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Lead-Free Solder Paste with Stable Printability

This document summarizes the properties and benefits of Nihon Superior SN100C P506 D4 lead-free solder paste. It simplifies stock management by having stable printability and viscosity over extended storage at room temperature. It improves productivity with excellent consecutive printability and minimized mid-chip beading. The paste has excellent storage stability and wetting properties.

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huynh thi y vi
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381 views2 pages

Lead-Free Solder Paste with Stable Printability

This document summarizes the properties and benefits of Nihon Superior SN100C P506 D4 lead-free solder paste. It simplifies stock management by having stable printability and viscosity over extended storage at room temperature. It improves productivity with excellent consecutive printability and minimized mid-chip beading. The paste has excellent storage stability and wetting properties.

Uploaded by

huynh thi y vi
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Simplified Stock Management

Stable Printability

Lead-free solder paste

Nihon Superior SN100C P506 D4 is a lead-free


no-clean solder paste that can be stored at
room temperature for extended periods with
minimum change in viscosity. This new material
will not only simplify stock management, but
also improve productivity with excellent
consecutive printability.

No silver Printing
Lead-free
Grade

Excellent Minimized
Excellent
Storage Mid-Chip
Wetting
Stability Beading

Printability Mid-Chip Beading Minimized


First Print After 10 hours printing

QFP 0.4mm pitch


Printing environment
16 ∼ 25℃ 40%RH

No print defects after


10 hours continiuous
printing

Excellent wetting Stable viscosity

Viscosity as a Function of Time at 40C


SOT23-3 pin 0.4mm pitch QFP

Stencil Thickness Programing rate


Peek temperature Time above liquidus
Lead-Free Solder Paste

Properties
Test Specification
Alloy Composition

Melting point 227℃


Powder size 20 ∼ 38μm/TYPE4
Flux Classification

Halide(Potentiometric titration wt %
Copper plate corrosion No Corrosion
Flux Content 12wt %
Viscosity Pa・s Annex6
Thxotropic index Annex6
Insulation resistance Ω
Electromigration Pass
Spread

Long term storage life 12months in refrigerator


On line shelf life 60days Up to 40℃

Reflow Profiles Product Code

Peak
Soak for
temperature
RSS profile
240 5℃
160-200C
temperature（℃）

Ramp rate for


for RSS 60-90sec
profile
2-4℃/sec
Alloy Flux type Powder size
Time above
227℃ liquidus

Minimum Order Quantity


Ramp rate for
RTS profile
1-2℃/sec
5kg (10×500g jars)

time（sec.）

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