TDA1910 Datasheet PDF
TDA1910 Datasheet PDF
DESCRIPTION
The TDA 1910 is a monolithic integrated circuit in
MULTIWATT package, intended for use in Hi-Fi
audio power applications, as high quality TV sets.
The TDA 1910 meets the DIN 45500 (d = 0.5%)
guaranteed output power of 10W when used at
24V/4W. At 24V/8W the output power is 7W min.
Features:
– muting facility Multiwatt 11
– protection against chip over temperature
– very low noise ORDERING NUMBERS:
– high supply voltage rejection
TDA1910 (Multiwatt11 Vertical)
– low ”switch-on” noise. TDA1910HS (Multiwatt11 Horizontal)
The TDA 1910 is assembled in MULTIWATT
package that offers:
– easy assembly – space and cost saving
– simple heatsink – high reliability
TEST CIRCUIT
SCHEMATIC DIAGRAM
2/14
TDA1910
TEST CIRCUIT
MUTING CIRCUIT
3/14
TDA1910
THERMAL DATA
Symbol Parameter Value Unit
Rth j-case Thermal resistance junction-case max 3 °C/W
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, Tamb = 25 °C, Rth (heatsink)= 4°C/W, unless
otherwise specified)
Symbol Parameter Test condition Min. Typ. Max. Unit
Vs Supply voltage 8 30 V
d = 10% f = 1 KHz
8.5 9.5
Vs = 18V R L = 4Ω
15 17
Vs = 24V R L = 4Ω
9 10
Vs = 24V R L = 8Ω
F = 1 KHz,
Vs = 18V RL = 4Ω Po = 7 W 170
Vi Input sensitivity mV
vs = 24V RL = 4Ω Po = 12 W 220
Vs = 24V RL = 8Ω Po = 7.5W 245
4/14
TDA1910
Muting on 10 30 Ω
AT Muting attenuation Rg + R 1 = 10 KΩ 50 60 dB
Note :
(°) Weighting filter = curve A.
(° °) Filter with noise bandwidth: 22 Hz to 22 KHz.
(*) See fig. 29 and fig. 30.
5/14
TDA1910
Figure 1. Quiescent output Figure 2. Quiescent drain Figure 3. Open loop fre-
voltage vs. supply voltage current vs. supply voltage quency response
Figure 4. Output power vs. Figure 5. Output power vs. F i gure 6 . Dis torti on vs.
supply voltage supply voltage output power
F i gure 7 . Dis torti on vs. Figure 8. Output power vs. Figure 9. Output power vs.
output power frequency frequency
6/14
TDA1910
Figure 10. Output power vs. Figure 11. Output power vs. Figure 12. Total input noise
input voltage input voltage vs. source resistance
Figure 13. Values of capaci- Figure 14. Supply voltage Figure 15. Supply voltage
tor CX vs. bandwidth (BW) rejection vs. voltage gain r e je c ti o n v s . s o urc e
and gain (GV) resistance
7/14
TDA1910
APPLICATION INFORMATION
Figure 19. Application circuit without muting Figure 20. PC board and component lay-out of
the circuit of fig. 19 (1:1 scale)
Figure 21. Application circuit with muting Performance (circuits of fig. 19 and 21)
Po = 12W (40 to 15000 Hz, d ≤ 0.5%)
Vs = 24V
Id = 0.82A
Gv = 30 dB
8/14
TDA1910
Figure 22. Two position DC tone control (10 dB boost 50 Hz and Figu re 23 . Fre quenc y re-
20 KHz) using change of pin 1 resistance (muting function) sponse of the circuit of fig. 22
Figure 24. 10 dB 50 Hz boos tone control using change of pin 1 Figu re 25 . Fre quenc y re-
resistance (muting function) sponse of the circuit of fig. 24
Figure 26. Squelch function in TV applications Figure 27. Delayed muting circuit
9/14
TDA1910
MUTING FUNCTION
The output signal can be inhibited applying a DC voltage VT to pin 11, as shown in fig. 28
Figure 28
The input resistance at pin 1 depends on the threshold voltage VT at pin 11 and is typically.
Referringto the following input stage, the possible attenuationof the input signal and therefore of the output
signal can be found using the following expression.
Vi Rg + R5 ⁄ ⁄ R1
AT = =
V5 R5 ⁄ ⁄ R1
where R5 ≅ 100 KΩ
10/14
TDA1910
APPLICATION SUGGESTION
The recommended values of the components are those shown on application circuit of fig. 21. Different
values can be used.
The following table can help the designer.
11/14
TDA1910
Figure 29. Output power and Figure 30. Output power and Figure31. Maximumallow able
d r ai n c u rr e n t vs . c ase d ra i n c u rr e nt vs . cas e power dissipation vs. ambient
temperature temperature temperature
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re- spring (clip) being sufficient. Between the heatsink
moved by adding an external heatsink. and the package it isbetterto insert a layer of silicon
Thanks to the Multiwatt package attaching the grease, to optimize the thermal contact; no electri-
heatsink is very simple, a screw or a compression cal isolation is needed between the two surfaces.
12/14
TDA1910
13/14
TDA1910
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1997 SGS-THOMSON Microelectronics – Printed in Italy – All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
14/14