Keysight I3070 In-Circuit Test System Board Test Insight: User Guide
Keysight I3070 In-Circuit Test System Board Test Insight: User Guide
User Guide
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3
5 Auto Debug and Optimizer for Analog Tests
AutoDebug for Analog Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Customizing AutoDebug Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Creating a New Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Creating a New Rule Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
AutoDebug Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Optimizer for Analog Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Customizing the Optimizer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4
9 Debugging the Testplan
Features of the Testplan Editor. . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Debug the Testplan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
Example: Variable Watch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Example: Passing Test Parameters . . . . . . . . . . . . . . . . . . . . . .118
Testplan Variables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
10 Production Testing
Production Workflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
Appendix
BT-Basic Command Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Supported BT-Basic Commands . . . . . . . . . . . . . . . . . . . . . . . .127
5
6
Using Board Test Insight
Overview 8
Board Test Insight Window 10
Dashboard 12
Board Explorer 13
Board Browser 14
Menus and Toolbar 18
Using Board Test Insight
Overview
Board Test Insight is used for debugging tests on the i3070 In-Circuit Test systems.
Board Test Insight enables you to quickly run and locate failing tests, then adjust
them so that they pass. The software will:
• execute device tests
• perform statistical analysis on the results
• display the information for you to evaluate
• allow you to modify test parameters and see the results
When you save the changes made during debugging, the debug software
automatically compiles the test source and updates the wirelist and testorder
files.
After debugging device tests, run and debug the testplan. Set breakpoints in the
testplan where further debug is required, and step through to determine the
changes required. Then run Board Test Grader to determine and fine-tune any
marginal tests.
Once the tests pass reliably when running the testplan with a known good board,
the project is ready for production testing.
Board Test Insight can also be used as the Operator interface for production testing.
For details, see Production Testing on page 125.
Board Outline – Outline of the board or pane. Output Panel – Shows BT-Basic output and print
First Pass Yield – First pass yield together with the statements. Test results appear here, when running tests
number of boards tested and the number that passed. from Test Lists, and running macros.
Worst Probe Report – Reports on probes associated This pane also contains the BT-Basic Command Line.
with test failures. Repair Ticket – Shows details of failing tests from running
Test Explorer – Lists all tests from testorder. the testplan.
Test Execution Queue – Lists tests waiting to be run. Watch – Monitors variables during debugging. Displays the
Macro Explorer – Pre-defined macros. See Macros on value of any variables in the current line of the testplan.
page 35. Call Stack – When testplan debugging pauses at a
Board Explorer – Summary of current board. breakpoint, shows subroutines in the execution stack and
line numbers.
Project Explorer – Lists the files in the project folder.
Show or hide the above panes from the View menu. (To show Project Explorer on the menu, enable it from Settings).
Dashboard
The Dashboard shows a test summary for the current board, reporting on the
number of tests passed and failed. Click the project name in the Test Explorer to
display the Dashboard.
Figure 3 Dashboard
Board Explorer
The Board Explorer summarizes details of the current board file. The information
cannot be edited.
• In the Board Explorer, select a category to display a list (devices in the example
below).
• Select an item in the Device list to see additional details.
• Right-click on an item and select View in Browser to locate it in the board
graphics (Figure 6).
Board Browser
The Board Browser provides a graphical display of the features on the board and
fixture, and can help you pinpoint the actual location of the device on the board.
From the Tools menu, select Board Browser to open it.
2 When you select a device, the display automatically zooms in to the device.
Device details
are displayed
Device is highlighted
3 Click an item in the dialog box (a probe in the example) to locate it.
Option Description
File menu
New Create a new text document.
Open Open File – Opens a file for editing.
Open Project – Loads a project (board directory).
Auto Load When a fixture is loaded and Auto Load selected, the system does the
following:
– acquire testhead
– lock fixture
– read fixture ID
– load testplan based on fixture ID
Auto Unload Does the following:
– acquire testhead
– unlock fixture
Close Project Closes the current project.
Save, Save All, Save As Options to save open files.
Exit Exits Board Test Insight.
Tools menu
Settings Change preferences for Board Test Insight. See Table 2.
Administrator Tools Settings
• Access Rights – Click on a role to assign access rights.
• Launch Menu – Add or remove applications from the Launch menu.
• File Watcher – Monitor the selected file for changes.
Extraction
Copy a project folder (board directory) from one system to another.
• Package – Saves the project folder into a .tar file.
• Extract – Deploys the project to the destination folder.
Macro Record – Start user actions in a macro. Note that this only records what
you type in the testplan. Mouse actions are not recorded.
Stop – Stop recording.
View Macro – Show the list of user-defined macros. Select a macro and
click Run to run it.
Repair Link Repair broken links for panelized boards.
Option Description
Board Browser Launches the Board Browser, which displays a graphical view of the
current board.
AutoDebug • Analog > Rule Editor – Define rules for auto debugging of analog
tests.
• Cover Extend > Parameter Settings – Set parameters for auto
debugging of Cover Extend tests.
• TestJet/VTEP > Parameter Settings – Set parameters for auto
debugging of TestJet/VTEP tests.
Optimizer Analog > Optimizer Rule Editor – Define rules for the auto optimization
of analog tests.
Safeguard • All – Runs safeguard all.
• None – Runs safeguard none.
Learn • On – Runs learn on.
• Off – Runs learn off.
Vacuum Well • Vacuum A On – Runs faon to turn on vacuum A.
• Vacuum B On – Runs fbon to turn on vacuum B.
(Available for panelized boards.)
• Vacuum Off – Turns off the vacuum.
Vacuum Preferences (For panelized boards) Specify the vacuum port to be activated for each
board, and the auxconnect commands to run.
Auxiliary Auxconnect and auxdisconnect commands for every relay defined in
the system config file.
AuxConnect <n> – Closes relay <n>.
AuxDisconnect <n> – Opens relay <n>.
SpecialAux Commands to declare and control special relays.
Set – Declare an auxiliary relay as “special”.
Clear – Clear the “special” setting for the relay.
Connect – Closes the special relay.
Disconnect – Opens the special relay.
NOTE: To use the above commands, first specify the relay(s) to control
in the file AgilentICT_ROOT\lib\special_aux_set. The syntax
is: special aux set <n>.
For example, enter special aux set 5 in the file to control relay 5.
(This file is not required when executing the special aux commands
from the testplan or BT-Basic window.)
Option Description
Debug menu
Run Run test(s) or testplan.
Debug Debug testplan.
Stop Stop execution.
Step Into Testplan debug functions. See Debug the Testplan on page 120.
Step Over
Step Out
View menu
Open or close panes in the Board Test Insight window.
Launch menu
Launch other board test applications such as Access Consultant and
Pushbutton Debug. An administrator can add or remove applications
from this menu.
Option Description
General Enable or disable the following options:
• When application starts, open project/file last worked on.
• When application starts, reload Analog In-Circuit table preferences.
(If you customized the view of the Analog In-Circuit device list, for
example, moved or hid columns, reload the same view.)
• When project loads, load the macro files.
• Show Project Explorer in the View menu. (Board Test Insight must be
restarted for this change to take effect.)
Editor Settings • Choose the colors for syntax highlighting in the Test Editor.
• Enable/disable Smart Suggestion in the Test Editor and command box.
• Select Indent size – Used when the software auto indents commands in
the Test Editor.
Board Browser Choose colors to use in the Board Browser.
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Using Board Test Insight
21
Using Board Test Insight
This chapter introduces the features and tools provided to facilitate debugging,
and describes a typical debug workflow in Board Test Insight.
Debugging in Board Test Insight
2. Select
device
1. Select
device type
Editing a Test
• Fields with a white background in the test list can be edited. Click in a field to
edit the value for that test.
• To copy parameter values from one test to another:
a Right-click the test to copy and select Copy All Values.
b Right-click the second test and select Paste All Values.
Saving Changes
Whenever you make changes to a test (using any of the methods outlined here),
User will appear in the Save Testsource column to indicate a user change.
To save changes, make sure you select it and then click Save on the toolbar.
Mass Editing
The mass edit feature lets you apply the same change to multiple tests at once.
1 Select the tests.
You can use the standard Windows selection shortcuts (e.g. Ctrl-a to select all
rows, or Ctrl-click to select multiple rows).
2 Click on the value for any of the tests and make the change.
Click here to
select all tests
• Or right-click the test and select Open Test Source to edit the test source.
After saving changes, you must select Reload from File to update the Test List.
Run Options
Select tests from a Test List to run them. You can use the standard Shift-click or
Ctrl-click to select multiple rows, or Ctrl-a to select all.
To execute tests, three Run options are provided on the toolbar.
• Run – Run once
• Run N Times – Run N number of times (from 3 to 500)
• Run Till Fail – Run until the first failure occurs
View the progress and test results in the Output Panel. When tests are executed
using Run, the results also appear in the Test Result column in the test list. You can
click the column header to sort the table by test results and show failed tests at the
top.
If the Run buttons on the toolbar are grayed out, try selecting
the test(s) again, or click on the title bar of the Test List or
Device List.
Debug Workflow
Before beginning debug, Verify the Fixture.
The following is a typical debug workflow in Board Test Insight.
1 Debug Pins Test
2 Debug Pre-shorts Tests
3 Debug Shorts and Opens Test
4 Debug Analog In-Circuit Tests
5 Debug VTEP/TestJet Tests
6 Debug Polarity Check Tests
7 Debug Connect Check Tests
8 Power the Board
9 Debug Digital Tests
10 Debug Boundary-Scan Tests
11 Debug Cover-Extend Tests
12 Debug Analog Powered Tests
13 Debug Mixed Tests
14 Debug the Testplan
15 Run Board Test Grader to evaluate how well tests are working and determine
fault coverage of the tests.
See the following for additional notes if you are debugging tests for Multiple-Board
Panels and Multiple Board Versions.
Multiple-Board Panels
Note the following when running and debugging multiple-board panels.
You can view the results in Board Outline as well as Output Panel. In case of failures,
check the Repair Ticket.
Repairing links
If any links between the boards are broken, this is indicated by an N in the Link ID
column.
To repair a link for a test, right-click the test in the Test List. Select Link/Unlink
followed by the test to link to.
b Hold the guided probe on the point in question, and click Start (F1).
The system finds the connections to this point and lists them on the screen.
c Use F6 to choose between the following:
– Show all dig gnds - lists every connection to a digital ground brc.
– Show one dig gnd - lists only one connection to ground.
d When you finish probing, click Done (F8).
2 Verify all nodes.
a Execute verify all nodes from the command line.
Macros
Table 3 describes the pre-defined i3070 macros available in Board Test Insight. If
you are familiar with the i3070 macros, you can run them from the Macro Explorer.
Results will be displayed in the Output Panel and updated in the Test Explorer.
• Right-click on a folder and select New to create a new macro in that folder.
• Right-click on a macro to select the options that let you run, edit, or delete it.
Category Description
Setup Macros Setup macros which are used to set up the testhead, load the testplan,
and do other steps required to execute a section of the testplan. These
macros set up the test environment so you can execute and debug tests.
Testplan Macros Testplan macros which are used to execute a section of the testplan (for
example, Digital Incircuit, Analog Functional).
When a macro is executed, failing tests and repair tickets are
automatically displayed on the screen.
Test Grader Macros Lists Board Test Grader and Test Coverage macros, which are used to
generate reports on the quality of the board test and test coverage.
Quick Report Macros The Generate Quick Report macro evaluates a board directory, identifies
areas where changes could be made to reduce test time, and suggests
strategies to maximize throughput. You can use the information to
determine how to adjust your tests, testplan, and system resources to
reduce test times and increase throughput.
After loading the board, you can use the following testhead controls in Board Test
Insight to begin debugging:
1 Click Fixture Lock on the toolbar.
2 From the Tools menu, select Vacuum Well > Vacuum A On.
3 Click Unpowered on the toolbar.
Debugging Pins, Pre-shorts, and Shorts
Column Description
Type Indicates whether this is a short or node test.
Node 1, Node 2 The node or node pair to be tested.
Failure Message The failure message to be printed in the shorts report.
Threshold Resistance value, in ohms, that determines a short or an open.
Settling Time The time to allow transients to settle before taking a measurement.
When you click OK, the new row is added to the bottom of the table.
• To delete a short or node that was added manually, select it and then click
Delete.
You cannot delete shorts or nodes that were generated by the i3070 In-Circuit
Test Software.
Moving a Node
1 Select the node to be moved and click Mark.
2 Click on the row where you want to insert the node, then click Paste Above or
Paste Below.
Note that you can only move one node at a time. If you select multiple rows,
only the row that you last clicked on will be moved.
Common information and test options provided in the device tables are described
in Table 5 below. Additional columns for each device type show the measurement
options which are briefly explained in Measurement Options on page 59.
Column Description
Test Name Name of the device test.
Device Type The type of device.
Pre Shorts Device tests that need to be run before shorts testing. See Debug
Pre-shorts Tests on page 40.
Save Testsource Accepts modifications to the test. Changes are saved to the test source
files only when this option is selected.
Test Resul t Indicates if the test passed or failed.
Commented Lets you comment out the test.
Version For Multiple Board Versions: Shows the board version in which the test is
saved.
Test Time Time taken to run the test.
Column Description
Measured value The measured value of the device.
Nominal Value The nominal value of the device.
Expected The expected value of the device.
Value/Threshold
Offset The value to compensate for the resistance contributed by the fixture.
Lower Tolerance levels determine whether the test passes or fails.
Tolerance/Limit Lower and upper limits of the device value are calculated based on the
tolerance values.
Upper
Tolerance/Limit
CPK The minimum CPK (process capability index) to be met for the test to be
considered stable.
pf Option Pass/fail parameter.
Remark Lets you add comments on the test.
2 When changing device type from jumper to a resistor, locate the changed
device in the Resistor Test List and enter the relevant values for the device.
3 Ensure the Save Testsource checkbox for the changed device is selected before
saving changes.
Note that a device change will update the testorder file.
2 View failures:
Click the Test Result column header to sort the table and show the failed tests
at the top.
You can:
• run AutoDebug to automatically debug all the failed tests, or
• run AutoDebug on marginal failures only, and debug the other failed tests
manually.
If you run AutoDebug on selected tests and manually debug other tests, the
tests that you run during manual debug will be placed at the front of the test
execution queue.
3 To run AutoDebug on failed tests:
Select the tests and click AutoDebug on the toolbar.
4 To manually debug failed tests:
Check physical board and schematics
Right-click on a failed test and click View in Board Browser button to locate the
device in the board graphics display. The board graphics can help you
determine if the device is not loaded or see board topology problems.
Manually adjust test options and parameters
a Double-click a failed test and use the MOA and Histogram to help evaluate
the test results.
b Modify the test and measurement options or their values to enhance test
performance. See Device Test Example for details.
c Run the test again using AutoDebug or Run on the toolbar.
Measurement
This provides details of the connect statement for the selected device. It shows the
names of the nodes connected to the Source (S) and Input (I) buses.
• Some measurement errors may be solved by swapping the S and I buses. (Click
the Swap button.)
• Minimize current splitting error by placing the S and I buses such that
maximum circuit impedance is between the I and G buses.
Sense
Specify the sensing options for the A and B buses by selecting them from the
drop-down menus. (See Techniques for Reducing Measurement Errors for
information on the errors that can be minimized using these options.)
Remote Sensing
Depending on the measurement accuracy required, remote sensing may be
specified. Remote sensing uses additional wires in the fixture, which must already
be available and included in the wirelist.
1 Click Add Remote Sensing to add remote sensing buses including A , B, and L
buses.
2 Click OK.
On Failure
This specifies the statements to be printed or reported upon failure.
• To add a statement, click Add, then click in the new highlighted line to type the
statement.
• To edit a statement, click in the statement and make the change.
• To remove the statement, click in the statement and click Remove.
The system automatically includes the following in the on failure block:
• If the device under test has devices in parallel, these parallel devices are listed.
• If AutoDebug adjusts the expected value for the device and it differs from the
nominal value, the system inserts the following line in the test source file:
report "<nominal value>"
Guard
A device under test may have one or more parallel impedance paths due to the
circuit topology of the board. These can cause measurement errors by providing
current paths around the device under test.
The G bus is used to guard the device under test by breaking these parallel
impedance paths. Guarding, however, may cause its own measurement errors
(guard offset errors). When needed, the L bus can be used to correct for guard offset
errors. The L bus senses the guard (G bus) directly at the board under test.
The software may specify one of two levels of sensing: remote sensing that requires
extra L bus wires in the fixture, or testhead level sensing that connects the G and L
buses together inside the testhead with no additional wiring needed.
Guard settings for a device (example below) are derived from the following:
• During test generation, the i3070 In-Circuit Test Software determines the
possible guards for a device and recommends the default setting to use. All the
guards will be displayed.
• In addition, one-away guard information is obtained from the board file. Any
device directly connected to the device under test is a possible guard point.
To add a guard:
1 Move the mouse over a node name where you want to enable a guard, and
right-click to select Add Guard.
2 To change the guard type, double-click on the G(uard) icon to toggle through
the available guard options for this node.
3 Click OK to save. Changes will be updated in the Guard table.
Interactive Guard shows a simplified view and not the full schematics, so in case the
node where you want to add a guard is not shown, return to the Guard table to add
the guard.
Histogram
The Histogram displays the distribution of measurements for the selected test
when Run N Times is used. (N can be any number from 3 to 500.) Up to eight
histograms are shown when the test is run again.
• The histogram shows the number of measurements that fall within the passing
and failing regions. The red marks are the high and low limits that define the
passing region. Colored bars show the number of measurements in each region.
• The blue cross shows the position of the mean.
• Measurements that fall outside the blue marks on the X-axis are considered
gross failures.
• The statistics calculated from the measurements are shown on the right of the
display.
• The percent passing and total statistics are calculated based on all
measurements. For all other statistics (such as CPK and standard deviation),
gross failures are not included in the calculations. This is an attempt to keep
invalid data from distorting the statistical measures.
• The CPK (process capability index) is an indication of how far the mean value
is from the test limits in units of three standard deviations. This value should
be at least one, and the higher the value the better the test. Note that this
index depends on a normality value of less than one.
• Normality is an indication of the distribution of the data as compared to a
normal distribution. This value should be less than one. If this value is
greater than one, the process capability index may not be valid.
MOA
The MOA display helps in identifying possible measurement problems caused by
circuit topology on the board under test.
The model of the measuring operational amplifier (MOA) circuit shows all
measurement buses being used, and the value of the reference resistor. The display
lists the voltages at the following points:
• at the source
• at the I bus and the A and B buses, if they are used
• across the device under test
• across the reference resistor
• output of the MOA
• MOA mode
Measurement Options
Table 6 summarizes all the measurement options for the analog in-circuit devices.
Available options depend on the type of device. For detailed information about the
measurement options, refer to Analog Tests: Reference in Analog Testing.
Error Cause/Solution
Source vol tage error Is caused by the thermally induced offset voltages of relay contacts, impedances of the
measurement buses, and loading of the stimulus source by small parallel impedances on the
board under test.
Can be reduced by:·
• Sensing the source with the A bus. Sensing the source requires the en option.·
• Sensing the I bus with the B bus.
Current splitting Is caused by a small impedance path in parallel with the input to the MOA, and by an
apparent increase in the input impedance of the MOA when AC stimulus sources are used.
MOA input impedance increases as the frequency of the source is increased. A large value
reference resistor in the MOA feedback path also contributes to current splitting.
Can be reduced by:·
• placing the S and I buses such that maximum circuit impedance is between the I and G
buses
• using the B bus
• increasing the gain of the MOA by changing the bandwidth·
• lowering the frequency of the AC source
Guard offset error Is caused by the voltage drop across the impedance of the G bus. This voltage drop appears
as an offset voltage at the input terminals of the MOA. Guard offset error is sometimes called
guard gain.
Can be reduced by using the L bus. Specify this in the Guard pane.
Example
Suppose AutoDebug is run on the following test, which failed due to an incorrect
re option: resistor 10k, 1.4, 1.4, re2, wb, ed, en
Applying the default rule for re causes AutoDebug to step through the re options,
starting with the options closest to the existing value. That is, re1 and re3 are
applied and tested before proceeding to re4 and re5.
As re5 is the first option that enables the test to pass, AutoDebug stops debugging
and updates the test with the new value:
resistor 10k, 1.4, 1.4, re5, wb, ed, en
AutoDebug Results
• All changes made by AutoDebug are highlighted on the screen for review.
• For successfully debugged tests, the Save Testsource option is automatically
selected. The word AutoDebug in the Save Testsource column indicates the
source of the changes.
• If AutoDebug fails to achieve the required results, the test is modified to
achieve the closest possible values. In such cases, the Save Testsource option
is not selected.
You should manually debug and modify such tests where necessary, before
saving to the test source files.
7
6
8
1
AutoDebug Actions
A rule can contain more than one action; a rule can also be merged with an existing
test during AutoDebug (when Merge with Existing Test is selected). The following
describes how the actions are combined.
• When you combine two iterative actions, AutoDebug tests all possible
permutations of the two sets of values.
• If you combine a single condition action with an iterative action, the option is
enabled for all iterations.
If you wish to test both conditions (on and off) with the iterative action, create
two rules, one with the action included and one without. For example, creating
a rule with Amplitude and Extra Digit tests the specified Amplitude settings
with Extra Digit enabled. You must create then a second rule containing the
same Amplitude settings but without the Extra Digit option.
• When Merge with Existing Test is specified for the rule, the actions in the rule
are added to the test.
In the case of single condition options such as Extra Digit, the option is enabled
in the test. If the test did not contain the option, it is added; if the test already
contained the option, there is, in effect, no change to the test.
Action Description
A Bus Sense On S Bus Directs the system to use the A bus to sense the source voltage being applied to the component
under test. The sense is made at the S bus.
Amplitude Sets the amplitude of the source voltage.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
ASRU Range Specifies the ASRU gain range.
Autodebug Guards Sets guarding on for the device. Using the guard information generated during test
development and the one-away guard information from the board file, AutoDebug runs tests on
the board and selects the optimal guards. You can choose to include or exclude the system
commented guards.
B Bus Sense On I Bus Directs the system to use the B bus to sense the detector voltage. The sense is made at the I
bus.
Action Description
Change Test Limits Changes the upper or lower test limit based on the measured value, if it falls within the
acceptable range. See Change test limits.
Parameters:
• Lower limit, upper limit – Defines the limits of the working range.
• Offset – The offset to be added to or deleted from the measured value to obtain the new
upper or lower limit.
Change Test Value Changes the test value to the measured value, if it falls within the acceptable range. See Change
test value.
Parameters:
• Lower limit, upper limit – Defines the working range.
Change Threshold Changes the threshold based on the measured value, if it falls within the acceptable range. See
Change threshold.
Parameters:
• Limit – Defines the upper limit of the working range.
• Offset – The offset to be added to the measured value to obtain the new threshold value.
Current Change Specifies the change in DC current to use when testing npn or pnp transistors.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
Current Compliance Specifies the current limit when testing components in the MOA input (constant voltage
configuration). This protects the component under test and the MOA from damage due to
excessive current during testing. Predefined values are approximately 35 ma and 150 ma.
DC Current Specifies the DC source current. It is used in transistor testing to provide a DC bias; in diode
testing to provide a known DC current; and in capacitor testing to specify the DC charging
current.
Predefined steps are 10 mA to 100 mA, in increments of 10 mA for transistors and diodes. For
capacitors, they are 100 mA to 1 mA, in decrements of 10 mA.
DC Offset Used to select a DC offset voltage for an AC source.
Parameters:
• Range – Sets the test boundaries
• Step resolution – Sets the increment for each iteration in the search for the optimal value.
Detector Wait Causes the detector to wait the specified interval between measurements when enhancement is
used.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
Enhancement Directs the system to perform an enhanced component test. That is, additional measurements
are made to improve accuracy.
Action Description
Extra Digit Directs the system to integrate the measurement over a complete line cycle. It can be used
when additional accuracy is required.
Fil ter Directs the system to take a specified number of readings during a component test and output
the average as the test result. This helps reduce the effects of system noise.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
Frequency Sets the frequency of the AC source in Hz. Predefined values are 128, 1024, and 8192.
Interval Sets the interval value between samples when testing capacitors in DC mode.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
L Bus Sense on G Bus Directs the system to use the L bus to sense the guard point. Sense L can be done inside the
testhead without additional wiring in the fixture.
Opposite Causes the expected result of a test to be reversed. The jumper and switch tests pass if the
measured resistance is less than or equal to the specified threshold. When this option is
included, the tests pass if the measured resistance is greater than the specified threshold.
Parallel Model Selects the parallel model for capacitor and inductor tests.
Reference Element Selects the reference resistor for the MOA feedback loop. Predefined values are 10, 100, 1K,
10K, 100K, and 1M.
Swap S and I Swaps the Source (S) and Input (I) buses.
Vol tage Compliance Sets the source voltage limit when testing components in the MOA feedback (constant current
configuration). This protects the component under test and the MOA from damage due to
excessive voltage during testing.
Parameters:
• Range – Sets the test boundaries
• Step resolution – The incremental value to use in stepping through the range defined.
Wait Specifies a wait interval between applying a stimulus and taking a reading. This allows the
source to settle when testing reactive devices. The wait is invoked before and after making the
measurement.
Parameters:
• Range – Sets the test boundaries
• Step resolution – Sets the increment for each iteration in the search for the optimal value.
Wideband Selects the wideband characteristics of the MOA.
A Change Test Value rule, with both lower and upper limits set to 20%, is applied.
This defines a working range of 80 to 120 (20% from the expected value of 100).
The test is run and fails when the measured value is 90, outside the tolerance limits
of 95 to 105.
However, the measured value is within the acceptable range defined by the rule,
therefore AutoDebug modifies the test statement. The new test will be:
resistor 90, 5, 5, re2, wb, ar100m
At the same time, a new on-failure message is added, which states that the BOM
value is 100.
3. Measured value: 90 90
Change threshold
This action changes the threshold based on the measured value, if it falls within the
acceptable range.
Take the example of a jumper with the threshold set at 10 ohms. The Change
Threshold rule defines the working range as up to 15 ohms (10 ohms plus 50% of
10 ohms).
The test is run and fails when the measured value is 14 ohms, which exceeds the
original threshold. However, the measured value is within the acceptable range
defined by the rule, therefore AutoDebug modifies the threshold, setting it to the
measured value plus the offset. That is, 14 ohms plus 10% of 10 ohms, giving a new
threshold of 15 ohms.
A Change Test Limits rule, with all parameters set to 10%, is applied. This defines
a working range of 81 to 119, calculated as follows:
a Test statement: 10% of the expected value of 100 is 10, giving a lower test
limit of 90.
b Rule: 10% of the lower test limit is 9; 90 less 9 gives 81 as the lower end of
the AutoDebug working range.
c The same value (9) is added to the upper test limit (110) to give 119 as the
upper end of the AutoDebug working range.
The test is run and fails when the measured value is 85, outside the test limits of 90
to 110.
However, the measured value is within the acceptable range defined by the rule,
therefore AutoDebug modifies the test statement. The new test is as follows:
resistor 100, 24, 10, re2, wb, ar100m
3. Measured value: 85 85
Item Description
Stability Test CPK - The minimum CPK (process capability index). The CPK for the test is calculated after a
predefined number of runs, and the value must be greater than or equal to the minimum CPK for
the test to be considered stable.
During stability testing, you can allow the Optimizer to adjust the test limits or test value based
on the test results.
Change Test Limits Specify whether the Optimizer should adjust the test limits.
• Change Test Limits – Defines the limits of the working range.
The Optimizer changes the upper or lower test limit based on the measured value, if it falls
within this range.
• Widen Test Limits – The percentages used to calculate the new upper or lower test limit.
New lower limit = measured value - (specified percentage x measured value)
New upper limit = measured value + (specified percentage x measured value)
For tests with threshold values, the upper limit is used as the threshold.
Change Test Value Specify whether the Optimizer should change the test value. It will set the test value to the
measured value, if it falls within the working range.
• Lower limit, Upper limit – Defines the working range.
VTEP/TestJet Tests 80
Debug VTEP/TestJet Tests 83
AutoDebug for VTEP/TestJet 85
Debugging VTEP/TestJet Tests
VTEP/TestJet Tests
Vectorless Test EP (VTEP) or TestJet tests for manufacturing defects such as open
connections, missing devices, and improperly positioned (skewed) devices. Either
VTEP or TestJet tests are developed, depending on your hardware.
In the Test Explorer, click TestJet/VTEP to view the test list.
Pin table
Column Description
Pin No. Pin number
Low Limit, High Limit
Throughput Ad justment The options are on the drop-down list are:
• <blank> – Throughput adjustment 0
• Throughput Adjustment – Throughput adjustment 1
• iVTEP – Throughput adjustment 2
• VTEP Enhanced Guarding – Throughput adjustment 4
Measured Value Measured value
Column Description
Test Resul t Status of the pin test
Threshold Low, Values that determine whether the test passes or fails
Threshold High
Commented Comments out the pin
Std Dev Standard deviation of multiple runs
Mean Mean value of multiple runs
CPK CPK value of multiple runs
Remark Lets you add comments on the test
Chart
The chart plots the high and low thresholds for each device. Run N Times will
update the chart showing the maximum, minimum, and average measurement for
each pin.
You can adjust the display by changing the maximum value on the Y-axis (enter the
value and click Reload Chart).
TestJet Macros
These macros were developed for TestJet and have not been updated for VTEP.
The recommendations they give may be worth considering for VTEP, but they have
not been validated against the better performance characteristics of VTEP.
Macro Description
Close Ad just - With Board Close Adjust checks for the effect of close probes.
Close Ad just - Without Board The macros measure and compare values with and without the board. The report
Close Ad just - Calculate Resul ts generated gives recommendations for manual adjustments to some of the low
thresholds to account for bottom side devices being close to probes in the fixture
and measuring extra capacitance even if a pin is open.
Missing Ad just - Blank Missing Adjust determines if the test detects missing devices.
Missing Ad just - Loaded The macros measure and compare the difference between a loaded and a blank
Missing Ad just - Calculate Resul ts board. The report generated gives recommendations for manual adjustments to
some of the high thresholds to make sure the test fails if the device is missing. A
sensor plate directly touching the bare board usually measures higher than normal
readings when the device is missing.
• Undo Last AutoDebug will undo the last AutoDebug operation (run AutoDebug,
restore test, or restore device).
• Restore Original Test reverts to the original test file. This discards any learned
limits, and recovers any pins commented out by AutoDebug.
• Restore Selected Device(s) reverts to the original device(s).
Run iVTEP
This option runs AutoDebug on the selected devices. Any pins commented out by
AutoDebug are then re-tested using the iVTEP technique.
It makes a backup of the test, runs the test, evaluates the results to calculate the
new thresholds, and applies a CPK analysis. Pins that read below a minimum CPK
then have throughput adjustment 2 added and thresholds set to 1 and 10. This
turns on the iVTEP measurement for those pins.
The test is compiled and run a second time and only those pins are analyzed. Those
that are less than the minimum CPK are commented, the test is compiled for a final
time.
Do not change the threshold values when using this option.
Column Description
LowestLowLimit Controls the lowest limit set. No limit will be set lower than the LowestLowLimit.
MinCpk Determines when pins are commented out of the test.
After the limits are calculated, the Cpk for each pin is also calculated as follows:
mean - closest limit
Cpk =
3*standard deviation
Any pin whose Cpk falls below this value will be commented out.
Note: The Cpk is calculated using the mean and standard deviation from the set of 10
readings taken when AutoDebug is run on this test. It is not a Cpk across all boards that have
run through AutoDebug.
HiPercent, HiMinOffset Parameters used in calculating the high limit. The formula is as follows:
HiLimit = mean + max ((mean*HiPercent), HiMinOffset)
LowPercent, Parameters used in calculating the low limit. The formula is as follows:
LowMinOffset LowLimit = mean - max ((mean*LowPercent), LowMinOffset)
c From the Tools menu, select Learn > Off before running the tests again.
d Repeat the tests with a few more boards to check test stability.
3 To make any adjustments, right-click the test and select Open Test Source.
4 Save changes and repeat step 2.
Refer to Using Pushbutton Debug in the i3070 help for suggestions on debugging
Connect Check tests.
Debug Pane
The following tables provide brief descriptions of the test options and parameters
in the Debug Pane. For more information about digital testing, see Digital Testing
in the i3070 online help.
Column Description
Pin, Node Device pins and associated nodes.
Pin Type Inputs, outputs, or bidirectional.
Test Resul t Indicates if the test passed or failed.
Input Defaul t Input default for each pin, 0, 1, or X.
Drive Low, Drive High Adjust driver voltages.
Receive Low, Receive Adjust receiver voltages.
High
Slew Rate Set the slew rate, which determines the rise time of the driven pulses.
Terminator Select this option to connect the RC networks in the receiver circuits,
to enhance high-speed signal quality.
Column Description
Ad vanced Options
Receiver Offset(a), Change the offset on the indicated receiver. Keep the offsets the same
Receiver Offset(b) for two receivers on the same pin where possible.
Driver Offset(a), Change the offset on the indicated driver. Keep the offsets the same
Driver Offset(b) for two drivers on the same pin where possible.
Probe Offset(a), Change the offset on the indicated probe channel.
Probe Offset(b)
Set Driver State To Modify the driver state on an input or bidirectional node or pin, for one
or more machine vectors.
Click in the cell and click the down arrow icon to select a setting from
the dropdown list, then click Set.
Set Receiver State To Modify the receiver state on an input or bidirectional node or pin, for
one or more machine vectors.
Click in the cell and click the down arrow icon to select a setting from
the dropdown list, then click Set.
Other Settings
Family The family establishes the parameter values for all pins in the VCL test.
Vector Cycle Lets you temporarily change the timing of the vectors.
Receive Delay
Action Description
Display Ad justments Lists changes to the test parameters made during debugging.
Remove Adjustments Cancels all changes made.
Debug Status Lists debug resources and other information about the test being
debugged. The list is sent to the current printer is device.
This does not include information about the cause of failure.
Diagnose Faul ts Diagnose failing tests by automatically changing the parmeters and
running the tests several times to check test stability. The list is sent to
the current printer is device.
Diagnose Faul ts: Diagnose faults and provides more detailed information.
Verbose
Action Description
Generate Backpatch Save debug data to a backpatch file named <test path>.bp. This
will contain the same information as the Display Adjustments
function.
Get Backpatch Retrieve debug data from the backpatch file.
Display Probe Setup Sends probe setup details to the current printer is device.
Parameter Description
Probe/Others
Probe Offset(a), Changes the offset on the indicated probe channel.
Probe Offset(b) The offset (-30 ns to 100 ns) from the event on which the activity is to occur.
A value cannot be used if it would place two transitions (state changes) on the same pin
closer than 50 ns, or if the transition would then occur in the next vector.
Probe Receive High/Low Programs the probe to set the specified values.
Set Probe to Node or Pin Programs the probe to set the same values as those currently set on the receiver pin selected
in the pins table. If you need to look at the actual signals on a driver, you must program the
probe to a receiver’s values.
If the values on the pin changes, note that the probe values do not update automatically. You
will need to set them again.
Data to Node/Pin Connect debug port (data) to the node/pin selected in the pins table.
Clock to Node Connect debug port (clock) to the node/pin selected in the pins table.
Verify Faul ts Simulates fault conditions on nodes and runs the test. Only one fault on one node is
simulated for each run of the test. If the test fails, the fault was found; if the test passes, the
fault was not found. The test results are sent to the current printer is device.
Display Setups Sends pin channel setup details to the current printer is device (whether the channel is
driving or receiving, events (FCLKs) in the machine vectors, offsets, high and low driver or
receiver voltages).
Add/Remove
Add Driver/Receiver on Assign resource to a node for a VCL test.
Node • Note that the node must have a fixture wire connected to the resource being added.
• The resource is added for the current debug session only.
• If you decide to permanently add the resouce, you must assign them in the VCL test. Use
the Generate Backpath function to save the changes to a file as a checklist when editing
the VCL test.
• All the digital debug functions apply to the added resources.
Parameter Description
Add Sync At Adds a sync pulse at the specified vector.
Expand Homingloop At Displays all homingloop machine vectors including the piped vectors for each pass through
the homingloop. Specify the machine vector number of the last piped vector for the
homingloop you are expanding.
Without this function digital debug displays only the first pass through the loop.
Add Driver/Receiver Add a driver or receiver.
Add/Delete Vector Add or delete a vector.
Timing
Select Edge Falling, Temporarily changes the trigger edge of the external clock used to synchronize the test
Select Edge Rising timing.
Events Every Internal Specify the time between events (i.e., temporarily change the period of the reference clock).
DUT Clock Specify the period of the DUT clock.
Learn test Time Executes a VCL test the specified number of times and reports the time required for the test
to run.
Vector Timing Modifies the position of the data strobes within the specified machine vector.
Ports Connect debug port (sync, clock or data) to a resource.
Clock to Event Clock Connects clock to an event clock (TCLK).
Clock to Timing Clock Connects clock to a timing clock (FCLK).
Clock to Vector Clock Connects clock to a vector clock (SCLK).
Sync to Debug Sync Connects sync to debug port (sync).
Sync to Program Sync Connects sync to the program sync (sync setup in a VCL test).
Sync to Vector Clock Connects sync to a vector clock (SCLK).
Remove Sync Cancels the sync setting.
Waveform Pane
Use the Waveform display to help debug the test. The display options (shown in
Figure 20) are described in Table 12.
If you make changes and save the tests in the Debug pane, click Display Refresh
to update the waveform display.
If you click Display Failure, a new waveform is added to the previous display.
Figure 20 Waveform
5 3 9 1 2 7
6 4
4 Show binary states 1 Click the down arrow and select Track Ball Info. Figure 25
2 Move the cursor to any vector to display binary states at that vector.
5 Expected, Actual, 1 Choose the data to display by clicking in the checkboxes. Figure 26
Vector 2 Then click Display Waveform to update the display.
Include Vector to show the drive/receive status on the waveform.
Graphics Display
The vectors displayed are machine vectors; they are numbered along the top, and
the number of the first vector in the display (the start vector) is shown at the
upperleft. Piped vectors, if any, are identified by the letter P.
Vector 0 (not visible in the example) is shown as an asterisk because it is not an
actual vector. In the display, it indicates the initial conditions (X or Z) which exist
when the test starts and before the first vector is executed.
The displayed waveforms are numbered on the left side of the display, and identified
by pin, or node, and the type of data collected for that node: actual, expected, or
failed.
Colors are used in the waveforms to denote the different types of data:
• Green for actual states. That is, states that have been received by a system
receiver or by the probe.
• White for expected driver and receiver states read from the test.
• Red for failed states. The expected level of a failed state will be displayed.
States Display
The states display contains the same information as the graphics display except
that the states are shown as logic 1’s, 0’s and X’s.
Hex Display
Hex display is useful for looking at groups of bus lines, such as address lines whose
states change in a counting sequence.
This display shows basically the same information as the states display except that
every four lines are combined into one line. For each vector, the states on the four
lines are combined to form a hexadecimal digit, with the top state being the most
significant bit of that digit. For example, if the four states, from top to bottom, are
0100, then the digit 4 is displayed. If the states are 1011, a B is displayed. An X is
displayed if any one of the four combined states is an X.
When the lines are combined, all four lines assume the same type as the first (top)
line in the group. For instance, if the first line was displaying expected data, then all
four lines will now show expected data.
Test Source
• Select Test Source to open the test source for editing.
• You can locate a particular vector, unit or subroutine by selecting it from the
Outline drop-down list.
• Right-click in the Test Source pane to display a context menu with editing
functions.
• When you make changes, clicking Save will save and compile the test. This also
stops the debugging.
To continue debug with the updated test source, click Start Debug again in the
Debug pane.
Frame Debugger
Since boundary scan tests are serial in nature, a failure introduced at a given vector
may not be detected until hundreds of vectors later. The Frame Debugger
addresses this challenge by graphically displaying predicted and actual information
in parallel for each frame cell.
The Frame Debugger is based on the concepts of frames and frame cells. The
boundary registers of each device in a boundary scan chain are connected together,
and a pattern of data in this chain is known as a frame. Each cell in the chain is a
chain cell, and the chain cells on the interconnect nodes are known as frame cells.
When the data in a frame cell varies from what is expected for the frame, the frame
cell is said to fail for that frame. In the Expected/Actual column (Figure 31), each
bit represents a frame. Chain cells that fail one or more frames will have two lines
displayed in red in the column: predicted values on the first line and actual values
on the second.
ITL
The ITL (InterconnectPlus Test Language) pane show the high-level requirements
for the boundary scan tests for your devices, written by the software. On the ITL
pane, expand the sections to view or edit the settings.
General Information
Column Description
Test Inputs Only When selected, tests only the inputs on bidirectional pins.
Checkerboard • Without this option, the default test patterns drive and receive
all ones and all zeros.
• When selected, it alters the test patterns to a checkerboard
pattern in which there is a mix of ones and zeros at one test
vector and the inverse at the next test vector.
Ground Bounce Suppression When selected, this option suppresses the ground bounce effect.
Click TPG Warning to view any warning messages (from test generation).
Device List
Lists the devices to be tested.
Column Description
TAP Only If selected, indicates that the device will be tested as TAP only
because of a compliance problem.
Otherwise, full boundary scan test capability is employed.
Disable Indicates whether boundary scan disabling is required.
Ignore Instruction Indicates whether to ignore the contents of the specified register
Ignore DeviceID during boundary scan testing.
Ignore Bypass
Insert Source
Sequence of routines or bit patterns (PCF format only) that configure the boundary
scan device to put it into a particular test mode.
Disable Information
If more than one device has to be preconditioned at a time, and their disabling
methods conflict, the software is not able to do the preconditioning. In such cases,
you may need to edit the disable information in this section.
Node List
Lists the nodes in this test. If there are any failure nodes after testing, you can
comment out all the failed nodes.
4 Run N Times and review the histogram results. If needed, edit the Test Source.
When debugging a mixed test, you can track the continue analog/continue
digital statements in the test source display. For example, click on continue
analog in the Digital Test Source (yellow marker) to jump to the corresponding line
in the Analog Test Source display (green marker) .
Figure 33 Testplan
Active Testplan
When a project is opened, the testplan is Active, as indicated at the top-left corner.
If you subsequently open any other testplans, they will be Inactive and the status
cannot be changed.
Right-click in the testplan to display a context menu. Besides the common editing
functions, the context menu provides the following:
• Comment Line(s) – Comment out the current line.
You can select several lines before right-clicking and selecting the function.
• Add Watch – Right-click on a variable and select Add Watch to add the
variable to the Watch list. The variable(s) added will be monitored during test
execution.
• Add Breakpoint – Sets a breakpoint at the current line. Test execution will
pause at the breakpoint.
• Add Bookmark – Bookmarks the current line.
• Find All References – Right-click on a variable or other item and select Find All
References to list all references to that item.
Step Into
Debug Step Over
Step Out
1 Set the breakpoints in the testplan by clicking to the left of the line number.
2 To specify any variables to monitor during the debug, right-click on the variable
in the testplan and select Add Watch.
3 Click Debug on the toolbar.
The testplan is run and execution will pause at the first breakpoint.
4 Scenario 1: Debug subroutine using testplan step controls
a At the breakpoint, click the Step Into button to jump to the subroutine.
– Click the Step Into button to execute the test steps one at a time.
(Use Step Over if you want to skip a test step.)
– Click the Step Out button to exit the subroutine and return to the line
after the subroutine call.
Testplan Variables
This pane provides quick access to the testplan variables described in Table 13.
These are optional test features that can be enabled for production testing. If you
make changes, click Save to save the settings.
Variable Description
QSTATS_Mode • Off – Set datalogging off.
• No_Histo – Logs failing data and disables random sampling.
• Histo – Logs failing data and enables the random sampling of
data from 10% (the default) of the analog components that pass.
This enables Pushbutton Q-STATS to produce histograms that are
statistically meaningful.
Chek_Point_Mode CHEK-POINT determines if the board under test is making contact
with the fixture.
• Off – Set CHEK-POINT off.
• Pretest – Set CHEK-POINT to be executed every time.
• Failures – Execute CHEK-POINT on failed devices only.
Using_IYET Enable Intelligent Yield Enhancement Test (IYET).
IYET_Report_On Enable IYET reporting.
Report_Printer$ Specify where to send reports.
Testrev$ Revision number for the testplan.
Variable Description
Serial_Length Length of the board ID number (for barcode scanning).
IYET_Preshorts_Attempts IYET re-tests only failing tests, unlike standard testing. This sets the
number of re-test attempts for preshorts. Only the last re-test result
will be logged.
Before using Board Test Insight as the Operator interface, close any i3070
applications that are running.
Production Testing
Production Workflow
The following is a sample workflow for using Board Test Insight on the i3070
Series 5 In-Circuit Test System during production.
1 Click Open Project to load the project (board directory).
2 Click Acquire Testhead.
3 Place a test fixture on the testhead and click Fixture Lock.
4 Click Run.
You can use the Prev and Next buttons to recall executed commands.
Shortcut Description
Enter Execute command
Up or F3 Previous command
Down or F2 Next command
F10 Clear text
F11 Clear text from cursor
F12 Clear output messages