ISP1807

Built-in Antenna Low Energy Module

BT 5 Long Range, Zigbee, Thread, ANT+

This ultra-small LGA module, 8 x 8 x 1 mm, is based on

the nRF52840 Chip. Its powerful Cortex™ M4 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Long range
and multiple digital and analogue interfaces give
optimum flexibility for sensor integration.

Key Features Applications

2.4GHz Ultra Low Power RF Transceiver Advanced Wearables: watches, fitness

Full Bluetooth 5 – long range stack devices, wireless payment wearables,
ANT/ANT+ stack connected health, augmented reality
2.4 GHz proprietary stack applications …
BT Mesh, Zigbee, Thread stacks available Smart Home sensors and controllers
NFC-A Tag for OOB pairing Industrial IoT sensors and controllers
Fully integrated RF matching and Antenna Advanced remote controls
Integrated 32 MHz& 32kHZ Clock Remote &Gaming controllers
DC/DC converter with loading circuit Beacons
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4F CPU
ARM CryptoCell 310 Certifications
1 MB Flash / 256 kB SRAM
Configurable 46 GPIOs including 8 ADC Bluetooth SIG certified
Many interfaces USB, SPI, UART, PDM, I2C CE certified
Power supply 1.7 to 3.6V, USB supply 5V FCC, IC certified
Very small size 8.0 x 8.0 x 1.0 mm TELEC, KCC certified
Temperature -40 to +85 °C RoHS and Reach compliant
Pin to Pin compatible with ISP1507 Conflict Mineral Declaration

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Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

Revision History

Revision Date Ref Change Description

R0 23/11/2017 cr pg Preliminary release
R1 12/12/2017 cr pg Engineering samples release
Section 5.2 – FW tool correction and update
R2 20/04/2018 cr pg
Section 6.5 – Extension name change
R3 22/08/2018 cr pg Section 3 – Typo error correction
R4 12/12/2018 cr pg Section 2.9 – Schematic updated
R5 18/02/2019 cr pg Definitive release
Correction VCC / VCCH
R6 14/03/2019 cr pg
No High-Power Mode availability
R7 06/06/2019 mm pg Change to MSL3
Section 4.1 – Mechanical dimension precision
R8 08/11/2019 mm pg
Section 8 – Certification list update
Section 4.2 – Assembly guideline precisions
R9 17/04/2020 cb pg
Section 8 – Certification list update
R10 03/05/2021 Vn pg Section 8 – Certification list update

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Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

Contents

1. Block Diagram........................................................................................................................................ 4
2. Specifications......................................................................................................................................... 5
2.1. Important Notice ............................................................................................................................ 5
2.2. Absolute Maximum Ratings........................................................................................................... 5
2.3. Operating Conditions .................................................................................................................... 5
2.4. Power Consumption ...................................................................................................................... 6
2.5. Clock Sources ............................................................................................................................... 6
2.6. Radio Specifications...................................................................................................................... 6
2.7. Range Measurement..................................................................................................................... 7
2.8. Antenna Performance ................................................................................................................... 7
2.9. Electrical Schematic ...................................................................................................................... 9
3. Pin Description .................................................................................................................................... 10
4. Mechanical Outlines ............................................................................................................................ 13
4.1. Mechanical Dimensions .............................................................................................................. 13
4.2. SMT Assembly Guidelines .......................................................................................................... 15
4.3. Antenna Keep-Out Zone ............................................................................................................. 15
5. Product Development Tools .............................................................................................................. 16
5.1. Hardware .................................................................................................................................... 16
5.2. Firmware ..................................................................................................................................... 16
5.3. Development Tools ..................................................................................................................... 17
6. Packaging & Ordering information ................................................................................................... 18
6.1. Marking ....................................................................................................................................... 18
6.2. Prototype Packaging ................................................................................................................... 18
6.3. Jedec Trays ................................................................................................................................ 18
6.4. Tape and Reel ............................................................................................................................ 19
6.5. Ordering Information ................................................................................................................... 20
7. Storage & Soldering information ....................................................................................................... 21
7.1. Storage and Handling ................................................................................................................. 21
7.2. Moisture Sensitivity ..................................................................................................................... 21
7.3. Soldering information .................................................................................................................. 22
8. Quality & User information ................................................................................................................. 23
8.1. Certifications ............................................................................................................................... 23
8.2. USA – User information .............................................................................................................. 23
8.3. Canada – User information ......................................................................................................... 24
8.4. RF Exposure Information ............................................................................................................ 24
8.5. Informations concernant l'exposition aux fréquences radio (RF) ................................................. 24
8.6. Discontinuity................................................................................................................................ 24
8.7. Disclaimer ................................................................................................................................... 25

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Specification subject to change without notice.
 BLE MODULE
ISP1807

1. Block Diagram

This module is based on nRF52840 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, an ARM ®Cortex® -M4 32-bit processor with 64 MHz FPU,
a 1 MB flash memory, a 256 kB RAM and analog and digital peripherals.

It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic
Semiconductor.

Fully qualified BLE stacks for nRF52840 are implemented in the S140 SoftDevices which can be freely
downloaded. ISP1807 can then be used in Bluetooth Central, Peripheral, Observer or Broadcaster role
with up to 20 connections and for both ends of other proprietary protocols. nRF52840 platform also
provides extensive software support for ANT, ZIGBEE and THREAD applications.

Ultra-low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching
circuit and antenna in addition to the wireless SoC.

Only the addition of a suitable DC power source is necessary for BLE / ANT / ZIGBEE / THREAD
connectivity. Sensor applications require the further addition of appropriate sensors. The antenna was
designed to be optimized with several standard ground plane sizes. The NFC tag antenna can be
connected externally.

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Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

2. Specifications

2.1. Important Notice

The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for the nRF52840 chipset. Bellow information is only a summary of the main parameters. For more
detailed information, especially about current consumption, please refer to the up-to-date specification of
the chipset available on Nordic Semi website.

2.2. Absolute Maximum Ratings

Parameter Min Typ Max Unit

Main Supply Voltage respect to ground – VCC_nRF -0.3 3.9 V
USB Supply Voltage respect to ground – VBUS -0.3 5.8 V
IO Pin Voltage -0.3 3.9 V
RF Input Level 10 dBm
NFC Antenna pin current 80 mA
Storage Temperature -40 +125 °C
Moisture Sensitivity Level 5 -
ESD Human Body Model 4000 V
ESD Charged Device Model 750 V
Flash Endurance 10000 cycles

ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A

2.3. Operating Conditions

Parameter Min Typ Max Unit

VCC_nRF Supply Voltage, independent of DCDC enable 1.7 3.0 3.6 V
VBUS Supply Voltage 4.35 5.0 5.5 V
Extended Industrial Operating Temperature Range -40 +25 +85 °C

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Specification subject to change without notice.
 BLE MODULE
ISP1807

2.4. Power Consumption

Parameter Min Typ Max Unit

Peak Current, Transmitter +8 dBm, VCC 3V + DCDC 16.4 mA
Peak Current, Transmitter 0 dBm, VCC 3V + DCDC 6.4 mA
Peak Current, Receiver 1 Mbps, VCC 3V + DCDC 6.26 mA
System OFF, no RAM retention 0.4 µA
System ON, no RAM retention, wake on RTC 1.5 µA
Additional RAM retention current per 4 KB block 30 N nA

2.5. Clock Sources

Parameter Min Typ Max Unit

Internal High Frequency Clock for RF Stability:
+/- 40 ppm
32 MHz Crystal Frequency Tolerance (1)
Internal Low Frequency Clock for BLE Synchronization:
+/- 40 ppm
32.768 kHz Crystal Frequency Tolerance (1)
Internal Low Frequency Clock for BLE Synchronization:
+/- 250 ppm
RC Oscillator (2)

RF Frequency Tolerance for BLE Operation +/- 40 ppm

(1) including initial tolerance, drift, aging, and frequency pulling

(2) Frequency tolerance after calibration

2.6. Radio Specifications

Parameter Min Typ Max Unit

Frequency Range 2402 2480 Mhz
Maximum Output Power +8 +8.5 dBm
Rx Sensitivity Level, BLE1 Mbps -95 dBm
Rx Sensitivity Level, BLE Long Range 125 kbps -103 dBm
Antenna Gain 0.6 dBi
EIRP -19.4 8.6 dBm
Data Rate 125 2000 kbps

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Specification subject to change without notice.
 BLE MODULE
ISP1807

2.7. Range Measurement

Range measurement between ISP1807-LR test board (configured as Central) and ISP1807-LR test
board (configured as Peripheral).

Parameter Min Typ Max Unit

Range Open field @1m height (0 dBm, 1 Mbps) 150 m
Range Open field @1m height (0 dBm, 125 Kbps) 175 m
Range Open field @1m height (8 dBm, 1 Mbps) 230 m
Range Open field @1m height (8 dBm, 125 Kbps) 450 m

2.8. Antenna Performance

Typical Antenna Return Loss

Module mounted on a
USB dongle ground plane

Radiation Pattern in 3 planes

Module mounted on a USB

dongle ground plane

Gain measurement
in dBi in the BLE band
from 2.4 to 2.5 GHz.

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Specification subject to change without notice.
 BLE MODULE
ISP1807

Ground Plane Effect Simulation

USB dongle Cell phone config 1 Cell phone config 1 with

ground plane ground plane side ground plane
(size: 18 x 30 mm²) (size: 40 x 100 mm²) (size: 40 x 100 mm²)

Cell phone config 2 with Cell phone config 3 with

side ground plane side ground plane
(size: 40 x 100 mm²) (size: 40 x 100 mm²)

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The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

2.9. Electrical Schematic

Electrical schematic showing

ISP1807 module connections

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Specification subject to change without notice.
 BLE MODULE
ISP1807

3. Pin Description

The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads
on the application PCB for mechanical stability and reliability (drop test).

Pin Name Pin function Description

1 VSS Ground Should be connected to ground plane on application PCB
2 P0_09 Digital I/O General purpose I/O pin
NFC1 NFC Input NFC antenna connection
3 P0_12 Digital I/O General purpose I/O pin
TRACEDATA1 Trace port output
4 P0_10 Digital I/O General purpose I/O pin
NFC2 NFC Input NFC antenna connection
5 P0_14 Digital I/O General purpose I/O pin
6 P0_26 Digital I/O General purpose I/O pin
7 VSS Ground Should be connected to ground plane on application PCB
8 D+ Digital I/O USB D+
9 P0_16 Digital I/O General purpose I/O pin
10 D- Digital I/O USB D-
11 P0_21 Digital I/O General purpose I/O pin
12 VBUS Power 5V input for USB 3.3V regulator
13 P0_18 Digital I/O General purpose I/O pin
RESET Configurable as system RESET pin
14 VSS Ground Should be connected to ground plane on application PCB
15 P0_20 Digital I/O General purpose I/O pin
16 VSS Ground Should be connected to ground plane on application PCB
17 P0_22 Digital I/O General purpose I/O pin
18 VSS Ground Should be connected to ground plane on application PCB
19 P0_24 Digital I/O General purpose I/O pin
20 OUT_ANT Antenna I/O This pin is connected to the internal antenna
It should be connected to Pin 22 OUT_MOD for normal operation
21 VSS Ground Should be connected to ground plane on application PCB
22 OUT_MOD Antenna I/O This pin is the RF I/O pin of the BLE module
It should be connected to Pin 20 OUT_ANT for normal operation
23 VSS Ground Should be connected to ground plane on application PCB
24 VSS Ground Should be connected to ground plane on application PCB
25 VSS Ground Should be connected to ground plane on application PCB
26 VCC_nRF Power Power supply (1.7 – 3.6V)
27 P0_17 Digital I/O General purpose I/O pin
28 SWDIO Digital I/O Serial Wire Debug I/O for debug and programming
29 P0_13 Digital I/O General purpose I/O pin
30 SWDCLK Digital Input Serial Wire Debug clock input for debug and programming
31 VSS Ground Should be connected to ground plane on application PCB
32 P0_08 Digital I/O General purpose I/O pin
33 P0_07 Digital I/O General purpose I/O pin
TRACECLK Trace port clock output

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Specification subject to change without notice.
 BLE MODULE
ISP1807

Pin Name Pin function Description

34 P0_06 Digital I/O General purpose I/O pin
35 P0_04 Digital I/O General purpose I/O pin
AIN2 Analog Input SAADC/COMP/LPCOMP input
36 P0_05 Digital I/O General purpose I/O pin
AIN3 Analog Input SAADC/COMP/LPCOMP input
37 P0_15 Digital I/O General purpose I/O pin
38 P0_03 Digital I/O General purpose I/O pin
AIN1 Analog Input SAADC/COMP/LPCOMP input
39 P0_27 Digital I/O General purpose I/O pin
40 P0_02 Digital I/O General purpose I/O pin
AIN0 Analog Input SAADC/COMP/LPCOMP input
41 P0_25 Digital I/O General purpose I/O pin
42 P0_31 Digital I/O General purpose I/O pin
AIN7 Analog Input SAADC/COMP/LPCOMP input
43 P0_11 Digital I/O General purpose I/O pin
TRACEDATA2 Trace port output
44 P0_30 Digital I/O General purpose I/O pin
AIN6 Analog Input SAADC/COMP/LPCOMP input
45 P0_19 Digital I/O General purpose I/O pin
46 P0_29 Digital I/O General purpose I/O pin
AIN5 Analog Input SAADC/COMP/LPCOMP input
47 P0_23 Digital I/O General purpose I/O pin
48 P0_28 Digital I/O General purpose I/O pin
AIN4 Analog Input SAADC/COMP/LPCOMP input
49 P1_02 Digital I/O General purpose I/O pin
50 P1_06 Digital I/O General purpose I/O pin
51 P1_15 Digital I/O General purpose I/O pin
52 P1_14 Digital I/O General purpose I/O pin
53 P1_13 Digital I/O General purpose I/O pin
54 P1_05 Digital I/O General purpose I/O pin
55 P1_08 Digital I/O General purpose I/O pin
56 P1_09 Digital I/O General purpose I/O pin
TRACEDATA3 Trace port output
57 P1_00 Digital I/O General purpose I/O pin
TRACEDATA0 Trace port output
58 P1_03 Digital I/O General purpose I/O pin
59 P1_12 Digital I/O General purpose I/O pin
60 P1_10 Digital I/O General purpose I/O pin
61 P1_11 Digital I/O General purpose I/O pin
62 P1_07 Digital I/O General purpose I/O pin
63 P1_04 Digital I/O General purpose I/O pin
64 P1_01 Digital I/O General purpose I/O pin
65 NC Not Connected Isolated pad on application PCB for mechanical stability
to 78

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Specification subject to change without notice.
 BLE MODULE
ISP1807

ISP1807
pad placement and pin assignment
for the LGA QFN package

TOP VIEW

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Specification subject to change without notice.
 BLE MODULE
ISP1807

4. Mechanical Outlines

4.1. Mechanical Dimensions

Package dimensions

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 BLE MODULE
ISP1807

Dimensional drawing for 62-Pad LGA Package

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Specification subject to change without notice.
 BLE MODULE
ISP1807

4.2. SMT Assembly Guidelines

For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the same dimensions as
module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.

For implementations in which most or all of the inner pads are used Insight SiP recommends the use of
capped vias placed in the centre of each pad.

For standard PCB types (no micro vias - all vias are top to bottom): we use nominal 0.4mm catch pads
with 0.2mm vias. The vias should be plugged and capped to avoid solder wicking.

For HDI PCB types having micro vias on a layer by layer basis: we use 0.25mm catch pads and 0.1mm
copper filled laser vias. Ideally the via is centered in the pad.

For reduced pinout implementations we recommend using external pads only. The use of a small
number of internal pads can be accommodated by placing normal vias in the centre of the device. In this
case only the required pads should be Solder Mask opened and the vias tented with solder mask to
prevent short circuits.

In general, we recommend NSMD solder mask with 50µm SM extension.

4.3. Antenna Keep-Out Zone

For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of
the board: no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.

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Specification subject to change without notice.
 BLE MODULE
ISP1807

5. Product Development Tools

5.1. Hardware

In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1807, Insight SIP
offers a Development Kit containing:
- One Interface Board
- J-Link Lite CortexM-9 JTAG/SWD Emulator
- One Test Board
- A Development Dongle
- 5 ISP1807 module samples
- Cables, power supply and coin battery holder

Using this development kit, product developers can use a working solution as starting point to develop
their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition,
there may be some applications that use the hardware as is.

Please refer to the documentation for more information:

http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf

5.2. Firmware

ISP1807supports Bluetooth Low Energy protocol stacks. It also provides extensive software support for
ANT, ZIGBEE and THREAD applications as well as 2.4 GHz protocol stacks, including Gazell. All are
available as downloads at www.nordicsemi.com.

The S140 SoftDevice is a Bluetooth low energy (BLE) Central and Peripheral protocol stack solution.
The S140 SoftDevice supports up to twenty connections with an additional observer and a
broadcaster role all running concurrently.

The S140 SoftDevice integrates a Bluetooth low energy Controller and Host, and provides a full and
flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions:

- Bluetooth 5.0 compliant low energy single-mode protocol stack suitable for Bluetooth low energy
products.
- Concurrent central, observer, peripheral, and broadcaster roles with up to 20 concurrent connections
along with one Observer and one Broadcaster.
- Link layer supporting LE 1M PHY and LE 2M PHY.
- LL Privacy.
- LE Data Packet Length Extension.
- LE Secure Connections pairing model

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 BLE MODULE
ISP1807

5.3. Development Tools

The following development tools and software are recommended for using and testing ISP1807 module:

Nordic Semiconductor nRFgo Studio:

Downloadable after registering at www.nordicsemi.com.

Nordic Semiconductor Master Control Panel:

Downloadable after registering at www.nordicsemi.com.

Keil MDK-ARM Lite:

Downloadable from https://www.keil.com/demo/eval/arm.htm.

Segger J-Link Lite:

Downloadable from http://www.segger.com/jlink-software.html.

nRF52 Software Development Kit (SDK):

nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains example of
source codes applications (C language):
- Precompiled HEX files
- Source code
- Keil ARM project files
- IAR project files

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Specification subject to change without notice.
 BLE MODULE
ISP1807

6. Packaging & Ordering information

6.1. Marking

M /N : I S P 1 8 0 7
T T Y Y W W R

ISP1807 Part Number

2 letters Module Type (see
TT
section 6.5)
YY 2 digits year number
WW 2 digits week number
R 1 letter Hardware revision

6.2. Prototype Packaging

For engineering samples and prototype quantities

up to 99 units, deliveries are provided in thermoformed
trays or cut tapes.

They are delivered in sealed pack with desiccant

pack and humidity sensors. Please see section 7.2
for more information on moisture sensitivity.

Please order with “ST” code packaging suffix.

6.3. Jedec Trays

For pre-production volumes, ISP1807 are available in Jedec trays. They are delivered in sealed pack
with desiccant pack and humidity sensors. These Jedec trays are also suitable for further baking. Please
see section 7.2 for more information on moisture sensitivity. Please order with “JT” code packaging
suffix.

Refer to tray sizes below. Complete information on Jedec trays is available on request.

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Specification subject to change without notice.
 BLE MODULE
ISP1807

Top view position of

modules within the tray.

6.4. Tape and Reel

ISP1807 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and
humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units
(330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for
2000-unit reels.

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Specification subject to change without notice.
 BLE MODULE
ISP1807

Top view position of modules within the reel.

6.5. Ordering Information

I S P 1 8 0 7 - T T - Z Z
▼ ▼ ▼ ▼
▼ ▼ ▼ ▼
▼ ▼ ▼ ▼
I S P 1 8 0 7 Part Number

- L R Long range version

- E B Evaluation Board(1)
- T B Test board (1)
- S T Standard Tray or Cut Tape
- J T Jedec Tray Packaging
- R S Reel of 500 units
- R 2 Reel of 2000 units

(1) Please see section 5.1 and refer to the following documentation for more information on
development kit and test board:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_ANXXXXX.pdf

May 3, 2021 Page 20/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

7. Storage & Soldering information

7.1. Storage and Handling

Keep this product away from other high frequency devices which may interfere with operation such as
other transmitters and devices generating high frequencies.

Do not expose the module to the following conditions:

- Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX
- Extreme humidity or salty air
- Prolonged exposure to direct Sunlight
- Temperatures beyond those specified for storage

Do not apply mechanical stress

Do not drop or shock the module

Avoid static electricity, ESD and high voltage as these may damage the module

ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES

7.2. Moisture Sensitivity

All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient
temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in
vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of
the plastic mold compound, then it is possible to crack the package. Even if the package does not crack,
interfacial delamination can occur.

Since the device package is sensitive to moisture absorption, it is recommended to bake the product
before assembly. The baking process for dry packing is 24 hours at 125°C.

ISP1807 has been tested MSL-3 according to standards. After baking, modules can be exposed to
ambient room conditions (approximately 30 °C/60%RH) during 168 hours before assembly on the PCB.

CAUTION
MOISTURE
SENSITIVE DEVICES

May 3, 2021 Page 21/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

7.3. Soldering information

Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.

Preheat/Soak 260°C
Peak package body temperature (Tp)
Temperature Min (Tsmin) 150 °C (+0/-5°C)
Temperature Max (Tsmax) 200 °C Classification Temperature (Tc) 260 °C
Time (ts) from (Tsmin to Tsmax) 60-120 sec Time (tp) maintained above TC-5 °C 30 sec
Ramp-up rate (TL to Tp) 3 °C/sec max Ramp-down rate (Tp to TL) 6 °C/sec max
Liquidous temperature (TL) 217 °C
Time 25 °C to peak temperature 8 mn max
Time (tL) maintained above TL 60-150 sec

May 3, 2021 Page 22/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

8. Quality & User information

8.1. Certifications

All below certificates can be downloaded on the website:

Bluetooth SIG Declaration ID n° D046560

CE Certified, DoC Insight SiP Ref TR201105
TELEC Certified, n° 020-200037
KCC Certification n° R-C-iNs-ISP1807
FCC Certification n° 2AAQS-ISP1807
IC Certification n° 11306A-ISP1807
RoHS3 and Reach compliant, Ref TR200301 and TR191101
Conflict Mineral Declaration available, Ref TR180701

To support customers in their application certification, Insight SiP can provide test reports on request.

8.2. EC – CE Certification

This device can be operated in at least one Member State without infringing applicable requirements on
the use of radio spectrum.

8.3. USA – User information

This intends to inform how to specify the FCC ID of our module “ISP1807” on the product. Based on the
Public Notice from FCC, the host device should have a label which indicates that it contains our module.
The label should use below example wording or any similar wording that expresses the same meaning:

“Contains FCC ID: 2AAQS-ISP1807”

The label of the host device should also include the below FCC Statement. When it is not possible, this
information should be included in the User Manual of the host device:

“This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions.
(1) This device may not cause harmful interference
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Caution: Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.”

May 3, 2021 Page 23/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

8.4. Canada – User information

This intends to inform how to specify the IC ID of our module “ISP1807” on the product. According to
Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that
it contains our module. The label should use below example wording or any similar wording that
expresses the same meaning:

“Contains IC: 11306A-ISP1807”

The label of the host device should also include the below IC Statement. When it is not possible, this
information should be included in the User Manual of the host device:

“This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.”

8.5. RF Exposure Information

This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF)Exposure Guidelines in Supplement C toOET65 and RSS-102
of the IC radio frequency (RF) Exposure rules. This equipment has very low levels of RF energy that it
deemed to comply without maximum permissive exposure evaluation (MPE).

8.6. Informations concernant l'exposition aux fréquences radio (RF)

La puissance de sortie émise par l’appareil de sans-fil est inférieure à la limite d'exposition aux
fréquences radio d'Industry Canada (IC). Ce module a également été évalué et démontré conforme aux
limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles et/ou
portables.

8.7. Discontinuity

Normally a product will continue to be manufactured as long as all of the following are true:
- The manufacturing method is still available.
- There are no replacement products.
- There is demand for it in the market.

May 3, 2021 Page 24/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
 BLE MODULE
ISP1807

In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation
Notice (PDN) will be sent to all distributors and made available on our website. After this, the procedure
goes as follows:
- Last Order Date will be 6 months after the PDN was published.
- Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN.

8.8. Disclaimer

Insight SiP’s products are designed and manufactured for general consumer applications, so testing and
use of the product shall be conducted at customer’s own risk and responsibility. Please conduct
validation and verification and sufficient reliability evaluation of the products in actual condition of
mounting and operating environment before commercial shipment of the equipment. Please also pay
attention (i) to apply soldering method that don’t deteriorate reliability, (ii) to minimize any mechanical
vibration, shock, exposure to any static electricity, (iii) not to overstress the product during and after the
soldering process.

The products are not designed for use in any application which requires especially high reliability where
malfunction of these products can reasonably be expected to result in personal injury or damage to the
third party's life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace
equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment,
(vi) transportation equipment, (vii) traffic signal equipment, (viii) disaster prevention / crime prevention
equipment.

The only warranty that Insight SiP provides regarding the products is its conformance to specifications
provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express
or implied, including without limitation any warranty of fitness for a particular purpose, that they are
defect-free, or against infringement of intellectual property rights. Insight SiP customers agree to
indemnify and defend Insight SiP against all claims, damages, costs and expenses that may be incurred,
including without any limitation, attorney fees and costs, due to the use of products.

May 3, 2021 Page 25/25 Document Ref: isp_ble_DS1807_R10.docx

Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.