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19 October 2020 1442 ‫ ربيع األول‬2

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Introduction to Electronics

Lecture 01
Introduction

Dr. Hesham A. Omran

Integrated Circuits Laboratory (ICL)
Electronics and Communications Eng. Dept.
Faculty of Engineering
Ain Shams University
 Introduction

ENIAC, U.S. Army, 1946 Smart phone

Size → Large hall (> 150m2) Size → Your pocket
Power Consumption ≈ 150kW Power consumption < 1W
01: Introduction 2
 Electronics All Around Us

01: Introduction 3
 Transistor Evolution

First transistor Trigate Transistor

Contacts separation ≈ 100µm Fin width ≈ 8nm
Bell Labs, 1947 Intel, 2015

01: Introduction 4
 Integrated Circuit Evolution
≈ 13.5mm

≈ 11mm

First IC Quad-core CPU

Only one transistor (+ R + C)! > 109 transistors!
Texas Instruments (TI), 1958 Intel, 2017

01: Introduction 5
 Sensing Microsystems

3mm 4mm

ADXL350
Analog Devices, 2012
Complete system on a tiny chip
• 3-axis MEMS* accelerometer
• Interface electronics
• Analog-to-digital conversion
• Memory
First accelerometer • Control logic
B&K, 1940s • Power management
• Digital interface
Simple bulky transducer
Acceleration → Voltage *MEMS = Micro-Electro-Mechanical
01: Introduction Systems 6
 What is an Integrated Circuit (IC)?
❑ Various circuit elements: transistors, capacitors, resistors, and even small inductances can
be integrated on one chip

01: Introduction 7
 Discrete vs. Integrated Electronics
Circuits using discrete components Integrated circuit

01: Introduction 8
 Analog vs Digital Signals
❑ Analog: continuous in time and amplitude

❑ Digital: discrete in time and amplitude

01: Introduction [Razavi, 2014] 9

 Why Digital?
❑ Digital circuits are
▪ Less sensitive to noise (robust)
▪ Easier to store (digital memories)
▪ Easier to process (digital signal processing: DSP)
▪ Amenable to automated design
▪ Amenable to automated testing
▪ Direct beneficiary of Moore’s law (down-scaling)

01: Introduction 10
 Why Analog?
❑ All the physical signals in the world around us are analog
▪ Voice, light, temperature, pressure, etc.
❑ We (will) always need an “analog” interface circuit to connect between our physical world
and our digital electronics

Digital
Amplifier A/D processing
Transducer and storage

01: Introduction 11
 Signal Processing Chain

Amp A/D

Transducers
Physical world
Digital
(sound, light,
Power Management processing
temperature,
and storage
pressure, etc.)

Amp D/A

01: Introduction 12
 Electronic System Example: Wireless Transceiver

Rx Amp A/D

EM Waves
Digital
Power Management processing
and storage

Tx Amp D/A

01: Introduction 13
 Electronic System Example: Mixed-Signal Hearing Aid

ΣΔ ΣΔ H-Bridge
DSP
A/D D/A Driver

AGC Decimation
Filter

01: Introduction [Y. Chiu, EECT 7327, UTD] 14

 Textbook
❑ A. Sedra and K. Smith, “Microelectronic circuits,” 7th ed., Oxford University Press, 2015.
❑ There is an 8th edition in 2020!

01: Introduction 15
 Main Branches of Electronics

Electronics

Microelectronics Electronic Power

(IC Design) Systems Electronics

Analog IC Digital IC Embedded

Design Design Systems

01: Introduction 16
 Electronics Journey
Electrical Circuits Semiconductor Physics

Introduction to Electronics
Analog Circuits Digital Circuits Electronic Devices

Electronic
Analog ICs Digital ICs
Instrumentation
Fabrication
RF Circuits ASIC Automation
Technology
01: Introduction 17
 IC Industry in Egypt

01: Introduction 18
 Thank you!

01: Introduction 19
 Analog IC Design Flow (Simplified)
Design Specs

Topology Selection Fabrication

Circuit Hand Calculations

Packaging
Design and Analysis Tape-out

Simulation and
Testing
Design Adjustment

Physical Layout and Post No Specs

Design Layout Simulation met?

Yes
Specs
No met? Yes Product

01: Introduction [M. El-Nozahi, ASU] 20

 Tape-Out
❑ The layout is sent to the fab in a format called GDS II
▪ Previously it was sent on a magnetic tape → tape-out
▪ Now by email (small design) or FTP (large design)

01: Introduction [Weste and Harris, 2010] 21

 Packaging and Testing
❑ Wafer diced into dies
❑ Gold bond wires from die I/O pads to package
❑ Packaging is now much more advanced than the
simple DIP
→ DIP: Dual inline package

01: Introduction [Weste and Harris, 2010] 22