CPUs GPUs Accelerators
CPUs GPUs Accelerators
accelerators
x86
Intel server micro-architectures (1/2)
Microarchitecture Technology Launch year Highlights
Main specs:
● 4 dies per chip (14nm), each die embedding IO and memory controllers, no chipset, SP3 sockets
● range of frequencies : 2.0-2.4 GHz, turbo up to 3.2 GHz
● 8 DDR4 memory channels with hardware, on the fly, encryption, up to 2600 MHz
● up to 32 cores (64 threads)
● up to 128 PCI gen3 lanes per processor (64 in dual )
● TDP range: 120W-180W
EPYC Naples processors have similar computing power compared to Intel Skylake processors (HS06 benchmarks on
close frequencies and core count CPUs) with cutoff prices up to 49% (AMD claim).
Mostly compatible with Intel based x86, sparing for user code modifications.
AMD EPYC Rome (starting Q2 ‘19)
Next AMD EPYC generation (Zen2 based), embeds 9 dies (8 CPU 7nm chiplets for 1 I/O 14 nm die). All I/O and memory
access is concentrated into a single die.
Main specs:
● 9 dies per chip : a 7nm single IO/memory die and 8 CPU 7nm chiplets
● 8 DDR4 memory channels, up to 3200 MHz
● up to 64 cores (128 threads) per processor
● up to 128 PCI gen3/4 lanes per processor
● SP3 / LGA-4094 sockets
● TDP range: 120W-225W (max 190W for SP3 compatibility)
Claimed +20% performance per zen2 core (over zen), +75% through the whole chip with similar TDP over Naples.
At the moment, only possible solutions are based on trade-offs and DSL for very simple codes
Sour
ce:
https://www.marketsandmarkets.com/Market-Reports/fpga-market-194123367.html
https
://ww
w.gra
FPGAs for Application Acceleration
● Programmability without sacrificing
efficiency
● Highly suited for low latency Source:
applications
https://
www.ne
xtplatfor
m.com/
2018/10
applications for-
Process
inferencTechnology 20 nm 16 nm 14 nm
e- Intel® Xilinx® Intel® Xilinx® Intel® Xilinx®
accelera
Best Performance
tion/ Or Virtex® Virtex® UltraScale+® Intel® Stratix®
Fastest, Most Powerful UltraScale® Zynq® UltraScale+® 10