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Differences and applications of MEMS & NEMS
3 authors:
Srinivas Kasulla S J Malik
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دکتر ا فشين رشيد
Islamic Azad University Tehran Science and Research Branch
253 PUBLICATIONS 179 CITATIONS
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Srinivas Kasulla S J Malik دکتر افشين رشيد
Differences and applications of MEMS & NEMS
Abstract: Recent trends in Nano electronics engineering and
science have focused on emphasizing the combination, analysis,
and control of advanced MEMS and NEMS. The processes of
composition, design, and optimization are in fact evolutionary
over natural samples.
At each level of the design hierarchy, the efficiency of the
system in the realm of its behavior is used to evaluate, optimize
and correct the optimization and composition process to find
new solutions. ICs must meet the performance characteristics of
MEMS, such as the control of electromagnetic
electromechanical devices and structures, input-output channels,
analog-to-digital
Srinivas Kasulla S J Malik دکتر افشين رشيد
conversions, and analog-to-analog data. systems (MEMS,
(complex of mechanical elements, sensors, actuators and
implements a base silicon via technology building about the size
of microns. As long as the equipment Electronics for use in the
process of polishing compound (IC (made (such as process
Components), "BICMOS, Bipolar, CMOS Micromechanical
fabrication " for use in micro- machining processes, suitable for
selectively part-by-part with silicone tablets or the addition of
new building layers to form mechanical and mechanical
devices. Used, made. MEMS represents a new revolution in
silicon integration products based on microelectronic technology
and micro machines that aims to enable the full realization of
"systems on a chip". MEMS is a technology that allows the
development of intelligent products , complementing the
computing power of micro electrons, taking into account the
capabilities of micro sensors and micro motors, and the
development of possible design and use space. Microelectronic
integrated circuits can be considered as the thinking brain of a
system, and MEMS has enhanced this decision-making
capability with eyes
Srinivas Kasulla S J Malik دکتر افشين رشيد
and arms to allow microsystems to measure the environment by
mechanical, temperature, biological,
Collect chemical, optical and magnetic. The electronics then
instruct the arms to display the information taken from the
sensors and through some decisions to react by moving,
stabilizing, adjusting, pumping and filtering . As a result, the
environment is controlled for the desired demands. Because
MEMS devices are built for use in group manufacturing
methods such as integrated circuits , new levels of
performance, reliability and skill can be afforded on a small
silicon chip at a relatively "low cost"
MEMS & NEMS applications
Different MEMS and NEMS should be designed according to
the specifications of the needs, objectives and applications.
MEMS and electromechanical NEMS or Electro- mechanical
Usually have developed "systems for optical faster, easier and
more efficient, more reliable and more durable than
electromechanical systems. If the optical systems for various
applications are
Srinivas Kasulla S J Malik دکتر افشين رشيد
designed (such as communications, computing and key woman,
wireless, etc.) configurations are different in general, it is very
difficult that a comparative study between them do. for example,
the optical system cannot be used as stimuli to be applied.
Functional requirements must be counted and fittings,
electromagnetic, Temperature, vibration or Radiation can be the
factors used to make better. The size of the actuator depends on
the amount of force or torque that is a function of the material
used and its size (volume). In fact, the size is determined by the
force and torque required and its gender.
Srinivas Kasulla S J Malik دکتر افشين رشيد
The fact that electromagnetic MEMS, microstructures or Micro
Trans Dyvsdhayy with IC used in Myykrv radiant energy
devices are controlled, are complex, very important is. Thus,
microstructures and micros transmitters , radiant energy devices,
and ICs must be integrated. Direct chip connection technology
has advanced extensively. In particular, the chip-flip MEMS set
was replaced with wired tape to connect ICs to micron-scale
actuators and sensors. The use of chip-flip technology allows the
removal of inductors and capacitors and noise resistance. This
leads to the modification of the device specifications. Continued
chip-flip integration benefits in packet implementationFlexible,
advanced, progress reliability and reduced weight and size, and
.... the result is. Integrated chip-flip, diode micro transformers
can be mounted with protrusions and downwards on the layers
mounted on electromechanical devices and attached to the IC
base. MEMS Large-scale integrated (a number of chips that
can be mass-produced at a low cost used in COMS).
Srinivas Kasulla S J Malik دکتر افشين رشيد
