A cost effective, no-

ALPHA®
silver, lead-free solder
alloy that delivers
superior
performance and
SnCX Plus™ 07
high reliability Solder Alloy

Product Guide

SM1165 OCT 2013

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. an Alent plc Company
 Content
Introduction 3
Properties Data 5
Soldering Performance 6
Reliability Data 13
Processing Parameters 29
Availability 30
Technical Bulletin and MSDS 31
Summary of Properties 32

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
2 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Introduction
Introduction
ALPHA SnCX Plus™ 07 is a lead free alloy developed by Alpha,
comprised of tin, copper and a small amount of additives to enhance the
alloy properties. It is engineered to be a cost effective alternative to
silver-bearing alloys in terms of soldering performance and reliability on
certain types of electronic assemblies. It also exhibits improved
performance in a variety of areas over many of the popular tin copper
solder alloys used today.

Key Alloy Attributes

• No silver = low cost • Fast wetting resulting in improved
yield
• Low copper erosion rates • Low drossing rates
• High mechanical reliability • Smooth and bright solder joints

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
3 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
When to consider SnCX Plus™ 07
Introduction

• For simple to standard complexity dual sided assemblies

– Assembler building multiple board types should always consider their most difficult
assembly when selecting a single alloy

Assembly Type
Type I Type II Type III Type IV
Dual sided FR-4 w/ PTH's, 1.6mm Complex, up to 12 inner copper >2.4mm thick, >12 inner copper
Simple, single sided, FR2 / CEM-1
thick, up to 4 inner copper layers, layers, OSP pad finishes, all layers, large high heat capacity
laminates
metallized pad finishes processing in air components
ver. 61211
Toys PC Motherboard High End PC Motherboard Server board
Device Types

Set top Box Gamebox board High End Gamebox board Network Infrastructure
Standard Audio and Video PC Peripherals Complex PC Peripherals Telecom Base Station
White Goods Standard Video High End Video
Automotive (chasis / powertrain) Automotive (Infotainment) Automotive (networking)
High End Audio

Reliability Requirement
Thermal Fatigue 0ºC to 100ºC - standard profile 0ºC to 100ºC - standard and shock - 25ºC to 125ºC - standard and - 45ºC to 125ºC - standard and
Resistance cycles profile cycles shock profile cycles shock profile cycles

• For assemblers who want a single alloy for both wave soldering and selective /
rework soldering processes.
• Users of other no silver, Pb-free alloys that:
– Are not getting the soldering performance they need
– Are seeing an increase in mechanical reliability related field failures

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
4 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Properties Data
Alloy Properties
Competitor SnCu
SnCX Plus™ 07 SAC305
Alloy
Liquidus Temperature (oC) 229 229 221.5
Solidus Temperature (oC) 227 227 217.3
CTE 30-100oC (µm/moC) 23.8 22.5 22.3
CTE 100-180oC (µm/moC) 24.3 23.1 23.7
Density (g/cm3) 7.30 7.31 7.43
Impact Energy (J) 51.2 52.0 59.2
Hardness (HV 0.2) 9.4 9.0 13.0

• SAC305 exhibits improved mechanical properties versus the no silver alloys.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
5 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Soldering Performance
Wetting Performance TM-JIS Z 3198-4

• Wetting Speed Performance:

SAC305 > SnCX Plus™ 07 > Competitor SnCu Alloy
Best Worst
• SnCX Plus™ 07 maximum wetting force is slightly higher than SAC305 and
Competitor SnCu Alloy.
• Above 265oC, wetting behavior of all three alloys is generally very good
(t0< 1sec).

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
6 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Soldering Performance
Test Vehicle Used:
Alpha’s SAKT v5.1 (FR4, Wave
OSP, 2.4mm thickness, 4
layers – 1 oz copper ground
layers)
Soldering
Performance
• The SAKT board is specially
designed to be difficult to solder.
Top • Mainly used to test hole fill
performance and bridging.
Bottom

• Boards were soldered with 3 different alloys: SAC305, SnCX Plus™ 07,
Competitor SnCu Alloy.
• Similar soldering conditions were used for all boards:
- Pot temperature: 260ºC (dual wave)
- Contact time: < 4 secs
- Top side maximum preheat: 95ºC
- Flux: EF6808HF-P (Alcohol based, Rosin containing flux)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
7 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Wave Soldering Performance
Soldering Performance

Bridging

• Bridging Performance:
SnCX Plus™ 07 > SAC305 > Competitor SnCu Alloy
Best Worst

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
8 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Wave Soldering Performance
Soldering Performance

Hole Fill

• Hole-fill Performance:
SAC305 > SnCX Plus™ 07 > Competitor SnCu Alloy
Best Worst
• SnCX Plus™ 07 shows comparable hole-fill performance to SAC305.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
9 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Soldering Performance
Wave Soldering Performance
Solder Joint Appearance

SnCX
Plus™ 07

SAC305

• SnCX Plus™ 07 solder joint is smooth and bright as compared with SAC305.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
10 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Soldering Performance
Copper Erosion Performance
Time taken for a
0.05 mm diameter
weighted Cu wire
to break

• Cu Erosion Performance:
SnCX Plus™ 07 > Competitor SnCu Alloy > SAC305
Best Worst
• Competitor SnCu Alloy and SAC305 have similar Cu erosion performance.
• SnCX Plus™ 07 shows Cu erosion resistance >2 to 2.5 times better than
SAC305 and 1.5 to 2 times better than Competitor SnCu Alloy.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
11 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Soldering Performance
Drossing Performance

• Overall Drossing Rate Comparison:

SnCX Plus™ 07 > Competitor SnCu Alloy > SAC305
Best Worst
• SnCX Plus™ 07 generates 70% less dross than SAC305.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
12 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Reliability Data
Mechanical Properties
As Cast After Aging (125oC for 96 hours)
Mechanical SnCX Competitor SAC305 SnCX Competitor SAC305
Properties Plus™ 07 SnCu Alloy Plus™ 07 SnCu Alloy
Tensile Stress (MPa) 42.0 38.9 50.1 30.1 27.5 38.4
Tensile Strain (%) 7.6 7.3 3.9 6.6 7.9 5.3
Yield Stress (MPa) 33.4 31.4 44.5 25.7 22.7 33.4
Elongation (%) 33.1 37.4 51.6 53.9 70.1 58.5

• SAC305 has the best mechanical properties among the three alloys. It is well
known that silver improves a solder alloys strength and ductility.
• Compared to the Competitors SnCu Alloy, SnCX Plus™ 07 exhibit slightly better
overall mechanical strength.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
13 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Reliability Data

Mechanical Properties

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
14 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
Creep Test @ 200N, 125oC
Reliability Data

Average. Average • SAC305 has the best creep

Creep Creep properties among the three alloys.
Alloys
Rupture Elongation
Time (hrs) (%) • Alloying additions in SnCX Plus™ 07
SnCX Plus™ 07 2.5 36.0
result in 3x higher creep strength
than Competitor SnCu Alloy.
Competitor SnCu
0.85 47.0 • Higher creep strength gives longer
Alloy
fatigue life and more reliable solder
SAC305 66.2 55.3
joints.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
15 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Reliability Data
Thermal Fatigue Resistance Testing
Separate assemblies were conditioned under three different thermal profiles:
1. Thermal Ageing
1,000 hours at 125ºC
2. Thermal Shock
1,000 cycles of -25 to +85ºC, 5 mins dwell, 30 mins total cycle time
3. Thermal Cycling
200 cycles of -25 to +125ºC, 20 mins dwell, 55 mins total cycle time

After conditioning, each assembly was subjected

to assessment of:
• Joint integrity based on cross sectional analysis
• Uniformity and thickness of intermetallic area
• Joint strength based on pull and shear testing

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
16 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

As Soldered (Through-hole Connector)

SnCX Competitor
SAC305
Plus™07 SnCu Alloy

Joint Integrity

IMC
Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
17 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

1000 Hours Thermal Ageing (Through-hole Connector)

SnCX Competitor
SAC305
Plus™07 SnCu Alloy

Joint Integrity

IMC
Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
18 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

1000 Cycles Thermal Shock (Through-hole Connector)

SnCX Competitor
SAC305
Plus™07 SnCu Alloy

Joint Integrity

IMC
Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
19 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

200 Cycles Thermal Cycling (Through-hole Connector)

SAC305 SnCX Competitor
Plus™07 SnCu Alloy

Joint Integrity Poor Hole-fill

IMC
Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
20 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

As Soldered (0805 Chip Resistor)

Competitor
SAC305 SnCX Plus™ 07
SnCu Alloy

Joint Integrity

IMC Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
21 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

1000 Hours Thermal Ageing (0805 Chip Resistor)

Competitor
SAC305 SnCX Plus™ 07
SnCu Alloy

Joint Integrity

IMC Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
22 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

200 Cycles Thermal Cycling (0805 Chip Resistor)

Competitor
SAC305 SnCX Plus™ 07
SnCu Alloy

Joint Integrity

IMC Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
23 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

1000 Cycles Thermal Shock (0805 Chip Resistor)

Competitor
SAC305 SnCX Plus™ 07
SnCu Alloy

Joint Integrity

IMC Uniformity
and Thickness

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
24 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

Observations and Conclusions

Joint Integrity
• No cracks were observed for all the alloys.
• All the alloys exhibited good joint formation.
•SnCX Plus™ 07 and SAC305 exhibited similar hole
fill while the Competitor SnCu Alloy, while generally
good, had random incidences of lower hole fill.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
25 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing
Reliability Data

Observations and Conclusions cont .

IMC Thickness Measurement

• Initial average IMC thickness for the alloys is ~ 2µm.

• SnCX Plus™ 07 has the smallest IMC growth after thermal cycling and thermal
aging in both 0805 chip resistor and through-hole connectors
Smaller IMC regions are associated with higher reliability
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
26 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing Reliability Data

Joint Strength Testing

Pull Test
• Test Specimen:
0.65 mm QFP
• Test Condition:
5.0 mm/min
• Measurement :
Record the force required for lead to be
released from the PCB

Shear Test
• Test Specimen:
0805 Chip Resistor
• Test Condition:
12 mm/min (200 μm/sec)
• Measurement :
Record the force required for lead to be
released from the PCB

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
27 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Thermal Fatigue Resistance Testing Reliability Data

Joint Strength Testing

Observations and Conclusion

• Generally, the alloys exhibited comparable joint strength.
• SAC305 joint strength is slightly better than the no silver alloys after thermal
shock and thermal ageing.
• SnCX Plus™ 07 exhibits the highest pull strength after thermal cycling.
• The Competitor SnCu Alloy exhibits the lowest overall resistance to pull and shear
force after each of the thermal storage conditions.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
28 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Processing Parameters
Processing Parameters

ALPHA® SnCX Plus™ 07

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
29 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Availability SnCX Plus™ 07 is made in
each of our 3 global regions
Product Type BAR Alloy code Alloy Global Specification #
Product Group BRC 1021 SnCX Plus™ 07 GLB-SAS-058
Product Name VAC 1022 SnCX Plus™ 00 GLB-SAS-057

Item No# Item Description Product Name

161217 CAL 1021 VAC SnCX Plus™ 07 BULK ALPHA® VAC SnCX Plus™ 07 BULK
161218 CAL 1022 VAC SnCX Plus™ 00 BULK ALPHA® VAC SnCX Plus™ 00 BULK
161219 BRC 1021 VAC SnCX Plus™ 07 20KG/BOX ALPHA® VAC SnCX Plus™ 07 1KG
161220 BRC 1022 VAC SnCX Plus™ 00 20KG/BOX ALPHA® VAC SnCX Plus™ 00 1KG
161666 BRC 1021 VAC SnCX Plus™ 07 CHUNK ALPHA® VAC SnCX Plus™ 07 CHUNK
161667 BRC 1022 VAC SnCX Plus™ 00 CHUNK ALPHA® VAC SnCX Plus™ 00 CHUNK
161664 WS 1021 3.00mm SOLID 20KG/Spool / VAC ALPHA® VAC SnCX Plus™ 07 Solid
SnCX Plus™ 07 Wire 20KG/Spool
161665 WS 1022 3.00mm SOLID 20KG/Spool / VAC ALPHA® VAC SnCX Plus™ 00 Solid
SnCX Plus™ 00 Wire 20KG/Spool
Consult your local / regional manufacturing plant for special shape or size requests
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
30 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Technical Bulletin and MSDS
- Available through your local service personnel or on our website

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
31 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
 Summary of Properties
• No silver content lowers alloy cost
• Bright, mirror finish solder joints
• Engineered for reduced copper erosion to
ensure PCBA reliability
• Vaculoy manufacturing process and
unique additives minimize dross
• Comparable soldering performance and
reliability to silver bearing alloys on certain
board types

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
an Alent plc Company
32 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.