 192.1 to 196.0

Wavelength range nm 1529.55 to 1560.61

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.2

Channel spacing GHz 100

Isolation IN-D1/D2/D3/D4@adjacent channel dB >25

IN-D1/D2/D3/D4@nonadjacent channel dB >35

IN-MID1@drop channel dB >14

IN-OUT@drop channel dB >28

Optical return loss dB >40

Insertion Drop wavelength (IN-D1/D2/D3/D4) dB <4

loss
Add wavelength (A1/A2/A3/A4-OUT) dB <4

Pass-through wavelength (IN-OUT) dB <5

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

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3.9.1.2 SCOAD Board Specifications

Technical specifications of the SCOAD1 board and the SCOAD2 board in band C are
illustrated in Table 3-35.

Table 3-35 Technical Specifications of SCOAD Boards in Band C

Item U- SCO- SCO- SCO- SCO- SCO- SCO- SCO-

nit AD1- AD1-x AD1- AD1-x-U AD2-x-S AD2-x AD2-
x-S x-US x-U

CWDM channel number - 1+1311 1 1+1311 1 2+1311 2 2

wave- wave- wave-
length length length

CWDM central wavelength nm 1271/12 1271/129 1271/1 1271/12 1271/129 1271/12 1271/12
91/1331 1/1331/1 291/13 91/1331/ 1/1331/1 91/1331/ 91/1331
/1351/1 351/1371 31/135 1351/13 351/1371 1351/13 /1351/1
371/139 /1391/14 1/1371 71/1391 /1391/14 71/1391 371/139
1/1411/ 11/1431/ /1391/1 /1411/14 11/1431/ /1411/14 1/1411/
1431/14 1451/147 411/143 31/1451/ 1451/147 31/1451/ 1431/14
51/1471 1/1491/1 1/1451 1471/14 1/1491/1 1471/14 51/1471
/1491/1 511/1531 /1471/1 91/1511/ 511/1531 91/1511/ /1491/1
511/153 /1551/15 491/15 1531/15 /1551/15 1531/15 511/153
1/1551/ 71/1591/ 11/1531 51/1571/ 71/1591/ 51/1571/ 1/1551/
1571/15 1611 /1551/1 1591/16 1611/131 1591/16 1571/15
91/1611 571/15 11 1 11 91/1611
/1311 91/1611
/1311

CWDM channel [email protected] nm lC ±6.5 lC ±6.5 lC ±6.5 lC ±6.5 lC ±6.5 lC ±6.5 lC ±6.5

CWDM passband flatness dB ≤0.5 ≤0.5 ≤0.5 ≤0.5 ≤0.5 ≤0.5 ≤0.5

Insert IN - D1 dB ≤1.8 ≤1.3 ≤1.8 ≤1.3 ≤2.3 ≤1.8 ≤1.8

loss (with
A1 - OUT dB ≤1.6 ≤1.0 ≤1.6 ≤1.0 ≤2.3 ≤1.6 ≤1.6
connector)
IN-OUT dB ≤2.1 ≤1.4 ≤2.2 ≤1.5 ≤2.8 ≤2.2 ≤2.4

IN-SOUT dB ≤1.4 NA ≤1.4 NA ≤1.4 NA NA

SIN-OUT dB ≤1.0 NA ≤1.0 NA ≤1.0 NA NA

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Item U- SCO- SCO- SCO- SCO- SCO- SCO- SCO-

nit AD1- AD1-x AD1- AD1-x-U AD2-x-S AD2-x AD2-
x-S x-US x-U

Isolation CWDM channel dB DEMU- DE- DEMU- DEMUX- DE- DEMU- DEMU-
& adjacent X:≥30 MUX:≥30 X:≥30 :≥30 MUX:≥30 X:≥30 X:≥30
channel MUX- MUX:NA MUX- MUX:NA MUX:NA MUX:NA MUX-
:NA :NA :NA

CWDM channel dB DEMU- DE- DEMU- DE- DE- DE- DEMU-

& non-adjacent X≥45 MUX≥45 X≥45 MUX≥45 MUX≥45 MUX≥45 X≥45
channel MUX: MUX: NA MUX- MUX: MUX: NA MUX: MUX:
NA :NA NA NA NA

straight-through dB ≥14 ≥14 ≥14 ≥14 ≥14 ≥14 ≥14

interface
(IN-MID1)
& CWDM
demultiplexing
signal

straight-through dB ≥28 ≥28 ≥28 ≥28 ≥28 ≥28 ≥28

interface
(IN-OUT)
& CWDM
demultiplexing
signal

Polarization dependent loss dB ≤0.2 ≤0.2 ≤0.2 ≤0.2 ≤0.2 ≤0.2 ≤0.2

Return loss dB ≥45 ≥45 ≥45 ≥45 ≥45 ≥45 ≥45

3.9.2 Multiplex/Demultiplex Unit Specifications

3.9.2.1 SCOMD Board Specifications
The ZXMP M721 equipment provides various SCOMD boards, including SCOMDS,
SCOMD4-1US, SCOMD4-5U, SCOMD4-9U, SCOMD5-14U, SCOMD4-5US,
SCOMD4-9US, and SCOMD5-14US.

The SCOMDS board is applied in the 8-channel system, and other SCOMD boards are
applied in the 18-channel system. Table 3-36, Table 3-37, and Table 3-38 list technical
specifications of various SCOMD boards.

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Table 3-36 SCOMDS Board Technical Specifications

Item Unit Specification

CWDM central wavelength lC nm 1471/1491

1511/1531

1551/1571

1591/1611

1310/1451

CWDM channel [email protected] nm lC ±6.5

Insertion loss (with Line- CWDM dB ≤4.5

connector)
Line-1310nm/1451nm dB ≤4.5

Isolation CWDM channel to dB DEMUX: ≥30

adjacent channel
MUX: NA

CWDM channel to dB DEMUX: ≥45

nonadjacent channel
MUX: NA

Return loss dB ≥40

Table 3-37 SCOMD4-1US/SCOMD4-5US/SCOMD4-9US/SCOMD5-14US Board Technical

Specifications

Item Unit Specification

SCOMD4-1US SCOMD4-5US SCOMD4-9US SCOMD5-14US

CWDM central wavelength nm 1471 1551 1271 1371

lC
1491 1571 1291 1391

1511 1591 1331 1411

1531 1611 1351 1431

1311 1311 1311 1451

- - - 1311

CWDM channel nm lC ±6.5 lC ±6.5 lC ±6.5 lC ±6.5

[email protected]

Insertion Line- CWDM dB ≤3.0 ≤3.0 ≤3.0 ≤3.0

loss (with
Line- UPG dB ≤3 (red ribbon) ≤3.0 ≤3.0 ≤3.0
connector)
≤2.5 (blue
ribbon)

Line-1311nm dB ≤2.0 ≤2.0 ≤2.0 ≤2.0

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Item Unit Specification

SCOMD4-1US SCOMD4-5US SCOMD4-9US SCOMD5-14US

Isolation CWDM dB DEMUX: ≥30 DEMUX: ≥30 DEMUX: ≥30 DEMUX: ≥30
channel to
MUX: NA MUX: NA MUX: NA MUX: NA
adjacent
channel

CWDM dB DEMUX: ≥45 DEMUX: ≥45 DEMUX: ≥45 DEMUX: ≥45

channel to
MUX: NA MUX: NA MUX: NA MUX: NA
nonadjacent
channel

Upgrade dB DEMUX: ≥12 DEMUX: ≥12 DEMUX: ≥12 DEMUX: ≥12

interface
MUX: NA MUX: NA MUX: NA MUX: NA
to CWDM
demultiplex
signal

Return loss dB >40 >40 >40 >40

Table 3-38 SCOMD4-5U/SCOMD4-9U/SCOMD5-14U Board Technical Specifications

Item Unit Specification

SCOMD4-5U SCOMD4-9U SCOMD5-14U

CWDM central wavelength lC nm 1551 1271 1371

1571 1291 1391

1591 1331 1411

1611 1351 1431

- - 1451

CWDM channel nm lC ±6.5 lC ±6.5 lC ±6.5

[email protected]

Insertion Line- CWDM dB ≤2.5 ≤2.5 ≤3.0

loss (with
Line- UPG dB ≤2.5 ≤2.5 ≤3.0
connector)

Isolation CWDM channel to dB DEMUX: ≥30 DEMUX: ≥30 DEMUX: ≥30

adjacent channel
MUX: NA MUX: NA MUX: NA

CWDM channel dB DEMUX: ≥45 DEMUX: ≥45 DEMUX: ≥45

to nonadjacent
MUX: NA MUX: NA MUX: NA
channel

Upgrade interface dB DEMUX: ≥12 DEMUX: ≥12 DEMUX: ≥12

to CWDM
MUX: NA MUX: NA MUX: NA
demultiplex signal

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Item Unit Specification

SCOMD4-5U SCOMD4-9U SCOMD5-14U

Return loss dB >40 >40 >40

3.9.2.2 SSDM Board Specifications

The SSDMT board is applied at the transmitting end. The technical specifications of the
SSDMT board are illustrated in Table 3-39. The SSDMR board is applied at the receiving
end. The technical specifications of the SSDMR board are illustrated in Table 3-40.
Table 3-39 SSDMT Board Technical Specifications

Item Unit Specification

Operating nm C band 1528 to 1568

wavelength range
nm C-band supervisory channel 1500 to 1520

Insertion loss dB IN→OUT <1.5

dB SIN→OUT <1.5

Isolation dB IN→OUT (@λSIN) >12

dB SIN→OUT (@λIN) >20

Return loss dB >40 -

Polarization dB <0.2 -
dependent loss
(PDL)

Optical input power mW <500 -

Table 3-40 SSDMR Board Technical Specifications

Item Unit Specification

Operating nm C band 1528 to 1568

wavelength range
nm C-band supervisory channel 1500 to 1520

Insertion loss dB IN→OUT <1.5

dB IN→SOUT <1.5

Isolation dB IN→OUT (@λSOUT) >12

dB IN→SOUT (@λOUT) >40

Return loss dB >40 -

Polarization dB <0.2 -
dependent loss
(PDL)

Optical input power mW <500 -

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3.9.3 Group Mux/DeMux Unit Specifications

3.9.3.1 SOGMD Board Specifications
Technical specifications of the SOGMD board in C band are illustrated in Table 3-41.

Table 3-41 Technical Specifications of the SOGMD Board in C Band

Item Unit Specification

Operating wavelength range nm 1528 to 1562

Insertion loss IN→RRO dB <2.5

IN→RBO dB <2.5

IN→BRO dB <2.5

IN→BBO dB <2.5

RRI→OUT dB <2.5

RBI→OUT dB <2.5

BRI→OUT dB <2.5

BBI→OUT dB <2.5

Isolation dB >12

Optical reflectance dB >40

PDL dB <0.4

PMD ps <0.15

Maximum allowed optical power mW <500

3.10 Optical Amplification Subsystem Specifications

3.10.1 M2SEOA Board Specifications
M2SEOBA Board
Technical specifications of the M2SEOBA board with 40/80 channels working in band C
are listed in Table 3-42. For the M2SEOBA board with 32 channels, the single-channel
optical power equals to that of the 40-channel board plus 1 dB.

Table 3-42 Technical Specifications of the M2SEOBA Board with 40/80-Channel in Band C

Item Unit Specification (40/80-Channel)

M2SEOBA17/17 M2SEOBA22/20

40-Channel 80-Channel 40-Channel 80-Channel

Operating wavelength range nm 1529 to 1561 1529 to 1561

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Item Unit Specification (40/80-Channel)

M2SEOBA17/17 M2SEOBA22/20

40-Channel 80-Channel 40-Channel 80-Channel

Total input power range dBm -32 to 3 -32 to 1 -32 to 1

Channel input power range dBm -32 to -13 -32 to -16 -32 to -15 -32 to -18

Channel output power range dBm -2 to 4 -5 to 1 1 to 7 -2 to 4

Total output power range dBm -2 to -17 -5 to 17 1 to 20 -2 to 20

Maximum total output power dBm 17 20

Noise ratio dB <6 <6

Polarization dependent loss dB <0.5 <0.5

Input leakage of pump dBm <-30 <-30

Output leakage of pump dBm <-30 <-30

Return loss of input light dB >40 >40

Return loss of output light dB >40 >40

Channel gain dB 17 22

Maximum tolerable input dB >30 >30

reflectance

Maximum tolerable output dB >30 >30

reflectance

Gain flatness dB ±1 ±1

Gain response time when ms <10 <10

adding/deleting channel
(stable status)

Polarization mode dispersion ps <0.5 <0.5

M2SEOPA Board
Technical specifications of the M2SEOPA board with 40/80 channels working in band C
are listed in Table 3-43. For the M2SEOPA board with 32 channels, the single-channel
optical power equals to that of the 40-channel board plus 1 dB.

Table 3-43 Technical Specifications of the M2SEOPA Board with 40/80 Channels in Band C

Item Unit Specification (40/80-Channel)

M2SEOPA17/17 M2SEOPA22/17 M2SEOPA27/17

40-Chan- 80-Chan- 40-Chan- 80-Chan- 40-Chan- 80-Chan-

nel nel nel nel nel nel

Operating wavelength nm 1529 to 1561 1529 to 1561 1529 to 1561

range

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Item Unit Specification (40/80-Channel)

M2SEOPA17/17 M2SEOPA22/17 M2SEOPA27/17

40-Chan- 80-Chan- 40-Chan- 80-Chan- 40-Chan- 80-Chan-

nel nel nel nel nel nel

Total input power range dBm -35 to 3 -35 to -2 -35 to -7

Channel input power dBm -35 to 13 -35 to -16 -35 to -18 -35 to -21 -35 to -23 -35 to -26
range

Channel output power dBm -2 to 4 -5 to 1 -2 to 4 -5 to 1 -2 to 4 -5 to 1

range

Total output power dBm -2 to 17 -5 to 17 -2 to 17 -5 to 17 -2 to 17 -5 to 17

range

Maximum total output dBm 17 17 17

power

Noise ratio dB <5.5 <5.5 <5.5

Polarization dependent dB <0.5 <0.5 <0.5

loss

Input leakage of pump dBm <-30 <-30 <-30

Output leakage of pump dBm <-30 <-30 <-30

Return loss of input light dB >40 >40 >40

Return loss of output dB >40 >40 >40

light

Channel gain dB 17 22 27

Maximum tolerable dB >30 >30 >30

input reflectance

Maximum tolerable dB >30 >30 >30

output reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time ms <10 <10 <10

when adding/deleting
channel (stable status)

Polarization mode ps <0.5 <0.5 <0.5

dispersion

M2SEOLA Board
Technical specifications of the M2SEOLA board with 40/80 channels working in band C are
listed in Table 3-44. For the M2SEOLA board with 32-channel, the single-channel optical
power equals to that of the 40-channel board plus 1 dB.

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Table 3-44 Technical Specifications of the M2SEOLA Board with 40/80-Channel in Band C

Item Unit Specification (40/80-Channel)

M2SEOLA22/20

40-Channel 80-Channel

Operating wavelength range nm 1529 to 1561

Total input power range dBm -35 to 1

Channel input power range dBm -35 to -15 -35 to -18

Channel output power range dBm 1 to 7 -2 to 4

Total output power range dBm 1 to 20 -2 to 20

Maximum total output power dBm 20

Noise figure dB <6

Polarization dependent loss dB <0.5

Pump leakage at input dBm <-30

Pump leakage at output dBm <-30

Return loss of input light dB >40

Return loss of output light dB >40

Channel gain dB 22

Maximum tolerable input reflectance dB >30

Maximum tolerable output reflectance dB >30

Gain flatness dB ±1

Gain response time when ms <10

adding/reducing channel (stable
status)

Polarization mode dispersion ps <0.5

3.11 Protection Subsystem Specifications

3.11.1 SOP Board Specifications
The specifications of the SOP board are listed in Table 3-45.

Table 3-45 Technical SOP Board Specifications

Item Unit Specification

Operating wavelength range nm 1260 to 1620

1260 to 1510 1510 to 1620

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Item Unit Specification

Insertion loss T1_I to T1_O1 dB <5 <4.5

T2_I to T2_O1 dB <5 <4.5

T1_I to T1_O2 dB <5 <4.5

T2_I to T2_O2 dB <5 <4.5

R1_I1 to R1_O dB <2.5 <2

R2_I1 to R2_O dB <2.5 <2

R1_I2 to R1_O dB <2.5 <2

R2_I2 to R2_O dB <2.5 <2

Return loss dB >40

Polarization dependent loss dB <0.2

Optical input power mW <200

Switching time ms <10

3.11.2 SOPCS Board Specifications

The technical specifications of the SOPCS board are listed in Table 3-46.

Table 3-46 SOPCS Board Technical Specifications

Item Unit Specification

Operating wavelength range nm 1260 to 1620

1510 to 1620 1260 to 1510

Insertion loss dB API → BPO <2.1 <2.7

dB API→BOUT <2.7 <3.3

dB AWI→AOUT <2.1 <2.7

dB AIN → AWO <4.4 <5.0

dB AIN→BPO <5.1 <5.7

dB BIN→ BWO <4.4 <5.0

dB BIN→APO <5.1 <5.7

dB BWI→BOUT <2.1 <2.7

dB BPI→AOUT <2.7 <3.3

dB BPI→APO <2.1 <2.7

Return loss dB >40

Polarization dB <0.3
dependent loss

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Item Unit Specification

Optical input power mW <200

Switching time ms <50

3.11.3 SOPMS Board Specifications

The technical specifications of the SOPMS board are listed in Table 3-47.

Table 3-47 SOPMS Board Technical Specifications

Item Unit Specification

Operating wavelength nm 1510 to 1610

range

Insertion loss dB API→BPO <3.2

dB AWI→AOUT <1.7

dB BWI→BOUT <1.7

dB BPI→APO <3.2

dB AIN→AWO <1.7

dB BIN→BWO <1.7

dB API→AWO <3.2

dB AWI→APO <3.2

dB AIN→BPO <1.7

dB BPI→AOUT <1.7

dB BWI→BPO <3.2

dB BPI→BWO <3.2

dB BIN→APO <1.7

dB API→BOUT <1.7

Return loss dB >40

Polarization dependent dB <0.3

loss

Optical input power mW <200

Switching time ms <50

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3.12 Supervision Subsystem Specifications

3.12.1 NCP Board Specifications
The NCP board can be used in both the DWDM system and the CWDM system. Table
3-48 and Table 3-49 list the technical specifications of the NCP board.

Table 3-48 NCP Board Technical Specifications (DWDM)

Item Unit Specification

80 km 120 km 140 km

Optical signal type - 100BASE-FX

Operating wavelength nm 1510±10

Signal code - 4B/5B

Supervision rate Mbit/s 100

Signal transmitting power dBm -5 to 0 -1 to 6 ≥+4

Minimum receiver dBm -34 -37 -43

sensitivity

Table 3-49 NCP Board Technical Specifications (CWDM)

Item Unit Specification

1310 nm SFP 1311 nm SFP 1451 nm SFP

Signal transmitting dBm -5 to 0 0 to 5 -3 to 5

power

Central frequency nm ±50 ±6.5 ±6.5

deviation

Minimum receiver dBm -34 -36 -34

sensitivity

Span km 602 802 602

Application - Bi-directional Bi-directional Bi-directional

single-fiber two-fiber system single-fiber
system system

3.13 Power Subsystem Specifications

3.13.1 FAN Board Specifications
Table 3-50 lists the technical specifications of the FAN board.

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ZXMP M721 Product Descriptions

Table 3-50 FAN Board Technical Specifications

Item Unit Specification

Operating voltage V -7 to -15

Operating current A 7

Full-rate rotation rate rpm 7200

Default rotation rate rpm 50%

Adjustable rotation rate rpm 50%, 80%, 100%

3.13.2 PW-DC Board Specifications

The PW-DC board is the 48 V/60 V DC power supply board. The specifications of the
PW-DC board are listed in Table 3-51.

Table 3-51 PW-DC Board Specifications

Input Voltage Allowable Voltage Fluctuation Range Rated Output Power

-48 VDC -60 VDC to -40 VDC -

-60 VDC -50 VDC to -72 VDC -

3.13.3 PW-AC Board Specifications

The PW-AC board is the 110 V to 220 V AC power supply board. The specifications of the
PW-AC board are listed in Table 3-52.

Table 3-52 PW-AC Board Specifications

Input Voltage Allowable Voltage Allowable Frequency Rated Output Power

Fluctuation Range Fluctuation Range

110 VAC/220 100 VAC to 240 VAC 45 Hz to 65 Hz -

VAC

3.14 DCM Specifications

Table 3-53 and Table 3-54 list technical specifications of DCM.

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 Chapter 3 Technical Specifications

Table 3-53 DCM Technical Specifications (G.652 Optical Fiber)

Item Unit Specification

DCM-5 DCM-10 DCM-20 DCM-40 DCM-60 DCM-80 DCM- DCM-

100 120

Operating nm 1525 to 1525 to 1525 to 1525 to 1525 to 1525 to 1525 to 1525 to

wavelength 1565 1565 1565 1565 1565 1565 1565 1565

Allowable dBm >20 >20 >20 >20 >20 >20 >20 >20
input power

Equivalent km 5 10 20 40 60 80 100 120

compensa-
tion length
of G.652
fiber

Insertion dB <2.2 <2.6 <3.5 <5.0 <6.8 <8.0 <9.0 <11.0

loss (its
(2.5) (3) (4) (5) (7) (8) (9) (11)
reference
value)

Polarization dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

dependent
loss

Disper- ps/nm -80 to -159 to -313 to -620 to -930 to -1240 to -1550 to -1860 to
sion@1525 -70 -145 -293 -596 -894 -1192 -1490 -1788
nm

Disper- ps/nm -87 to -171 to -336 to -666 to -1000 to -1333 to -1666 to -1999 to
sion@1545 -77 -157 -316 -640 -962 -1282 -1602 -1922
nm

Disper- ps/nm -93 to -183 to -360 to -714 to -1070 to -1427 to -1784 to -2141 to
sion@1565 -83 -169 -340 -686 -1028 -1371 -1714 -2057
nm

Table 3-54 DCM Technical Specifications (G.655 LEAF Optical Fiber)

Item Unit Specification

DCM-20 DCM-40 DCM-60 DCM-80 DCM-100 DCM-120

Operating nm 1525 to 1525 to 1525 to 1525 to 1525 to 1525 to

wavelength 1565 1565 1565 1565 1565 1565

Allowable dBm >20 >20 >20 >20 >20 >20

input power

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Item Unit Specification

DCM-20 DCM-40 DCM-60 DCM-80 DCM-100 DCM-120

Equivalent km 20 40 60 80 100 120

compensa-
tion length
of G.655
LEAF fiber

Insertion dB <4.0 <5.0 <5.9 <7.0 <8.0 <9.0

loss (its
-4 -5 -6 -7 -8 -9
reference
value)

Polarization dB <0.3 <0.3 <0.3 <0.3 <0.3 <0.3

dependent
loss

Disper- ps/nm -56 to -41 -111 to -85 -180 to -128 -230 to -173 -280 to -217 -330 to -262
sion@1530
nm

Disper- ps/nm -84 to -66 -166 to -135 -246 to -204 -330 to -274 -410 to -343 -498 to -413
sion@1545
nm

Disper- ps/nm -112 to -96 -224 to -192 -336 to -288 -448 to -384 -560 to -480 -672 to -576
sion@1565
nm

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 List of Figure
Figure 1-1 A Mixed Network of DWDM and CWDM .................................................. 1-2
Figure 2-1 Slot Layout of the 2U DC Subrack Motherboard ...................................... 2-1
Figure 2-2 Slot Layout of the 1U DC Subrack Motherboard....................................... 2-1
Figure 2-3 Slot Layout of a 2U AC Subrack Motherboard.......................................... 2-2
Figure 2-4 Slot Layout of an 1U AC Subrack Motherboard ........................................ 2-2
Figure 3-1 Jitter Transfer Specifications of the Optical Interface at Line Side ........... 3-18

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 List of Figure

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 List of Table
Table 1-1 Descriptions About the FEC Function of the ZXMP M721 .......................... 1-1
Table 3-1 Dimensions and Weights of Structural Parts of ZXMP M721...................... 3-1
Table 3-2 ZXMP M721 Board Weight ........................................................................ 3-2
Table 3-3 Power Consumptions of Boards and Units of ZXMP M721 ........................ 3-4
Table 3-4 Climate Requirements (Storage Environment)........................................... 3-6
Table 3-5 Concentration of the Mechanical Activity Material (Storage
Environment) ........................................................................................... 3-7
Table 3-6 Concentration of the Chemical Activity Material (Storage
Environment) ........................................................................................... 3-7
Table 3-7 Climate Requirements (Transportation Environment)................................. 3-8
Table 3-8 Concentration of the Mechanical Activity Material (Transportation
Environment) ........................................................................................... 3-9
Table 3-9 Concentration of the Chemical Activity Material (Transportation
Environment) ........................................................................................... 3-9
Table 3-10 Requirements for Temperature and Humidity (Operating
Environment) ........................................................................................... 3-9
Table 3-11 Requirements for Other Climate Factors (Operating Environment)
.............................................................................................................. 3-10
Table 3-12 Concentration of the Mechanical Activity Material (Operating
Environment) ......................................................................................... 3-10
Table 3-13 Concentration of the Chemical Activity Material (Operating
Environment) ......................................................................................... 3-10
Table 3-14 Typical Power Supply Lightning Protection Classification....................... 3-11
Table 3-15 Requirements for Connection Cable of Lightning Protection Units and
Cross-Sectional Area of The Ground Cable............................................ 3-12
Table 3-16 Lightning Requirements of the ZXMP M721 Port .................................. 3-12
Table 3-17 Electro-Magnetic Susceptibility Specifications ....................................... 3-13
Table 3-18 Wavelength Allocation of the 40 CH/100 GHZ System in Band C ........... 3-13
Table 3-19 Wavelength Allocation (18-Wavelength System).................................... 3-14
Table 3-20 Noncontinuous Wavelength Allocation................................................... 3-15
Table 3-21 TD2C/TS2C Board Technical Specifications .......................................... 3-16
Table 3-22 Jitter Specifications................................................................................ 3-18
Table 3-23 Jitter Transfer Specifications at 3R Line Side ........................................ 3-18
Table 3-24 MQA1 Board Technical Specifications (DWDM)..................................... 3-19

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Table 3-25 MQA1 Board Technical Specifications (CWDM)..................................... 3-20

Table 3-26 MQA2 Board Technical Specifications ................................................... 3-21
Table 3-27 MJA Board Technical Specifications ...................................................... 3-22
Table 3-28 MQM1 Board Technical Specifications (DWDM) .................................... 3-23
Table 3-29 MQM1 Board Technical Specifications(CWDM) ..................................... 3-24
Table 3-30 MQM2 Board Technical Specifications................................................... 3-26
Table 3-31 MJM Board Technical Specifications...................................................... 3-27
Table 3-32 Technical Specifications of the SOAD1 Board in Band C ...................... 3-28
Table 3-33 Technical Specifications of the SOAD2 Board in Band C ...................... 3-28
Table 3-34 Technical Specifications of the SOAD4 Board in Band C ...................... 3-29
Table 3-35 Technical Specifications of SCOAD Boards in Band C .......................... 3-30
Table 3-36 SCOMDS Board Technical Specifications .............................................. 3-32
Table 3-37 SCOMD4-1US/SCOMD4-5US/SCOMD4-9US/SCOMD5-14US Board
Technical Specifications ......................................................................... 3-32
Table 3-38 SCOMD4-5U/SCOMD4-9U/SCOMD5-14U Board Technical
Specifications......................................................................................... 3-33
Table 3-39 SSDMT Board Technical Specifications ................................................. 3-34
Table 3-40 SSDMR Board Technical Specifications................................................. 3-34
Table 3-41 Technical Specifications of the SOGMD Board in C Band ...................... 3-35
Table 3-42 Technical Specifications of the M2SEOBA Board with 40/80-Channel in
Band C................................................................................................... 3-35
Table 3-43 Technical Specifications of the M2SEOPA Board with 40/80 Channels
in Band C .............................................................................................. 3-36
Table 3-44 Technical Specifications of the M2SEOLA Board with 40/80-Channel in
Band C .................................................................................................. 3-38
Table 3-45 Technical SOP Board Specifications...................................................... 3-38
Table 3-46 SOPCS Board Technical Specifications ................................................. 3-39
Table 3-47 SOPMS Board Technical Specifications................................................. 3-40
Table 3-48 NCP Board Technical Specifications (DWDM) ....................................... 3-41
Table 3-49 NCP Board Technical Specifications (CWDM) ....................................... 3-41
Table 3-50 FAN Board Technical Specifications ...................................................... 3-42
Table 3-51 PW-DC Board Specifications ................................................................. 3-42
Table 3-52 PW-AC Board Specifications ................................................................. 3-42
Table 3-53 DCM Technical Specifications (G.652 Optical Fiber) .............................. 3-43
Table 3-54 DCM Technical Specifications (G.655 LEAF Optical Fiber) .................... 3-43

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 Glossary
AFEC
- Advanced Forward Error Correction
APR
- Automatic Power Reduction
APSD
- Automatic Power Shutdown
CWDM
- Coarse Wavelength Division Multiplexing
DWDM
- Dense Wavelength Division Multiplexing
EDFA
- Erbium Doped Fiber Amplifier
EMI
- Electromagnetic Interference
EMS
- Electromagnetic Susceptibility

FEC
- Forward Error Correction

GE
- Gigabit Ethernet
PDL
- Polarization Dependent Loss
PMD
- Physical Medium Dependent
SDH
- Synchronous Digital Hierarchy
SFP
- Small Form-factor Pluggable
WDM
- Wavelength Division Multiplexing

XFP
- 10-Gigabit Samll Form-Factor Pluggable

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