Network Computing

Innovative Platforms for Next Generation Network Infrastructure

Volume 20.1 www.lannerinc.com

2 www.lannerinc.com
Lanner’s Leadership in Network Appliance

Cloud computing and high-speed mobile communications networks have

exponentially increased the Internet traffic, placing enormous workload
demands onto network appliances. Such network demand is attracting
increasing numbers of sophisticated and well-prepared malware, viruses,
and other information security risks; service providers and infrastructure
owners are in need of innovative, next-generation platforms with high-
performance and high-throughput processors for implementing hardware
security measures that could carry out deep packet inspection and virus
scanning in a thorough and swift manner.

Lanner has been the leader in the rapid-growing information security

industry for over three decades and is dedicated to supplying innovative
and next-generation hardware platforms with advanced architectures.
According to Gartner Magic Quadrants, 60% of all 46 companies supplying
Enterprise Network Firewalls, UTM, Wired/Wireless LAN, WAN optimization
and Application Delivery use hardware made by Lanner. Lanner had thus
far shipped over 2 million networking appliances, reaching a significant
corporate milestone. Such demand demonstrates Lanner’s strength and
commitment to designing superior network platforms in the field.

With SD-WAN becoming the most anticipated WAN Services today, Lanner’s
desktop network platforms have been successfully deployed in more than
11 of the 20 industry-leading SD-WAN solution providers, according to the
latest Gartner’s Magic Quadrant report on WAN Edge Infrastructure. With
multiple success stories showing Lanner appliances’ capabilities in various
deployment settings, Lanner desktop network platforms are proved to be
highly customizable for not only meeting customer demands in enterprise
networking hardware but also for building a better network platform for the
businesses they serve, greatly accelerating the time-to-market and reducing
time needed for validation.

As the industry requires higher quality, more advanced and more powerful
network appliances, we will continue our expertise, and will support our
clients and partners in full dedication so we can all grow together.

Terence Chou
General Manager, Network Computing Business Unit
www.lannerinc.com 3
 About Lanner
Lanner Electronics Inc. (TAIEX 6245) is a world-leading hardware provider in design,
engineering, and manufacturing services for advanced network appliances and rugged
industrial computers.
With 33-year experiences, Lanner provides reliable and cost-effective computing platforms
with high quality and performance. Today, Lanner has a large and dynamic manpower with
approximately 1,000 well-experienced employees worldwide with the headquarters in Taipei,
Taiwan and subsidiaries in the US, Canada, and China.

Global Manufacturing Capabilities Service Capabilities

• Custom design and production in board,
Taipei, Taiwan chassis and system
• Area 30,000 m² • High mix low volume manufacturing
• 3 x SMT, DIP and assembly lines • Quality assurance services
• Production capacity: 30,000 system units/month • Global order fulfillment services

Beijing and Dongguang, China Certifications

• Area 15,200 m² • ISO 9001:2008
• 5 x Assembly lines • ISO 14001:2004
• Production capacity: 8,000 system units/month • ISO 28000:2007
• QC 080000:2012
• OHSAS 18001:2007
• TL 9000:R5.5
• ISO 27001:2013

Contents
About Lanner�������������������������������������������������������������������4

Why Lanner?��������������������������������������������������������������������5

Design and Manufacturing Services����������������������������������6

Desktop Network Appliances �������������������������������������������9

Rackmount Network Appliances�������������������������������������13

Advanced Network Platforms ����������������������������������������24

4 www.lannerinc.com
Why Lanner?
Lanner has the leading technological advantages and long-established manufacturing
processes to service clients with customized solutions for mission-critical applications.
Lanner possesses well-managed manufacturing lines, and is capable of customizing both
hardware and software parts of a platform, including chassis, dimensions, modular/fixed
ports, BIOS, IPMI, acceleration cards, NIC modules, and required certifications.

Strong Allies
Lanner’s membership in industrial-leading alliances enables us to provide the latest
technology, and extend your product lifecycles.

Intel®
Lanner is an Associate Member of the Intel® Network Builders Partner, a community of
SDN/NFV developers, system integrators, OEMs and solution providers committed to the
development of modular, standards-based solutions on Intel® technologies.

AMD®
Advanced Micro Devices, Inc. is an American multinational semiconductor company
that develops computer processors and related technologies for business and consumer
markets.

Marvell® Networks
Lanner’s Network Processing Appliance are built with performance-boosting and low-
powered RISC processors from Marvell® for specified mission-critical applications like IPS,
VPN and virus scanning.

Broadcom®
Broadcom® is a global innovator and leader in semiconductor solutions for wired and
wireless communications. Lanner offer products with processors from Broadcom.
Mellanox Technologies
Mellanox Technologies is a supplier of end-to-end InfiniBand and Ethernet interconnect
solutions and services for data-center servers and storage systems.

Barefoot Networks
Barefoot Networks is a team of visionaries, experienced technologists and engineers
who have created a blueprint for designing and operating the world’s fastest and most
programmable networks.

Infineon Technologies
Infineon Technologies AG, a Germany-based designer, developer and manufacturer
of semiconductors and related system solutions, operates through four segments:
Automotive, Industrial Power Control, Power Management & Multimarket, and Chip Card
& Security.

NXP Semiconductors N.V.

NXP Semiconductors N.V. is the world leader in secure connectivity solutions for embedded
applications. NXP is driving innovation in the secure connected vehicle, end-to-end security
and privacy and smart connected solutions markets.

www.lannerinc.com 5
 Design and Manufacturing Services

Wide Customization Options

Lanner supplies customized hardware solutions
for mission-critical applications with managed
manufacturing process thanks to our in-house
design and manufacturing services.

Advanced Networking Features

• Copper and fiber at 10/25/40/100 GbE Engineered for Reliable Operation
• Future-proof scalability with NIC modules With redundant power sources, hot-swappable
• Advanced LAN bypass fans and LAN bypass, these network appliances will
• Network throughput acceleration continue to support your network even when the
• Hardware-assisted cryptographic engine unexpected occur.
• Built-in hardware security
• Remote manageability The Latest and Fastest Processors
The latest Intel® Xeon®, Core™, Celeron®, Atom™
Best-In-Class Port Density and AMD EPYC™ processors perform network
Lanner has engineered unprecedented port density security functions at optimal throughput while at
for our rackmount network appliances. Utilizing low power. Lanner also designs with Cavium®
our modular or blade technology, each platform and Broadcom® processors to provide RISC based
can be configured to your optimal requirements. network platforms.

Electronic Engineering Mechanical Engineering Software Engineering

Choose from an array of board Lanner’s engineers are well- Implement the necessary BIOS or
and platform level components versed in tackling the multitude of firmware into your platforms with
to create the perfect appliance or design issues faced on the board the help of Lanner’s software team.
solution based on your application and mechanical level including Our software development expertise
requirements. Lanner’s strategic ventilation, peripherals, and more. can create and customize the
partnerships allow us to incorporate Rigorously tested, Lanner products necessary BIOS, firmware, drivers
the latest technology in the industry can withstand a broad range of and API level, to ensure seamless
to provide customers with a richer environmental parameters to communication between hardware
palette of options. guarantee product robustness in an and application software.
array of applications.

66 www.lannerinc.com
www.lannerinc.com
Lanner’s Complete Range of Network Appliances
Lanner possesses a wide range of network appliances including budget desktop firewalls with onboard
processors, and also advanced hybrid appliances with multiple processors, expansion options, and
reassuring redundancy features. Lanner offers both x86 and RISC appliances that can come with a range
of acceleration cards and expansion modules to form the perfect appliance.

Carrier, ISP &

Cloud Computing
400 Gbps

Enterprise
HTCA-6000 Series
100 Gbps

SMB

FW-8800, NCA-6000 Series FX-3810 Series

10 Gbps
NCA-1000 Series

FW-8700, NCA-5000/4000 Series

MR-300 Series FX-3420 Series

NCA-2500, FW-7500 Series

FW-7500 Series

Desktop Appliances Rackmount Appliances Advanced Network Platforms

Prototyping Product Identity Service Manufacturing

During the prototype stage, Lanner Take advantage of Lanner’s Lanner owns and operates its own
can help you with testing guidelines product identify service. Lanner in-house state-of-the-art SMT, DIP,
and BIOS tuning to maximize the can customize the identity of your assembly and testing facilities. By
performance of your appliance. products, everything from industrial maintaining control of the entire
Lanner has a wide range of design of 2D and 3D faceplates to manufacturing process, we ensure
standard appliances that can speed custom packaging and labeling. the integrity of your end product
up your product development and This ensures that your product through our tight production
bring your product to the market accurately promotes your brand procedures, integrated quality
faster. awareness and leaves a lasting assurance programs and rigorous
impression with your customers. design quality.

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 Global Order Fulfillment and RMA

Worldwide Offices and RMA Centers

With our presence in various continents, we are able to serve our clients worldwide.

• St. Petersburg

• Eindhoven
• Tokyo
• Toronto • Beijing
• Fremont • Tel Aviv
• Taipei

• Chennai

A Complete Service
After we have designed and manufactured your products, we install the required software and ship
directly to your customers in your branded packages. Drop shipments can be arranged from our logistics
centers worldwide.

Our service allows you to focus on your core competency of software development for the information
security industry. We take care of the hardware design, manufacturing, logistics and service. That’s our
core competency.

Quality Control Logistics Technical Support

Lanner’s strict and ISO 9001-certified Successful logistics are reinforced by Lanner provides full RMA service and
quality testing procedures have efficient procedures. Lanner clients’ technical support to fulfill customer
been adjusted to comply with orders can be tracked through service. For the systems built with
standards. Also, as part of our green the production process by specific Intel® platforms, we offer up to
management plan, initiated early numbers allowing for routine 7-year lifecycle support. Longer
2006, all Lanner products meet project updates. Order traceability lifecycle support can also be arranged
RoHS certification requirements. can guarantee consistency and by jointly planned inventories.
quality.

8 www.lannerinc.com
 Desktop Network Appliances

NCA-1020 NCA-1515
Intel Braswell CPU with Intel Denverton CPU with
3 GbE RJ45 Ports 6x GbE RJ45, 2x GbE SFP Ports

NCA-1031 NCA-1513 NCA-1510

Intel Apollo Lake CPU with Intel Denverton CPU with Intel Denverton CPU with
6 GbE RJ45 Ports 6 or 4 GbE RJ45 or 4 GbE RJ45, 2 GbE SFP Ports & Fanless Design
4 GbE RJ45 & 2 SFP Ports

Low-footprint Intel CPU Engine Wireless RF Connectivity

To addresses the demand for building efficient Lanner desktop appliances feature Wifi concurrent,
and secured network edge, Lanner adopts the dual LTE, mini-PCIe expansion slots for Wi-Fi/3G/
latest generation of Intel® Atom™ and Celeron® LTE RF modules and external antenna for wireless
processors to supply entry security gateway/UTM/ network connectivity.
SD-WAN/uCPE for SMBs or branch networks.

Fanless Design
Intel QuickAssist Technology
System fans, considered one of the most error-
This hardware-assisted security engine is not
prone components, are removed from appliances
only designed to optimize the cryptographic and
while at the same time allowing heat dissipation
data compression applications, but also reserves
off the top of the corrugated aluminum enclosure.
processor cycles for critical application processing
while improving overall system performance.
Versatile Mounting Kits
Intel Virtualization Technology For mounting flexibility, Lanner desktop
(Intel VT) appliances are compatible with wallmount or
Intel® VT provides hardware assist to the rackmount options for suitable installation in any
virtualization software, reducing its size, cost, environment setting.
and complexity; it is part of Lanner’s value-added
software packages intended for optimizing the
performance, security, agility and manageability.
Intel® Virtualization Technology such as VT-x,
VT-d and SR-IOV are baked into Lanner appliances.
www.lannerinc.com 9
 Desktop
Network
Appliances
Feature Description NCA-1010 NCA-1020 NCA-1031 NCA-1210
Form Factor Fanless Desktop Fanless Desktop Desktop Desktop

Intel® Atom™ E3930/

Intel® Atom™ E3815/E3825 Intel® Celeron® N3010 Intel® Atom™ C2358/C2558
Processor Options Intel® Celeron® N3350
(Bay Trail) (Braswell) (Rangeley)
(Apollo Lake)
Platform CPU Socket onboard onboard onboard onboard

Chipset SoC SoC SoC SoC

Security Acceleration N/A N/A N/A Intel QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

Technology DDR3L 1067 MHz UDIMM DDR3L 1600 MHz UDIMM DDR3L 1866 MHz UDIMM DDR3 1333/1600 MHz UDIMM

System Memory
Max. Capacity 8 GB 8 GB 8 GB 16 GB

Socket 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM

4 x GbE RJ45 Intel® SoC Integrated

Ethernet Ports 3 x GbE RJ45 Intel® i211 3 x RJ45 GbE Intel® i211 6 x GbE RJ45 Intel® i211
i354
Networking
Bypass N/A 1 pair Gen3 2 pairs Gen3 (By SKU) 1 pair Gen3 (By SKU)

NIC Module Slot N/A N/A N/A N/A

I/O Interface N/A N/A N/A N/A

LOM
OPMA Slot N/A N/A N/A N/A

Reset Button 1 (H/W reset only) 1 1 1

LED Power LED on power button Power LED on power button Power/Status/Storage Power/Status/Storage

Power Button 1 1 1 1

Console 1 x RJ45 1 x RJ45 1 x RJ-45 1 x RJ-45

I/O Interface
USB 1 x USB 2.0, 1 x USB 3.0 1 x USB 2.0, 1 x USB 3.0 2 x USB 3.0 2 x USB 2.0

LCD Module N/A N/A N/A N/A

Display 1 x HDMI 1 x HDMI 1 x HDMI N/A

Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack

1 x 2.5” Bay - SSD Only 1 x 2.5” Bay - SSD Only

HDD/SSD Support N/A 1 x 2.5” Bay (Optional)
(By SKU) (Optional)
Storage
Onboard Storage 1 x mSATA mini 1 x mSATA mini 1 x mSATA 1 x SATA DOM

PCIe N/A N/A N/A N/A

Expansion 1 x Mini-PCIe (PCIe-By Project/

mini-PCIe 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 2 x Mini-PCIe (PCIe/USB2.0)
USB2.0)

Watchdog N/A Yes Yes Yes

Internal RTC with Li
Miscellaneous Yes Yes Yes Yes
Battery
TPM Yes Yes (Optional) Yes Yes

Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passisve CPU heatsink
Cooling
System Fanless Fanless 1 x cooling fan or fanless 1 x Cooling Fan or Fanless (By Project)

0~40ºC Operating 0~40ºC Operating 0~40ºC Operating 0~40ºC Operating

Temperature
-20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating
Environmental
Parameters
5~90% Operating 5~90% Operating 5~90% Operating 5~90% Operating
Humidity (RH)
5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating

System (WxHxD) 124 x 19 x 119 mm 137 x 36 x 120 mm 230 x 44 x 170 mm 185 x 44 x 137 mm
Dimensions Weight 0.5 kg 0.5 kg 1.2 kg 1 kg

Package (WxHxD) 335 x 236 x 282 mm 426 x 252 x 282 mm 518 x 264 x 391 mm 312 x 280 x 140 mm
Dimensions Weight 8.5 kg (10 in 1) 8.5 kg (10 in 1) 10 kg (4 in 1) 1.8 kg

Type / Watts 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter
Power
Input AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B RoHS RoHS, CE/FCC Class B

10 www.lannerinc.com
 NCA-1513 NCA-1510 NCA-1515 NCA-1611
Desktop Fanless Desktop Desktop Desktop

Intel® Atom® C3000 (Denverton) Intel® Atom™ C3000 (Denverton) Intel® Atom® C3000 (Denverton) Intel® Xeon® D-1500 (Broadwell-DE NS)

onboard onboard onboard onboard

SoC SoC SoC SoC

Intel® QuickAssist Technology (by SKU) Intel QuickAssist Technology Intel QuickAssist Technology Intel® QuickAssist Technology

AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR4 2133/1866 MHz ECC/Non-ECC SOD- DDR4 2400/2133/1866 MHz ECC/Non-ECC

DDR4 2133 MHz ECC/Non-ECC DIMM DDR4 2133MHz ECC/Non-ECC RDIMM
IMM (By SKU) SODIMM (By SKU)

16 GB 16 GB 32 GB 128 GB

1 x 260-pin SODIMM 1 x 260-pin SODIMM 2 x 260-pin SODIMM 4 x 288-pin DIMM

4 x GbE RJ45 Intel® SoC Integrated MAC 2 x 4 x GbE RJ45 Intel® SoC Integrated MAC 6 x GbE RJ45 Intel® i350-AM4
4 x GbE RJ45 Intel® SoC Integrated MAC
GbE RJ45 Intel® i210AT or i211AT (by SKU 2 x GbE RJ45 Intel® i350 and (by SKU) 2 x SFP Intel® i350-AM4 (By SKU)
2 x GbE RJ45 or SFP Intel® i210 (By SKU)
2x GbE SFP Intel® i210-IS(by SKU) 2 x GbE SFP Intel® i350 (by SKU) 2 x SFP+ SoC Integrated MAC (By SKU)

2 pair Gen3 (By SKU) 1 pair Gen3 (By SKU) 1 pair Gen3 (By SKU) 1 pair Gen3 (By SKU)

N/A N/A N/A N/A

N/A N/A 1 x RJ45 (By SKU) 1 x RJ45

N/A N/A Yes IPMI Onboard (By SKU)

1 1 1 1

Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

1 1 1 1

1 x RJ-45 1 x Mini USB 1 x RJ-45 1 x RJ45

2 x USB 2.0 or 2 x USB 3.0 (by SKU) 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0

N/A N/A N/A N/A

N/A N/A N/A N/A

1 x DC Jack 1 x DC Jack 1 x DC Jack 2 x DC Jack

1 x 2.5” Bay (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay (Optional)

1 x EMMC 8GB 1 x EMMC 8GB 1 x EMMC 8GB 1 x SATADOM (Optional)

N/A N/A N/A N/A

1 x Mini-PCIe (PCIe/USB2.0), 1 x M.2 1 x Mini-PCIe (PCIe) 2 x Mini-PCIe (PCIe/USB2.0)
2 x Mini-PCIe Half Size (PCIe/USB2.0)
2280/2242 (SATA3.0), 1x M.2 3042 (USB3.0), 1 x M.2 (USB2.0/PCIe) 1 x M.2 2242 B Key (USB3.0)
1 x Nano SIM Slot
1 x Nano SIM for M.2 1 x Nano SIM 2 x Nano SIM for M.2
Yes Yes Yes Yes

Yes Yes Yes Yes

Yes Yes Yes Yes

Passisve CPU heatsink Passive CPU heatsink Passive CPU Heatsink Passive CPU heatsink

1 x Cooling Fan w/ Smart Fan Fanless 1 x Cooling Fan w/ Smart Fan 3 x cooling fans

0~50ºC Operating (SKU A/B/C)

0~40ºC Operating 0~40ºC Operating 0~50ºC Operating
0~40ºC Operating (SKU D)
-20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating
-20~70ºC Non-Operating

5~90% Operating 5~90% Operating 5~90% Operating 5~90% Operating

5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating

231 x 200 x 44 mm 231 x 44 x 200 mm 231 x 44 x 200 mm 275 x 44 x 310 mm

1.2 kg 1.2 kg 1.2 kg 3 kg

358 x 135 x 290 mm 325 x 305 x 120 mm 358 x 290 x 135 mm 478 x 359 x 163 mm

2.75 kg 2.2 kg 2.75 kg 5 kg

40W Power Adapter 36W or 60W Power Adapter (By SKU) 36W or 60W Power Adapter (By SKU) 90W Power Adapter (Optional 1+1)

AC 100~240V @50~60Hz, 1.7A AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz

RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

www.lannerinc.com 11
 Desktop Network
Appliances

Feature Description FW-7525 FW-7551SE NCR-1510

Form Factor Fanless Desktop Desktop Fanless Desktop

Intel® Atom™ C2358/C2518/C2558 Intel® Atom™ C2358/C2558/C2758 Intel® Atom™ C3308/C3508/C3708

Processor Options
(Rangeley) (Rangeley) (Denverton)

Platform CPU Socket onboard onboard onboard

Chipset SoC SoC SoC

Security Acceleration Intel® QuickAssist Technology Intel® QuickAssist Technology Intel® QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

Technology DDR3 1333/1600 MHz UDIMM DDR3 1333/1600 MHz ECC DIMM DDR4 2400MHz ECC/Non-ECC

System Memory Max. Capacity 8 GB 16 GB 16 GB

Socket 1 x 204-pin SODIMM 1 or 2 x 204pin SODIMM (By SKU) 2 x 260-pin SODIMM (By SKU)

4 x GbE RJ45 Intel® SoC Integrated MAC,

4 x GbE RJ45 Intel® SoC Integrated i354 6 x GbE RJ45 or 4 x RJ45 & 2 x GbE SFP
Ethernet Ports 2 x GbE RJ45 Intel® i210 (By SKU) or 2 x
2 x GbE RJ45 Intel® i210 (By SKU) (By SKU)
GbE RJ45 Intel® i210 (By SKU)
Networking
Bypass 1 pair Gen2 (By SKU) N/A 1 pair Gen3

NIC Module Slot N/A N/A N/A

I/O Interface N/A N/A N/A

LOM
OPMA Slot N/A N/A N/A

Reset button 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 1 1

Console 1 x RJ45 1 x RJ45 1 x Mini USB

I/O Interface
USB 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0 (By SKU)

LCD Module N/A N/A N/A

Display N/A N/A N/A

Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack

HDD/SSD Support 1 x 2.5” Bay - SSD Only (By SKU/Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay (Optional)
Storage
Onboard Storage 1 x Type II CF / 1 x mSATA 1 x M.2 2242, 1 x SATA 1 x M.2 2242, 1 x SATA III

PCIe N/A N/A N/A

Expansion
mini-PCIe 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0)

Watchdog Yes Yes Yes

Internal RTC with

Miscellaneous Yes Yes Yes
Li Battery

TPM Yes (By SKU) / Yes Yes Yes

Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
Cooling
System Fanless 1 x cooling fan with smart fan Fanless

-40~70ºC Operating (SKU A/B)

0~40ºC Operating 0~40ºC Operating
Temperature -40~60ºC Operating (SKU C)
-20~70ºC Non-Operating -20~70ºC Non-Operating
-40~85ºC Non-Operating
Environmental
Parameters
5~90% Operating 5~90% Operating 5~90% Operating
Humidity (RH)
5~95% Non-Operating 5~95% Non-Operating 5~95%, Non-Operating

System (WxHxD) 177 x 44 x 146 mm 231 x 44 x 200 mm 310 x 44 x 240 mm

Dimensions Weight 1.5 kg 1.2 kg TBD

Package (WxHxD) 270 x 250 x 120 mm 325 x 305 x 120 mm TBD

Dimensions Weight 2 kg 2.2 kg TBD

Type / Watts 36W or 60W Power dapter (By SKU) 36W or 60W Power Adapter 60W Power Adapter
Power
Input AC 100~240V @50~60 Hz AC 100~240V @50~60 Hz 9~54 VDC

Approvals and Compliance RoHS, CE/FCC Class B, UL TBD RoHS, CE/FCC Class A

12 www.lannerinc.com
 Rackmount Network Appliances

NCA-2510/NCA-2512 NCA-5710
Intel® Denverton CPU Intel® Skylake-SP/Cascade Lake-SP CPU
5 GbE RJ45 + 4 SFP+, 1 NIC Slot, 2 PSUs (NCA-2512) Onboard IPMI Chip, 4 10G SFP+, 4 NIC Slots

NCA-4010/NCA-4012
Intel® Broadwell-DE CPU
NCA-6210
Intel® Skylake-SP/Cascade Lake-SP CPU
16 GbE RJ45 + 2 SFP, 1 NIC Slot, 2 PSUs (NCA-4012)
8 NIC Slots + 20 288-pin DIMM

• Support Intel Xeon/Core CPUs • IPMI • Redundant Power • Modular Fans

Intel® Core™ and Xeon® CPU AMD EPYC™ 7000/3000 Series CPU
Lanner rackmount appliances feature the latest server-grade With the flexibility to choose from 8 to 32 cores, AMD
Intel® Core™ and Xeon® CPUs optimized to offer high EPYC™ enables you to deploy the right hardware platforms
throughputs and function as next-gen firewalls deployed in to meet your workload needs from virtualized infrastructure
the enterprise network and cloud infrastructures. to large-scale big-data and analytics platforms and legacy
line-of-business applications.
Scalable Modules and Cards
Scale the performance and throughputs up for your IPMI Remote Manageability
network appliances with over 20 different copper, fiber Lanner provides SSL encrypted IPMI add-on card and custom
bypass Ethernet modules including 1/10/40/50/100GbE LAN SDK to remotely configure, monitor, reboot and shut down
options, and also the add-on accelerator cards providing your appliances.
high performance tunneling and encryption.
Data Plane Development Kit (DPDK)
High Availability Design Lanner appliances support Intel DPDK that manages
To ensure the 24/7 non-stop network operation, Lanner communication workload consolidation to accelerate
appliances support high availability design including dual network packet processing performance by 3 to 4 times.
management ports, hot-swappable cooling fans and
redundant power supplies. Intel Virtualization Technology
Lanner appliances come with Intel® VT (VT-x, VT-d and
Trusted Platform Module SR-IOV) built in, providing hardware assist to the virtualization
Our appliances support Trusted Platform Module (TPM) that software, reducing its size, cost, and complexity and
provides the integrated cryptographic keys and secure boot optimizing performance, security, agility and manageability.
to protect the hardware from unauthorized accesses.

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 Rackmount Network
Appliances

Feature Description NCA-2510/NCA-2512 NCA-4010/NCA-4012

Form Factor 1U 19” Rackmount 1U 19” Rackmount

Processor Options Intel® Atom™ C3000, 8~16 Cores (Denverton) Intel® Xeon® D-1500 4~16 Cores (Broadwell-DE)

CPU Socket onboard onboard

Platform
Chipset SoC SoC

Security Acceleration Intel® QuickAssist Technology N/A

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR4 2400MHz DDR4 2400MHz

Technology
ECC or non-ECC UDIMM REG, ECC or non-ECC UDIMM
System Memory
Max. Capacity 32GB R-DIMM: 64GB / ECC:32GB

Socket 4 x 288pin DIMM 2 x 288pin DIMM

1 x GbE RJ45 Intel® i210 8 x GbE RJ45 Intel® i210

Ethernet Ports 4 x GbE RJ-45 Intel® i350-AM4 8 x GbE RJ45 Intel® i350-AM4 (By SKU)
4 SFP+ Intel® Denverton Integrated (By SKU) 2 x 10G SFP+ Broadwell-DE SOC (By SKU)
Networking
Bypass 2 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU)

NIC Module Slot 1 1

I/O Interface 1 x RJ45 (By SKU) 1 x RJ45 (By Project) *Share with ETH0
LOM
OPMA Slot Yes (By SKU) Yes (By SKU)

Reset Button 1 1

LED Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45

I/O Interface
USB 2 x USB 3.0 / 2 x USB 2.0 2 x USB 2.0

LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Display From OPMA slot (Optional) From OPMA slot (By Project)

Power Input AC power inlet on PSU AC power inlet on PSU

HDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays

Storage
Onboard Storage 1 x mSATA 1 x mSATA

PCIe 1 x PCI-E*8 HH/HL (Optional) 1 x PCI-E*8 FH/HL (Optional)

Expansion
mini-PCIe N/A N/A

Watchdog Yes Yes

Miscellaneous Internal RTC with Li Battery Yes Yes

TPM Yes (optional) Yes (optional)

Processor Passive CPU heatsink Passive CPU heatsink

Cooling
System 2 x cooling fans with smart fan 2 x cooling fans with smart fan

0~40ºC Operating 0~40ºC Operating

Temperature
-20~70ºC Non-Operating -20~70ºC Non-Operating
Environmental
Parameters 5~90% Operating 5~90% Operating
Humidity (RH)
5~95% Non-Operating 5~95% Non-Operating

(WxDxH) 438 x 321 x 44 mm / 438 x 431 x 44 mm 438 x 321 x 44 mm / 438 x 431 x 44 mm

System
Dimensions Weight 7 kg 7.5 kg

(WxDxH) 540 x 500 x 230 mm / 582 x 548 x 182 mm 540 x 500 x 230 mm / 582 x 548 x 182 mm
Package
Dimensions Weight 8 kg 8.5 kg

Type / Watts 220W ATX Single PSU/300W Redundant PSU 220W ATX Single PSU/300W Redundant PSU
Power
Input AC 90~264V @47~63Hz AC 90~264V @47~63Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

14 www.lannerinc.com
 NCA-4020 NCA-4210 NCA-4220
1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

The 6/7th Intel® Core™ i7/i5/i3 or Pentium® or Celeron®

Intel® Xeon® D2100 8~16 Cores (Skylake-DE) Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Coffee Lake)
(Skylake/Kaby Lake)

1 x FCPGA 1 x LGA1151 1 x LGA1151

N/A Intel® H110 or C236 Intel® H310/Q370/C246

Intel® QuickAssist Technology N/A N/A

AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR4 2400MHz DDR4 2666MHz ECC(By CPU for C246 only) or

DDR4 2666MHz REG DIMM
ECC(By CPU for C236 only) or non-ECC UDIMM Non-ECC UDIMM

128GB 32GB 32GB

4 x 288-pin DIMM 2 x 288pin DIMM 2 x 288pin DIMM

6 x GbE RJ45 Intel® i210

10 x GbE RJ45 with 8 x Port PoE+ and 4 x SFP+ (SKU A/B)
2 x GbE SFP Intel® i210-IS (SKU B/C) 8 x GbE RJ45 Intel® i210
10 x GbE RJ45 with 4 x Port PoE+ and 4 x SFP+ (SKU C/D)
8 x GbE RJ45 Intel® i210 (SKU C)

N/A 2 pairs Gen3 (By SKU) up to 3 pairs Gen3 (By SKU)

N/A 1 1

1 x RJ45 1 x RJ45 (Optional) *Share with ETH0 -

IPMI Onboard Yes -

1 1 1

Power/Status/Storage Power/Status/Storage Power/Status/Storage

1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

1 x RJ45 1 x RJ45 1 x RJ45

2 x USB 2.0 2 x USB 3.0 2 x USB 3.0

N/A 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Internal Pin Header From OPMA slot (Optional) HDMI (Optional)

AC Power Inlet on PSU AC power inlet on PSU AC power inlet on PSU

2 x 2.5” Internal 2 x 2.5” bays 2 x 2.5” bays

2 x M.2 (w/ LTE Support) 1 x mSATA 1 x M.2

1 x PCI-E*8 FH/HL (Optional) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 (Default), 2 x PCI-E*4 (Optional)

1 x Mini-PCIe (PCIe*1/USB2.0) N/A 1 x Mini-PCIe

Yes Yes Yes

Yes Yes Yes

Yes (optional) Yes (optional) Yes (optional)

Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

3 x cooling fans with smart fan 2 x cooling fans with smart fan 2 x cooling fans with smart fan

0~40ºC Operating 0~40ºC Operating 0~40ºC Operating

-40~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating

5~90% Operating 5~90% Operating 5~90% Operating

5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating

438 x 468 x 44 mm 438 x 321 x 44 mm 438 x 321 x 44 mm

7.9 kg 7.5 kg 7.5 kg

739 x 582 x 215 mm 540 x 500 x 230 mm 540 x 500 x 230 mm

13.6 kg 8.5 kg 8.5 kg

600W 1+1 ATX Redundant PSUs 220W ATX Single PSU 220W ATX Single PSU

AC 100~240V @47~63Hz AC 90~264V @47~63Hz AC 90~264V @47~63 Hz

RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

www.lannerinc.com 15
 Rackmount Network
Appliances

Feature Description NCA-5210 NCA-4112

Form Factor 1U 19” Rackmount 1U 19” Rackmount

Intel® Xeon® E3-1200v5/v6 or the 6/7th Core™ i7/i5/i3 or

Processor Options AMD EPYC™ 3000 Series 4~8 Cores
Pentium® or Celeron® (Skylake/Kaby Lake)

CPU Socket 1 x LGA1151 onboard

Platform
Chipset Intel® C236 SoC

Security Acceleration N/A 10Gbps Encryption + 10Gbps Decryption

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR4 2400MHz
Technology DDR4 2666 MHz ECC/U/R DIMM
ECC(By CPU) or non-ECC UDIMM
System Memory Max. Capacity 64GB 128GB

Socket 4 x 288pin DIMM 4 x 288-pin DIMM

1 x GbE RJ45 Intel® i210 / 8 x GbE RJ45 Intel® i210 (SKU A)

12 x GbE RJ45 Intel® i350-AM4 + 4 x GbE SFP Intel® i350-AM4 8 x GbE RJ45 Intel® i350-AM4
Ethernet Ports
(SKU B) 2 x 10G SFP+
Networking 4 NIC modules (SKU C)

Bypass up to 6 pairs Gen3 (By SKU) 3 x Pairs of Gen3

NIC Module Slot 2 or 4 (By SKU) 1 (for 1 x PCIe*8 or 2 x PCIe*4)

I/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 *Share with ETH0
LOM
OPMA Slot Yes Yes

Reset Button 1 1

LED Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power Switch

Console 1 x RJ45 1 x RJ45

I/O Interface
USB 2 x USB 3.0 2 x USB 3.0

LCD Module 2x20 character LCM 4 x keypads 1 x LCM, 4 x Keypads

Display From OPMA slot (Optional) From OPMA Slot for VGA (Optional)

Power Input AC power inlet on PSU AC Power Inlet on PSU

HDD/SSD Support 2 x 2.5” bays 2 x 2.5” Bays

Storage

Onboard Storage 1 x mSATA 1 x M.2 2242, 1 x Mini-PCIe

PCIe 1 x PCI-E*8 FH/HL (By Project) 1 x PCIe*2 (Optional)

Expansion
mini-PCIe / NVME N/A 1 x Mini PCIe (for Wifi)

Watchdog Yes Yes

Miscellaneous Internal RTC with Li Battery Yes Yes

TPM Yes (optional) TPM 1.2/2.0

Processor Passive CPU heatsink Passive CPU Heatsink

Cooling
System 4 x cooling fans with smart fan 2 x Cooling Fans w/ Smart Fan

0~40ºC Operating 0~40ºC Operating

Temperature
-20~70ºC Non-Operating -20~70ºC Non-Operating
Environmental
Parameters
5~90% Operating 5~90% Operating
Humidity (RH)
5~95% Non-Operating 5~95% Non-Operating

(WxDxH) 438 x 525 x 44 mm 438 x 431 x 44 mm

System
Dimensions Weight 15 kg TBD

(WxDxH) 790 x 600 x 220 mm 582 x 548 x 182 mm

Package
Dimensions Weight 16 kg TBD

Type / Watts 300W 1+1 ATX Redundant PSUs Redundant 300W Power Adapter
Power
Input AC 90~264V @47~63 Hz 100~240VAC,50~60Hz, 5~3A

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE, FCC, UL

16 www.lannerinc.com
 NCA-6110 NCA-5220 NCA-5520
2U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

Intel® Xeon® Processor Scalable Family

AMD EPYC™ 7000 Series (Up to 32C64T) Intel® Xeon® E-2100 Processor (Coffee Lake)
(Skylake-SP/Cascade Lake-SP)

2 x SP3r1 1 x LGA1151 1 x LGA3647

N/A Intel® C246 Intel® C621/626

40Gbps Encryption + 40Gbps Decryption N/A Intel® QuickAssist Technology (By SKU)

AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR4 2666MHz ECC REG DIMM DDR4 2666 MHz ECC (By CPU) or Non-ECC UDIMM DDR4 2666MHz REG DIMM

512GB 64GB 384GB

16 x 288-pin DIMM 4 x 288-pin DIMM 12 x 288pin DIMM

2x Gbe RJ45 for Dual MGMT Intel® i210

8x Gbe RJ45 Intel® i210(SKU A) 4 x GbE RJ45 or
2 x GbE RJ45 Intel® i210
4x Gbe RJ45 Intel® i350-AM4 (SKU A) 4 x 10G SFP+ Lewisburg Internal MAC
4x SFP LAN Ports (By Project)

N/A Up to 3 Pairs of Gen3 Bypass (By SKU) Depends on NIC Module Specifications

4 2 4

1 x RJ45 (By SKU) 1 x RJ45 (Optional) 1 x RJ45 (Optional)

Yes Yes N/A, IPMI Chip Onboard

1 1 1

Power/Status/Storage Power/Status/Storage Power/Status/Storage

1 x ATX Power Switch 1 x ATX Power Switch 1 x ATX Power switch

1 x RJ45 1 x RJ45 1 x RJ45, 1 x Mini USB

2 x USB 2.0 2 x USB 3.0 2 x USB 3.0

N/A (Optional) 4 x Keypads, 2x16 Character LCM N/A (Optional)

1 x VGA (Optional) From OPMA Slot (Optional) Internal Pin Header

AC Power Inlet on PSU AC Power Inlet on PSU AC power inlet on PSU

4 x 3.5” Swappable Bays 2 x 2.5” Bays 2 x 2.5” Internal

1 x mSATA (M.2 By Project) 1 x M.2 2242, B+M Key (Optional) 1 x mSATA

2x PCIe*8 FH or 1x PCIe*16 FH 2 x PCIe*4 FH/HL (Optional) 1 x PCI-E*16 FH/HL (Optional)

N/A / Max. 1TB N/A N/A

Yes Yes Yes

Yes Yes Yes

Yes (Optional) Yes (optional) Yes (Optional)

Passive CPU Heatsink Passive CPU heatsink Passive CPU heatsink

4 x Individual Hot-swappable Cooling Fans Default x 2, Reserved x 1 Cooling Fans with Smart Fan 4 x Individual Hot-swappable cooling fans with smart fan

0~40ºC Operating 0~40ºC Operating 0~40ºC Operating

-20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating

5~90% Operating 5~90% Operating 5~90% Operating

5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating

438 x 647 x 89 mm 438 x 468 x 44 mm 438 x 650 x 43.5 mm

24 kg 7.1kg 16.5 kg

825 x 600 x 270 mm 739 x 582 x 215 mm 790 x 600 x 220 mm

26 kg 13kg 18kg

800W 1+1 ATX Redundant PSUs 300W 1+1 ATX Redundant PSUs TBD

AC 100V~240V @47~63Hz AC 90V~264V @47~63Hz AC 100~240V @47~63Hz

RoHS, CE, FCC, UL RoHS, CE/FCC Class A, UL TBD

www.lannerinc.com 17
 Rackmount Network
Appliances

Feature Description NCA-5710 NCA-6210 FW-7573/FW-7571

Form Factor 1U 19” Rackmount 2U 19” Rackmount 1U 19” Rackmount

Intel® Xeon® Processor Scalable Family Intel® Xeon® Processor Scalable Family Intel® Atom™ C2758/C2518 (Rangeley) /
Processor Options
(Skylake-SP/Cascade Lake-SP) (Skylake-SP/Cascade Lake-SP) Intel® Atom™ C2358 (Rangeley)

Platform CPU Socket 2 x LGA3647 2 x LGA3647 onboard

Chipset Intel® C621/627 Intel® C621/627 SoC

Security Acceleration Intel® QuickAssist Technology (By SKU) Intel® QuickAssist Technology (By SKU) Intel® QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

DDR3 1333/1600MHz ECC or non-ECC

Technology DDR4 2666MHz REG DIMM DDR4 2666MHz REG DIMM
UDIMM
System
Memory Max. Capacity 384GB 640GB 16GB/8GB

Socket 12 x 288pin DIMM 20 x 288pin DIMM 2 x 240pin DIMM

1 or 2 x GbE RJ45 Intel® i210 (By SKU)

4 x GbE RJ45 Intel® SoC Integrated i354
Ethernet Ports 4 x 10G SFP+ Lewisburg Internal MAC 2 x 10G SFP+ Lewisburg Internal MAC (By
2 x GbE RJ45 Intel® i210 (By SKU)
SKU)
Networking
Bypass Depends on NIC Module Specifications Depends on NIC Module Specifications 3 pairs Gen3 (By SKU)/2 pairs Gen3 (By SKU)

NIC Module Slot 4 8 1/N/A

I/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (By SKU) N/A
LOM
OPMA Slot IPMI Chip Onboard (SKU B & C) IPMI Onboard (SKU C & D) N/A

Reset Button 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45, 1 x Mini USB 1 x RJ45, 1 x Mini USB (By SKU) 1 x RJ45
I/O Interface
USB 2 x USB 3.0 2 x USB 3.0 2 x USB 2.0

LCD Module N/A (Optional) N/A (Optional) 2x20 character LCM 4 x keypads/N/A

Display Internal Pin Header 1 x VGA (Optional) N/A

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

2 x 3.5” Swappable (with Support for 2 x 2 x 2.5” Bays/2 x 2.5” Bays or 1x 3.5”
HDD/SSD Support 2 x 2.5” Internal
Storage 2.5”) (Optional)

Onboard Storage 1 x M.2 1 x mSATA (M.2 By Project) 1 x Type II CF

PCIe 1 x PCI-E*16 FH/HL (Optional) 1 x PCI-E*16 FH/HL (Optional) 1 x PCI-E*8 FH/HL (optional)
Expansion
mini-PCIe N/A N/A N/A

Watchdog Yes Yes Yes

Miscellaneous Internal RTC with Li Battery Yes Yes Yes

TPM Yes (Optional) Yes (Optional) Yes (By SKU)/Yes (By Project)

Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

Cooling 6 x Individual Hot-swappable cooling fans 4 x Individual Hot-swappable cooling fan

System 1 x cooling fan with smart fan
with smart fan with smart fan

0~40ºC Operating 0~40ºC Operating 0~40ºC Operating

Temperature
-20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating
Environmental
Parameters
5~90% Operating 5~90% Operating 5~90% Operating
Humidity (RH)
5~95% Non-Operating 5~95% Non-Operating 5~95% Non-Operating

System (WxDxH) 438 x 610 x 44 mm 438 x 600 x 88 mm 431 x 305 x 44 mm

Dimensions Weight 24 kg 24 kg 6.5 kg/6 kg

Package (WxDxH) 790 x 600 x 220 mm 825 x 600 x 270 mm 540 x 510 x 215 mm
Dimensions Weight 18 kg 26 kg 7.5 kg/7 kg

Type / Watts 650W 1+1 ATX Redundant PSUs 800W 1+1 ATX Redundant PSUs 150W ATX Single PSU/100W ATX Single PSU
Power
Input AC 100~240V @47~63Hz AC 100~240V @47~63Hz AC 100~240V @50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS RoHS, CE/FCC Class A, UL

18 www.lannerinc.com
 NIC Modules

Enhance the performance and bandwidth of your network appliances with Lanner’s new swappable network
modules. These modules enable higher packet processing for network appliances in applications such as DPI,
IPS/IDS and WAN optimization.

Processor and Performance

Model Name Ports Chipset Bypass
Choose from a wide selection of network modules
GbE RJ45 Modules powered by Intel’s latest CPU/chipset technologies,
NCS2-IGM806A 8 i350-AM4 4 Pairs Gen3 which include Intel® X540/XL710, Fortville XXV710,
FM10420 multi-host Ethernet controller and more.
NCS2-IGM806B 8 i350-AM4 N/A

GbE SFP Modules

Wide Compatibility and Scalability
NCS2-ISM405A 4 i350-AM4 Fiber Bypass Lanner offers wide compatibility and scalability
NCS2-ISM802A 8 i350-AM4 N/A with our custom modular design. Our modules are
certified with endurance and compatibility tests and
10G RJ45 Modules
are compatible with our existing and future network
NCS2-ITM202 2 X540 N/A
appliances.
NCS2-ITM401 4 X710-AM2 N/A

10G Fiber Modules

Module Customizations
Choose from 20+ Ethernet network modules, including
NCS2-IXM205A 2 82599ES 1 Pair Gen3
RJ-45, fiber, bypass and transmission rates from 1GbE,
NCS2-IXM407 4 XL710-AM2 N/A
10GbE, 25GbE, 40GbE to even 100GbE. Lanner also
25G Modules has PCI-E expansion modules for data storage, Wi-Fi
NCS2-IVM201 2 XXV710 N/A
connectivity, video transcoding and more.

40G Modules
Time to Market
NCS2-IQM201 2 XL710-AM2 N/A
Aiming to accelerate your time-to-market development,
100G Modules Lanner customizes our standard models based on your
NC2S-RRC01 2 FM10420 N/A
specific, mission-critical applications.

NC2S-MXH01 2 ConnectX-4 N/A

www.lannerinc.com 19
 Lanner F.A.S.T. Solutions
Design and customize your appliances for today’s dynamic network environments with the all-new F.A.S.T.
Solutions. These Flexible, Adaptable, Scalable and Transformable multi-purpose solutions are compatible
with Lanner appliances and are developed for unleashing, expanding and accelerating networking appliances’
connectivity, storage, video transcoding and Open Compute capabilities.

Connectivity Modules
Lanner offer wide selections of NIC modules that support 1/10/40/100GbE with copper and fiber interface,
as well as PoE or TAP ready design.

100Gbps NIC Module - NC2S-RRC01A

• Intel RRC FM10420 controller
• 2 x 100GbE QSFP28 cages

2-port Network TAP Module - NCS2-TAPG201A

• Intel Ethernet controller
• 2 x GbE RJ45 network TAP ports

4-port PoE NIC Module - NCS2-POEIG402A / NCS2-POEIG801A

(Power over Ethernet) module
• Intel Ethernet controller • IEEE 802.3af/at compliant
• 4/8 x PoE RJ45 ports, 30W per module

RF Carrier Module - NCS2-MINIPCIE01

• 2 x MPCIE slots • 2 x SIM card readers
• PCIE/USB signal • 3 x Antennas

RF Carrier Module - NCS2-MINIPCIE02

• 1 x MPCIE slot (PCIE) • 1 x MPCIE slot (PCIE/USB)
• 1 x m.2 B key (USB) • 2 x SIM card readers
• 4 x Antennas

Swappable 4G/LTE Radio Modem Module - PGN-600/PGN-300

• Sierra Wireless EM7511/EM7455 • CAT-12/ CAT-6
• AT&T/Verizon Pre-certified • 2x SIM, 2x 4G LTE Antenna
• PTCRB/FirstNet™/CBRS Pre-certified

20 www.lannerinc.com
 Expandable Design

Storage Modules
The new swappable storage modules support mainstream standard storage devices, including 2.5” SSD/HDD,
3.5” HDD, and future-proof NVMe SSD drive.

NCS2-25TRAY201 N3S-35TRAY201
• Single NCS2 Form Factor • Tri NCS2 Form Factor
• 2x 2.5” Swappable Tray • 2x 3.5” Swappable Tray

NCS2-NVMEM2201
• NCS2 Form Factor
• 2x M.2 Connector
(Length 2280 & 22110)

PCI-Express Expansion Modules

To meet the diverse requirement in open-compute projects, Lanner offer PCIe expansion modules compatible
with acceleration cards for GPU, network performance and flow processing.

PCIe Carrier Module - N2S-PCIE16X1

• Double NCS2 NIC Module Slot
• Support for 1 x PCIe x16 Full Height, Half-length Card, such as GPU
Card, Storage, Network Acceleration Card or Flow Processing Card

PCIe Carrier Module - N2S-PCIE8X2

• Double NCS2 NIC Module Slot
• Support for 2 x PCIe x8 Full Height, Half-length Card, such as GPU
Card, Storage, Network Acceleration Card or Flow Processing Card

Video Transcoding Modules

Lanner provides front-facing, easily swappable video transcoding modules that transport high quality
streaming and bandwidth-hungry video content.

4K Video Transcoding Module - NCS2-VT02A

• Video transport NIC module for Lanner network appliances
• Onboard Intel® Xeon® E3-1565L v5 CPU with C236 chipset
• Support 4K Ultra-HD resolution and H.265 compression
• Built-in Intel® Iris Pro Graphics GT4e

www.lannerinc.com 21
 Security Package

Security Inside Out

Lanner can be counted on for offering hardware solutions built with the most advanced hardware-based
and hardware-assisted security measures and enhancements. These added benefits and values include
hardware security (i.e. TPM), security acceleration (i.e. Intel® QAT), BIOS security (i.e. BootGuard), Intel®
SGX, ISO 27001:2013, secure BMC and more.

Security Acceleration
Intel QAT
Marvell Nitrox Security Processor
Hardware Security AMD Crypto Co-Processor
Mellanox Innova™ IPsec
FIPS Compliant
Kensington Lock BIOS Security
Intrusion Detection
TPM 2.0 BootGuard
Secure Boot
Secure Flash

Security Enhancement
Intel SGX Secure BMC
Intel SECL-DC
Secure Access Control
Intel SDO
AMD SME
ISO 27001:2013 Enhanced 2048-bit SSL

AMD SEV
Certified
Information Security
Management

22 www.lannerinc.com
Hyper Converged Network Platforms

Compute+Switch+Storage, All-In-One Single Appliance

Nowadays, network operators have faced unprecedented challenges from the growth in data traffic and
the increased service demands. To expand their bandwidth in the competitive environment without a
great extent of additional CAPEX and OPEX, the next-gen hyper-converged infrastructure is anticipated
to evolve into a carrier-grade, hyperscale network platform, offering faster, more agile and more reliable
mission-critical applications.

Responding to today’s networking demands, Lanner is introducing hyper-converged network platforms

aiming at delivering multi-node compute, high-speed 100G switching and massive storage in one single
appliance, offering highly available service agility and economics in edge cloud, CORD and managed
service providers.

Compute Networking Storage

Multi-node CPU Blades Top-of-Rack Switch Up to 16x HDD Bays
Each Blade with 2x 100G+ Network Blades Support RAID 0,
Intel® Xeon® E5 CPU Advanced LAN Bypass RAID 1, RAID 5

Deployment
Cases
vADC SD-Stroage vCGNAT MEC NFV DPI Cloud RAN

Moible Edge Computing vBNG vRouter

MEC servers deployed at edge cloud for ultra Customizable and scalable advanced network
low latency, high bandwidth content delivery platforms for vRouter and vBNG

SD-Storage/Enterprise VDI Carrier-grade NFVI

Converged platforms with multi-node compute and NFV-I ready NGFW for high availability DPI,
storage bays in one single appliance sandboxing and network behavior analysis

www.lannerinc.com 23
 Advanced Network Platforms

HTCA-6600 Architecture

Middle Plane
High Availability Validation
- Hot plug & hot-swap NEBS and FIPS compliance
Storage - Redundant PSU & fans
SATA HDD bay for - Rich IPMI manageability
each MB blade
Multiple Computing Blades
Multicore computing capability with
dual Intel® Xeon® CPUs for each blade

Control Panel

x6

Fully Modular Design

A wide range of computing and
networking blades available Switching Capacity
- Packet load balancing
- Blade communications
x2
x4

Multiple Computing Blades Full Redundancy and High Availability

Offering extreme performance and processing All CPU blade, network I/O blades, N+1 cooling
power, Lanner’s advanced network appliances fans and power supply units are in full-redundancy
can host up to 6 CPU blades, supporting up to 12 design to ensure carrier-grade high-availability
Intel® Xeon® processor Gold 6252N CPUs with and 99.9999% uptimes.
a total of 144 cores.
NEBS and FIPS Compliance
Fully Modular Network I/O Blades Lanner appliances are compliant with NEBS/FIBS
Lanner’s advanced network appliances feature up design to meet the key carrier-grade requirements
to 6 front-cabling, swappable network I/O blades. required for telecom network.
The top 2 blade slots are reserved for switch or
Ethernet NI blades, while the other 4 slots are PCI-Express and Storage Options
solely used for Ethernet NI blades. To meet the requirements for open compute
architecture, Lanner appliances can support up to
High-speed Switching Capacity six 3.5” HDD/SSD storage drives and 6 PCIe slots
To meet the requirement of carrier-grade for expansion with acceleration cards.
network traffic, Lanner leverages the latest
packet processors to offer 100GbE high speed
throughputs with capacity up to 3.2Tbps.

24 www.lannerinc.com
Networking I/O Blades
The rising adoption of SDN and NFV in telecommunication industry has driven the demands for
consolidated and integrated hardware architectures for networking purposes, including servers, switches
and routers. The software approaches are favored by telecommunication sectors as SDN and NFV help
reduce implementations of proprietary hardware equipments. By leveraging the benefits of SDN and NFV,
carriers are gaining lower TCO, higher efficiencies and increased flexibility in network managements.

In order to enhance scalability of the HybridTCA appliances above, Lanner also announces its latest HTCA-
compatible and swappable HLM-series carrier-grade blades lineup that provides enhanced redundancy,
interoperability, flexibility, bandwidth and performance boosts.

Blades Picture Features/Ports Chipset

Intel Skylake-SP/Cascade Lake-SP Dual sockets

HMB-6100 Intel C621/C627 PCH (by SKU)
(up to 28C/56T,165W)

Intel Haswell-EP/Broadwell-EP Dual sockets

HMB-1000 Intel C612 PCH
(up 22C/44T 145W)

HLM-1001 32 port 10GbE SFP+ Intel XL710

720G Bandwidth Fabric

HLM-1004 Interface Switch Broadcom BCM56854
16x 10G SFP+ + 4x 10G CU

HLM-1020 2 port 100GbE CXP + 20 10GbE SFP+ BCM56860

2.0T Bandwidth Fabric

HLM-1021 Interface Switch Broadcom BCM56873(Trident 3)
2 x 100G QSFP28,16x 25G SFP28

6 100GbE QSFP28
HLM-1030 4 40GbE QSFP+ BCM56960
16 10GbE SFP+

The Compute, I/O blades or NIC modules shown in this material are not designed to operate independently without a compatible Lanner appliance. Please make sure a
compatible Lanner appliance is in place before purchasing the modules.

HTCA-6400
www.lannerinc.com 25
 Advanced Network
Platforms

Feature Description FX-3420 FX-3810 HTCA-6200A

Form Factor 2U 19” Rackmount 3U Rackmount 2U Rackmount

Intel® Xeon® Processor Scalable Family Intel® Xeon® processor E5-2600 v3/v4
Processor Options Depends on compute blade specification
(Skylake-SP/Cascade Lake-SP up to 205) (Haswell-EP/Broadwell-EP)
Platform
Chipset Intel C612 Intel C612 Depends on compute blade specification

OS Support Linux Kernel 2.6 or above Linux Kernel 2.6 or above, Linux Kernel 2.6 or above

Technology DDR4 2933 MHz REG DIMM DDR4 2400 MHz REG DIMM Depends on compute blade specification
System
Max. Capacity 768GB 256 GB Depends on compute blade specification
Memory
Socket 24x 288-pin DIMM 8 x 288-pin DIMM Depends on compute blade specification

Front: 12x 3.5” HDD SATA 6G /SAS 12G

HDD Bays or 12x 2.5” NVME 2 x 2.5” Swappable HDD drive bays 2 x 2.5” Swappable HDD drive bays
Storage Back: 2 x 2.5” SATA 6G

CF/SD N/A 1 x mSATA connector Depends on compute blade specification

4 x 10G SFP+ 2x RJ-45 with LED for IPMI / Management Blade 1~2: Switch Fabric Blade or
Ethernet Ports
6 x GbE RJ45 port, 1x RJ45 for console port Ethernet I/O Blade

Bypass N/A N/A N/A

Depends on blade specification (HLM

Networking Controllers i350 / XL710 1 x Intel i210
series)

NIC Module Slot / Blade N/A N/A 2 x Blades

IPMI IPMI Chip Onboard 1 x IPMI port 1 x onboard IPMI ports

Management Port N/A 1 x Management port 1 x Management port

Reset Button Yes Yes Yes

I/O Interface Console 1 x DB9 1 x RJ-45 1 x RJ-45

USB 2 x USB 2.0, 2 x USB 3.0 1 x USB 3.0 1 x USB 2.0

2x PCI-E*16 FH/FL + 1x PCI-E*8 HH/HL 2* PCI-E Gen 3 x 8 Removable slots

PCIe N/A
M.2 PCI-e SSD 4* PCI-E Gen 3 x 16 Removable slots
Expansion
PCI N/A N/A N/A

Processor Passive CPU Heatsink CPU heatsink with fan duct CPU heatsink with fan duct
Cooling
6x individual hot-swappable cooling
System 8 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B
fans with smart fan

0~40ºC Operating 0~40ºC Operating

Temperature 0~40ºC / -20~70ºC
-20~70ºC Non-Operating -20~70ºC Non-Operating
Environmental
Parameters
5~90% non condensing / 5 ~ 90% Operating 5 ~ 90% Operating
Humidity (RH)
5~95%, non condensing 5 ~ 95% Non-Operating 5 ~ 95% Non-Operating

LCD Module N/A LCM, 2 x 20 characters 2 x 20 characters

Miscellaneous Watchdog Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes

Dimensions (WxHxD) 445 x 88 x 785 mm 438 x 132 x 609 mm 438 x 88 x 685 mm

Dimensions
Weight TBD 35 kg 26 kg

AC 1100 watt 1+1 Redundant /each AC 1200 watt N+1 Redundant /each
Watts / Type 1200W 1+1 Redundant PSU DC 1100 watt 1+1 Redundant /each DC 1010 watt N+1 Redundant /each
Power PM bus support PM bus support

AC 90~264V @ 50~60Hz AC 85 ~ 264 V

Input AC 100V~240V @47~63Hz
DC -36 ~ -72V DC -36V ~ -72V

CE Class A, FCC Class A, RoHS, NEBS

Approvals & Compliance CE/FCC Class A RoHS compliance
design compliance

26 www.lannerinc.com
 HTCA-6310S HTCA-6400 HTCA-6600A
3U Rackmount 4U Rackmount 6U Rackmount

Intel® Xeon® processor E5-2600 v3/v4

Depends on compute blade specification Depends on compute blade specification
(Haswell-EP/Broadwell-EP)

Intel C612 Depends on compute blade specification Depends on compute blade specification

Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above

DDR4 2400 MHz REG DIMM Depends on compute blade specification Depends on compute blade specification

512 GB (16 x 32GB) Depends on compute blade specification Depends on compute blade specification

8 x 288-pin DDR4 DIMMs Depends on compute blade specification Depends on compute blade specification

16 x 3.5” Swappable HDD drive bays 4 x 2.5” Swappable HDD drive bays 6 x 3.5” Swappable HDD drive bays

1 x CF Depends on compute blade specification Depends on compute blade specification

1x console RJ45, LOM port, MGMT port, Blade 1~2: Switch Fabric Blade Blade 1~2: Switch Fabric Blade
4 RJ45 ports at rear Blade 3~4: Ethernet I/O Blade Blade 3~6: Ethernet I/O Blade

N/A N/A N/A

2 x Intel i210 Depends on blade specification (HLM series) Depends on blade specification (HLM series)

N/A 4 x Blades 6 x Blades

1 x onboard IPMI ports 1 x onboard IPMI ports 1 x onboard IPMI ports

1 x Management port 1 x Management port 1 x Management port

Yes Yes Yes

1 x RJ-45 1 x RJ-45 1 x RJ-45

1 x USB 2.0 1 x USB 2.0 1 x USB 2.0

Internal 1x PCIe by 16 slot for graphic acceleration card N/A N/A

N/A N/A N/A

CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct

3 x hot-swappable cooling fan sets with smart fan control 5 x hot-swappable cooling fans per M/B 5 x hot-swappable cooling fans per M/B

0~40ºC Operating 0~40ºC Operating 0~40ºC Operating

-20~70ºC Non-Operating -20~70ºC Non-Operating -20~70ºC Non-Operating

5 ~ 90% Operating 5 ~ 90% Operating 5 ~ 90% Operating

5 ~ 95% Non-Operating 5 ~ 95% Non-Operating 5 ~ 95% Non-Operating

N/A 2 x 20 characters 2 x 20 characters

Yes Yes Yes

Yes Yes Yes

438 x 132 x 685 mm 438 x 177.3 x 685 mm 438 x 265.9 x 685 mm

30 kg 40 kg 55 kg

AC 1200 watt N+1 Redundant AC 1200 watt N+1 Redundant /each AC 1200 watt N+1 Redundant /each
DC 1010 watt N+1 Redundant DC 1010 watt N+1 Redundant /each DC 1010 watt N+1 Redundant /each
PM bus support PM bus support PM bus support

AC 85 ~ 264 V AC 85 ~ 264 V AC 85 ~ 264 V

DC -36V ~ -72V DC -36V ~ -72V DC -36V ~ -72V

CE Class A, FCC Class A, RoHS CE Class A, FCC Class A, RoHS, NEBS design compliance CE Class A, FCC Class A, RoHS, NEBS design compliance

www.lannerinc.com 27
Corporate

Lanner Electronics Inc.

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Xizhi District,
New Taipei City 221, Taiwan
T: +886-2-8692-6060
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T: +1 877-813-2132 T: +886-2-8692-6060
F: +1 905-362-2369 F: +886-2-8692-6101
E: [email protected] E: [email protected]

Please verify specifications before quoting. All product specifications are subject to change without
notice. No part of this publication may be reproduced in any form or by any means, electronic,
photocopying or otherwise without prior written permission of Lanner Electronics Inc. All brand
names and product names are the trademarks or registered trademarks of their respective companies.
© Lanner Electronics Inc., 2020 www.lannerinc.com