AZ® P4620 Photoresist

Data Package

The information contained herein is, as far as we are aware, true and accurate. However, no representations
or warranties, either express or implied, whether of merchantable quality, fitness for any particular
purpose or of any other nature are hereby made in respect of the information contained in this
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 AZ P4620 Copper plating
Before plating
(Development) Cu plating Resist Stripping

10um L/S

10um L/S

Plating process condition

Photoresist thickness: 15um, Prebake: 110C/180 sec. (Hotplate)
Exposure: PLA-501F（Soft contact, ghi-line aligner)
Development: AZ 400K 1:4, Immersion for 300 sec., 23 C
Plating liquid: MICROFAB Cu200 (EEJA)
Plating height: 7.0um, Plating: 25 C / 30 min.
 AZ® P4620 Gold Plating Process

FT: 28um, Single Coat

Softbake: 1) 100ºC / 500 sec. (Hotplate)
2) 90ºC / 180 min. (Oven)
Rehydration time: 60 minutes
Exposure: UTS-SS-III (ghi-line)
Develop: AZ 400K 1:3, 21.5ºC
Plating: Cyanide Gold Plating Solution

AZ Confidential AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® P4620 Gold Plating Process

AZ Confidential AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
 AZ® P4620 Gold Plating Process

Photoresist Mask CD = 93.5um; Au Bump CD = 96um.

AZ Confidential AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
 AZ P4620 Lithography performance
Process Conditions:

Optitrac Coat/ Bake

Coat: Static dispense on Silicon
Target Film Thickness: 12 µm
Softbake: 110C hotplate/ 80 sec. full contact
Exposure: Ultratech 1500 gh line Stepper
Develop: AZ® 300 MIF, continuous spray for 200 sec. @ 23 C

Analysis:

Amray SEM
AZ P4620 Lithography performance
12 µm 10 µm 9.0 µm 8.0 µm

Film Thickness: 12 µm 7.0 µm

Optitrac coat and Bake
SB: 110 C / 80 sec
Ultratech 1500 gh line Stepper
AZ 300 MIF, 200 sec continuous spray @ 23 C

4.0 µm 5.0 µm 6.0 µm

 AZ P4620 Lithography performance
800mJ/cm² 900 mJ/cm² 1000 mJ/cm² 1100 mJ/cm² 1200 mJ/cm²

10.0 µm Contact Holes 1:1 Pitch

800mJ/cm² 900 mJ/cm² 1000 mJ/cm² 1100 mJ/cm² 1200 mJ/cm²

Film Thickness: 12 µm 10.0 µm Contact Holes 1:0.3 Pitch

Optitrac coat and Bake
SB: 110 C / 80 sec
Ultratech 1500 gh line Stepper
AZ 300 MIF, 200 sec continuous spray @ 23 C
 AZ P4620 Lithography performance
Process Conditions:
Optitrac Coat/ Bake
Coat: Static dispense on Silicon
Target Film Thickness: 24 µm
Softbake: 1st layer 110 C hotplate/ 80 sec. full contact
2nd layer 115 C hotplate/ 180 sec. full contact
Exposure: Ultratech 1500 gh line Stepper
Develop: AZ® 400K 1:4, continuous spray for 260 sec. @ 27 C

Analysis:

Amray SEM
 AZ P4620 Lithography performance
1650 mJ/cm² 1750 mJ/cm² 1850 mJ/cm² 1950 mJ/cm² 2050 mJ/cm²

1650 mJ/cm² 1750 mJ/cm² 1850 mJ/cm² 1950 mJ/cm² 2050 mJ/cm²

Film Thickness: 24 µm
Optitrac coat and Bake
SB: 1st layer 110 C / 80 sec
2nd layer 115 C /180 sec
Ultratech 1500 gh line Stepper
AZ 400K 1:4, 260 sec continuous spray @ 27 C
AZ® P4620 Lithographic Performance Summary

Process Conditions

Substrate : Bare-Si
Film-thickness : 17µm
Softbake : 120˚C / 240 sec. (DHP)
Exposure : Canon PLA-501F (ghi-line)
Dose : 630 mJ/cm2
Development : AZ 400K Developer 1:4,
Immersion - 300 sec., 23˚C

AZ Confidential AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, Signiflow, and
Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP,
SWG, and TARP are trademarks of AZ Electronic Materials.
 AZ® P4000 Bleached Absorbance Curve

AZ P4000 Series resist(s)

Ellipsometrc Absorbance
Normalized to 1/µm

5.00

4.50
'k' ellipsometric: P4000
4.00

3.50
Absorbance ('k')

3.00

2.50

2.00

1.50

1.00

0.50

0.00
175 200 225 250 275 300 325 350 375 400 425 450 475 500
Wavelength (nm )

BU Electronic Materials
 AZ® P4000 Unbleached Absorbance Curve

AZ P4000 Series resist(s)

Ellipsometrc Absorbance
Normalized to 1/µm

3.00

2.50 'k' ellipsometric: P4000

2.00
Absorbance ('k')

1.50

1.00

0.50

0.00
175 200 225 250 275 300 325 350 375 400 425 450 475 500
Wavelength (nm )

BU Electronic Materials
AZ® P4000 Series Spin Speed Curve

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.