® BTA08, BTB08 and T8 Series

SNUBBERLESS™, LOGIC LEVEL & STANDARD 8A TRIACS

Table 1: Main Features A2

Symbol Value Unit

IT(RMS) 8 A G

VDRM/VRRM 600 and 800 V A1

A2
IGT (Q1) 5 to 50 mA A2

A1 A2
A1
G A2
G
DESCRIPTION
Available either in through-hole or surface-mount D2PAK IPAK
packages, the BTA08, BTB08 and T8 triac series (T8-G) (T8-H)
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applica- A2

tions such as static relays, heating regulation, in-

duction motor starting circuits... or for phase A1 A2

control operation in light dimmers, motor speed G

controllers,... DPAK
(T8-B)
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on A2
inductive loads, thanks to their high commutation
performances.
Logic level versions are designed to interface
directly with low power drivers such as A1
A2
A1
A2
G G
microcontrollers.
By using an internal ceramic pad, the BTA series TO-220AB Insulated TO-220AB
provides voltage insulated tab (rated at (BTA08) (BTB08)
2500VRMS) complying with UL standards (file ref.:
E81734).
Table 2: Order Codes
Part Number Marking
BTA08-xxxxxRG
BTB08-xxxxxRG
See page table 8 on
T8xx-xxxG
page 10
T8xx-xxxH
T8xx-xxxB

February 2006 REV. 6 1/11

BTA08, BTB08 and T8 Series

Table 3: Absolute Maximum Ratings

Symbol Parameter Value Unit
IPAK/D2PAK/ T = 110°C
IT(RMS) RMS on-state current (full sine DPAK/TO-220AB c 8 A
wave)
TO-220AB Ins. Tc = 100°C

Non repetitive surge peak on-state F = 50 Hz t = 20 ms 80

ITSM A
current (full cycle, Tj initial = 25°C) F = 60 Hz t = 16.7 ms 84
I²t I²t Value for fusing tp = 10 ms 36 A ²s
Critical rate of rise of on-state cur-
dI/dt F = 120 Hz Tj = 125°C 50 A/µs
rent IG = 2 x IGT , tr ≤ 100 ns
IGM Peak gate current tp = 20 µs Tj = 125°C 4 A
PG(AV) Average gate power dissipation Tj = 125°C 1 W
Tstg Storage junction temperature range - 40 to + 150
°C
Tj Operating junction temperature range - 40 to + 125

Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)

■ SNUBBERLESS and Logic Level (3 quadrants)
Quad- T8 BTA08 / BTB08
Symbol Test Conditions Unit
rant T810 T835 TW SW CW BW
IGT (1) I - II - III MAX. 10 35 5 10 35 50 mA
VD = 12 V RL = 30 Ω
VGT I - II - III MAX. 1.3 V
VD = VDRM RL = 3.3 kΩ
VGD I - II - III MIN. 0.2 V
Tj = 125°C
IH (2) IT = 100 mA MAX. 15 35 10 15 35 50 mA
I - III 25 50 10 25 50 70
IL IG = 1.2 IGT MAX. mA
II 30 60 15 30 60 80
VD = 67 %VDRM gate open
dV/dt (2) MIN. 40 400 20 40 400 1000 V/µs
Tj = 125°C
(dV/dt)c = 0.1 V/µs Tj = 125°C 5.4 - 3.5 5.4 - -
(dI/dt)c (2) (dV/dt)c = 10 V/µs Tj = 125°C MIN. 2.8 - 1.5 2.98 - - A/ms
Without snubber Tj = 125°C - 4.5 - - 4.5 7

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 BTA08, BTB08 and T8 Series

■ Standard (4 quadrants)
BTA08 / BTB08
Symbol Test Conditions Quadrant Unit
C B
I - II - III 25 50
IGT (1) MAX. mA
VD = 12 V RL = 30 Ω IV 50 100
VGT ALL MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C ALL MIN. 0.2 V
IH (2) IT = 500 mA MAX. 25 50 mA
I - III - IV 40 50
IL IG = 1.2 IGT MAX. mA
II 80 100
dV/dt (2) VD = 67 %VDRM gate open Tj = 125°C MIN. 200 400 V/µs
(dV/dt)c (2) (dI/dt)c = 5.3 A/ms Tj = 125°C MIN. 5 10 V/µs

Table 5: Static Characteristics

Symbol Test Conditions Value Unit
VT (2) ITM = 11 A tp = 380 µs Tj = 25°C MAX. 1.55 V
Vto (2) Threshold voltage Tj = 125°C MAX. 0.85 V
Rd (2) Dynamic resistance Tj = 125°C MAX. 50 mΩ

IDRM Tj = 25°C 5 µA
VDRM = VRRM MAX.
IRRM Tj = 125°C 1 mA
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.

Table 6: Thermal resistance

Symbol Parameter Value Unit
IPAK / D2PAK / DPAK / TO-220AB 1.6
Rth(j-c) Junction to case (AC) °C/W
TO-220AB Insulated 2.5
S = 1 cm² D2PAK 45
S = 0.5 cm² DPAK 70
Rth(j-a) Junction to ambient °C/W
TO-220AB / TO-220AB Insulated 60
IPAK 100
S = Copper surface under tab.

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BTA08, BTB08 and T8 Series

Figure 1: Maximum power dissipation versus Figure 2: RMS on-state current versus case
RMS on-state current (full cycle) temperature (full cycle)

P(W) IT(RMS)(A)
10 10
9 9 BTB / T8
8 8
7 7 BTA

6 6
5 5
4 4
3 3
2 2
1 1
IT(RMS)(A) TC(°C)
0 0
0 1 2 3 4 5 6 7 8 0 25 50 75 100 125

Figure 3: RMS on-state current versus ambient Figure 4: Relative variation of thermal
temperature (printed circuit board FR4, copper impedance versus pulse duration
thickness: 35µm) (full cycle)

IT(RMS)(A) K=[Zth/Rth]
3.5 1E+0
Zth(j-c)
3.0 D2PAK DPAK/IPAK
(S=1CM2) Zth(j-a)

2.5
1E-1
2.0 TO-220AB/D2PAK
Zth(j-a)

1.5 DPAK
(S=0.5CM2)
1E-2
1.0

0.5
TC(°C) tp(s)
0.0 1E-3
0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

Figure 5: On-state characteristics (maximum Figure 6: Surge peak on-state current versus
values) number of cycles

ITM(A) ITSM(A)
100 90
Tj max. Tj = Tj max.
Vto = 0.85V 80
Rd = 50 mΩ
70 t=20ms

60 One cycle
Non repetitive
50 Tj initial=25°C
10
Tj = 25°C.
40 Repetitive
TC=110°C
30

20

10
VTM(V) Number of cycles
1 0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 10 100 1000

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 BTA08, BTB08 and T8 Series

Figure 7: Non-repetitive surge peak on-state Figure 8: Relative variation of gate trigger
current for a sinusoidal pulse with width tp < 10 ms current, holding current and latching current
and corresponding value of I2t versus junction temperature (typical values)

2
ITSM(A), I t (A s)
2 IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1000 2.5
Tj initial=25°C

2.0
IGT
dI/dt limitation:
ITSM
50A/µs 1.5
100
IH & IL
1.0
I2t

0.5

tp(ms) Tj(°C)
10 0.0
0.01 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140

Figure 9: Relative variation of critical rate of Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level (typical values) (Standard types)
types)

(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c

2.2 2.0
2.0 TW
1.8
1.8
1.6
1.6
C
1.4 1.4
1.2 T835/CW/BW
1.2 B
1.0
0.8 1.0
T810/SW
0.6 0.8
0.4
0.2 0.6
(dV/dt)c (V/µs) (dV/dt)c (V/µs)
0.0 0.4
0.1 1.0 10.0 100.0 0.1 1.0 10.0 100.0

Figure 11: Relative variation of critical rate of Figure 12: DPAK and D2PAK Thermal resistance
decrease of main current versus junction junction to ambient versus copper surface under
temperature tab (printed circuit board FR4, copper thickness:
35 µm)

(dI/dt)c [Tj] / (dI/dt)c [Tj specified] Rth(j-a)(°C/W)

6 100
90
5
80
70
4
60
3 50 DPAK

40
2
30 D2PAK

20
1
Tj(°C) 10 S(cm²)
0 0
0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40

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BTA08, BTB08 and T8 Series

Figure 13: Ordering Information Scheme (BTA08 and BTB08 series)

BT A 08 - 600 BW (RG)

Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless
C = 25mA Standard CW = 35mA Snubberless
SW = 10mA Logic Level TW = 5mA Logic Level
Packing mode
RG = Tube

Figure 14: Ordering Information Scheme (T8 series)

T 8 10 - 600 B (-TR)

Triac series
Current
8 = 8A
Sensitivity
10 = 10mA
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
B = DPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel

Table 7: Product Selector

Voltage (xxx)
Part Number Sensitivity Type
600 V 800 V Package
BTA/BTB08-xxxB X X 50 mA Standard TO-220AB
BTA/BTB08-xxxBW X X 50 mA Snubberless TO-220AB
BTA/BTB08-xxxC X X 25 mA Standard TO-220AB
BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB
BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB
BTA/BTB08-xxxTW X X 5 mA Logic Level TO-220AB
T810-xxxG X X 10 mA Logic Level D2PAK
T810-xxxH X X 10 mA Logic Level IPAK
T835-xxxB X X 35 mA Snubberless DPAK
T835-xxxG X X 35 mA Snubberless D2PAK
T835-xxxH X X 35 mA Snubberless IPAK
BTB: non insulated TO-220AB package

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 BTA08, BTB08 and T8 Series

Figure 15: D2PAK Package Mechanical Data

DIMENSIONS
REF. Millimeters Inches
A Min. Typ. Max. Min. Typ. Max.
E
C2
A 4.30 4.60 0.169 0.181
L2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D B 0.70 0.93 0.027 0.037
L
B2 1.25 1.40 0.048 0.055
L3
C 0.45 0.60 0.017 0.024
A1
C2 1.21 1.36 0.047 0.054
B2
C R
B D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G
G 4.88 5.28 0.192 0.208
A2 L 15.00 15.85 0.590 0.624
2mm min.
FLAT ZONE L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
V2
R 0.40 0.016
V2 0° 8° 0° 8°

Figure 16: D2PAK Foot Print Dimensions

(in millimeters)

16.90

10.30 5.08

1.30

3.70
8.90

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BTA08, BTB08 and T8 Series

Figure 17: DPAK Package Mechanical Data

DIMENSIONS
REF. Millimeters Inches
Min. Max Min. Max.
E A A 2.20 2.40 0.086 0.094
B2 A1 0.90 1.10 0.035 0.043
C2
A2 0.03 0.23 0.001 0.009
L2
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
D
H R C 0.45 0.60 0.017 0.023
L4 C2 0.48 0.60 0.018 0.023
A1 D 6.00 6.20 0.236 0.244
B R

G C
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
A2
0.60 MIN. L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2
V2 0° 8° 0° 8°

Figure 18: DPAK Foot Print Dimensions

(in millimeters)

6.7 3 3 1.6

2.3
6.7
2.3

1.6

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 BTA08, BTB08 and T8 Series

Figure 19: TO-220AB Package Mechanical Data

DIMENSIONS
REF. Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
B C A 15.20 15.90 0.598 0.625
ØI b2 a1 3.75 0.147
L
a2 13.00 14.00 0.511 0.551
F
B 10.00 10.40 0.393 0.409
A b1 0.61 0.88 0.024 0.034
I4 b2 1.23 1.32 0.048 0.051
l3 C 4.40 4.60 0.173 0.181
a1 c2 c1 0.49 0.70 0.019 0.027
l2
c2 2.40 2.72 0.094 0.107
a2
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
M ØI 3.75 3.85 0.147 0.151
b1 c1
e I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102

Figure 20: IPAK Package Mechanical Data

DIMENSIONS
REF. Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A
A1 0.90 1.10 0.035 0.043
E
C2 A3 0.70 1.30 0.027 0.051
B2 B 0.64 0.90 0.025 0.035
L2
B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
D
B5 0.30 0.035
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
H
L1 B3 D 6 6.20 0.236 0.244
L
B A1 E 6.40 6.60 0.252 0.260
V1 e 2.28 0.090
G 4.40 4.60 0.173 0.181
H 16.10 0.634
e B5 C L 9 9.40 0.354 0.370
G A3 L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
V1 10° 10°

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BTA08, BTB08 and T8 Series

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.

Table 8: Ordering Information

Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz TO-220AB 2.3 g 50 Tube
T8yy-xxxG T8yyxx 50 Tube
D2PAK 1.5 g
T8yy-xxxG-TR T8yyxx 1000 Tape & reel
T8yy-xxxB T8yyxx 75 Tube
DPAK 0.3 g
T8yy-xxxB-TR T8yyxx 2500 Tape & reel
T8yy-xxxH T8yyxx IPAK 0.4 g 75 Tube
Note: xxx = voltage, yy = sensitivity, z = type

Table 9: Revision History

Date Revision Description of Changes
Apr-2002 5A Last update.
TO-220AB delivery mode changed from bulk to tube.
13-Feb-2006 6
ECOPACK statement added.

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 BTA08, BTB08 and T8 Series

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