CRCW0201 e3
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Lead (Pb)-free Commodity Thick Film Chip Resistors
FEATURES
• High volume product suitable for commercial
applications
• Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and
lead containing soldering processes
• Metal glaze on high quality ceramic
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
LIMITING
ELEMENT
CASE CASE POWER RATING TEMPERATURE RESISTANCE
VOLTAGE TOLERANCE
MODEL SIZE SIZE P70 COEFFICIENT RANGE SERIES
Umax. %
INCH METRIC W ppm/K
ACRMS/DC
V
± 200 10.0 to 10M
± 0.5 E24; E96
-200 / +400 1.0 to 9.76
± 100 47.0 to 1M
0.05 30 ± 200 ±1 10.0 to 10M E24; E96
CRCW0201 0201 RR 0603M
-200 / +400 1.0 to 9.76
± 200 10.0 to 10M
±5 E24
-200 / +400 1.0 to 9.1
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. at 70 °C = 1.0 A
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRCW0201
Rated Dissipation at 70 °C (1) W 0.05
Operating Voltage Umax. ACRMS/DC V 30
Insulation Voltage Uins (1 min) V 50
Insulation Resistance > 109
Operating Temperature Range °C -55 to +155
Weight mg 0.17
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 07-Mar-17 1 Document Number: 20052
For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
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PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW02011K00FNED
C R C W 0 2 0 1 1 K 0 0 F K E D
MODEL VALUE TOLERANCE TCR PACKAGING
CRCW0201 R = decimal D = ± 0.5 % K = ± 100 ppm/K ED
K = thousand F = ± 1.0 % N = ± 200 ppm/K EE
M = million J = ± 5.0 % X = -200 ppm/K / +400 ppm/K EI
0000 = jumper Z = jumper 0 = jumper
PRODUCT DESCRIPTION: CRCW0201 100 1K0 1 % ET7 e3
CRCW0201 100 562R 1% ET7 e3
RESISTANCE TOLERANCE
MODEL TCR PACKAGING LEAD (Pb)-FREE
VALUE VALUE
CRCW0201 ± 200 ppm/K 1R0 = 1 ± 0.5 % ET7 e3 = pure tin
± 100 ppm/K 10R = 10 ±1% EF4 termination finish
- 200/+ 400 ppm/K 1K0 = 1 k ±5% ET2
10K = 10 k
1M0 = 1 M
0R0 = jumper
PACKAGING
MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
ED = ET7 10 000 Paper tape acc. 180 mm/7"
CRCW0201 EI = ET2 20 000 to IEC 60068-3 8 mm 2 mm 254 mm/10"
EE = EF4 50 000 Type I 330 mm/13"
DIMENSIONS in millimeters
SIZE DIMENSIONS SOLDER PAD DIMENSIONS
INCH METRIC L W H T1 T2 a b l
0201 0603 0.6 ± 0.05 0.3 ± 0.05 0.23 ± 0.05 0.15 ± 0.05 0.10 ± 0.05 0.28 0.43 0.23
Note
• No marking for 0201 size.
Revision: 07-Mar-17 2 Document Number: 20052
For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
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DERATING
Fraction of Rated Dissipation P70 in %
100
50
0
- 50 0 50 70 100 125 150
Ambient Temperature ϑamb in °C
TEST PROCEDURES AND REQUIREMENTS
IEC REQUIREMENTS
PROCEDURE
EN 60115-1 60068-2 PERMISSIBLE CHANGE (R)
TEST
CLAUSE TEST Stability for product types:
METHOD CRCW0201 e3 1 to 10 M
4.5 - Resistance - ± 0.5 %; ± 1 %; ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
Solder bath method;
Sn60Pb40
Good tinning ( 95 % covered)
non activated flux;
no visible damage
(235 ± 5) °C
(2 ± 0.2) s
4.13 58 (Td) Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
Good tinning ( 95 % covered)
non-activated flux;
(245 ± 5) °C no visible damage
(3 ± 0.3) s
± 100 ppm/K,
(20 / -55 / 20) °C and
4.8.4.2 - Temperature coefficient ± 200 ppm/K,
(20 / 125 / 20) °C
-200 ppm/K / +400 ppm/K
4.32 21 (Uu3) Shear (adhesion) 9N No visible damage
No visible damage,
4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times no open circuit in bent position
± (0.5 % R + 0.05 )
30 min. at -55 °C;
Rapid change 30 min. at 125 °C
4.19 14 (Na)
of temperature 5 cycles ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 )
4.23 - Climatic sequence: -
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH; 24 h; 1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2 h ± (2 % R + 0.1 )
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH; 24 h; 5 cycles
4.23.7 - DC load U= P 70 x R Umax.
Revision: 07-Mar-17 3 Document Number: 20052
For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
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Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC REQUIREMENTS
PROCEDURE
EN 60115-1 60068-2 PERMISSIBLE CHANGE (R)
TEST
CLAUSE TEST Stability for product types:
METHOD CRCW0201 e3 1 to 10 M
U = P 70 x R Umax.;
1.5 h on; 0.5 h off;
4.25.1 - Endurance at 70 °C
70 °C; 1000 h ± (2 % R + 0.1 )
70 °C; 8000 h ± (4 % R + 0.1 )
Resistance to Solder bath method
4.18.2 58 (Td) ± (1 % R + 0.05 )
soldering heat (260 ± 5) °C; (10 ± 1) s
Flamability, IEC 60695-11-5;
4.35 - No burning after 30 s
needle flame test 10 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (2 % R + 0.1 )
Endurance at upper
4.25.3 - 155 °C, 1000 h ± (2 % R + 0.1 )
category temperature
Component Isopropyl alcohol;
4.29 45 (XA) No visible damage
solvent resistance 50 °C; method 2
f = 10 Hz to 2000 Hz;
Vibration, endurance x, y, z 1.5 mm;
4.22 6 (Fc) ± (0.5 % R + 0.05 )
by sweeping A 200 m/s2;
10 sweeps per axis
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 07-Mar-17 4 Document Number: 20052
For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 13-Jun-16 1 Document Number: 91000
