STM32F105xx

STM32F107xx
Connectivity line, ARM-based 32-bit MCU with 64/256 KB Flash, USB
OTG, Ethernet, 10 timers, 2 CANs, 2 ADCs, 14 communication interfaces

Features
■ Core: ARM 32-bit Cortex™-M3 CPU
– 72 MHz maximum frequency, LQFP100 14 × 14 mm
1.25 DMIPS/MHz (Dhrystone 2.1) LQFP64 10 × 10 mm
performance at 0 wait state memory
access ■ Up to 10 timers with pinout remap capability
– Single-cycle multiplication and hardware
– Up to four 16-bit timers, each with up to 4
division
IC/OC/PWM or pulse counter and
■ Memories quadrature (incremental) encoder input
– 64 to 256 Kbytes of Flash memory – 1 × 16-bit motor control PWM timer with
– up to 64 Kbytes of general-purpose SRAM dead-time generation and emergency stop
■ Clock, reset and supply management – 2 × watchdog timers (Independent and
Window)
– 2.0 to 3.6 V application supply and I/Os
– SysTick timer: a 24-bit downcounter
– POR, PDR, and programmable voltage
detector (PVD) – 2 × 16-bit basic timers to drive the DAC
– 3-to-25 MHz crystal oscillator ■ Up to 14 communication interfaces with pinout
– Internal 8 MHz factory-trimmed RC remap capability
– Internal 40 kHz RC with calibration – Up to 2 × I2C interfaces (SMBus/PMBus)
– 32 kHz oscillator for RTC with calibration – Up to 5 USARTs (ISO 7816 interface, LIN,
■ Low power IrDA capability, modem control)
– Sleep, Stop and Standby modes – Up to 3 SPIs (18 Mbit/s), 2 with a
multiplexed I2S interface that offers audio
– VBAT supply for RTC and backup registers
class accuracy via advanced PLL schemes
■ 2 × 12-bit, 1 µs A/D converters (16 channels) – 2 × CAN interfaces (2.0B Active) with
– Conversion range: 0 to 3.6 V 512 bytes of dedicated SRAM
– Sample and hold capability – USB 2.0 full-speed device/host/OTG
– Temperature sensor controller with on-chip PHY that supports
– up to 2 MSPS in interleaved mode HNP/SRP/ID with 1.25 Kbytes of dedicated
■ 2 × 12-bit D/A converters SRAM
– 10/100 Ethernet MAC with dedicated DMA
■ DMA: 12-channel DMA controller and SRAM (4 Kbytes): IEEE1588 hardware
– Supported peripherals: timers, ADCs, DAC, support, MII/RMII available on all packages
I2Ss, SPIs, I2Cs and USARTs
■ Debug mode Table 1. Device summary
– Serial wire debug (SWD) & JTAG interfaces Reference Part number
– Cortex-M3 Embedded Trace Macrocell™
STM32F105R8, STM32F105V8
■ Up to 80 fast I/O ports STM32F105xx STM32F105RB, STM32F105VB
– 51/80 I/Os, all mappable on 16 external STM32F105RC, STM32F105VC
interrupt vectors and almost all 5 V-tolerant
STM32F107RB, STM32F107VB
■ CRC calculation unit, 96-bit unique ID STM32F107xx
STM32F107RC, STM32F107VC

September 2009 Doc ID 15274 Rev 4 1/95

www.st.com 1
Contents STM32F105xx, STM32F107xx

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2 Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.1 ARM® Cortex™-M3 core with embedded Flash and SRAM . . . . . . . . . 13
2.3.2 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.3 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 13
2.3.4 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.5 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 13
2.3.6 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.7 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.8 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.9 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.10 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.11 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.12 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.13 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.3.14 RTC (real-time clock) and backup registers . . . . . . . . . . . . . . . . . . . . . . 16
2.3.15 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.3.16 I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.3.17 Universal synchronous/asynchronous receiver transmitters (USARTs) 18
2.3.18 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3.19 Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3.20 Ethernet MAC interface with dedicated DMA and IEEE 1588 support . 19
2.3.21 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3.22 Universal serial bus on-the-go full-speed (USB OTG FS) . . . . . . . . . . . 20
2.3.23 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3.24 Remap capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.25 ADCs (analog-to-digital converters) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.26 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.27 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.3.28 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 22

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2.3.29 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 35
5.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 35
5.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3.6 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.3.7 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
5.3.8 PLL, PLL2 and PLL3 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.3.9 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.3.10 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.3.11 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 52
5.3.12 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.3.13 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
5.3.14 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.3.15 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
5.3.16 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.3.17 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
5.3.18 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

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Contents STM32F105xx, STM32F107xx

6.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

6.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.2.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.2.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . . 80

7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Appendix A Applicative block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

A.1 USB OTG FS interface solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
A.2 Ethernet interface solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
A.3 Complete audio player solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
A.4 USB OTG FS interface + Ethernet/I2S interface solutions . . . . . . . . . . . . 89

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

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STM32F105xx, STM32F107xx List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. STM32F105xx and STM32F107xx features and peripheral counts . . . . . . . . . . . . . . . . . . 10
Table 3. STM32F105xx and STM32F107xx family versus STM32F103xx family . . . . . . . . . . . . . . 11
Table 4. Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 5. Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 6. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 7. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 8. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 9. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 10. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 11. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 12. Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 13. Maximum current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 14. Maximum current consumption in Run mode, code with data processing
running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 15. Maximum current consumption in Sleep mode, code running from Flash or RAM. . . . . . . 38
Table 16. Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 38
Table 17. Typical current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 18. Typical current consumption in Sleep mode, code running from Flash or
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 19. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 20. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 21. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 22. HSE 3-25 MHz oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 23. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 24. HSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 25. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 26. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 27. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 28. PLL2 and PLL3 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 29. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 30. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 31. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 32. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 33. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 34. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 35. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 36. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 37. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 38. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 39. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 40. I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 41. SCL frequency (fPCLK1= 36 MHz.,VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 42. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 43. I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 44. USB OTG FS startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

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List of tables STM32F105xx, STM32F107xx

Table 45. USB OTG FS DC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Table 46. USB OTG FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 47. Ethernet DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 48. Dynamics characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 49. Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 50. Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 51. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 52. RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 53. ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 54. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 55. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 56. TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 57. LQPF100 – 100-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . 77
Table 58. LQFP64 – 64 pin low-profile quad flat package mechanical data. . . . . . . . . . . . . . . . . . . . 78
Table 59. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Table 60. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 61. PLL configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 62. Applicative current consumption in Run mode, code with data
processing running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 63. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

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STM32F105xx, STM32F107xx List of figures

List of figures

Figure 1. STM32F105xx and STM32F107xx connectivity line block diagram . . . . . . . . . . . . . . . . . 12

Figure 2. STM32F105xxx and STM32F107xxx connectivity line LQFP100 pinout . . . . . . . . . . . . . . 23
Figure 3. STM32F105xxx and STM32F107xxx connectivity line LQFP64 pinout . . . . . . . . . . . . . . . 24
Figure 4. Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 5. Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 6. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 7. Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 8. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 9. Typical current consumption on VBAT with RTC on vs. temperature at
different VBAT values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 10. Typical current consumption in Stop mode with regulator in Run mode
versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 11. Typical current consumption in Stop mode with regulator in Low-power
mode versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 12. Typical current consumption in Standby mode versus temperature at
different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 13. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 14. Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 15. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 16. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 17. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 18. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 19. I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 20. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 21. SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 22. SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 23. I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 24. I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 25. USB OTG FS timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . 65
Figure 26. Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 27. Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 28. Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 29. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 30. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 31. Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . . 72
Figure 32. Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . . 72
Figure 33. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Figure 34. LQFP100, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 35. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 36. LQFP64 – 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 37. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 38. LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 39. USB OTG FS device mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Figure 40. Host connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 41. OTG connection (any protocol). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 42. MII mode using a 25 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 43. RMII with a 50 MHz oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 44. RMII with a 25 MHz crystal and PHY with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

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List of figures STM32F105xx, STM32F107xx

Figure 45. RMII with a 25 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Figure 46. Complete audio player solution 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 47. Complete audio player solution 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 48. USB OTG FS + Ethernet solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Figure 49. USB OTG FS + I2S (Audio) solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

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STM32F105xx, STM32F107xx Introduction

1 Introduction

This datasheet provides the description of the STM32F105xx and STM32F107xx

connectivity line microcontrollers. For more details on the whole STMicroelectronics
STM32F10xxx family, please refer to Section 2.2: Full compatibility throughout the family.
The STM32F105xx and STM32F107xx datasheet should be read in conjunction with the
STM32F10xxx reference manual.
For information on programming, erasing and protection of the internal Flash memory
please refer to the STM32F10xxx Flash programming manual.
The reference and Flash programming manuals are both available from the
STMicroelectronics website www.st.com.
For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical
Reference Manual, available from the www.arm.com website at the following address:
http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0337e/.

2 Description

The STM32F105xx and STM32F107xx connectivity line family incorporates the high-
performance ARM® Cortex™-M3 32-bit RISC core operating at a 72 MHz frequency, high-
speed embedded memories (Flash memory up to 256 Kbytes and SRAM up to 64 Kbytes),
and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All
devices offer two 12-bit ADCs, four general-purpose 16-bit timers plus a PWM timer, as well
as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss,
five USARTs, an USB OTG FS and two CANs. Ethernet is available on the STM32F107xx
only.
The STM32F105xx and STM32F107xx connectivity line family operates in the –40 to
+105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of
power-saving mode allows the design of low-power applications.
The STM32F105xx and STM32F107xx connectivity line family offers devices in two different
package types: from 64 pins to 100 pins. Depending on the device chosen, different sets of
peripherals are included, the description below gives an overview of the complete range of
peripherals proposed in this family.

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Description STM32F105xx, STM32F107xx

These features make the STM32F105xx and STM32F107xx connectivity line

microcontroller family suitable for a wide range of applications:
● Motor drive and application control
● Medical and handheld equipment
● Industrial applications: PLC, inverters, printers, and scanners
● Alarm systems, Video intercom, and HVAC
● Home audio equipment
Figure 1 shows the general block diagram of the device family.

2.1 Device overview

Table 2. STM32F105xx and STM32F107xx features and peripheral counts
Peripherals(1) STM32F105Rx STM32F107Rx STM32F105Vx STM32F107Vx

Flash memory in Kbytes 64 128 256 128 256 64 128 256 128 256
SRAM in Kbytes 20 32 64 48 64 20 32 64 48 64
Ethernet No Yes No Yes
General-purpose 4
Timers Advanced-control 1
Basic 2
2 (2)
SPI(I S) 3(2) 3(2) 3(2) 3(2)
I2C 2 1 2 1
Communication
USART 5
interfaces
USB OTG FS Yes
CAN 2
GPIOs 51 80
12-bit ADC 2
Number of channels 16
12-bit DAC 2
Number of channels 2
CPU frequency 72 MHz
Operating voltage 2.0 to 3.6 V
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Operating temperatures
Junction temperature: –40 to + 125 °C
Package LQFP64 LQFP100
1. Please refer to Table 5: Pin definitions for peripheral availability when the I/O pins are shared by the peripherals required
by the application.
2. The SPI2 and SPI3 interfaces give the flexibility to work in either the SPI mode or the I2S audio mode.

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STM32F105xx, STM32F107xx Description

2.2 Full compatibility throughout the family

The STM32F105xx and STM32F107xx constitute the connectivity line family whose
members are fully pin-to-pin, software and feature compatible.
The STM32F105xx and STM32F107xx are a drop-in replacement for the low-density
(STM32F103x4/6), medium-density (STM32F103x8/B) and high-density
(STM32F103xC/D/E) performance line devices, allowing the user to try different memory
densities and peripherals providing a greater degree of freedom during the development
cycle.

Table 3. STM32F105xx and STM32F107xx family versus STM32F103xx family(1)

STM32 Low-density Medium-density High-density
STM32F105xx STM32F107xx
device STM32F103xx devices STM32F103xx devices STM32F103xx devices

Flash
16 32 32 64 128 256 384 512 64 128 256 128 256
size (KB)

RAM
6 10 10 20 20 48 64 64 20 32 64 48 64
size (KB)

144 pins

100 pins 5 × USARTs,

5 × USARTs,
5 × USARTs 4 × 16-bit timers,
4 × 16-bit timers,
4 × 16-bit timers, 2 × basic timers,
3 × USARTs 2 × basic timers,
2 × basic timers, 3 × SPIs, 3 × SPIs, 3 × SPIs,
2 × USARTs 3 × 16-bit 2
2 × I Ss, 2 × I2Cs, USB, 2 × I2Ss, 2 × I2S,
2 × 16-bit timers 1 × I2C,
2 × USARTs CAN, 2 × PWM timers 2 × I2Cs,
timers 2 × SPIs, USB OTG FS,
64 pins 2 × 16-bit timers 2 3 × ADCs, 2 × DACs, USB OTG FS,
1 × SPI, 2 × I Cs, USB, 1 × SDIO, FSMC (100- 2 × CANs,
1 × SPI, 1 × I2C, USB, 2 × CANs,
1 × I2C, CAN, (2)
and 144-pin packages ) 1 × PWM timer, 1 × PWM timer,
CAN,
USB, CAN, 1 × PWM timer 2 × ADCs,
1 × PWM timer 2 × ADCs,
1 × PWM 2 × ADCs 2 × DACs,
2 × ADCs 2 × DACs
timer Ethernet
2 × ADCs
48 pins

36 pins

1. Please refer to Table 5: Pin definitions for peripheral availability when the I/O pins are shared by the peripherals required
by the application.
2. Ports F and G are not available in devices delivered in 100-pin packages.

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Description STM32F105xx, STM32F107xx

2.3 Overview
Figure 1. STM32F105xx and STM32F107xx connectivity line block diagram
TRACECLK
TRACED[0:3] TPIU Power
ETM VDD18
as AF Trace/Trig VDD = 2 to 3.6 V
SW/JTAG Voltage reg.
NJTRST VSS

Flashl obl
Interface
3.3 V to 1.8 V
JTDI Ibus Flash 256 KB
JTCK/SWCLK Cortex-M3 CPU 64 bit @VDD
JTMS/SWDIO
JTDO POR
Fmax : 72 MHz Dbus Supply
as A F Reset supervision NRST
SRAM @VDDA
Int VDDA
System 64 KB POR / PDR
RC HS VSSA

Bus Matri x
NVIC RC LS PVD
PLL3
GP DMA1 @VDDA
MII_TXD[3:0]/RMII_TXD[1:0] @VDD
PLL2 OSC_IN
MII_TX_CLK/RMII_TX_CLK 7 channels
XTAL osc OSC_OUT
C_O
MII_TX_EN/RMII_TX_EN PLL 3-25 MHz
MII_RXD[3:0]/RMII_RXD[1:0] GP DMA2
MII_RX_ER/RMII_RX_ER PCLK1 IWDG
5 channels Reset &
MII_RX_CLK/RMII_REF_CLK PCLK2
MII_RX_DV/RMII_CRS_DV clock HCLK Standby
MII_CRS control interface VBAT =1.8 V to 3.6 V
FCLK
MII_COL/RMII_COL Ethernet MAC PLL3 @VBAT
MDC 10/100
OSC32_IN
MDIO DMA Ethernet XTAL 32kHz
OSC32_OUT
PPS_OUT
AHB

RTC Bac kup

SOF register TAMPER-RTC/
DPRAM 2 KB DPRAM 2 KB AWU ALARM/SECOND OUT
VBUS
ID Backup interface
DM USB OTG FS
DP TIM2 4 Channels , ETR
as AF
AHB to AHB to TIM3 4 Channels , ETR
SRAM 1.25 KB APB2 APB1 as AF
TIM4 4 Channels , ETR
EXT.IT
80 AF as AF
WKUP
TIM5 4 Channel s, ETR
APB1 : Fmax = 36 MHz

PA[ 15:0] GPIO

P port A as A F
APB2 : F max = 72 MHz

RX,TX, CTS, RTS,

USART2
PB[ 15:0] GPIO
P port B CK as AF
RX,TX, CTS, RTS,
USART3
PC[15:0] GPIO port C CK as AF

UART4 RX,TX as AF
PD[15:0] GPIO port D

UART5 RX,TX as AF
PE[15:0] GPIO port E
MOSI/SD, MISO, MCK,
SPI2
2x(8x16b it) / I2S2(1) SCK/CK, NSS/WS as AF
4 Channels
4 compl. Channels MOSI/SD, MISO, MCK,
TIM1
BKIN, ETR input as AF SPI3
2x(8x16b it) / I2S3 SCK/CK, NSS/WS as AF

I2C1 SCL,SDA, SMBA

as AF
MOSI,MISO, I2C2(1) SCL,SDA,SMBA
SCK,NSS as AF SPI1
as AF
RX,TX, CTS, RTS,
WWDG bx CAN1 CAN1_TX as AF
CK as AF USART1
CAN1_RX as AF
SRAM 512B
Temp sensor

bx CAN2 CAN2_TX a
s AF
16 ADC12_INs 12bi t ADC1 IF
CAN2_RX as AF
common to
ADC1 & ADC2 12bit ADC2 IF TIM6 IF 12bit DAC1 DAC_OUT1 as AF
IF
TIM7 12bit DAC 2 DAC_OUT2 as AF

VREF– @VDDA
@VDDA
VREF+

ai15411

1. TA = –40 °C to +85 °C (suffix 6, see Table 60) or –40 °C to +105 °C (suffix 7, see Table 60), junction temperature up to
105 °C or 125 °C, respectively.
2. AF = alternate function on I/O port pin.

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STM32F105xx, STM32F107xx Description

2.3.1 ARM® Cortex™-M3 core with embedded Flash and SRAM

The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded
systems. It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
The ARM Cortex™-M3 32-bit RISC processor features exceptional code-efficiency,
delivering the high-performance expected from an ARM core in the memory size usually
associated with 8- and 16-bit devices.
With its embedded ARM core, STM32F105xx and STM32F107xx connectivity line family is
compatible with all ARM tools and software.
Figure 1 shows the general block diagram of the device family.

2.3.2 Embedded Flash memory

64 to 256 Kbytes of embedded Flash is available for storing programs and data.

2.3.3 CRC (cyclic redundancy check) calculation unit

The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit
data word and a fixed generator polynomial.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at link-
time and stored at a given memory location.

2.3.4 Embedded SRAM

20 to 64 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait
states.

2.3.5 Nested vectored interrupt controller (NVIC)

The STM32F105xx and STM32F107xx connectivity line embeds a nested vectored interrupt
controller able to handle up to 67 maskable interrupt channels (not including the 16 interrupt
lines of Cortex™-M3) and 16 priority levels.
● Closely coupled NVIC gives low latency interrupt processing
● Interrupt entry vector table address passed directly to the core
● Closely coupled NVIC core interface
● Allows early processing of interrupts
● Processing of late arriving higher priority interrupts
● Support for tail-chaining
● Processor state automatically saved
● Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimal interrupt
latency.

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Description STM32F105xx, STM32F107xx

2.3.6 External interrupt/event controller (EXTI)

The external interrupt/event controller consists of 20 edge detector lines used to generate
interrupt/event requests. Each line can be independently configured to select the trigger
event (rising edge, falling edge, both) and can be masked independently. A pending register
maintains the status of the interrupt requests. The EXTI can detect an external line with a
pulse width shorter than the Internal APB2 clock period. Up to 80 GPIOs can be connected
to the 16 external interrupt lines.

2.3.7 Clocks and startup

System clock selection is performed on startup, however, the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 3-25 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example with
failure of an indirectly used external oscillator).
A single 25 MHz crystal can clock the entire system including the ethernet and USB OTG
FS peripherals. Several prescalers and PLLs allow the configuration of the AHB frequency,
the high speed APB (APB2) and the low speed APB (APB1) domains. The maximum
frequency of the AHB and the high speed APB domains is 72 MHz. The maximum allowed
frequency of the low speed APB domain is 36 MHz. Refer to Figure 48: USB OTG FS +
Ethernet solution on page 89.
The advanced clock controller clocks the core and all peripherals using a single crystal or
oscillator. In order to achieve audio class performance, an audio crystal can be used. In this
case, the I2S master clock can generate all standard sampling frequencies from 8 kHz to
96 kHz with less than 0.5% accuracy error. Refer to Figure 49: USB OTG FS + I2S (Audio)
solution on page 89.
To configure the PLLs, please refer to Table 61 on page 90, which provides PLL
configurations according to the application type.

2.3.8 Boot modes

At startup, boot pins are used to select one of three boot options:
● Boot from User Flash
● Boot from System Memory
● Boot from embedded SRAM
The boot loader is located in System Memory. It is used to reprogram the Flash memory by
using USART1, USART2 (remapped), CAN2 (remapped) or USB OTG FS in device mode
(DFU: device firmware upgrade). For remapped signals refer to Table 5: Pin definitions.
The USART peripheral operates with the internal 8 MHz oscillator (HSI), however the CAN
and USB OTG FS can only function if an external 8 MHz, 14.7456 MHz or 25 MHz clock
(HSE) is present.
For full details about the boot loader, please refer to AN2662.

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STM32F105xx, STM32F107xx Description

2.3.9 Power supply schemes

● VDD = 2.0 to 3.6 V: external power supply for I/Os and the internal regulator.
Provided externally through VDD pins.
● VSSA, VDDA = 2.0 to 3.6 V: external analog power supplies for ADC, Reset blocks, RCs
and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADC is used). VDDA
and VSSA must be connected to VDD and VSS, respectively.
● VBAT = 1.8 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup
registers (through power switch) when VDD is not present.

2.3.10 Power supply supervisor

The device has an integrated power-on reset (POR)/power-down reset (PDR) circuitry. It is
always active, and ensures proper operation starting from/down to 2 V. The device remains
in reset mode when VDD is below a specified threshold, VPOR/PDR, without the need for an
external reset circuit.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD/VDDA power supply and compares it to the VPVD threshold. An interrupt can be
generated when VDD/VDDA drops below the VPVD threshold and/or when VDD/VDDA is higher
than the VPVD threshold. The interrupt service routine can then generate a warning
message and/or put the MCU into a safe state. The PVD is enabled by software.

2.3.11 Voltage regulator

The regulator has three operation modes: main (MR), low power (LPR) and power down.
● MR is used in the nominal regulation mode (Run)
● LPR is used in the Stop modes.
● Power down is used in Standby mode: the regulator output is in high impedance: the
kernel circuitry is powered down, inducing zero consumption (but the contents of the
registers and SRAM are lost)
This regulator is always enabled after reset. It is disabled in Standby mode.

2.3.12 Low-power modes

The STM32F105xx and STM32F107xx connectivity line supports three low-power modes to
achieve the best compromise between low power consumption, short startup time and
available wakeup sources:
● Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.
● Stop mode
Stop mode achieves the lowest power consumption while retaining the content of
SRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC
and the HSE crystal oscillators are disabled. The voltage regulator can also be put
either in normal or in low-power mode.
The device can be woken up from Stop mode by any of the EXTI line. The EXTI line
source can be one of the 16 external lines, the PVD output, the RTC alarm or the USB
OTG FS wakeup.

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Description STM32F105xx, STM32F107xx

● Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire 1.8 V domain is powered off. The
PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering
Standby mode, SRAM and register contents are lost except for registers in the Backup
domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a
rising edge on the WKUP pin, or an RTC alarm occurs.
Note: The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop
or Standby mode.

2.3.13 DMA
The flexible 12-channel general-purpose DMAs (7 channels for DMA1 and 5 channels for
DMA2) are able to manage memory-to-memory, peripheral-to-memory and memory-to-
peripheral transfers. The two DMA controllers support circular buffer management,
removing the need for user code intervention when the controller reaches the end of the
buffer.
Each channel is connected to dedicated hardware DMA requests, with support for software
trigger on each channel. Configuration is made by software and transfer sizes between
source and destination are independent.
The DMA can be used with the main peripherals: SPI, I2C, USART, general-purpose, basic
and advanced control timers TIMx, DAC, I2S and ADC.
In the STM32F107xx, there is a DMA controller dedicated for use with the Ethernet (see
Section 2.3.20: Ethernet MAC interface with dedicated DMA and IEEE 1588 support for
more information).

2.3.14 RTC (real-time clock) and backup registers

The RTC and the backup registers are supplied through a switch that takes power either on
VDD supply when present or through the VBAT pin. The backup registers are forty-two 16-bit
registers used to store 84 bytes of user application data when VDD power is not present.
They are not reset by a system or power reset, and they are not reset when the device
wakes up from the Standby mode.
The real-time clock provides a set of continuously running counters which can be used with
suitable software to provide a clock calendar function, and provides an alarm interrupt and a
periodic interrupt. It is clocked by a 32.768 kHz external crystal, resonator or oscillator, the
internal low power RC oscillator or the high-speed external clock divided by 128. The
internal low-speed RC has a typical frequency of 40 kHz. The RTC can be calibrated using
an external 512 Hz output to compensate for any natural quartz deviation. The RTC features
a 32-bit programmable counter for long term measurement using the Compare register to
generate an alarm. A 20-bit prescaler is used for the time base clock and is by default
configured to generate a time base of 1 second from a clock at 32.768 kHz.
For more information, please refer to AN2604: “STM32F101xx and STM32F103xx RTC
calibration”, available from www.st.com.

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STM32F105xx, STM32F107xx Description

2.3.15 Timers and watchdogs

The STM32F105xx and STM32F107xx devices include an advanced-control timer, four
general-purpose timers, two basic timers, two watchdog timers and a SysTick timer.
Table 4 compares the features of the general-purpose and basic timers.

Table 4. Timer feature comparison

Counter Counter Prescaler DMA request Capture/compare Complementary
Timer
resolution type factor generation channels outputs

Up, Any integer

TIM1 16-bit down, between 1 Yes 4 Yes
up/down and 65536
TIMx
(TIM2, Up, Any integer
TIM3, 16-bit down, between 1 Yes 4 No
TIM4, up/down and 65536
TIM5)
Any integer
TIM6,
16-bit Up between 1 Yes 0 No
TIM7
and 65536

Advanced-control timer (TIM1)

The advanced control timer (TIM1) can be seen as a three-phase PWM multiplexed on 6
channels. It has complementary PWM outputs with programmable inserted dead-times. It
can also be seen as a complete general-purpose timer. The 4 independent channels can be
used for:
● Input capture
● Output compare
● PWM generation (edge or center-aligned modes)
● One-pulse mode output
If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If
configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
The counter can be frozen in debug mode.
Many features are shared with those of the standard TIM timers which have the same
architecture. The advanced control timer can therefore work together with the TIM timers via
the Timer Link feature for synchronization or event chaining.

General-purpose timers (TIMx)

There are up to 4 synchronizable standard timers (TIM2, TIM3, TIM4 and TIM5) embedded
in the STM32F105xx and STM32F107xx connectivity line devices. These timers are based
on a 16-bit auto-reload up/down counter, a 16-bit prescaler and feature 4 independent
channels each for input capture/output compare, PWM or one pulse mode output. This
gives up to 16 input captures / output compares / PWMs on the largest packages. They can
work together with the Advanced Control timer via the Timer Link feature for synchronization
or event chaining.
The counter can be frozen in debug mode.

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Description STM32F105xx, STM32F107xx

Any of the standard timers can be used to generate PWM outputs. Each of the timers has
independent DMA request generations.

Basic timers TIM6 and TIM7

These timers are mainly used for DAC trigger generation. They can also be used as a
generic 16-bit time base.

Independent watchdog
The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is
clocked from an independent 40 kHz internal RC and as it operates independently from the
main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog
to reset the device when a problem occurs, or as a free running timer for application timeout
management. It is hardware or software configurable through the option bytes. The counter
can be frozen in debug mode.

Window watchdog
The window watchdog is based on a 7-bit downcounter that can be set as free running. It
can be used as a watchdog to reset the device when a problem occurs. It is clocked from the
main clock. It has an early warning interrupt capability and the counter can be frozen in
debug mode.

SysTick timer
This timer is dedicated to real-time operating systems, but could also be used as a standard
down counter. It features:
● A 24-bit down counter
● Autoreload capability
● Maskable system interrupt generation when the counter reaches 0.
● Programmable clock source

2.3.16 I²C bus

Up to two I²C bus interfaces can operate in multimaster and slave modes. They can support
standard and fast modes.
They support 7/10-bit addressing mode and 7-bit dual addressing mode (as slave). A
hardware CRC generation/verification is embedded.
They can be served by DMA and they support SMBus 2.0/PMBus.

2.3.17 Universal synchronous/asynchronous receiver transmitters (USARTs)

The STM32F105xx and STM32F107xx connectivity line embeds three universal
synchronous/asynchronous receiver transmitters (USART1, USART2 and USART3) and
two universal asynchronous receiver transmitters (UART4 and UART5).
These five interfaces provide asynchronous communication, IrDA SIR ENDEC support,
multiprocessor communication mode, single-wire half-duplex communication mode and
have LIN Master/Slave capability.
The USART1 interface is able to communicate at speeds of up to 4.5 Mbit/s. The other
available interfaces communicate at up to 2.25 Mbit/s.

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STM32F105xx, STM32F107xx Description

USART1, USART2 and USART3 also provide hardware management of the CTS and RTS
signals, Smart Card mode (ISO 7816 compliant) and SPI-like communication capability. All
interfaces can be served by the DMA controller except for UART5.

2.3.18 Serial peripheral interface (SPI)

Up to three SPIs are able to communicate up to 18 Mbits/s in slave and master modes in
full-duplex and simplex communication modes. The 3-bit prescaler gives 8 master mode
frequencies and the frame is configurable to 8 bits or 16 bits. The hardware CRC
generation/verification supports basic SD Card/MMC/SDHC(a) modes.
All SPIs can be served by the DMA controller.

2.3.19 Inter-integrated sound (I2S)

Two standard I2S interfaces (multiplexed with SPI2 and SPI3) are available, that can be
operated in master or slave mode. These interfaces can be configured to operate with 16/32
bit resolution, as input or output channels. Audio sampling frequencies from 8 kHz up to
96 kHz are supported. When either or both of the I2S interfaces is/are configured in master
mode, the master clock can be output to the external DAC/CODEC at 256 times the
sampling frequency with less than 0.5% accuracy error owing to the advanced clock
controller (see Section 2.3.7: Clocks and startup).
Please refer to the “Audio frequency precision” tables provided in the “Serial peripheral
interface (SPI)” section of the STM32F10xxx reference manual.

2.3.20 Ethernet MAC interface with dedicated DMA and IEEE 1588 support
Peripheral not available on STM32F105xx devices.
The STM32F107xx devices provide an IEEE-802.3-2002-compliant media access controller
(MAC) for ethernet LAN communications through an industry-standard media-independent
interface (MII) or a reduced media-independent interface (RMII). The STM32F107xx
requires an external physical interface device (PHY) to connect to the physical LAN bus
(twisted-pair, fiber, etc.). the PHY is connected to the STM32F107xx MII port using as many
as 17 signals (MII) or 9 signals (RMII) and can be clocked using the 25 MHz (MII) or 50 MHz
(RMII) output from the STM32F107xx.
The STM32F107xx includes the following features:
● Supports 10 and 100 Mbit/s rates
● Dedicated DMA controller allowing high-speed transfers between the dedicated SRAM
and the descriptors (see the STM32F105xx/STM32F107xx reference manual for
details)
● Tagged MAC frame support (VLAN support)
● Half-duplex (CSMA/CD) and full-duplex operation
● MAC control sublayer (control frames) support

a. SDHC = Secure digital high capacity.

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Description STM32F105xx, STM32F107xx

● 32-bit CRC generation and removal

● Several address filtering modes for physical and multicast address (multicast and group
addresses)
● 32-bit status code for each transmitted or received frame
● Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive
FIFO are both 2 Kbytes, that is 4 Kbytes in total
● Supports hardware PTP (precision time protocol) in accordance with IEEE 1588 with
the timestamp comparator connected to the TIM2 trigger input
● Triggers interrupt when system time becomes greater than target time

2.3.21 Controller area network (CAN)

The two CANs are compliant with the 2.0A and B (active) specifications with a bitrate up to
1 Mbit/s. They can receive and transmit standard frames with 11-bit identifiers as well as
extended frames with 29-bit identifiers. Each CAN has three transmit mailboxes, two receive
FIFOS with 3 stages and 28 shared scalable filter banks (all of them can be used even if one
CAN is used). The 256 bytes of SRAM which are allocated for each CAN (512 bytes in total)
are not shared with any other peripheral.

2.3.22 Universal serial bus on-the-go full-speed (USB OTG FS)

The STM32F105xx and STM32F107xx connectivity line devices embed a USB OTG full-
speed (12 Mb/s) device/host/OTG peripheral with integrated transceivers. The USB OTG FS
peripheral is compliant with the USB 2.0 specification and with the OTG 1.0 specification. It
has software-configurable endpoint setting and supports suspend/resume. The USB OTG
full-speed controller requires a dedicated 48 MHz clock that is generated by a PLL
connected to the HSE oscillator. The major features are:
● 1.25 KB of SRAM used exclusively by the endpoints (not shared with any other
peripheral)
● 4 bidirectional endpoints
● HNP/SNP/IP inside (no need for any external resistor)
● for OTG/Host modes, a power switch is needed in case bus-powered devices are
connected
● the SOF output can be used to synchronize the external audio DAC clock in
isochronous mode
● in accordance with the USB 2.0 Specification, the supported transfer speeds are:
– in Host mode: full speed and low speed
– in Device mode: full speed

2.3.23 GPIOs (general-purpose inputs/outputs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions. All GPIOs are high current-
capable except for analog inputs.
The I/Os alternate function configuration can be locked if needed following a specific
sequence in order to avoid spurious writing to the I/Os registers.
I/Os on APB2 with up to 18 MHz toggling speed

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STM32F105xx, STM32F107xx Description

2.3.24 Remap capability

This feature allows the use of a maximum number of peripherals in a given application.
Indeed, alternate functions are available not only on the default pins but also on other
specific pins onto which they are remappable. This has the advantage of making board
design and port usage much more flexible.
For details refer to Table 5: Pin definitions; it shows the list of remappable alternate functions
and the pins onto which they can be remapped. See the STM32F10xxx reference manual
for software considerations.

2.3.25 ADCs (analog-to-digital converters)

Two 12-bit analog-to-digital converters are embedded into STM32F105xx and
STM32F107xx connectivity line devices and each ADC shares up to 16 external channels,
performing conversions in single-shot or scan modes. In scan mode, automatic conversion
is performed on a selected group of analog inputs.
Additional logic functions embedded in the ADC interface allow:
● Simultaneous sample and hold
● Interleaved sample and hold
● Single shunt
The ADC can be served by the DMA controller.
An analog watchdog feature allows very precise monitoring of the converted voltage of one,
some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
The events generated by the standard timers (TIMx) and the advanced-control timer (TIM1)
can be internally connected to the ADC start trigger and injection trigger, respectively, to
allow the application to synchronize A/D conversion and timers.

2.3.26 DAC (digital-to-analog converter)

The two 12-bit buffered DAC channels can be used to convert two digital signals into two
analog voltage signal outputs. The chosen design structure is composed of integrated
resistor strings and an amplifier in inverting configuration.
This dual digital Interface supports the following features:
● two DAC converters: one for each output channel
● 8-bit or 12-bit monotonic output
● left or right data alignment in 12-bit mode
● synchronized update capability
● noise-wave generation
● triangular-wave generation
● dual DAC channel independent or simultaneous conversions
● DMA capability for each channel
● external triggers for conversion
● input voltage reference VREF+

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Description STM32F105xx, STM32F107xx

Eight DAC trigger inputs are used in the STM32F105xx and STM32F107xx connectivity line
family. The DAC channels are triggered through the timer update outputs that are also
connected to different DMA channels.

2.3.27 Temperature sensor

The temperature sensor has to generate a voltage that varies linearly with temperature. The
conversion range is between 2 V < VDDA < 3.6 V. The temperature sensor is internally
connected to the ADC1_IN16 input channel which is used to convert the sensor output
voltage into a digital value.

2.3.28 Serial wire JTAG debug port (SWJ-DP)

The ARM SWJ-DP Interface is embedded, and is a combined JTAG and serial wire debug
port that enables either a serial wire debug or a JTAG probe to be connected to the target.
The JTAG TMS and TCK pins are shared respectively with SWDIO and SWCLK and a
specific sequence on the TMS pin is used to switch between JTAG-DP and SW-DP.

2.3.29 Embedded Trace Macrocell™

The ARM® Embedded Trace Macrocell provides a greater visibility of the instruction and
data flow inside the CPU core by streaming compressed data at a very high rate from the
STM32F10xxx through a small number of ETM pins to an external hardware trace port
analyzer (TPA) device. The TPA is connected to a host computer using USB, Ethernet, or
any other high-speed channel. Real-time instruction and data flow activity can be recorded
and then formatted for display on the host computer running debugger software. TPA
hardware is commercially available from common development tool vendors. It operates
with third party debugger software tools.

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STM32F105xx, STM32F107xx Pinouts and pin description

3 Pinouts and pin description

Figure 2. STM32F105xxx and STM32F107xxx connectivity line LQFP100 pinout

BOOT0
VDD_3
VSS_3

PC12
PC11
PC10
PA15
PA14
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8

PB7
PB6
PB5
PB4
PB3
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
PE2 1 75 VDD_2
PE3 2 74 VSS_2
PE4 3 73 NC
PE5 4 72 PA 13
PE6 5 71 PA 12
VBAT 6 70 PA 11
PC13-TAMPER-RTC 7 69 PA 10
PC14-OSC32_IN 8 68 PA 9
PC15-OSC32_OUT 9 67 PA 8
VSS_5 10 66 PC9
VDD_5 11 65 PC8
OSC_IN 12 64 PC7
OSC_OUT 13 LQFP100 63 PC6
NRST 14 62 PD15
PC0 15 61 PD14
PC1 16 60 PD13
PC2 17 59 PD12
PC3 18 58 PD11
VSSA 19 57 PD10
VREF- 20 56 PD9
VREF+ 21 55 PD8
VDDA 22 54 PB15
PA0-WKUP 23 53 PB14
PA1 24 52 PB13
PA2 25 51 PB12
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PA3
VSS_4

PA4
PA5
PA6
PA7
PC4
PC5
PB0
PB1
PB2
PE7
PE8
PE9
VDD_4

PE10
PE11
PE12
PE13
PE14
PE15
PB10
PB11
VSS_1
VDD_1

ai14391

Doc ID 15274 Rev 4 23/95

Pinouts and pin description STM32F105xx, STM32F107xx

Figure 3. STM32F105xxx and STM32F107xxx connectivity line LQFP64 pinout

BOOT0
VDD_3
VSS_3

PC12
PC11
PC10
PA15
PA14
PD2
PB9
PB8

PB7
PB6
PB5
PB4
PB3
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VBAT 1 48 VDD_2
PC13-TAMPER-RTC 2 47 VSS_2
PC14-OSC32_IN 3 46 PA13
PC15-OSC32_OUT 4 45 PA12
PD0 OSC_IN 5 44 PA11
PD1 OSC_OUT 6 43 PA10
NRST 7 42 PA9
PC0 8 41 PA8
PC1 9 LQFP64 40 PC9
PC2 10 39 PC8
PC3 11 38 PC7
VSSA 12 37 PC6
VDDA 13 36 PB15
PA0-WKUP 14 35 PB14
PA1 15 34 PB13
PA2 16 33 PB12
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
PA3

PA4
PA5
PA6
PA7
PC4
PC5
PB0
PB1
PB2
PB10
PB11
VSS_4

VSS_1
VDD_4

VDD_1
ai14392

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STM32F105xx, STM32F107xx Pinouts and pin description

Table 5. Pin definitions

Pins Alternate functions(4)

I / O level(2)
Main

Type(1)
LQFP100

function(3)
LQFP64

Pin name
(after reset) Default Remap

1 - PE2 I/O FT PE2 TRACECK

2 - PE3 I/O FT PE3 TRACED0
3 - PE4 I/O FT PE4 TRACED1
4 - PE5 I/O FT PE5 TRACED2
5 - PE6 I/O FT PE6 TRACED3
6 1 VBAT S VBAT
PC13-TAMPER-
7 2 I/O PC13(6) TAMPER-RTC
RTC(5)
8 3 PC14-OSC32_IN(5) I/O PC14(6) OSC32_IN
PC15-
9 4 I/O PC15(6) OSC32_OUT
OSC32_OUT(5)
10 - VSS_5 S VSS_5
11 - VDD_5 S VDD_5
12 5 OSC_IN I OSC_IN
13 6 OSC_OUT O OSC_OUT
14 7 NRST I/O NRST
15 8 PC0 I/O PC0 ADC12_IN10
16 9 PC1 I/O PC1 ADC12_IN11/ ETH_MDC
17 10 PC2 I/O PC2 ADC12_IN12/ ETH_MII_TXD2
18 11 PC3 I/O PC3 ADC12_IN13/ ETH_MII_TX_CLK
19 12 VSSA S VSSA
20 - VREF- S VREF-
21 - VREF+ S VREF+
22 13 VDDA S VDDA
WKUP/USART2_CTS(7)
ADC12_IN0/TIM2_CH1_ETR
23 14 PA0-WKUP I/O PA0
TIM5_CH1/
ETH_MII_CRS_WKUP
USART2_RTS(7)/ ADC12_IN1/
TIM5_CH2 /TIM2_CH2(7)/
24 15 PA1 I/O PA1
ETH_MII_RX_CLK/
ETH_RMII_REF_CLK
USART2_TX(7)/
25 16 PA2 I/O PA2 TIM5_CH3/ADC12_IN2/
TIM2_CH3 (7)/ ETH_MDIO

Doc ID 15274 Rev 4 25/95

Pinouts and pin description STM32F105xx, STM32F107xx

Table 5. Pin definitions (continued)

Pins Alternate functions(4)

I / O level(2)
Main

Type(1)
LQFP100

function(3)
LQFP64

Pin name
(after reset) Default Remap

USART2_RX(7)/
26 17 PA3 I/O PA3 TIM5_CH4/ADC12_IN3 /
TIM2_CH4(7)/ ETH_MII_COL
27 18 VSS_4 S VSS_4
28 19 VDD_4 S VDD_4
SPI1_NSS(7)/DAC_OUT1 /
29 20 PA4 I/O PA4 SPI3_NSS
USART2_CK(7) / ADC12_IN4
SPI1_SCK(7) /
30 21 PA5 I/O PA5
DAC_OUT2 / ADC12_IN5
SPI1_MISO(7)/ADC12_IN6 /
31 22 PA6 I/O PA6 TIM1_BKIN
TIM3_CH1(7)
SPI1_MOSI(7)/ADC12_IN7 /
32 23 PA7 I/O PA7 TIM3_CH2(7)/ ETH_MII_RX_DV/ TIM1_CH1N
ETH_RMII_CRS_DV
ADC12_IN14 / ETH_MII_RXD0 /
33 24 PC4 I/O PC4
ETH_RMII_RXD0
ADC12_IN15 / ETH_MII_RXD1 /
34 25 PC5 I/O PC5
ETH_RMII_RXD1
ADC12_IN8/TIM3_CH3/
35 26 PB0 I/O PB0 TIM1_CH2N
ETH_MII_RXD2
ADC12_IN9 / TIM3_CH4(7)/
36 27 PB1 I/O PB1 TIM1_CH3N
ETH_MII_RXD3
37 28 PB2 I/O FT PB2/BOOT1
38 - PE7 I/O FT PE7 TIM1_ETR
39 - PE8 I/O FT PE8 TIM1_CH1N
40 - PE9 I/O FT PE9 TIM1_CH1
41 - PE10 I/O FT PE10 TIM1_CH2N
42 - PE11 I/O FT PE11 TIM1_CH2
43 - PE12 I/O FT PE12 TIM1_CH3N
44 - PE13 I/O FT PE13 TIM1_CH3
45 - PE14 I/O FT PE14 TIM1_CH4
46 - PE15 I/O FT PE15 TIM1_BKIN
I2C2_SCL/USART3_TX(7)/
47 29 PB10 I/O FT PB10 TIM2_CH3
ETH_MII_RX_ER
I2C2_SDA/USART3_RX(7)/
48 30 PB11 I/O FT PB11 ETH_MII_TX_EN/ TIM2_CH4
ETH_RMII_TX_EN

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STM32F105xx, STM32F107xx Pinouts and pin description

Table 5. Pin definitions (continued)

Pins Alternate functions(4)

I / O level(2)
Main

Type(1)
LQFP100

function(3)
LQFP64

Pin name
(after reset) Default Remap

49 31 VSS_1 S VSS_1
50 32 VDD_1 S VDD_1
SPI2_NSS/I2S2_WS/
I2C2_SMBA / USART3_CK(7)/
51 33 PB12 I/O FT PB12 TIM1_BKIN(7) / CAN2_RX/
ETH_MII_TXD0/
ETH_RMII_TXD0
SPI2_SCK / I2S2_CK /
USART3_CTS(7)/ TIM1_CH1N /
52 34 PB13 I/O FT PB13
CAN2_TX / ETH_MII_TXD1/
ETH_RMII_TXD1
SPI2_MISO / TIM1_CH2N /
53 35 PB14 I/O FT PB14
USART3_RTS(7)
SPI2_MOSI / I2S2_SD /
54 36 PB15 I/O FT PB15
TIM1_CH3N(7)
USART3_TX/
55 - PD8 I/O FT PD8
ETH_MII_RX_DV
USART3_RX/
56 - PD9 I/O FT PD9
ETH_MII_RX_D0
USART3_CK/
57 - PD10 I/O FT PD10
ETH_MII_RX_D1
USART3_CTS/
58 - PD11 I/O FT PD11
ETH_MII_RX_D2
TIM4_CH1 /
59 - PD12 I/O FT PD12 USART3_RTS/
ETH_MII_RX_D3
60 - PD13 I/O FT PD13 TIM4_CH2
61 - PD14 I/O FT PD14 TIM4_CH3
62 - PD15 I/O FT PD15 TIM4_CH4
63 37 PC6 I/O FT PC6 I2S2_MCK/ TIM3_CH1
64 38 PC7 I/O FT PC7 I2S3_MCK TIM3_CH2
65 39 PC8 I/O FT PC8 TIM3_CH3
66 40 PC9 I/O FT PC9 TIM3_CH4
USART1_CK/OTG_FS_SOF /
67 41 PA8 I/O FT PA8
TIM1_CH1(7)/MCO
USART1_TX(7)/ TIM1_CH2(7)/
68 42 PA9 I/O FT PA9
OTG_FS_VBUS
USART1_RX(7)/
69 43 PA10 I/O FT PA10
TIM1_CH3(7)/OTG_FS_ID

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Pinouts and pin description STM32F105xx, STM32F107xx

Table 5. Pin definitions (continued)

Pins Alternate functions(4)

I / O level(2)
Main

Type(1)
LQFP100

function(3)
LQFP64

Pin name
(after reset) Default Remap

USART1_CTS / CAN1_RX /
70 44 PA11 I/O FT PA11
TIM1_CH4(7)/OTG_FS_DM
USART1_RTS / OTG_FS_DP /
71 45 PA12 I/O FT PA12
CAN1_TX(7) / TIM1_ETR(7)
72 46 PA13 I/O FT JTMS-SWDIO PA13
73 - Not connected
74 47 VSS_2 S VSS_2
75 48 VDD_2 S VDD_2
76 49 PA14 I/O FT JTCK-SWCLK PA14
TIM2_CH1_ETR / PA15
77 50 PA15 I/O FT JTDI SPI3_NSS / I2S3_WS
SPI1_NSS
78 51 PC10 I/O FT PC10 UART4_TX USART3_TX/ SPI3_SCK
USART3_RX/
79 52 PC11 I/O FT PC11 UART4_RX
SPI3_MISO
USART3_CK/
80 53 PC12 I/O FT PC12 UART5_TX
SPI3_MOSI
81 5 PD0 I/O FT OSC_IN(8) CAN1_RX
(8)
82 6 PD1 I/O FT OSC_OUT CAN1_TX
83 54 PD2 I/O FT PD2 TIM3_ETR / UART5_RX
84 - PD3 I/O FT PD3 USART2_CTS
85 - PD4 I/O FT PD4 USART2_RTS
86 - PD5 I/O FT PD5 USART2_TX
87 - PD6 I/O FT PD6 USART2_RX
88 - PD7 I/O FT PD7 USART2_CK
PB3 / TRACESWO/
89 55 PB3 I/O FT JTDO SPI3_SCK / I2S3_CK
TIM2_CH2 / SPI1_SCK
PB4 / TIM3_CH1/
90 56 PB4 I/O FT NJTRST SPI3_MISO
SPI1_MISO
I2C1_SMBA / SPI3_MOSI / TIM3_CH2/SPI1_MOSI/
91 57 PB5 I/O PB5
ETH_PPS_OUT / I2S3_SD CAN2_RX
92 58 PB6 I/O FT PB6 I2C1_SCL(7)/TIM4_CH1(7) USART1_TX/CAN2_TX
93 59 PB7 I/O FT PB7 I2C1_SDA(7)/TIM4_CH2(7) USART1_RX
94 60 BOOT0 I BOOT0
95 61 PB8 I/O FT PB8 TIM4_CH3(7)/ ETH_MII_TXD3 I2C1_SCL/CAN1_RX
96 62 PB9 I/O FT PB9 TIM4_CH4(7) I2C1_SDA / CAN1_TX

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STM32F105xx, STM32F107xx Pinouts and pin description

Table 5. Pin definitions (continued)

Pins Alternate functions(4)

I / O level(2)
Main

Type(1)
LQFP100

function(3)
LQFP64

Pin name
(after reset) Default Remap

97 - PE0 I/O FT PE0 TIM4_ETR

98 - PE1 I/O FT PE1
99 63 VSS_3 S VSS_3
100 64 VDD_3 S VDD_3
1. I = input, O = output, S = supply.
2. FT = 5 V tolerant. All I/Os are VDD capable.
3. Function availability depends on the chosen device.
4. If several peripherals share the same I/O pin, to avoid conflict between these alternate functions only one peripheral should
be enabled at a time through the peripheral clock enable bit (in the corresponding RCC peripheral clock enable register).
5. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current
(3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: the speed should not exceed 2 MHz with a maximum
load of 30 pF and these IOs must not be used as a current source (e.g. to drive an LED).
6. Main function after the first backup domain power-up. Later on, it depends on the contents of the Backup registers even
after reset (because these registers are not reset by the main reset). For details on how to manage these IOs, refer to the
Battery backup domain and BKP register description sections in the STM32F10xxx reference manual, available from the
STMicroelectronics website: www.st.com.
7. This alternate function can be remapped by software to some other port pins (if available on the used package). For more
details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual,
available from the STMicroelectronics website: www.st.com.
8. For the LQFP64 package, the pins number 5 and 6 are configured as OSC_IN/OSC_OUT after reset, however the
functionality of PD0 and PD1 can be remapped by software on these pins. For the LQFP100 package, PD0 and PD1 are
available by default, so there is no need for remapping. For more details, refer to Alternate function I/O and debug
configuration section in the STM32F10xxx reference manual.

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Memory mapping STM32F105xx, STM32F107xx

4 Memory mapping
The memory map is shown in Figure 4.

Figure 4. Memory map

Reserved 0x5000 0400 - 0x5FFF FFFF
USB OTG FS 0x5000 0000 - 0x5000 03FF
Reserved 0x4003 0000 - 0x4FFF FFFF
Ethernet 0x4002 8000 - 0x4002 9FFF
Reserved 0x4002 3400 - 0x4002 7FFF
CRC 0x4002 3000 - 0x4002 33FF
Reserved 0x4002 2400 - 0x4002 2FFF
AHB Flash interface 0x4002 2000 - 0x4002 23FF
Reserved 0x4002 1400 - 0x4002 1FFF
RCC 0x4002 1000 - 0x4002 13FF
Reserved 0x4002 0800 - 0x4002 0FFF
DMA2 0x4002 0400 - 0x4002 07FF
DMA1 0x4002 0000 - 0x4002 03FF
Reserved 0x4001 3C00 - 0x4001 FFFF
USART1 0x4001 3800 - 0x4001 3BFF
Reserved 0x4001 3400 - 0x4001 37FF
0xFFFF FFFF 512-Mbyte SPI1 0x4001 3000 - 0x4001 33FF
block 7 TIM1 0x4001 2C00 - 0x4001 2FFF
ADC2 0x4001 2800 - 0x4001 2BFF
Cortex-M3's
ADC1 0x4001 2400 - 0x4001 27FF
internal 0x4001 1C00 - 0x4001 23FF
Reserved
0xE000 0000 peripherals APB2 0x4001 1800 - 0x4001 1BFF
Port E
0xDFFF FFFF 0x4001 1400 - 0x4001 17FF
Port D
512-Mbyte Port C 0x4001 1000 - 0x4001 13FF
block 6 Port B 0x4001 0C00 - 0x4001 0FFF
Not used Port A 0x4001 0800 - 0x4001 0BFF
EXTI 0x4001 0400 - 0x4001 07FF
0xC000 0000
0xBFFF FFFF AFIO 0x4001 0000 - 0x4001 3FFF
Reserved 0x4000 7800 - 0x4000 FFFF
512-Mbyte 0x4000 7400 - 0x4000 77FF
DAC
block 5 PWR 0x4000 7000 - 0x4000 73FF
Not used
BKP 0x4000 6C00 - 0x4000 6FFF
0xB000 0000 bxCAN2 0x4000 6800 - 0x4000 6BFF
0xAFFF FFFF
512-Mbyte bxCAN1 0x4000 6400 - 0x4000 67FF
block 4 Reserved 0x4000 5C00 - 0x4000 63FF
Not used I2C2 0x4000 5800 - 0x4000 5BFF
I2C1 0x4000 5400 - 0x4000 57FF
0x8000 0000
0x7FFF FFFF UART5 0x4000 5000 - 0x4000 53FF
APB1
512-Mbyte UART4 0x4000 4C00 - 0x4000 4FFF
block 3 USART3 0x4000 4800 - 0x4000 4BFF
Not used USART2 0x4000 4400 - 0x4000 47FF
Reserved 0x4000 4000 - 0x4000 43FF
0x6000 0000
0x5FFF FFFF SPI3/I2S3 0x4000 3C00 - 0x4000 3FFF
512-Mbyte SPI2/I2S2 0x4000 3800 - 0x4000 3BFF
block 2 Reserved 0x4000 3400 - 0x4000 37FF
Peripherals IWDG 0x4000 3000 - 0x4000 33FF
0x4000 0000 WWDG 0x4000 2C00 - 0x4000 2FFF
0x3FFF FFFF RTC 0x4000 2800 - 0x4000 2BFF
512-Mbyte Reserved 0x4000 1800 - 0x4000 27FF
block 1 TIM7 0x4000 1400 - 0x4000 17FF
SRAM TIM6 0x4000 1000 - 0x4000 13FF

0x2000 0000 TIM5 0x4000 0C00 - 0x4000 0FFF

0x1FFF FFFF TIM4 0x4000 0800 - 0x4000 0BFF
512-Mbyte TIM3 0x4000 0400 - 0x4000 07FF
block 0 TIM2 0x4000 0000 - 0x4000 03FF
Code
0x0000 0000 0x3FFF FFFF
Reserved
0x2001 0000
SRAM (aliased 0x2000 FFFF
by bit-banding) 0x2000 0000
Option bytes 0x1FFF F800 - 0x1FFF FFFF
System memory 0x1FFF B000 - 0x1FFF F7FF
Reserved 0x1FFF AFFF
0x0804 0000
Flash 0x0803 FFFF
0x0800 0000
Reserved 0x07FF FFFF
0x0004 0000
Aliased to Flash or system 0x0003 FFFF
memory depending on
BOOT pins 0x0000 0000 ai15412b

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STM32F105xx, STM32F107xx Electrical characteristics

5 Electrical characteristics

5.1 Parameter conditions

Unless otherwise specified, all voltages are referenced to VSS.

5.1.1 Minimum and maximum values

Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by
the selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean±3U).

5.1.2 Typical values

Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 3.3 V (for the
2 V VDD 3.6 V voltage range). They are given only as design guidelines and are not
tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean±2U).

5.1.3 Typical curves

Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.

5.1.4 Loading capacitor

The loading conditions used for pin parameter measurement are shown in Figure 5.

5.1.5 Pin input voltage

The input voltage measurement on a pin of the device is described in Figure 6.

Figure 5. Pin loading conditions Figure 6. Pin input voltage

STM32F10xxx pin STM32F10xxx pin

C = 50 pF VIN

ai15664 ai15665

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Electrical characteristics STM32F105xx, STM32F107xx

5.1.6 Power supply scheme

Figure 7. Power supply scheme

VBAT

Backup circuitry
Po wer swi tch (OSC32K,RTC,
1.8-3.6V
Wake-up logic
Backup registers)

Level shifter
OUT
IO
GP I/Os Logic
IN Kernel logic
(CPU,
Digital
VDD
VDD & Memories)
1/2/3/4/5 Regulator
5 × 100 nF VSS
+ 1 × 4.7 µF 1/2/3/4/5

VDD
VDDA

VREF
VREF+
10 nF Analog:
10 nF VREF- ADC
+ 1 µF RCs, PLL,
+ 1 µF
...
VSSA

ai14125d

Caution: In Figure 7, the 4.7 µF capacitor must be connected to VDD3.

5.1.7 Current consumption measurement

Figure 8. Current consumption measurement scheme

IDD_VBAT
VBAT

IDD
VDD

VDDA

ai14126

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5.2 Absolute maximum ratings

Stresses above the absolute maximum ratings listed in Table 6: Voltage characteristics,
Table 7: Current characteristics, and Table 8: Thermal characteristics may cause permanent
damage to the device. These are stress ratings only and functional operation of the device
at these conditions is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.

Table 6. Voltage characteristics

Symbol Ratings Min Max Unit

External main supply voltage (including VDDA

VDD–VSS –0.3 4.0
and VDD)(1)
V
Input voltage on five volt tolerant pin(2) VSS / 0.3 +5.5
VIN
Input voltage on any other pin(2) VSS /"0.3 VDD+0.3
|FVDDx| Variations between different VDD power pins 50
mV
|VSSX /"VSS| Variations between all the different ground pins 50
see Section 5.3.11:
Electrostatic discharge voltage (human body
VESD(HBM) Absolute maximum ratings
model)
(electrical sensitivity)
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. IINJ(PIN) must never be exceeded (see Table 7: Current characteristics). This is implicitly insured if VIN
maximum is respected. If VIN maximum cannot be respected, the injection current must be limited
externally to the IINJ(PIN) value. A positive injection is induced by VIN> VINmax while a negative injection is
induced by VIN < VSS.

Table 7. Current characteristics

Symbol Ratings Max. Unit

IVDD Total current into VDD/VDDA power lines (source)(1) 150

(1)
IVSS Total current out of VSS ground lines (sink) 150
Output current sunk by any I/O and control pin 25
IIO
Output current source by any I/Os and control pin / 25
mA
Injected current on NRST pin ±5
IINJ(PIN) (2)(3) Injected current on HSE OSC_IN and LSE OSC_IN pins ±5
Injected current on any other pin(4) ±5
UIINJ(PIN)(2) Total injected current (sum of all I/O and control pins)(4) ± 25
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS.
3. Negative injection disturbs the analog performance of the device. See note in Section 5.3.16: 12-bit ADC
characteristics.
4. When several inputs are submitted to a current injection, the maximum UIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with UIINJ(PIN) maximum current injection on four I/O port pins of the device.

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Electrical characteristics STM32F105xx, STM32F107xx

Table 8. Thermal characteristics

Symbol Ratings Value Unit

TSTG Storage temperature range –65 to +150 °C

TJ Maximum junction temperature 150 °C

5.3 Operating conditions

5.3.1 General operating conditions

Table 9. General operating conditions

Symbol Parameter Conditions Min Max Unit

fHCLK Internal AHB clock frequency 0 72

fPCLK1 Internal APB1 clock frequency 0 36 MHz
fPCLK2 Internal APB2 clock frequency 0 72
VDD Standard operating voltage 2 3.6 V
Analog operating voltage
2 3.6
(ADC not used) Must be the same potential
VDDA (1) V
Analog operating voltage as VDD(2)
2.4 3.6
(ADC used)
VBAT Backup operating voltage 1.8 3.6 V
Power dissipation at TA = 85 °C LQFP100 434
PD for suffix 6 or TA = 105 °C for mW
suffix 7(3) LQFP64 444

Ambient temperature for 6 Maximum power dissipation –40 85

°C
suffix version Low power dissipation (4)
–40 105
TA
Ambient temperature for 7 Maximum power dissipation –40 105
°C
suffix version Low power dissipation(4) –40 125
6 suffix version –40 105
TJ Junction temperature range °C
7 suffix version –40 125
1. When the ADC is used, refer to Table 51: ADC characteristics.
2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
4. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.

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5.3.2 Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 10. Operating conditions at power-up / power-down

Symbol Parameter Conditions Min Max Unit

VDD rise time rate 0 ¢

tVDD µs/V
VDD fall time rate 20 ¢

5.3.3 Embedded reset and power control block characteristics

The parameters given in Table 11 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 9.

Table 11. Embedded reset and power control block characteristics

Symbol Parameter Conditions Min Typ Max Unit

PLS[2:0]=000 (rising edge) 2.1 2.18 2.26 V

PLS[2:0]=000 (falling edge) 2 2.08 2.16 V
PLS[2:0]=001 (rising edge) 2.19 2.28 2.37 V
PLS[2:0]=001 (falling edge) 2.09 2.18 2.27 V
PLS[2:0]=010 (rising edge) 2.28 2.38 2.48 V
PLS[2:0]=010 (falling edge) 2.18 2.28 2.38 V
PLS[2:0]=011 (rising edge) 2.38 2.48 2.58 V

Programmable voltage PLS[2:0]=011 (falling edge) 2.28 2.38 2.48 V

VPVD
detector level selection PLS[2:0]=100 (rising edge) 2.47 2.58 2.69 V
PLS[2:0]=100 (falling edge) 2.37 2.48 2.59 V
PLS[2:0]=101 (rising edge) 2.57 2.68 2.79 V
PLS[2:0]=101 (falling edge) 2.47 2.58 2.69 V
PLS[2:0]=110 (rising edge) 2.66 2.78 2.9 V
PLS[2:0]=110 (falling edge) 2.56 2.68 2.8 V
PLS[2:0]=111 (rising edge) 2.76 2.88 3 V
PLS[2:0]=111 (falling edge) 2.66 2.78 2.9 V
VPVDhyst(2) PVD hysteresis 100 mV

Power on/power down Falling edge 1.8(1) 1.88 1.96 V

VPOR/PDR
reset threshold Rising edge 1.84 1.92 2.0 V
VPDRhyst (2) PDR hysteresis 40 mV
(2)
TRSTTEMPO Reset temporization 1 2.5 4.5 ms
1. The product behavior is guaranteed by design down to the minimum VPOR/PDR value.
2. Guaranteed by design, not tested in production.

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5.3.4 Embedded reference voltage

The parameters given in Table 12 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 9.

Table 12. Embedded internal reference voltage

Symbol Parameter Conditions Min Typ Max Unit

–40 °C < TA < +105 °C 1.16 1.20 1.26 V

VREFINT Internal reference voltage
–40 °C < TA < +85 °C 1.16 1.20 1.24 V
ADC sampling time when
TS_vrefint(1) reading the internal reference 5.1 17.1(2) µs
voltage
Internal reference voltage
VRERINT(2) spread over the temperature VDD = 3 V ±10 mV 10 mV
range
TCoeff(2) Temperature coefficient 100 ppm/°C
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.

5.3.5 Supply current characteristics

The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 8: Current consumption
measurement scheme.
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to Dhrystone 2.1 code.

Maximum current consumption

The MCU is placed under the following conditions:
● All I/O pins are in input mode with a static value at VDD or VSS (no load)
● All peripherals are disabled except when explicitly mentioned
● The Flash memory access time is adjusted to the fHCLK frequency (0 wait state from 0
to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above)
● Prefetch in ON (reminder: this bit must be set before clock setting and bus prescaling)
● When the peripherals are enabled fPCLK1 = fHCLK/2, fPCLK2 = fHCLK
The parameters given in Table 13, Table 14 and Table 15 are derived from tests performed
under ambient temperature and VDD supply voltage conditions summarized in Table 9.

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Table 13. Maximum current consumption in Run mode, code with data processing
running from Flash
Max(1)
Symbol Parameter Conditions fHCLK Unit
TA = 85 °C TA = 105 °C

72 MHz 68 68.4
48 MHz 49 49.2

External clock(2), all 36 MHz 38.7 38.9

peripherals enabled 24 MHz 27.3 27.9
16 MHz 20.2 20.5

Supply current in 8 MHz 10.2 10.8

IDD mA
Run mode 72 MHz 32.7 32.9
48 MHz 25 25.2

External clock(3), all 36 MHz 20.3 20.6

peripherals disabled 24 MHz 14.8 15.1
16 MHz 11.2 11.7
8 MHz 6.6 7.2
1. Based on characterization, not tested in production.
2. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

Table 14. Maximum current consumption in Run mode, code with data processing
running from RAM
Max(1)
Symbol Parameter Conditions fHCLK Unit
TA = 85 °C TA = 105 °C

72 MHz 65.5 66
48 MHz 45.4 46

External clock(2), all 36 MHz 35.5 36.1

peripherals enabled 24 MHz 25.2 25.6
16 MHz 18 18.5
Supply 8 MHz 10.5 11
IDD current in mA
Run mode 72 MHz 31.4 31.9
48 MHz 27.8 28.2

External clock(3), all 36 MHz 17.6 18.3

peripherals disabled 24 MHz 13.1 13.8
16 MHz 10.2 10.9
8 MHz 6.1 7.8
1. Based on characterization, tested in production at VDD max, fHCLK max..
2. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

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Electrical characteristics STM32F105xx, STM32F107xx

Table 15. Maximum current consumption in Sleep mode, code running from Flash or RAM
Max(1)
Symbol Parameter Conditions fHCLK Unit
TA = 85 °C TA = 105 °C

72 MHz 48.4 49
48 MHz 33.9 34.4

External clock(2), all 36 MHz 26.7 27.2

peripherals enabled 24 MHz 19.3 19.8
16 MHz 14.2 14.8

Supply current in 8 MHz 8.7 9.1

IDD mA
Sleep mode 72 MHz 10.1 10.6
48 MHz 8.3 8.75

External clock(3), all 36 MHz 7.5 8

peripherals disabled 24 MHz 6.6 7.1
16 MHz 6 6.5
8 MHz 2.5 3
1. Based on characterization, tested in production at VDD max and fHCLK max with peripherals enabled.
2. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

Table 16. Typical and maximum current consumptions in Stop and Standby modes
Typ(1) Max
Symbol Parameter Conditions
VDD/VBAT VDD/VBAT VDD/VBAT TA = TA = Unit
= 2.0 V = 2.4 V = 3.3 V 85 °C 105 °C
Regulator in Run mode, low-speed
and high-speed internal RC
32 33 600 1300
oscillators and high-speed oscillator
Supply current OFF (no independent watchdog)
in Stop mode Regulator in Low Power mode, low-
speed and high-speed internal RC
25 26 590 1280
oscillators and high-speed oscillator
OFF (no independent watchdog)
IDD
Low-speed internal RC oscillator and
3 3.8 - - µA
independent watchdog ON
Supply current Low-speed internal RC oscillator
2.8 3.6 - -
in Standby ON, independent watchdog OFF
mode
Low-speed internal RC oscillator and
independent watchdog OFF, low- 1.9 2.1 5(2) 6.5(2)
speed oscillator and RTC OFF
Backup
IDD_VBAT domain supply Low-speed oscillator and RTC ON 1.1 1.2 1.4 2.1(2) 2.3(2)
current
1. Typical values are measured at TA = 25 °C.
2. Based on characterization, not tested in production.

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STM32F105xx, STM32F107xx Electrical characteristics

Figure 9. Typical current consumption on VBAT with RTC on vs. temperature at

different VBAT values
2.5

2 1.8 V

Consumption (µA)
2V
1.5 2.4 V
1 3.3 V
3.6 V
0.5

0
–40 °C 25 °C 70 °C 85 °C 105 °C
Temperature (°C) ai17329

Figure 10. Typical current consumption in Stop mode with regulator in Run mode
versus temperature at different VDD values

900.00

800.00

700.00
Consumption (µA)

600.00

500.00
3.6 V
400.00
3.3 V
300.00 3V

200.00 2.7 V
2.4 V
100.00

0.00
–40 °C 25 °C 85 °C 105 °C
Temperature (°C)
ai17122

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Electrical characteristics STM32F105xx, STM32F107xx

Figure 11. Typical current consumption in Stop mode with regulator in Low-power
mode versus temperature at different VDD values

900.00

800.00

700.00

Consumption (µA)
600.00

500.00
3.6 V
400.00
3.3 V
300.00 3V

200.00 2.7 V
2.4 V
100.00

0.00
–40 °C 25 °C 85 °C 105 °C
Temperature (°C) ai17123

Figure 12. Typical current consumption in Standby mode versus temperature at

different VDD values

4.50

4.00

3.50
Consumption (µA)

3.00

2.50

2.00 3.6 V
3.3 V
1.50
3V
1.00 2.7 V
2.4 V
0.50

0.00
–40 °C 25 °C 85 °C 105 °C
Temperature (°C) ai17124

Typical current consumption

The MCU is placed under the following conditions:
● All I/O pins are in input mode with a static value at VDD or VSS (no load).
● All peripherals are disabled except if it is explicitly mentioned.
● The Flash access time is adjusted to fHCLK frequency (0 wait state from 0 to 24 MHz, 1
wait state from 24 to 48 MHz and 2 wait states above).
● Ambient temperature and VDD supply voltage conditions summarized in Table 9.
● Prefetch is ON (Reminder: this bit must be set before clock setting and bus prescaling)
When the peripherals are enabled fPCLK1 = fHCLK/4, fPCLK2 = fHCLK/2, fADCCLK = fPCLK2/4

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Table 17. Typical current consumption in Run mode, code with data processing
running from Flash
Typ(1)
Symbol Parameter Conditions fHCLK All peripherals All peripherals Unit
enabled(2) disabled
72 MHz 47.3 28.3
48 MHz 32 19.6
36 MHz 24.6 15.4
24 MHz 16.8 10.6
16 MHz 11.8 7.4
(3)
External clock 8 MHz 5.9 3.7 mA
4 MHz 3.7 2.9
2 MHz 2.5 2
1 MHz 1.8 1.53
Supply 500 kHz 1.5 1.3
IDD current in
Run mode 125 kHz 1.3 1.2
36 MHz 23.9 14.8
24 MHz 16.1 9.7

Running on high 16 MHz 11.1 6.7

speed internal RC 8 MHz 5.6 3.8
(HSI), AHB
4 MHz 3.1 2.1 mA
prescaler used to
reduce the 2 MHz 1.8 1.3
frequency 1 MHz 1.16 0.9
500 kHz 0.8 0.67
125 kHz 0.6 0.5
1. Typical values are measures at TA = 25 °C, VDD = 3.3 V.
2. Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this
consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).
3. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

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Table 18. Typical current consumption in Sleep mode, code running from Flash or
RAM
Typ(1)
Symbol Parameter Conditions fHCLK Unit
All peripherals All peripherals
enabled(2) disabled

72 MHz 28.2 6
48 MHz 19 4.2
36 MHz 14.7 3.4
24 MHz 10.1 2.5
16 MHz 6.7 2
(3)
External clock 8 MHz 3.2 1.3
4 MHz 2.3 1.2
2 MHz 1.7 1.16
1 MHz 1.5 1.1
Supply 500 kHz 1.3 1.05
IDD current in mA
Sleep mode 125 kHz 1.2 1.05
36 MHz 13.7 2.6
24 MHz 9.3 1.8
16 MHz 6.3 1.3
Running on high
8 MHz 2.7 0.6
speed internal RC
(HSI), AHB prescaler 4 MHz 1.6 0.5
used to reduce the
2 MHz 1 0.46
frequency
1 MHz 0.8 0.44
500 kHz 0.6 0.43
125 kHz 0.5 0.42
1. Typical values are measures at TA = 25 °C, VDD = 3.3 V.
2. Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this
consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).
3. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

On-chip peripheral current consumption

The current consumption of the on-chip peripherals is given in Table 19. The MCU is placed
under the following conditions:
● all I/O pins are in input mode with a static value at VDD or VSS (no load)
● all peripherals are disabled unless otherwise mentioned
● the given value is calculated by measuring the current consumption
– with all peripherals clocked off
– with one peripheral clocked on (with only the clock applied)
● ambient operating temperature and VDD supply voltage conditions summarized in
Table 6

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Table 19. Peripheral current consumption(1)

Peripheral Typical consumption at 25 °C Unit

ETH_MAC 5.2
AHB
OTG_FS 7.7
TIM2 1.5
TIM3 1.5
TIM4 1.5
TIM5 1.5
TIM6 0.6
TIM7 0.3
SPI2 0.2
mA
USART2 0.5
APB1
USART3 0.5
UART4 0.5
UART5 0.5
I2C1 0.5
I2C2 0.5
CAN1 0.8
CAN2 0.8
DAC 0.4
GPIO A 0.5
GPIO B 0.5
GPIO C 0.5
GPIO D 0.5
GPIO E 0.5
APB2 mA
(2)
ADC1 2.1
ADC2(2) 2.0
TIM1 1.7
SPI1 0.4
USART1 0.9
1. fHCLK = 72 MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, default prescaler value for each peripheral.
2. Specific conditions for ADC: fHCLK = 56 MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, fADCCLK = fAPB2/4, ADON bit
in the ADC_CR2 register is set to 1.

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5.3.6 External clock source characteristics

High-speed external user clock generated from an external source
The characteristics given in Table 20 result from tests performed using an high-speed
external clock source, and under ambient temperature and supply voltage conditions
summarized in Table 9.

Table 20. High-speed external user clock characteristics

Symbol Parameter Conditions Min Typ Max Unit

External user clock source

fHSE_ext 1 8 50 MHz
frequency(1)
VHSEH OSC_IN input pin high level voltage 0.7VDD VDD
V
VHSEL OSC_IN input pin low level voltage VSS 0.3VDD
tw(HSE)
OSC_IN high or low time(1) 16
tw(HSE)
ns
tr(HSE)
OSC_IN rise or fall time(1) 20
tf(HSE)
Cin(HSE) OSC_IN input capacitance(1) 5 pF
DuCy(HSE) Duty cycle 45 55 %
IL OSC_IN Input leakage current VSS VIN VDD ±1 µA
1. Guaranteed by design, not tested in production.

Low-speed external user clock generated from an external source

The characteristics given in Table 21 result from tests performed using an low-speed
external clock source, and under ambient temperature and supply voltage conditions
summarized in Table 9.

Table 21. Low-speed external user clock characteristics

Symbol Parameter Conditions Min Typ Max Unit

User External clock source

fLSE_ext 32.768 1000 kHz
frequency(1)
OSC32_IN input pin high level
VLSEH 0.7VDD VDD
voltage
V
OSC32_IN input pin low level
VLSEL VSS 0.3VDD
voltage
tw(LSE)
OSC32_IN high or low time(1) 450
tw(LSE)
ns
tr(LSE)
OSC32_IN rise or fall time(1) 50
tf(LSE)
Cin(LSE) OSC32_IN input capacitance(1) 5 pF
DuCy(LSE) Duty cycle 30 70 %
IL OSC32_IN Input leakage current VSS VIN VDD ±1 µA
1. Guaranteed by design, not tested in production.

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Figure 13. High-speed external clock source AC timing diagram

VHSEH
90%
10%
VHSEL

tr(HSE) tW(HSE) t
tf(HSE) tW(HSE)
THSE

External fHSE_ext
IL
clock source OSC _IN
STM32F10xxx

ai14127b

Figure 14. Low-speed external clock source AC timing diagram

VLSEH
90%
10%
VLSEL

tr(LSE) tW(LSE) t
tf(LSE) tW(LSE)
TLSE

External fLSE_ext
OSC32_IN IL
clock source
STM32F10xxx

ai14140c

High-speed external clock generated from a crystal/ceramic resonator

The high-speed external (HSE) clock can be supplied with a 3 to 25 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in Table 22. In the application,
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).

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Table 22. HSE 3-25 MHz oscillator characteristics(1) (2)

Symbol Parameter Conditions Min Typ Max Unit

fOSC_IN Oscillator frequency 3 25 MHz

RF Feedback resistor 200 kY
Recommended load capacitance
C versus equivalent serial RS = 30"Y 30 pF
resistance of the crystal (RS)(3)
VDD = 3.3 V, VIN = VSS
i2 HSE driving current 1 mA
with 30 pF load
gm Oscillator transconductance Startup 25 mA/V
tSU(HSE(4) Startup time VDD is stabilized 2 ms
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Based on characterization, not tested in production.
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a
humid environment, due to the induced leakage and the bias condition change. However, it is
recommended to take this point into account if the MCU is used in tough humidity conditions.
4. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer

For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 15). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2. Refer to the application note AN2867 “Oscillator design guide for ST
microcontrollers” available from the ST website www.st.com.

Figure 15. Typical application with an 8 MHz crystal

Resonator with
integrated capacitors
CL1
OSC_IN fHSE
Bias
8 MH z controlled
RF
resonator gain
OSC_OU T STM32F10xxx
CL2 REXT(1)

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1. REXT value depends on the crystal characteristics.

Low-speed external clock generated from a crystal/ceramic resonator

The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in Table 23. In the application,
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal

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STM32F105xx, STM32F107xx Electrical characteristics

resonator manufacturer for more details on the resonator characteristics (frequency,

package, accuracy).

Table 23. LSE oscillator characteristics (fLSE = 32.768 kHz) (1)

Symbol Parameter Conditions Min Typ Max Unit

RF Feedback resistor 5 MY
Recommended load capacitance
C(2) versus equivalent serial RS = 30 kY 15 pF
resistance of the crystal (RS)(3)
I2 LSE driving current VDD = 3.3 V, VIN = VSS 1.4 µA
gm Oscillator Transconductance 5 µA/V
tSU(LSE)(4) startup time VDD is stabilized 3 s
1. Based on characterization, not tested in production.
2. Refer to the note and caution paragraphs below the table, and to the application note AN2867 “Oscillator
design guide for ST microcontrollers”.
3. The oscillator selection can be optimized in terms of supply current using an high quality resonator with
small RS value for example MSIV-TIN32.768kHz. Refer to crystal manufacturer for more details
4. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized
32.768 kHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary
significantly with the crystal manufacturer

Note: For CL1 and CL2 it is recommended to use high-quality external ceramic capacitors in the
5 pF to 15 pF range selected to match the requirements of the crystal or resonator (see
Figure 16). CL1 and CL2, are usually the same size. The crystal manufacturer typically
specifies a load capacitance which is the series combination of CL1 and CL2.
Load capacitance CL has the following formula: CL = CL1 x CL2 / (CL1 + CL2) + Cstray where
Cstray is the pin capacitance and board or trace PCB-related capacitance. Typically, it is
between 2 pF and 7 pF.
Caution: To avoid exceeding the maximum value of CL1 and CL2 (15 pF) it is strongly recommended
to use a resonator with a load capacitance CL 7 pF. Never use a resonator with a load
capacitance of 12.5 pF.
Example: if you choose a resonator with a load capacitance of CL = 6 pF, and Cstray = 2 pF,
then CL1 = CL2 = 8 pF.

Figure 16. Typical application with a 32.768 kHz crystal

Resonator with
integrated capacitors
CL1
OSC32_IN fLSE
Bias
32.768 KH z controlled
RF
resonator gain
OSC32_OU T STM32F10xxx
CL2

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5.3.7 Internal clock source characteristics

The parameters given in Table 24 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 9.

High-speed internal (HSI) RC oscillator

Table 24. HSI oscillator characteristics (1)

Symbol Parameter Conditions Min Typ Max Unit

fHSI Frequency 8 MHz

User-trimmed with the RCC_CR
1(3) %
register(2)
TA = –40 to 105 °C –2 2.5 %
Accuracy of the HSI
ACCHSI
oscillator Factory- TA = –10 to 85 °C –1.5 2.2 %
calibrated(4) TA = 0 to 70 °C –1.3 2 %
TA = 25 °C –1.1 1.8 %
HSI oscillator
tsu(HSI)(4) 1 2 µs
startup time
HSI oscillator
IDD(HSI)(4) 80 100 µA
power consumption
1. VDD = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Refer to application note AN2868 “STM32F10xxx internal RC oscillator (HSI) calibration” available from the
ST website www.st.com.
3. Guaranteed by design, not tested in production.
4. Based on characterization, not tested in production.

Low-speed internal (LSI) RC oscillator

Table 25. LSI oscillator characteristics (1)

Symbol Parameter Min Typ Max Unit

fLSI(2) Frequency 30 40 60 kHz

(3)
tsu(LSI) LSI oscillator startup time 85 µs
IDD(LSI)(3) LSI oscillator power consumption 0.65 1.2 µA
1. VDD = 3 V, TA = –40 to 105 °C unless otherwise specified.
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.

Wakeup time from low-power mode

The wakeup times given in Table 26 is measured on a wakeup phase with a 8-MHz HSI RC
oscillator. The clock source used to wake up the device depends from the current operating
mode:
● Stop or Standby mode: the clock source is the RC oscillator
● Sleep mode: the clock source is the clock that was set before entering Sleep mode.

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All timings are derived from tests performed under ambient temperature and VDD supply
voltage conditions summarized in Table 9.

Table 26. Low-power mode wakeup timings

Symbol Parameter Typ Unit

tWUSLEEP(1) Wakeup from Sleep mode 1.8 µs

Wakeup from Stop mode (regulator in run mode) 3.6

tWUSTOP(1) µs
Wakeup from Stop mode (regulator in low power mode) 5.4

tWUSTDBY(1) Wakeup from Standby mode 50 µs

1. The wakeup times are measured from the wakeup event to the point in which the user application code
reads the first instruction.

5.3.8 PLL, PLL2 and PLL3 characteristics

The parameters given in Table 27 and Table 28 are derived from tests performed under
temperature and VDD supply voltage conditions summarized in Table 9.

Table 27. PLL characteristics

Symbol Parameter Min(1) Max(1) Unit

PLL input clock(2) 3 12 MHz

fPLL_IN
Pulse width at high level 30 ns
fPLL_OUT PLL multiplier output clock 18 72 MHz
fVCO_OUT PLL VCO output 36 144 MHz
tLOCK PLL lock time 350 µs
Jitter Cycle-to-cycle jitter 300 ps
1. Based on characterization, not tested in production.
2. Take care of using the appropriate multiplier factors so as to have PLL input clock values compatible with
the range defined by fPLL_OUT.

Table 28. PLL2 and PLL3 characteristics

Symbol Parameter Min(1) Max(1) Unit

PLL input clock(2) 3 5 MHz

fPLL_IN
Pulse width at high level 30 ns
fPLL_OUT PLL multiplier output clock 40 74 MHz
fVCO_OUT PLL VCO output 80 148 MHz
tLOCK PLL lock time 350 µs
Jitter Cycle-to-cycle jitter 400 ps
1. Based on characterization, not tested in production.
2. Take care of using the appropriate multiplier factors so as to have PLL input clock values compatible with
the range defined by fPLL_OUT.

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5.3.9 Memory characteristics

Flash memory
The characteristics are given at TA = –40 to 105 °C unless otherwise specified.

Table 29. Flash memory characteristics

Symbol Parameter Conditions Min(1) Typ Max(1) Unit

tprog 16-bit programming time TA"?"–40 to +105 °C 40 52.5 70 µs

tERASE Page (1 KB) erase time TA ?"–40 to +105 °C 20 40 ms
tME Mass erase time TA ?"–40 to +105 °C 20 40 ms
Read mode
fHCLK = 72 MHz with 2 wait 20 mA
states, VDD = 3.3 V
IDD Supply current Write / Erase modes
5 mA
fHCLK = 72 MHz, VDD = 3.3 V
Power-down mode / Halt,
50 µA
VDD = 3.0 to 3.6 V
Vprog Programming voltage 2 3.6 V
1. Guaranteed by design, not tested in production.

Table 30. Flash memory endurance and data retention

Value
Symbol Parameter Conditions Unit
Min(1) Typ Max

TA = –40 to +85 °C (6 suffix versions)

NEND Endurance 10 kcycles
TA = –40 to +105 °C (7 suffix versions)
1 kcycle(2) at TA = 85 °C 30
(2)
tRET Data retention 1 kcycle at TA = 105 °C 10 Years
10 kcycles(2) at TA = 55 °C 20
1. Based on characterization, not tested in production.
2. Cycling performed over the whole temperature range.

5.3.10 EMC characteristics

Susceptibility tests are performed on a sample basis during device characterization.

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Functional EMS (electromagnetic susceptibility)

While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the
device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:
● Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.
● FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS
through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant
with the IEC 61000-4-4 standard.
A device reset allows normal operations to be resumed.
The test results are given in Table 31. They are based on the EMS levels and classes
defined in application note AN1709.

Table 31. EMS characteristics

Level/
Symbol Parameter Conditions
Class

VDD ?"3.3 V, LQFP100, TA = +25 °C,

Voltage limits to be applied on any I/O pin to
VFESD fHCLK = 75 MHz, conforms to 2B
induce a functional disturbance
IEC 61000-4-2
Fast transient voltage burst limits to be VDD"?"3.3 V, LQFP100, TA = +25 °C,
VEFTB applied through 100 pF on VDD and VSS fHCLK = 75 MHz, conforms to 4A
pins to induce a functional disturbance IEC 61000-4-2

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
● Corrupted program counter
● Unexpected reset
● Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).

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Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with SAE
IEC61967-2 standard which specifies the test board and the pin loading.

Table 32. EMI characteristics

Max vs. [fHSE/fHCLK]
Monitored
Symbol Parameter Conditions Unit
frequency band
8/48 MHz 8/72 MHz

0.1 to 30 MHz 9 9
VDD ?"3.3 V, TA ?"25 °C, 30 to 130 MHz 26 13 dBµV
SEMI Peak level LQFP100 package
compliant with IEC61967-2 130 MHz to 1GHz 25 31
SAE EMI Level 4 4 -

5.3.11 Absolute maximum ratings (electrical sensitivity)

Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.

Table 33. ESD absolute maximum ratings

Symbol Ratings Conditions Class Maximum value(1) Unit

Electrostatic discharge voltage TA ?"+25 °C conforming to

VESD(HBM) 2 2000
(human body model) JESD22-A114
V
Electrostatic discharge voltage TA ?"+25 °C conforming to
VESD(CDM) II 500
(charge device model) JESD22-C101
1. Based on characterization results, not tested in production.

Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
● A supply overvoltage is applied to each power supply pin
● A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with EIA/JESD 78A IC latch-up standard.

Table 34. Electrical sensitivities

Symbol Parameter Conditions Class

LU Static latch-up class TA ?"+105 °C conforming to JESD78A II level A

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5.3.12 I/O port characteristics

General input/output characteristics
Unless otherwise specified, the parameters given in Table 35 are derived from tests
performed under the conditions summarized in Table 9. All I/Os are CMOS and TTL
compliant.

Table 35. I/O static characteristics

Symbol Parameter Conditions Min Typ Max Unit

VIL Input low level voltage TTL ports –0.5 0.8

V
Standard IO input high level voltage 2 VDD+0.5
VIH
IO FT(1) input high level voltage 2 5.5V
VIL Input low level voltage CMOS ports –0.5 0.35 VDD
V
VIH Input high level voltage 0.65 VDD VDD+0.5
Standard IO Schmitt trigger voltage
200 mV
Vhys hysteresis(2)
IO FT Schmitt trigger voltage hysteresis(2) 5% VDD(3) mV
VSS VIN VDD
‒1
Ilkg Input leakage current (4) Standard I/Os µA
VIN= 5 V, I/O FT 3
All pins except for
Weak pull-up equivalent PA10 30 40 50
RPU VIN ?"VSS kY
resistor(5)
PA10 8 11 15
All pins except for
Weak pull-down 30 40 50
RPD PA10 VIN ?"VDD kY
equivalent resistor(5)
PA10 8 11 15
CIO I/O pin capacitance 5 pF
1. FT = Five-volt tolerant.
2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization, not tested in production.
3. With a minimum of 100 mV.
4. Leakage could be higher than max. if negative current is injected on adjacent pins.
5. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This
MOS/NMOS contribution to the series resistance is minimum (~10% order).

All I/Os are CMOS and TTL compliant (no software configuration required), their
characteristics consider the most strict CMOS-technology or TTL parameters:
● For VIH:
– if VDD is in the [2.00 V - 3.08 V] range: CMOS characteristics but TTL included
– if VDD is in the [3.08 V - 3.60 V] range: TTL characteristics but CMOS included
● For VIL:
– if VDD is in the [2.00 V - 2.28 V] range: TTL characteristics but CMOS included
– if VDD is in the [2.28 V - 3.60 V] range: CMOS characteristics but TTL included

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Output driving current

The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink
+20 mA (with a relaxed VOL).
In the user application, the number of I/O pins which can drive current must be limited to
respect the absolute maximum rating specified in Section 5.2:
● The sum of the currents sourced by all the I/Os on VDD, plus the maximum Run
consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating
IVDD (see Table 7).
● The sum of the currents sunk by all the I/Os on VSS plus the maximum Run
consumption of the MCU sunk on VSS cannot exceed the absolute maximum rating
IVSS (see Table 7).

Output voltage levels

Unless otherwise specified, the parameters given in Table 36 are derived from tests
performed under ambient temperature and VDD supply voltage conditions summarized in
Table 9. All I/Os are CMOS and TTL compliant.

Table 36. Output voltage characteristics

Symbol Parameter Conditions Min Max Unit

Output low level voltage for an I/O pin

VOL(1) TTL port 0.4
when 8 pins are sunk at same time
IIO = +8 mA V
Output high level voltage for an I/O pin
VOH(2) 2.7 V < VDD < 3.6 V VDD–0.4
when 8 pins are sourced at same time
Output low level voltage for an I/O pin
VOL (1) CMOS port 0.4
when 8 pins are sunk at same time
IIO =+ 8mA V
Output high level voltage for an I/O pin
VOH (2) 2.7 V < VDD < 3.6 V 2.4
when 8 pins are sourced at same time
Output low level voltage for an I/O pin
VOL(1)(3) 1.3
when 8 pins are sunk at same time IIO = +20 mA
V
Output high level voltage for an I/O pin 2.7 V < VDD < 3.6 V
VOH(2)(3) VDD–1.3
when 8 pins are sourced at same time
Output low level voltage for an I/O pin
VOL(1)(3) 0.4
when 8 pins are sunk at same time IIO = +6 mA
V
Output high level voltage for an I/O pin 2 V < VDD < 2.7 V
VOH(2)(3) VDD–0.4
when 8 pins are sourced at same time
1. The IIO current sunk by the device must always respect the absolute maximum rating specified in Table 7
and the sum of IIO (I/O ports and control pins) must not exceed IVSS.
2. The IIO current sourced by the device must always respect the absolute maximum rating specified in
Table 7 and the sum of IIO (I/O ports and control pins) must not exceed IVDD.
3. Based on characterization data, not tested in production.

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Input/output AC characteristics
The definition and values of input/output AC characteristics are given in Figure 17 and
Table 37, respectively.
Unless otherwise specified, the parameters given in Table 37 are derived from tests
performed under the ambient temperature and VDD supply voltage conditions summarized
in Table 9.

Table 37. I/O AC characteristics(1)

MODEx[1:0]
Symbol Parameter Conditions Min Max Unit
bit value(1)

fmax(IO)out Maximum frequency(2) CL = 50 pF, VDD = 2 V to 3.6 V 2 MHz

Output high to low
tf(IO)out 125(3)
10 level fall time
CL = 50 pF, VDD = 2 V to 3.6 V ns
Output low to high
tr(IO)out 125(3)
level rise time
fmax(IO)out Maximum frequency(2) CL = 50 pF, VDD = 2 V to 3.6 V 10 MHz
Output high to low
tf(IO)out 25(3)
01 level fall time
CL = 50 pF, VDD = 2 V to 3.6 V ns
Output low to high
tr(IO)out 25(3)
level rise time
CL = 30 pF, VDD = 2.7 V to 3.6 V 50 MHz
(2)
Fmax(IO)out Maximum frequency CL = 50 pF, VDD = 2.7 V to 3.6 V 30 MHz
CL = 50 pF, VDD = 2 V to 2.7 V 20 MHz
CL = 30 pF, VDD = 2.7 V to 3.6 V 5(3)
Output high to low
11 tf(IO)out CL = 50 pF, VDD = 2.7 V to 3.6 V 8(3)
level fall time
CL = 50 pF, VDD = 2 V to 2.7 V 12(3)
ns
CL = 30 pF, VDD = 2.7 V to 3.6 V 5(3)
Output low to high
tr(IO)out CL = 50 pF, VDD = 2.7 V to 3.6 V 8(3)
level rise time
CL = 50 pF, VDD = 2 V to 2.7 V 12(3)
Pulse width of
external signals
- tEXTIpw 10 ns
detected by the EXTI
controller
1. The I/O speed is configured using the MODEx[1:0] bits. Refer to the STM32F10xxx reference manual for a
description of GPIO Port configuration register.
2. The maximum frequency is defined in Figure 17.
3. Guaranteed by design, not tested in production.

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Figure 17. I/O AC characteristics definition

90% 10%
50% 50%
10% 90%

EXT ERNAL tr(I O)out tr(I O)out

OUTPUT
ON 50pF T

Maximum frequency is achieved if (tr + tf) "2/3)T and if the duty cycle is (45-55%)"
when loaded by 50pF
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5.3.13 NRST pin characteristics

The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up
resistor, RPU (see Table 35).
Unless otherwise specified, the parameters given in Table 38 are derived from tests
performed under the ambient temperature and VDD supply voltage conditions summarized
in Table 9.

Table 38. NRST pin characteristics

Symbol Parameter Conditions Min Typ Max Unit

VIL(NRST)(1) NRST Input low level voltage –0.5 0.8

V
VIH(NRST)(1) NRST Input high level voltage 2 VDD+0.5
NRST Schmitt trigger voltage
Vhys(NRST) 200 mV
hysteresis
RPU Weak pull-up equivalent resistor(2) VIN ?"VSS 30 40 50 kY
(1)
VF(NRST) NRST Input filtered pulse 100 ns
VNF(NRST)(1) NRST Input not filtered pulse VDD > 2.7 V 300 ns
1. Guaranteed by design, not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution
to the series resistance must be minimum (~10% order).

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Figure 18. Recommended NRST pin protection

VDD
External
reset circuit(1)
RPU Internal reset
NRST(2)
Filter
0.1 µF

STM32F10xxx

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2. The reset network protects the device against parasitic resets.

3. The user must ensure that the level on the NRST pin can go below the VIL(NRST) max level specified in
Table 38. Otherwise the reset will not be taken into account by the device.

5.3.14 TIM timer characteristics

The parameters given in Table 39 are guaranteed by design.
Refer to Section 5.3.12: I/O port characteristics for details on the input/output alternate
function characteristics (output compare, input capture, external clock, PWM output).

Table 39. TIMx(1) characteristics

Symbol Parameter Conditions Min Max Unit

1 tTIMxCLK
tres(TIM) Timer resolution time
fTIMxCLK = 72 MHz 13.9 ns

0 fTIMxCLK/2 MHz
Timer external clock
fEXT
frequency on CH1 to CH4 f
TIMxCLK = 72 MHz 0 36 MHz
ResTIM Timer resolution 16 bit
16-bit counter clock period 1 65536 tTIMxCLK
tCOUNTER when internal clock is
selected fTIMxCLK = 72 MHz 0.0139 910 µs

65536 × 65536 tTIMxCLK

tMAX_COUNT Maximum possible count
fTIMxCLK = 72 MHz 59.6 s
1. TIMx is used as a general term to refer to the TIM1, TIM2, TIM3, TIM4 and TIM5 timers.

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Electrical characteristics STM32F105xx, STM32F107xx

5.3.15 Communications interfaces

I2C interface characteristics
Unless otherwise specified, the parameters given in Table 40 are derived from tests
performed under the ambient temperature, fPCLK1 frequency and VDD supply voltage
conditions summarized in Table 9.
The STM32F105xx and STM32F107xx I2C interface meets the requirements of the
standard I2C communication protocol with the following restrictions: the I/O pins SDA and
SCL are mapped to are not “true” open-drain. When configured as open-drain, the PMOS
connected between the I/O pin and VDD is disabled, but is still present.
The I2C characteristics are described in Table 40. Refer also to Section 5.3.12: I/O port
characteristics for more details on the input/output alternate function characteristics (SDA
and SCL).

Table 40. I2C characteristics

Standard mode I2C(1) Fast mode I2C(1)(2)
Symbol Parameter Unit
Min Max Min Max

tw(SCLL) SCL clock low time 4.7 1.3

µs
tw(SCLH) SCL clock high time 4.0 0.6
tsu(SDA) SDA setup time 250 100
(3) 0(4) 900(3)
th(SDA) SDA data hold time 0
tr(SDA) ns
SDA and SCL rise time 1000 20 + 0.1Cb 300
tr(SCL)
tf(SDA)
SDA and SCL fall time 300 300
tf(SCL)
th(STA) Start condition hold time 4.0 0.6
Repeated Start condition µs
tsu(STA) 4.7 0.6
setup time
tsu(STO) Stop condition setup time 4.0 0.6 os
Stop to Start condition time
tw(STO:STA) 4.7 1.3 os
(bus free)
Capacitive load for each bus
Cb 400 400 pF
line
1. Guaranteed by design, not tested in production.
2. fPCLK1 must be higher than 2 MHz to achieve the maximum standard mode I2C frequency. It must be
higher than 4 MHz to achieve the maximum fast mode I2C frequency.
3. The maximum hold time of the Start condition has only to be met if the interface does not stretch the low
period of SCL signal.
4. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the
undefined region of the falling edge of SCL.

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STM32F105xx, STM32F107xx Electrical characteristics

Figure 19. I2C bus AC waveforms and measurement circuit

VDD VDD

4 .7 kΩ 4 .7 kΩ STM32F10xxx
100 Ω
SDA
I²C bus 100 Ω
SCL

S TART REPEATED

S TART

tsu(STA) S TART

SDA
tf(SDA) tr(SDA) tsu(SDA)
S TOP tsu(STA:STO)
th(STA) tw(SCKL) th(SDA)

SCL
tw(SCKH) tr(SCK) tf(SCK) tsu(STO)
ai14133c

1. Measurement points are done at CMOS levels: 0.3VDD and 0.7VDD.

Table 41. SCL frequency (fPCLK1= 36 MHz.,VDD = 3.3 V)(1)(2)

I2C_CCR value
fSCL (kHz)
RP = 4.7 kY

400 0x801E
300 0x8028
200 0x803C
100 0x00B4
50 0x0168
20 0x0384
1. RP = External pull-up resistance, fSCL = I 2C speed,
2. For speeds around 200 kHz, the tolerance on the achieved speed is of ‒5%. For other speed ranges, the
tolerance on the achieved speed ‒2%. These variations depend on the accuracy of the external
components used to design the application.

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Electrical characteristics STM32F105xx, STM32F107xx

I2S - SPI interface characteristics

Unless otherwise specified, the parameters given in Table 42 for SPI or in Table 43 for I2S
are derived from tests performed under the ambient temperature, fPCLKx frequency and VDD
supply voltage conditions summarized in Table 9.
Refer to Section 5.3.12: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI and WS, CK, SD for I2S).

Table 42. SPI characteristics(1)

Symbol Parameter Conditions Min Max Unit

fSCK Master mode 18

SPI clock frequency MHz
1/tc(SCK) Slave mode 18
tr(SCK) SPI clock rise and fall
Capacitive load: C = 30 pF 8 ns
tf(SCK) time
SPI slave input clock
DuCy(SCK) Slave mode 30 70 %
duty cycle
tsu(NSS)(2) NSS setup time Slave mode 4 tPCLK
th(NSS)(2) NSS hold time Slave mode 2 tPCLK
tw(SCKH) (2) Master mode, fPCLK = 36 MHz,
SCK high and low time 50 60
tw(SCKL)(2) presc = 4

tsu(MI) (2) Master mode 5

Data input setup time
tsu(SI)(2) Slave mode 5

th(MI) (2) Master mode 5

Data input hold time
th(SI)(2) Slave mode 4
ns
Data output access
ta(SO)(2)(3) Slave mode, fPCLK = 20 MHz 0 3 tPCLK
time
Data output disable
tdis(SO)(2)(4) Slave mode 2 10
time
tv(SO) (2)(1) Data output valid time Slave mode (after enable edge) 25
(2)(1)
tv(MO) Data output valid time Master mode (after enable edge) 5
th(SO)(2) Slave mode (after enable edge) 15
Data output hold time
th(MO)(2) Master mode (after enable edge) 2
1. Remapped SPI1 characteristics to be determined.
2. Based on characterization, not tested in production.
3. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate
the data.
4. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put
the data in Hi-Z

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STM32F105xx, STM32F107xx Electrical characteristics

Figure 20. SPI timing diagram - slave mode and CPHA = 0

NSS input

tc(SCK)

tSU(NSS) th(NSS)

CPHA= 0
SCK Input

CPOL=0
tw(SCKH)
CPHA= 0 tw(SCKL)
CPOL=1

ta(SO) tv(SO) th(SO) tr(SCK) tdis(SO)

tf(SCK)
MISO
OUT P UT MS B O UT BI T6 OUT LSB OUT
tsu(SI)
MOSI
M SB IN B I T1 IN LSB IN
I NPUT
th(SI)
ai14134c

Figure 21. SPI timing diagram - slave mode and CPHA = 1(1)

NSS input
tSU(NSS) tc(SCK) th(NSS)

CPHA=1
SCK Input

CPOL=0
tw(SCKH)
CPHA=1 tw(SCKL)
CPOL=1

tv(SO) th(SO) tr(SCK) tdis(SO)

ta(SO) tf(SCK)
MISO
OUT P UT MS B O UT BI T6 OUT LSB OUT
tsu(SI) th(SI)
MOSI
M SB IN B I T1 IN LSB IN
I NPUT

ai14135

1. Measurement points are done at CMOS levels: 0.3VDD and 0.7VDD.

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Electrical characteristics STM32F105xx, STM32F107xx

Figure 22. SPI timing diagram - master mode(1)

High

NSS input

tc(SCK)

CPHA= 0
SCK Input

CPOL=0
CPHA= 0
CPOL=1

CPHA=1
SCK Input

CPOL=0
CPHA=1
CPOL=1

tw(SCKH) tr(SCK)
tsu(MI) tw(SCKL) tf(SCK)
MISO
INP UT MS BIN BI T6 IN LSB IN

th(MI)
MOSI
M SB OUT B I T1 OUT LSB OUT
OUTUT
tv(MO) th(MO)

ai14136

1. Measurement points are done at CMOS levels: 0.3VDD and 0.7VDD.

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STM32F105xx, STM32F107xx Electrical characteristics

Table 43. I2S characteristics (1)

Symbol Parameter Conditions Min Max Unit

fCK Master TBD TBD

I2S clock frequency MHz
1/tc(CK) Slave 0 TBD
tr(CK) capacitive load
I2S clock rise and fall time TBD
tf(CK) CL = 50 pF
tv(WS) (2) WS valid time Master TBD
th(WS) (2) WS hold time Master TBD
tsu(WS) (2) WS setup time Slave TBD
(2)
th(WS) WS hold time Slave TBD
(2)
tw(CKH) Master fPCLK= TBD,
CK high and low time TBD
tw(CKL) (2) presc = TBD
tsu(SD_MR) (2) Master receiver TBD
Data input setup time
tsu(SD_SR) (2) Slave receiver TBD
th(SD_MR)(2)(3) Master receiver TBD
Data input hold time
th(SD_SR) (2)(3) Slave receiver TBD
ns
th(SD_MR) (2) Master fPCLK = TBD TBD
Data input hold time
th(SD_SR) (2) Slave fPCLK = TBD TBD
Slave transmitter
TBD
tv(SD_ST) (2)(3) Data output valid time (after enable edge)
fPCLK = TBD TBD
Slave transmitter
th(SD_ST) (2) Data output hold time TBD
(after enable edge)
Master transmitter
TBD
tv(SD_MT) (2)(3) Data output valid time (after enable edge)
fPCLK = TBD TBD TBD
Master transmitter
th(SD_MT) (2) Data output hold time TBD
(after enable edge)
1. TBD = to be determined.
2. Based on design simulation and/or characterization results, not tested in production.
3. Depends on fPCLK. For example, if fPCLK=8 MHz, then TPCLK = 1/fPLCLK =125 ns.

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Electrical characteristics STM32F105xx, STM32F107xx

Figure 23. I2S slave timing diagram (Philips protocol)(1)

tc(CK)

CK Input CPOL = 0

CPOL = 1

tw(CKH) tw(CKL) th(WS)

WS input

tsu(WS) tv(SD_ST) th(SD_ST)

SDtransmit
LSB transmit(2) MSB transmit Bitn transmit LSB transmit

tsu(SD_SR) th(SD_SR)

SDreceive LSB receive(2) MSB receive Bitn receive LSB receive

ai14881b

1. Measurement points are done at CMOS levels: 0.3 × VDD and 0.7 × VDD.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

Figure 24. I2S master timing diagram (Philips protocol)(1)

tf(CK) tr(CK)

tc(CK)
CK output

CPOL = 0
tw(CKH)

CPOL = 1
tv(WS) tw(CKL) th(WS)

WS output

tv(SD_MT) th(SD_MT)

SDtransmit LSB transmit(2) MSB transmit Bitn transmit LSB transmit

tsu(SD_MR) th(SD_MR)

SDreceive LSB receive(2) MSB receive Bitn receive LSB receive

ai14884b

1. Based on characterization, not tested in production.

2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

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STM32F105xx, STM32F107xx Electrical characteristics

USB OTG FS characteristics

The USB OTG interface is USB-IF certified (Full-Speed).

Table 44. USB OTG FS startup time

Symbol Parameter Max Unit

tSTARTUP(1) USB OTG FS transceiver startup time 1 µs

1. Guaranteed by design, not tested in production.

Table 45. USB OTG FS DC electrical characteristics

Symbol Parameter Conditions Min.(1) Typ. Max.(1) Unit

USB OTG FS operating

VDD 3.0(2) 3.6 V
voltage
VDI(3) Differential input sensitivity I(USBDP, USBDM) 0.2
Input
levels Differential common mode
VCM(3) Includes VDI range 0.8 2.5
range V
Single ended receiver
VSE(3) 1.3 2.0
threshold

Output VOL Static output level low RL of 1.5 kY to 3.6 V(4) 0.3
V
levels VOH Static output level high RL of 15 kY to VSS(4) 2.8 3.6
Pull-down resistance on
17 21 24
PA11, PA12
RPD VIN = VDD
Pull-down resistance on
0.65 1.1 2.0 kY
PA9
Pull-up resistance on PA12 VIN = VSS 1.5 1.8 2.1
RPU
Pull-up resistance on PA9 VIN = VSS 0.25 0.37 0.55
1. All the voltages are measured from the local ground potential.
2. The STM32F105xx and STM32F107xx USB OTG FS functionality is ensured down to 2.7 V but not the full
USB OTG FS electrical characteristics which are degraded in the 2.7-to-3.0 V VDD voltage range.
3. Guaranteed by design, not tested in production.
4. RL is the load connected on the USB OTG FS drivers

Figure 25. USB OTG FS timings: definition of data signal rise and fall time
Crossover
points
Differen tial
data lines
VCRS

VS S
tf tr
ai14137

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Electrical characteristics STM32F105xx, STM32F107xx

Table 46. USB OTG FS electrical characteristics(1)

Driver characteristics

Symbol Parameter Conditions Min Max Unit

tr Rise time(2) CL = 50 pF 4 20 ns
tf Fall time(2) CL = 50 pF 4 20 ns
trfm Rise/ fall time matching tr/tf 90 110 %
VCRS Output signal crossover voltage 1.3 2.0 V
1. Guaranteed by design, not tested in production.
2. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB
Specification - Chapter 7 (version 2.0).

Ethernet characteristics
Table 47 showns the Ethernet operating voltage.

Table 47. Ethernet DC electrical characteristics

Symbol Parameter Min.(1) Max.(1) Unit

Input level VDD Ethernet operating voltage 3.0 3.6 V

1. All the voltages are measured from the local ground potential.

Table 48 gives the list of Ethernet MAC signals for the SMI (station management interface)
and Figure 26 shows the corresponding timing diagram.

Figure 26. Ethernet SMI timing diagram

tMDC

ETH_MDC

td(MDIO)

ETH_MDIO(O)
tsu(MDIO) th(MDIO)

ETH_MDIO(I)

ai15666c

Table 48. Dynamics characteristics: Ethernet MAC signals for SMI(1)

Symbol Rating Min Typ Max Unit

tMDC MDC cycle time (1.71 MHz, AHB = 72 MHz) 582.8 583.3 584 ns
td(MDIO) MDIO write data valid time 305.2 305.9 306.5 ns
tsu(MDIO) Read data setup time TBD TBD TBD ns
th(MDIO) Read data hold time TBD TBD TBD ns
1. TBD stands for to be determined.

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STM32F105xx, STM32F107xx Electrical characteristics

Table 49 gives the list of Ethernet MAC signals for the RMII and Figure 27 shows the
corresponding timing diagram.

Figure 27. Ethernet RMII timing diagram

RMII_REF_CLK

td(TXEN)
td(TXD)

RMII_TX_EN
RMII_TXD[1:0]
tsu(RXD) tih(RXD)
tsu(CRS) tih(CRS)

RMII_RXD[1:0]
RMII_CRS_DV

ai15667

Table 49. Dynamics characteristics: Ethernet MAC signals for RMII(1)

Symbol Rating Min Typ Max Unit

tsu(RXD) Receive data setup time TBD TBD TBD ns

tih(RXD) Receive data hold time TBD TBD TBD ns
tsu(CRS) Carrier sense set-up time TBD TBD TBD ns
tih(CRS) Carrier sense hold time TBD TBD TBD ns
td(TXEN) Transmit enable valid delay time 0 9.6 21.9 ns
td(TXD) Transmit data valid delay time 0 9.9 21 ns
1. TBD stands for to be determined.

Table 50 gives the list of Ethernet MAC signals for MII and Figure 27 shows the
corresponding timing diagram.

Figure 28. Ethernet MII timing diagram

MII_RX_CLK
tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER

MII_TX_CLK

td(TXEN)
td(TXD)

MII_TX_EN
MII_TXD[3:0]

ai15668

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Electrical characteristics STM32F105xx, STM32F107xx

Table 50. Dynamics characteristics: Ethernet MAC signals for MII(1)

Symbol Rating Min Typ Max Unit

tsu(RXD) Receive data setup time TBD TBD TBD ns

tih(RXD) Receive data hold time TBD TBD TBD ns
tsu(DV) Data valid setup time TBD TBD TBD ns
tih(DV) Data valid hold time TBD TBD TBD ns
tsu(ER) Error setup time TBD TBD TBD ns
tih(ER) Error hold time TBD TBD TBD ns
td(TXEN) Transmit enable valid delay time 13.4 15.5 17.7 ns
td(TXD) Transmit data valid delay time 12.9 16.1 19.4 ns
1. TBD stands for to be determined.

CAN (controller area network) interface

Refer to Section 5.3.12: I/O port characteristics for more details on the input/output alternate
function characteristics (CANTX and CANRX).

5.3.16 12-bit ADC characteristics

Unless otherwise specified, the parameters given in Table 51 are derived from tests
performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage
conditions summarized in Table 9.
Note: It is recommended to perform a calibration after each power-up.

Table 51. ADC characteristics

Symbol Parameter Conditions Min Typ Max Unit

VDDA Power supply 2.4 3.6 V

VREF+ Positive reference voltage 2.4 VDDA V
IVREF Current on the VREF input pin 160(1) 220(1) µA
fADC ADC clock frequency 0.6 14 MHz
fS(2) Sampling rate 0.05 1 MHz
fADC = 14 MHz 823 kHz
fTRIG(2) External trigger frequency
17 1/fADC
0 (VSSA or VREF-
VAIN Conversion voltage range(3) VREF+ V
tied to ground)
See Equation 1 and
RAIN(2) External input impedance 50 kY
Table 52 for details
RADC(2) Sampling switch resistance 1 kY
CADC(2) Internal sample and hold capacitor 8 pF
fADC = 14 MHz 5.9 µs
tCAL(2) Calibration time
83 1/fADC

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STM32F105xx, STM32F107xx Electrical characteristics

Table 51. ADC characteristics (continued)

Symbol Parameter Conditions Min Typ Max Unit

fADC = 14 MHz 0.214 µs

tlat(2) Injection trigger conversion latency
(4)
3 1/fADC
fADC = 14 MHz 0.143 µs
tlatr(2) Regular trigger conversion latency
2(4) 1/fADC
fADC = 14 MHz 0.107 17.1 µs
tS(2) Sampling time
1.5 239.5 1/fADC
tSTAB(2) Power-up time 0 0 1 µs
fADC = 14 MHz 1 18 µs
Total conversion time (including
tCONV(2) 14 to 252 (tS for sampling +12.5 for
sampling time) 1/fADC
successive approximation)
1. Based on characterization, not tested in production.
2. Guaranteed by design, not tested in production.
3. VREF+ is internally connected to VDDA and VREF- is internally connected to VSSA.
4. For external triggers, a delay of 1/fPCLK2 must be added to the latency specified in Table 51.

Equation 1: RAIN max formula

TS
R AIN > -------------------------------------------------------------
- – R ADC
N+2
f ADC · C ADC · ln * 2 +

The formula above (Equation 1) is used to determine the maximum external impedance allowed for an
error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 52. RAIN max for fADC = 14 MHz(1)

Ts (cycles) tS (µs) RAIN max (kY)

1.5 0.11 0.4

7.5 0.54 5.9
13.5 0.96 11.4
28.5 2.04 25.2
41.5 2.96 37.2
55.5 3.96 50
71.5 5.11 NA
239.5 17.1 NA
1. Based on characterization, not tested in production.

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Electrical characteristics STM32F105xx, STM32F107xx

Table 53. ADC accuracy - limited test conditions(1)

Symbol Parameter Test conditions Typ Max(2) Unit

ET Total unadjusted error fPCLK2 = 56 MHz, ±1.3 ±2

EO Offset error fADC = 14 MHz, RAIN < 10 kY, ±1 ±1.5
VDDA = 3 V to 3.6 V
EG Gain error ±0.5 ±1.5 LSB
TA = 25 °C
ED Differential linearity error Measurements made after ±0.7 ±1
EL Integral linearity error ADC calibration ±0.8 ±1.5
1. ADC DC accuracy values are measured after internal calibration.
2. Based on characterization, not tested in production.

Table 54. ADC accuracy(1) (2)

Symbol Parameter Test conditions Typ Max(3) Unit

ET Total unadjusted error ±2 ±5

fPCLK2 = 56 MHz,
EO Offset error fADC = 14 MHz, RAIN < 10 kY, ±1.5 ±2.5
EG Gain error VDDA = 2.4 V to 3.6 V ±1.5 ±3 LSB
ED Differential linearity error Measurements made after ±1 ±2
ADC calibration
EL Integral linearity error ±1.5 ±3
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted VDD, frequency and temperature ranges.
3. Based on characterization, not tested in production.

Note: ADC accuracy vs. negative injection current: Injecting a negative current on any of the
standard (non-robust) analog input pins should be avoided as this significantly reduces the
accuracy of the conversion being performed on another analog input. It is recommended to
add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative currents.
Any positive injection current within the limits specified for IINJ(PIN) and UIINJ(PIN) in
Section 5.3.12 does not affect the ADC accuracy.

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STM32F105xx, STM32F107xx Electrical characteristics

Figure 29. ADC accuracy characteristics

V V
[1LSBIDEAL = REF+ (or DDA depending on package)]
4096 4096
EG
(1) Example of an actual transfer curve
4095
(2) The ideal transfer curve
4094 (3) End point correlation line
4093
(2)
ET=Total Unadjusted Error: maximum deviation
ET between the actual and the ideal transfer curves.
7 (3) EO=Offset Error: deviation between the first actual
(1) transition and the first ideal one.
6
EG=Gain Error: deviation between the last ideal
5 transition and the last actual one.
EO EL ED=Differential Linearity Error: maximum deviation
4 between actual steps and the ideal one.
3 EL=Integral Linearity Error: maximum deviation
ED between any actual transition and the end point
2 correlation line.
1 LSBIDEAL
1

0 1 2 3 4 5 6 7 4093 4094 4095 4096

VSSA VDDA ai14395b

Figure 30. Typical connection diagram using the ADC

VDD STM32F10xxx

Sample and hold ADC

VT converter
0.6 V
RAIN(1) AINx RADC(1)
12-bit
converter
VT
VAIN 0.6 V
Cparasitic CADC(1)
IL±1 µA

ai14139d

1. Refer to Table 51 for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.

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Electrical characteristics STM32F105xx, STM32F107xx

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 31 or Figure 32,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.

Figure 31. Power supply and reference decoupling (VREF+ not connected to VDDA)

STM32F10xxx

V REF+
(See note 1)

1 µF // 10 nF V DDA

1 µF // 10 nF
V SSA/V REF-
(See note 1)

ai14380c

1. VREF+ and VREF– inputs are available only on 100-pin packages.

Figure 32. Power supply and reference decoupling (VREF+ connected to VDDA)

STM32F10xxx

VREF+/VDDA
(See note 1)

1 µF // 10 nF

VREF–/VSSA
(See note 1)

ai14381c

1. VREF+ and VREF– inputs are available only on 100-pin packages.

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STM32F105xx, STM32F107xx Electrical characteristics

5.3.17 DAC electrical specifications

Table 55. DAC characteristics

Symbol Parameter Min Typ Max Unit Comments

VDDA Analog supply voltage 2.4 3.6 V

VREF+ Reference supply voltage 2.4 3.6 V VREF+ must always be below VDDA
VSSA Ground 0 0 V
RLOAD (1) Resistive load with buffer ON 5 kY
When the buffer is OFF, the
Impedance output with buffer Minimum resistive load between
RO(1) 15 kY
OFF DAC_OUT and VSS to have a 1%
accuracy is 1.5 MY
Maximum capacitive load at
CLOAD(1) Capacitive load 50 pF DAC_OUT pin (when the buffer is
ON).
It gives the maximum output
DAC_OUT Lower DAC_OUT voltage excursion of the DAC.
0.2 V
min(1) with buffer ON
It corresponds to 12-bit input code
(0x0E0) to (0xF1C) at VREF+ =
DAC_OUT Higher DAC_OUT voltage 3.6 V and (0x155) to (0xEAB) at
VDDA – 0.2 V
max(1) with buffer ON VREF+ = 2.4 V
DAC_OUT Lower DAC_OUT voltage
0.5 mV
min(1) with buffer OFF It gives the maximum output
DAC_OUT Higher DAC_OUT voltage excursion of the DAC.
VREF+ – 1LSB V
max(1) with buffer OFF
DAC DC current consumption With no load, worst code (0xF1C)
IDDVREF+ in quiescent mode (Standby 220 µA at VREF+ = 3.6 V in terms of DC
mode) consumption on the inputs
With no load, middle code (0x800)
380 µA
DAC DC current consumption on the inputs
IDDA in quiescent mode (Standby With no load, worst code (0xF1C)
mode) 480 µA at VREF+ = 3.6 V in terms of DC
consumption on the inputs

Given for the DAC in 10-bit

Differential non linearity ±0.5 LSB
configuration.
DNL(2) Difference between two
consecutive code-1LSB) Given for the DAC in 12-bit
±2 LSB
configuration.
Integral non linearity Given for the DAC in 10-bit
±1 LSB
(difference between configuration.
measured value at Code i
INL(2)
and the value at Code i on a Given for the DAC in 12-bit
line drawn between Code 0 ±4 LSB
configuration.
and last Code 1023)

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Electrical characteristics STM32F105xx, STM32F107xx

Table 55. DAC characteristics (continued)

Symbol Parameter Min Typ Max Unit Comments

Given for the DAC in 12-bit

±10 mV
Offset error configuration
(difference between
Given for the DAC in 10-bit at
Offset(2) measured value at Code ±3 LSB
VREF+ = 3.6 V
(0x800) and the ideal value =
VREF+/2) Given for the DAC in 12-bit at
±12 LSB
VREF+ = 3.6 V
Gain Given for the DAC in 12bit
Gain error ±0.5 %
error(2) configuration
Settling time (full scale: for a
10-bit input code transition
(2) between the lowest and the CLOAD 50 pF,
tSETTLING 3 4 µs
highest input codes when RLOAD 5 kY
DAC_OUT reaches final
value ±1LSB
Max frequency for a correct
Update DAC_OUT change when CLOAD 50 pF,
1 MS/s
rate(2) small variation in the input RLOAD 5 kY
code (from code i to i+1LSB)
Wakeup time from off state CLOAD 50 pF, RLOAD 5 kY
tWAKEUP(2) (Setting the ENx bit in the 6.5 10 µs input code between lowest and
DAC Control register) highest possible ones.
Power supply rejection ratio
PSRR+ (1) (to VDDA) (static DC –67 –40 dB No RLOAD, CLOAD = 50 pF
measurement
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.

Figure 33. 12-bit buffered /non-buffered DAC

Buffered/Non-buffered DAC

Buffer(1)
R LOAD
12-bit DACx_OUT
digital to
analog
converter

C LOAD

ai17157

1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.

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STM32F105xx, STM32F107xx Electrical characteristics

5.3.18 Temperature sensor characteristics

Table 56. TS characteristics

Symbol Parameter Min Typ Max Unit

TL(1) VSENSE linearity with temperature ‒1 ‒2 °C

Avg_Slope(1) Average slope 4.0 4.3 4.6 mV/°C

V25(1) Voltage at 25 °C 1.34 1.43 1.52 V

tSTART(2) Startup time 4 10 µs

ADC sampling time when reading the

TS_temp(3)(2) 17.1 µs
temperature
1. Based on characterization, not tested in production.
2. Guaranteed by design, not tested in production.
3. Shortest sampling time can be determined in the application by multiple iterations.

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Package characteristics STM32F105xx, STM32F107xx

6 Package characteristics

6.1 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

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STM32F105xx, STM32F107xx Package characteristics

Figure 34. LQFP100, 100-pin low-profile quad flat Figure 35. Recommended footprint(1)(2)
package outline(1)
0.25 mm
0.10 inch
GAGE PLANE

k 75 51

D
L 76 50
D1
0.5
D3 L1

75 51 C
0.3
76 50

16.7 14.3

E3 E1 E

100 26

1.2
1 25
100 26
12.3
Pin 1 1 25
ccc C
identification
16.7
e
A1
ai14906
A2

A
SEATING PLANE C
1L_ME

1. Drawing is not to scale.

2. Dimensions are in millimeters.

Table 57. LQPF100 – 100-pin low-profile quad flat package mechanical data
millimeters inches(1)
Symbol
Typ Min Max Typ Min Max
A 1.60 0.063
A1 0.05 0.15 0.002 0.0059
A2 1.40 1.35 1.45 0.0551 0.0531 0.0571
b 0.22 0.17 0.27 0.0087 0.0067 0.0106
c 0.09 0.20 0.0035 0.0079
D 16.00 15.80 16.20 0.6299 0.622 0.6378
D1 14.00 13.80 14.20 0.5512 0.5433 0.5591
D3 12.00 0.4724
E 16.00 15.80 16.20 0.6299 0.622 0.6378
E1 14.00 13.80 14.20 0.5512 0.5433 0.5591
E3 12.00 0.4724
e 0.50 0.0197
L 0.60 0.45 0.75 0.0236 0.0177 0.0295
L1 1.00 0.0394
k 3.5° 0° 7° 3.5° 0° 7°
ccc 0.08 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.

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Package characteristics STM32F105xx, STM32F107xx

Figure 36. LQFP64 – 64 pin low-profile quad flat Figure 37. Recommended footprint(1)(2)
package outline(1)

A 48 33
A2
0.3
A1
49 0.5 32

b 12.7
E E1 10.3

e 10.3
64 17

1.2
1 16
D1 c 7.8
D L1

L 12.7

ai14398b ai14909

1. Drawing is not to scale.

2. Dimensions are in millimeters.

Table 58. LQFP64 – 64 pin low-profile quad flat package mechanical data
mm inches(1)
Dim.
Min Typ Max Min Typ Max

A 1.60 0.0630
A1 0.05 0.15 0.0020 0.0059
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571
b 0.17 0.22 0.27 0.0067 0.0087 0.0106
c 0.09 0.20 0.0035 0.0079
D 12.00 0.4724
D1 10.00 0.3937
E 12.00 0.4724
E1 10.00 0.3937
e 0.50 0.0197
s 0° 3.5° 7° 0° 3.5° 7°
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 1.00 0.0394

Number of pins
N
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.

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STM32F105xx, STM32F107xx Package characteristics

6.2 Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 9: General operating conditions on page 34.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × SJA)
Where:
● TA max is the maximum ambient temperature in flC,
● SJA is the package junction-to-ambient thermal resistance, in flC/W,
● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = U"(VOL × IOL) + U((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.

Table 59. Package thermal characteristics

Symbol Parameter Value Unit
Thermal resistance junction-ambient
46
LQFP100 - 14 × 14 mm / 0.5 mm pitch
SJA °C/W
Thermal resistance junction-ambient
45
LQFP64 - 10 × 10 mm / 0.5 mm pitch

6.2.1 Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.

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Package characteristics STM32F105xx, STM32F107xx

6.2.2 Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Table 60: Ordering information scheme.
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F103xx at maximum dissipation, it is useful
to calculate the exact power consumption and junction temperature to determine which
temperature range will be best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.

Example 1: High-performance application

Assuming the following application conditions:
Maximum ambient temperature TAmax = 82 °C (measured according to JESD51-2),
IDDmax = 50 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low
level with IOL = 8 mA, VOL= 0.4 V and maximum 8 I/Os used at the same time in output
at low level with IOL = 20 mA, VOL= 1.3 V
PINTmax = 50 mA × 3.5 V= 175 mW
PIOmax = 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
This gives: PINTmax = 175 mW and PIOmax = 272 mW:
PDmax = 175 + 272 = 447 mW
Thus: PDmax = 447 mW
Using the values obtained in Table 59 TJmax is calculated as follows:
– For LQFP100, 46 °C/W
TJmax = 82 °C + (46 °C/W × 447 mW) = 82 °C + 20.6 °C = 102.6 °C
This is within the range of the suffix 6 version parts (–40 < TJ < 105 °C).
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Table 60: Ordering information scheme).

Example 2: High-temperature application

Using the same rules, it is possible to address applications that run at high ambient
temperatures with a low dissipation, as long as junction temperature TJ remains within the
specified range.
Assuming the following application conditions:
Maximum ambient temperature TAmax = 115 °C (measured according to JESD51-2),
IDDmax = 20 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low
level with IOL = 8 mA, VOL= 0.4 V
PINTmax = 20 mA × 3.5 V= 70 mW
PIOmax = 20 × 8 mA × 0.4 V = 64 mW
This gives: PINTmax = 70 mW and PIOmax = 64 mW:
PDmax = 70 + 64 = 134 mW
Thus: PDmax = 134 mW

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STM32F105xx, STM32F107xx Package characteristics

Using the values obtained in Table 59 TJmax is calculated as follows:

– For LQFP100, 46 °C/W
TJmax = 115 °C + (46 °C/W × 134 mW) = 115 °C + 6.2 °C = 121.2 °C
This is within the range of the suffix 7 version parts (–40 < TJ < 125 °C).
In this case, parts must be ordered at least with the temperature range suffix 7 (see
Table 60: Ordering information scheme).

Figure 38. LQFP100 PD max vs. TA

700
600
500
PD (mW)

400 Suffix 6
Suffix 7
300
200
100
0
65 75 85 95 105 115 125 135

TA (°C)

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Part numbering STM32F105xx, STM32F107xx

7 Part numbering

Table 60. Ordering information scheme

Example: STM32 F 105 R C T 6 xxx

Device family
STM32 = ARM-based 32-bit microcontroller

Product type
F = general-purpose

Device subfamily
105 = connectivity, USB OTG FS
107= connectivity, USB OTG FS & Ethernet

Pin count
R = 64 pins
V = 100 pins

Flash memory size

8 = 64 Kbytes of Flash memory
B = 128 Kbytes of Flash memory
C = 256 Kbytes of Flash memory

Package
T = LQFP

Temperature range
6 = Industrial temperature range, –40 to 85 °C.
7 = Industrial temperature range, –40 to 105 °C.

Options
xxx = programmed parts
TR = tape and real

For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.

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STM32F105xx, STM32F107xx Applicative block diagrams

Appendix A Applicative block diagrams

A.1 USB OTG FS interface solutions

Figure 39. USB OTG FS device mode
STM32F105xx/STM32F107xx

OTG PHY
USB DP
Full-speed DM

USB Micro-B connector

transceiver To host

DP
USB DM
OTG HNP VBUS
Full-speed V BUS VSS
core

VSS
ID

SRP
VDD(1) 5 V to VDD
Regulator(2)

ai15653b

1. VDD ranges between 2 V and 3.6 V.

2. Use a regulator if you want to build a bus-powered device.

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Applicative block diagrams STM32F105xx, STM32F107xx

Figure 40. Host connection

STM32F105xx/STM32F107xx

OTG PHY
USB DP
full-speed/
DM

USB Std-A connector

low-speed
transceiver

USB
OTG HNP
Full-speed V BUS
core

VSS
ID

VDD(2)
SRP

Current-limited
EN power distribution 5 V
GPIO
OVRCR switch
GPIO + IRQ
flag STMPS2141STR(1)

ai15654b

1. STMPS2141STR needed only if the application has to support bus-powered devices.

2. VDD ranges between 2 V and 3.6 V.

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STM32F105xx, STM32F107xx Applicative block diagrams

Figure 41. OTG connection (any protocol)

STM32F105xx/STM32F107xx

OTG PHY
USB DP
full-speed/

USB Micro-AB connector

DM
low-speed
transceiver
ID
USB
OTG HNP
Full-speed V BUS
core

VSS
ID

VDD(2)
SRP

Current-limited
EN power distribution 5 V
GPIO
OVRCR switch
GPIO + IRQ
flag STMPS2141STR(1)

ai15655b

1. STMPS2141STR needed only if the application has to support bus-powered devices.

2. VDD ranges between 2 V and 3.6 V.

A.2 Ethernet interface solutions

Figure 42. MII mode using a 25 MHz crystal
STM32F107xx
MCU MII_TX_CLK
Ethernet MII_TX_EN Ethernet
MAC 10/100 MII_TXD[3:0] PHY 10/100
MII_CRS
MII
MII_COL = 15 pins
HCLK(1)
MII_RX_CLK MII + MDC
MII_RXD[3:0] = 17 pins
IEEE1588 PTP MII_RX_DV
Timer MII_RX_ER
input
trigger Timestamp MDIO
TIM2 comparator
MDC

PPS_OUT(2)

XTAL PLL HCLK

25 MHz OSC
PHY_CLK 25 MHz
XT1

ai15656

1. HCLK must be greater than 25 MHz.

2. Pulse per second when using IEEE1588 PTP, optional signal.

Doc ID 15274 Rev 4 85/95

Applicative block diagrams STM32F105xx, STM32F107xx

Figure 43. RMII with a 50 MHz oscillator

STM32F107xx Ethernet
PHY 10/100
MCU RMII_TX_EN
Ethernet
MAC 10/100 RMII_TXD[1:0]
RMII_RXD[1:0] RMII
HCLK(1) = 7 pins
RMII_CRX_DV
RMII + MDC
RMII_REF_CLK = 9 pins
IEEE1588 PTP
Timer MDIO
input
trigger Timestamp MDC
TIM2 comparator

/2 or /20
2.5 or 25 MHz synchronous 50 MHz

OSC PLL HCLK

50 MHz

PHY_CLK 50 MHz XT1 50 MHz

ai15657

1. HCLK must be greater than 25 MHz.

Figure 44. RMII with a 25 MHz crystal and PHY with PLL

STM32F107xx Ethernet
PHY 10/100
MCU RMII_TX_EN
Ethernet
MAC 10/100 RMII_TXD[1:0]
RMII_RXD[1:0]
HCLK(1) RMII
RMII_CRX_DV = 7 pins
RMII_REF_CLK REF_CLK RMII + MDC
IEEE1588 PTP = 9 pins
Timer MDIO
input
trigger Timestamp MDC
TIM2 comparator

/2 or /20
2.5 or 25 MHz synchronous 50 MHz

XTAL PLL HCLK PLL

25 MHz OSC
PHY_CLK 25 MHz XT1

ai15658

1. HCLK must be greater than 25 MHz.

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STM32F105xx, STM32F107xx Applicative block diagrams

Figure 45. RMII with a 25 MHz crystal

STM32F107xx Ethernet
PHY 10/100
MCU RMII_TX_EN
Ethernet
MAC 10/100 RMII_TXD[1:0]
RMII_RXD[1:0]
HCLK RMII
RMII_CRX_DV = 7 pins
RMII_REF_CLK RMII + MDC
IEEE1588 PTP 50 MHz 50 MHz = 9 pins
Timer MDIO
input
trigger Time stamp MDC
TIM2 comparator

XTAL 50 MHz
25 MHz OSC PLLS XT1/XT2

NS DP83848(1)
ai15659b

1. The NS DP83848 is recommended as the input jitter requirement of this PHY. It is compliant with the output
jitter specification of the MCU.

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Applicative block diagrams STM32F105xx, STM32F107xx

A.3 Complete audio player solutions

Two solutions are offered, illustrated in Figure 46 and Figure 47.
Figure 46 shows storage media to audio DAC/amplifier streaming using a software Codec.
This solution implements an audio crystal to provide audio class I2S accuracy on the master
clock (0.5% error maximum, see the Serial peripheral interface section in the reference
manual for details).

Figure 46. Complete audio player solution 1

STM32F105/STM32F107

XTAL LCD
Cortex-M3 core SPI touch
14.7456 MHz
72 MHz screen

Program memory Control

GPIO buttons
File
System DAC +
OTG I2S Audio
USB (host ampli
Mass-storage Audio
mode) +
device CODEC
PHY
User
application
MMC/
SPI
SDCard

ai15660

Figure 47 shows storage media to audio Codec/amplifier streaming with SOF

synchronization of input/output audio streaming using a hardware Codec.

Figure 47. Complete audio player solution 2

STM32F105/STM32F107

XTAL LCD
Cortex-M3 core SPI touch
14.7456 MHz
72 MHz screen

Program memory Control

GPIO buttons
File
USB System
Mass-storage OTG I2S
device +
PHY
SOF
User
application
MMC/
SPI
SDCard Audio Audio
CODEC ampli
SOF synchronization of input/output
audio streaming
ai15661

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STM32F105xx, STM32F107xx Applicative block diagrams

A.4 USB OTG FS interface + Ethernet/I2S interface solutions

With the clock tree implemented on the STM32F107xx, only one crystal is required to work
with both the USB (host/device/OTG) and the Ethernet (MII/RMII) interfaces. Figure 48
illustrate the solution.

Figure 48. USB OTG FS + Ethernet solution

STM32F107
MCU
Div
XTAL
OSC

by 5 PLL2
25 MHz x8 Cortex-M3 core
up to
72 MHz

PLL
Div x9
by 5 VCO OTG
Out Div by 3 PHY
x18 48 MHz
sel

PLL3 Up to
x10 50 MHz MCLK
Ethernet MCO I2S 2% accuracy
PHY MCO error
SCLK
sel

ai15662b

With the clock tree implemented on the STM32F107xx, only one crystal is required to work
with both the USB (host/device/OTG) and the I2S (Audio) interfaces. Figure 49 illustrate the
solution.

Figure 49. USB OTG FS + I2S (Audio) solution

STM32F105/STM32F107
XTAL
MCU
14.7456 MHz
Div
OSC

by 4 PLL2
x12 Cortex-M3 core
Up to
71.88 MHz

PLL
Div x6.5
by 4 VCO OTG
Out Div by 3 47.9232 MHz PHY
sel x13

PLL3 0.16% accuracy error

VCO MCLK
MCO Out
MCO x40 Up to I2S Less than 0.5% accuracy
error on MCLK and SCLK
147.456 MHz SCLK

ai15663b

Doc ID 15274 Rev 4 89/95

Applicative block diagrams STM32F105xx, STM32F107xx

Table 61. PLL configurations

Crystal USB
I2Sn MCO (main
value in prescaler
Application PREDIV2 PLL2MUL PLLSRC PREDIV1 PLLMUL PLL3MUL clock clock
MHz (PLLVCO
input output)
(XT1) output)

PLL2ON PLL3ON XT1 (MII)

Ethernet only 25 /5 PLL2 /5 PLLON x9 NA NA
x8 x10 PLL3 (RMII)

PLL2ON PLL3ON XT1 (MII)

Ethernet + OTG 25 /5 PLL2 /5 PLLON x9 /3 NA
x8 x10 PLL3 (RMII)

Ethernet + OTG PLL2ON PLL3ON XT1 (MII)

25 /5 PLL2 /5 PLLON x9 /3 PLL
+ basic audio x8 x10 PLL3 (RMII)

NA
Ethernet + OTG PLL3
PLL2ON PLLON PLL3ON ETH PHY
+ Audio class 14.7456 /4 PLL2 /4 /3 VCO
x12 x6.5 x20 must use its
I2S(1) Out
own crystal

OTG only 8 NA PLL2OFF XT1 /1 PLLON x9 /3 PLL3OFF NA NA

OTG + basic
8 NA PLL2OFF XT1 /1 PLLON x9 /3 PLL3OFF PLL NA
audio

PLL3
OTG + Audio PLL2ON PLLON PLL3ON
14.7456 /4 PLL2 /4 /3 VCO NA
class I2S(1) x12 x6.5 x20
Out

PLL3
Audio class I2S PLL2ON PLLON PLL3ON
14.7456 /4 PLL2 /4 NA VCO NA
only(1) x12 x6.5 x20
out

1. SYSCLK is set to be at 72 MHz except in this case where SYSCLK is at 71.88 MHz.

Table 62 give the IDD run mode values that correspond to the conditions specified in
Table 61.

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STM32F105xx, STM32F107xx Applicative block diagrams

Table 62. Applicative current consumption in Run mode, code with data
processing running from Flash
Symbol parameter Conditions(1) Typ(2) Max(2) Unit

85 °C 105 °C

External clock, all peripherals enabled

except ethernet,
57 63 64
HSE = 8 MHz, fHCLK = 72 MHz, no
MCO
External clock, all peripherals enabled
except ethernet,
60.5 67 68
HSE = 14.74 MHz, fHCLK = 72 MHz, no
MCO
External clock, all peripherals enabled
except OTG,
53 60.7 61
HSE = 25 MHz, fHCLK = 72 MHz, MCO
= 25 MHz
External clock, all peripherals enabled,
Supply current HSE = 25 MHz, f
IDD HCLK = 72 MHz, MCO 60.5 65.5 66 mA
in run mode = 25 MHz
External clock, all peripherals enabled,
HSE = 25 MHz, fHCLK = 72 MHz, MCO 64 69.7 70
= 50 MHz
External clock, all peripherals enabled,
HSE = 50 MHz(3), fHCLK = 72 MHz, no 62.5 67.5 68
MCO
External clock, only OTG enabled,
HSE = 8 MHz, fHCLK = 48 MHz, no 26.7 None None
MCO
External clock, only ethernet enabled,
HSE = 25 MHz, fHCLK = 25 MHz, MCO 14.3 None None
= 25 MHz
1. VDD = 3.3 V.
2. Based on characterization, not tested in production.
3. External oscillator.

Doc ID 15274 Rev 4 91/95

Revision history STM32F105xx, STM32F107xx

Revision history

Table 63. Document revision history

Date Revision Changes

18-Dec-2008 1 Initial release.

I/O information clarified on page 1. Figure 4: STM32F105xxx and
STM32F107xxx connectivity line BGA100 ballout top view corrected.
Section 2.3.8: Boot modes updated.
PB4, PB13, PB14, PB15, PB3/TRACESWO moved from Default
column to Remap column, plus small additional changes in Table 5:
Pin definitions.
Consumption values modified in Section 5.3.5: Supply current
20-Feb-2009 2 characteristics.
Note modified in Table 13: Maximum current consumption in Run
mode, code with data processing running from Flash and Table 15:
Maximum current consumption in Sleep mode, code running from
Flash or RAM.
Table 20: High-speed external user clock characteristics and
Table 21: Low-speed external user clock characteristics modified.
Table 27: PLL characteristics modified and Table 28: PLL2 and PLL3
characteristics added.

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STM32F105xx, STM32F107xx Revision history

Table 63. Document revision history (continued)

Date Revision Changes

Section 2.3.8: Boot modes and Section 2.3.20: Ethernet MAC

interface with dedicated DMA and IEEE 1588 support updated.
Section 2.3.24: Remap capability added.
Figure 1: STM32F105xx and STM32F107xx connectivity line block
diagram and Figure 4: Memory map updated.
In Table 5: Pin definitions:
– I2S3_WS, I2S3_CK and I2S3_SD default alternate functions
added
– small changes in signal names
– Note 5 modified
– ETH_MII_PPS_OUT and ETH_RMII_PPS_OUT replaced by
ETH_PPS_OUT
– ETH_MII_MDIO and ETH_RMII_MDIO replaced by ETH_MDIO
– ETH_MII_MDC and ETH_RMII_MDC replaced by ETH_MDC
Figures: Typical current consumption in Run mode versus frequency
(at 3.6 V) - code with data processing running from RAM, peripherals
enabled and Typical current consumption in Run mode versus
frequency (at 3.6 V) - code with data processing running from RAM,
peripherals disabled removed.
Table 13: Maximum current consumption in Run mode, code with
data processing running from Flash, Table 14: Maximum current
consumption in Run mode, code with data processing running from
RAM and Table 15: Maximum current consumption in Sleep mode,
19-Jun-2009 3 code running from Flash or RAM are to be determined.
Figure 11 and Figure 12 show typical curves. PLL1 renamed to PLL.
IDD supply current in Stop mode modified in Table 16: Typical and
maximum current consumptions in Stop and Standby modes.
Figure 10: Typical current consumption in Stop mode with regulator
in Run mode versus temperature at different VDD values, Figure 12:
Typical current consumption in Standby mode versus temperature at
different VDD values and Figure 12: Typical current consumption in
Standby mode versus temperature at different VDD values updated.
Table 17: Typical current consumption in Run mode, code with data
processing running from Flash, Table 18: Typical current
consumption in Sleep mode, code running from Flash or RAM and
Table 19: Peripheral current consumption updated.
fHSE_ext modified in Table 20: High-speed external user clock
characteristics.
Min PLL input clock (fPLL_IN), fPLL_OUT min and fPLL_VCO min
modified in Table 27: PLL characteristics.
ACCHSI max values modified in Table 24: HSI oscillator
characteristics. Table 31: EMS characteristics and Table 32: EMI
characteristics updated. Table 42: SPI characteristics updated.
Modified: Figure 23: I2S slave timing diagram (Philips protocol)(1),
Figure 24: I2S master timing diagram (Philips protocol)(1) and
Figure 26: Ethernet SMI timing diagram.
BGA100 package removed.
Section 6.2: Thermal characteristics added. Small text changes.

Doc ID 15274 Rev 4 93/95

Revision history STM32F105xx, STM32F107xx

Table 63. Document revision history (continued)

Date Revision Changes

Document status promoted from Preliminary data to full datasheet.

Number of DACs corrected in Table 3: STM32F105xx and
STM32F107xx family versus STM32F103xx family.
Note 4 added in Table 5: Pin definitions.
VRERINT and TCoeff added to Table 12: Embedded internal reference
voltage.
Values added to Table 13: Maximum current consumption in Run
mode, code with data processing running from Flash, Table 14:
Maximum current consumption in Run mode, code with data
processing running from RAM and Table 15: Maximum current
consumption in Sleep mode, code running from Flash or RAM.
Typical IDD_VBAT value added in Table 16: Typical and maximum
current consumptions in Stop and Standby modes.
Figure 9: Typical current consumption on VBAT with RTC on vs.
temperature at different VBAT values added.
Values modified in Table 17: Typical current consumption in Run
mode, code with data processing running from Flash and Table 18:
Typical current consumption in Sleep mode, code running from Flash
or RAM.
fHSE_ext min modified in Table 20: High-speed external user clock
characteristics.
CL1 and CL2 replaced by C in Table 22: HSE 3-25 MHz oscillator
characteristics and Table 23: LSE oscillator characteristics (fLSE =
32.768 kHz), notes modified and moved below the tables. Note 1
14-Sep-2009 4 modified below Figure 15: Typical application with an 8 MHz crystal.
Conditions removed from Table 26: Low-power mode wakeup
timings.
Standards modified in Section 5.3.10: EMC characteristics on
page 50, conditions modified in Table 31: EMS characteristics.
Jitter maximum values added to Table 27: PLL characteristics and
Table 28: PLL2 and PLL3 characteristics.
RPU and RPD modified in Table 35: I/O static characteristics.
Condition added for VNF(NRST) parameter in Table 38: NRST pin
characteristics. Note removed and RPD, RPU values added in
Table 45: USB OTG FS DC electrical characteristics.
Table 47: Ethernet DC electrical characteristics added.
Parameter values added to Table 48: Dynamics characteristics:
Ethernet MAC signals for SMI, Table 49: Dynamics characteristics:
Ethernet MAC signals for RMII and Table 50: Dynamics
characteristics: Ethernet MAC signals for MII.
CADC and RAIN parameters modified in Table 51: ADC
characteristics. RAIN max values modified in Table 52: RAIN max for
fADC = 14 MHz.
Table 55: DAC characteristics modified. Figure 33: 12-bit buffered
/non-buffered DAC added.
Table 62: Applicative current consumption in Run mode, code with
data processing running from Flash added.
Small text changes.

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STM32F105xx, STM32F107xx

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