Regulador de Voltagem LM1117RS - HTC
Regulador de Voltagem LM1117RS - HTC
SOT-223 PKG
FEATURES
● Output Current up to 1 A
● Low Dropout Voltage ( 1.2V at 1A Output Current )
● Three Terminal Adjustable(ADJ) or Fixed 1.2V,1.5V, 1.8V, 2.5V, TO-252 PKG
2.85V, 3.3V, 5.0V
● Line Regulaion typically at 0.1% max
● Load Regulaion typically at 0.2% max
● Internal Current and Terminal Protection
● Maximum Input Voltage - 15V
● Surface Mount Package SOT-223, TO-252, SOT-89 SOT-89 PKG
● 100% Thermal Limit Burn-In
1 2 3
Pin 1. Adjust/Ground
2. Output
3. Input
APPLICATION
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ORDERING INFORMATION
Device (Marking) Package
● Active SCSI Terminators LM1117S-ADJ
SOT-223
● Portable/Plan Top/Notebook Computers LM1117S-XX
● High Efficiency Linear Regulators LM1117RS-ADJ
TO-252
● SMPS Post Regulators LM1117RS-XX
● Mother B/D Clock Supplies LM1117F-ADJ
SOT-89
● Disk Drives LM1117F-XX
● Battery Chargers ( X.X=Output Voltage=1.2V,1.5V, 1.8V, 2.5V,
'3.3V, 5.0V, Adjustable=ADJ)
DESCRIPTION
The LM1117 is a low power positive-voltage regulator designed to meet 1A output current and comply
with SCSI-II specifications with a fixed output voltage of 2.85V. This device is an excellent choice for use
in battery-powered applications, as active terminators for the SCSI bus, and portable computers.
The LM1117 features very low quiescent current and very low dropout voltage of 1V at a full load and
lower as output current decreases. LM1117 is available as an adjustable or fixed 1.5V, 1.8V, 2.5V,
3.3V, and 5.0V output voltages.
The LM1117 is offered in a 3-pin surface mount package SOT-223, TO-252 & SOT-89. The output capacitor
of 10㎌ or larger is needed for output stability of LM1117 as required by most of the other regulator circuits.
THERMAL DATA
TYPICAL APPLICATION
VIN LM1117S/RS/F
10㎌ 10㎌
Tantalum Tantalum
APPLICATION CIRCUITS
Figure 1. Figure 2.
LOAD R2
VOUT=VREF(1+R2/R1)+IADJR2
LM1117S-50
VIN
IN OUT
+ +
GND
10㎌ 100㎌
VOUT=-5V
FLOATING INPUT
110
110
18-27
LM1117S-28 110 LINES
IN (2.85V)
+ GND + 22㎌
110
4.75V
TO 10㎌
5.25V
LM1117S-50
VIN>11.5V IN OUT 10V
+ +
GND
10㎌ 100㎌
5VOUT
LM1117S-50
VIN IN OUT 5.2V LINE
+ 5.0 BATTERY
GND
10㎌
50Ω
SELECT FOR
CHARGE VALUE
LM1117S-50
+
IN OUT
6.5V 10㎌ GND +
100㎌
0.6
-0.5
-1.0 0.4
-1.5 0.2
-2.0 0
FIG 1. OUTPUT VOLTAGE CHANGE vs TEMPERATURE(℃) FIG 2. DROPOUT VOLTAGE vs OUTPUT CURRENT
2.0 1.8
Tj = 25℃ Vin=Vout +3.0V
Iout=10mA
1.7
Iout, OUTPUT CURRENT(A)
1.5 1.6
1.5
1.0 1.4
1.3
0.5 1.2
0 1.0
FIG 3. OUTPUT SHORT CIRCUIT CURRENT FIG 4. OUTPUT SHORT CIRCUIT CURRENT
20
IQ, QUIESCENT CURRENT CHANGE (%
15
Iadj, ADJUST PIN CURRENT
10
Iout = 10 mA
60 5
50
0
-5
40
-10
-15
10 -20
-50 -25 -0 25 50 75 100 125 150 -50 -25 -0 25 50 75 100 125 150
The LM1117 can deliver a continuous current of 1A over the full operating junction temperature range. However, the
current is limited by the restriction of power dissipation which differs from packages. A heat sink may be required
depending on the maximum power dissipation and maximum ambient temperature of application. With respect to th
applied package, the maximum output current of 1A may be still undeliverable due to the restriction of the power diss
of LM1117. Under all possible conditions, the junction temperature must be within the range specified under
operating conditions. The temperatures over the device are given by:
TC = T A + PD X θCA
TJ = T C + PD X θJC
TJ = T A + PD X θJA
TJ is the junction temperature, T C is the case temperature, TA is the ambient temperature, P D is the total power dissi
of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal resistance of junction-to-case,
and θJA is the thermal resistance of junction to ambient. The total power dissipation of the device is given by
where IGND is the operating ground current of the device which is specified at the Electrical Characteristics. The max
allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application
and the maximum allowable junction temperature (TJmax):
The maximum allowable value for junction-to-ambient thermal resistance, θ JA, can be calculated using the formula:
θJA = T Rmax / PD
LM1117 is available in SOT223, TO252 packages. The thermal resistance depends on amount of copper area or he
and on air flow. If the maximum allowable value of θJA calculated above is over 130°C/W for SO-223 package, over
for TO252 package, no heat sink is needed since the package can dissipate enough heat to satisfy these
requirements. If the value for allowable θJA falls near or below these limits, a heat sink or proper area of cop
plane is required. In summary, the absolute maximum ratings of thermal resistances are as follow: