SM000

®
ALPHA Vaculoy SACX 0307,0300 PLUS ®

LEAD FREE WAVE SOLDER and REWORK ALLOY

DESCRIPTION
ALPHA Vaculoy SACX0307 Plus is a next generation lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other
low silver SAC alloys including SACX0307 in wave solder, lead tinning and rework processes. SACX0307 Plus has been
engineered for improved copper dissolution performance during the long hot exposure times associated with rework and lead
tinning. The SACX0300 Plus variant is used as a replenishment alloy in solder baths with elevated copper levels. As with all Alpha
Metals bar solder, Alpha’s proprietary Vaculoy™ manufacturing process is used to remove certain impurities, particularly oxides.
The product is further enhanced with the addition of other materials designed to further reduce drossing, increase wetting speed
and force and improve joint cosmetics.

FEATURES & BENEFITS

Features:

‰ RELIABILITY – Comparable to higher Ag alloys (ie. SAC305) in thermal fatigue resistance, lap shear and pin pull performance.
‰ YIELD – Comparable to SAC305, superior performance for hole fill and SMT related defects compared to Ag free alloys like
Sn99.3/Cu0.7.
‰ COPPER EROSION – Low erosion during long rework exposure times
‰ DROSS GENERATION – lowest in class due to the Vaculoy process in conjunction with the addition of a dross reducing agent.

Benefits:

‰ Lowers Total Cost of Ownership due to the lower material cost, high yields and low dross generation.
‰ Excellent mechanical reliability.
‰ Gives very good hole fill and drainage due to the lower surface tension attributed to Ag.
‰ Reduces erosion of copper plating during rework improving assembly reliability.
‰ Delivers good performance across a range of flux technologies.

The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely
important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher
viscosity can result in increased soldering defects (i.e solder bridging)

APPLICATION
ALPHA VACULOY SACX0307 Plus is suitable for wave soldering, lead tinning and reworking both through hole and surface
mount components in a lead-free process. It is suited to single side and relatively complex, dual sided mixed technology boards.
A solder pot temperature of 255 - 265° C (491 – 509F) is recommended with a contact time 2.3 – 3.5 seconds. For suitable
wave solder fluxes, please see our selector guide. Lead free Reclaim services including dedicated lead free containers is also
available, please consult your local sales office.

AVAILABILITY
ALPHA VACULOY SACX0307/0300 Plus is available in 1kg (2.2lb) Bar , chunks , Feeder Ingots and Autofeed Wire

HEALTH & SAFETY

Please refer to MSDS for advice on proper handling and safety instructions.

Issue 5
TECHNICAL SPECIFICATION
Complies with all requirements of RoHS Directive (Article 4.1 of the European Directive 2002/95/EC). Alloy
specification for Maximum Lead (Pb) Content = 0.1%

Vaculoy
Material Property Units
SACX0307 Plus
Solidus Celsius 217
Liquidus Celsius 228
Hardness HV 14.1
Density g/cc 7.33
Specific Heat Capacity J/kg C 0.17
Stress at MAX Load Mean 29.5
(N/mm2) Std Dev 0.64
Elongation at failure (%) Mean 21.8
Std Dev 8.8
Thermal Expansion (30 - 100C)/C x 10-5 1.79
Coefficient (100 - 150C)/C x 10-5 2.30
Silver Content % 0.3 +0.15/-0.05
Copper Content % 0.70 +/-0.1
Lead Content % Max 0.1%

RECOMMENDED WAVE SOLDER PROCESS SETTINGS

Wave
Process Parameter Suggested Process Settings
Configuration
Pot temperature 255 - 265 Celsius (491 - 509 F)
Conveyor speed 1.0 - 1.5 m/min (3.3 - 5 ft/min)
Contact time 2.3 - 2.8 seconds
Single Wave
Wave Height 1/2 to 2/3 of board thickness
Dross removal Once per 8 hour run time
Copper Check Every 8,000 boards until 40,000
Pot temperature 255 - 265 Celsius (491 - 509 F)
Conveyor speed 1.0 - 1.5 m/min (3.3 - 5 ft/min)
Dual Wave Contact time 3.0 - 3.5 seconds
Wave Height 1/2 to 2/3 of board thickness
Dross removal Once per 8 hour run time

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials
designated.

Issue 2
MANAGEMENT OF COPPER LEVELS IN THE SOLDER BATH
Copper should be controlled in the solder bath between 0.7% and 1.0%
Management of the copper level in the wave solder bath is critical to ensure low defects in the soldering process.
There is a tendency for the copper levels of the SACX0307 materials to increase due to the leaching effect of the
solder wave on the board and components. This effect is at its most severe when using an OSP Copper finish on
the PCB. Studies have shown a typical leaching rate of 0.01% Cu per 1000 boards. Each process is unique this
is an indication only of the leaching rate (based on actual data).
It is recommended that the copper is controlled at between 0.7% and max 1.0% for SACX0307 Plus alloy. Copper
levels higher than 1.0% are known to increase the liquidus temperature which in turn may mean that the solder bath
temperature has to be increased to maintain the process yields. The copper levels in the bath can be controlled by
means of adding SACX0300 Plus to the wave solder pot. It may be the case that equilibrium can be attained by
continuing with SACX0300 Plus additions as the only means of solder top up, however each process is unique and we
would recommend regular analysis of the solder bath so that good control of copper can be maintained. This analysis
service is available from Cookson Electronics Assembly Materials, contact your local office for details.

RECOMMENDED ACTION LEVELS FOR WAVE SOLDER IMPURITES

Please find below a list of recommended action levels for wave solder bath impurities. For information of specific
action plans to bring your solder bath back to an acceptable condition please contact your local sales office.
ACTION
Element Notes
Levels
No Action level.
Sn BAL
RoHS Directive 2002/95/EC states a maximum Lead content of 0.1%
Pb 0.10
Levels greater than 0.03% can cause de-wetting.
As 0.03
SACX is tolerant to copper levels up to 1.0%, SACX0300 copper free should be added to maintain copper
Cu 1.00 levels. Levels above 1.0% may cause more bridging.
Lead Free alloys are tolerant to Bi up to 1.0%, however if levels above 0.20% are detected this indicates
Bi 0.20 some contamination issues that should be investigated
Levels greater than 0.003% may cause higher levels of bridging and icicling and a greater level of surface
Zn 0.003 oxidation in the solder bath.
Greater than 0.02% Iron can be an indicator of pot erosion and may cause gritty joint formation and the
Fe 0.02 formation of FeSn2 IMC needles that can cause bridging.
Silver levels of 4% are used in some SAC alloys, however if the levels in SACX rise above 0.5% then some
Ag 0.50 investigations should be held to establish the cause. Solderability should not be affected
Lead Free alloys are tolerant to Sb up to 1.0%, however if levels above 0.20% are detected this indicates
Sb 0.20 some contamination issues that should be investigated
Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance.
Ni 0.025 If process performance is OK then levels up to 0.05% are OK.
RoHS Directive 2002/95/EC states a maximum Cadmium content of 0.01%. Levels of 0.003% may cause
Cd 0.003 higher level of bridging and icicling.
Levels greater than 0.002% may cause higher levels of bridging and icicling and a greater level of surface
Al 0.002 oxidation in the solder bath.
At levels above 0.1% there may be some problems with joint strength.
Au 0.1

Headquarters Regional Sales Offices: Belgium Tel: +32 (0) 14 44 50 00 Japan: Tel: +81 463 53 3333
Cookson Electronics Assembly Materials Brazil Tel: +55 11 4353 2500 Korea: Tel: +82 31 499 1451
109 Corporate Blvd. France: Tel: +33 (0) 2 41 49 00 11 Mexico: Tel: +52 555 587 1700
South Plainfield Germany: Tel: +49 (0)2173 8490 300 Netherlands: Tel: +31 (0) 35 695 5411
NJ 07080, U.S.A. Hong Kong: Tel: +852 3190 3100 Singapore: Tel: +65 6861 1977
Tel: +1.908.791.3000 Hungary Tel: +36 (0) 24 460 72 0 Taiwan: Tel: +886 (3) 322 2721
Fax: +1.908.791.3090 India: Tel: +91 44 625 2666 UK: Tel: +44 (0) 1483 793100
www.alphametals.com Ireland: Tel: +353 (0) 1 842 1172 USA - Elgin: Tel: +1.847.638.7942
Italy: Tel: +39 (0)2 38 33 11

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials
designated.

Issue 2