GE Medical Systems

Technical
Publication

Direction 5114494-100
Revision 01
RIP Motorola Board Replacement
SERVICE DOCUMENTATION

Copyright © 2004 by General Electric Company, Inc.

All rights reserved.
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LEGAL NOTES

TRADEMARKS
All products and their name brands are trademarks of their respective holders.

OMISSIONS & ERRORS

Customers, please contact your GE Sales or Service represenatives.
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this
publication.

COPYRIGHTS
All Material Copyright (c) 2004 by General Electric Company, Inc. All rights reserved.

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IMPORTANT PRECAUTIONS
LANGUAGE
WARNING This Service Manual is available in English only.
If a customer’s service provider requires a language other than English, it is
the customer’s responsibility to provide translation services.
Do not attempt to service the equipment unless this service manual has
been consulted and is understood.
Failure to heed this Warning may result in injury to the service provider,
operator or patient from electric shock, mechanical or other hazards.
AVERTISSEMENT Ce Manuel de maintenance n’est disponible qu’en anglais.
Si le technicien du client a besoin de ce manuel dans une autre langue que
l’anglais, c’est au client qu’il incombe de le faire traduire.
Ne pas tenter d’intervention sur les équipements tant que le manuel Service
n’a pas été consulté et compris.
Le non-respect de cet avertissement peut entraîner chez le technicien,
l’opérateur ou le patient des blessures dues à des dangers électriques,
mécaniques ou autres.
WARNUNG Dieses Kundendienst-Handbuch existiert nur in englischer Sprache.
Falls ein fremder Kundendienst eine andere Sprache benötigt, ist es
Aufgabe des Kunden für eine entsprechende Übersetzung zu sorgen.
Versuchen Sie nicht, das Gerät zu reparieren, bevor dieses Kundendienst-
Handbuch zu Rate gezogen und verstanden wurde.
Wird diese Warnung nicht beachtet, so kann es zu Verletzungen des
Kundendiensttechnikers, des Bedieners oder des Patienten durch
elektrische Schläge, mechanische oder sonstige Gefahren kommen.
AVISO Este Manual de Servicio sólo existe en inglés.
Si algún proveedor de servicios ajeno a GEMS solicita un idioma que no sea
el inglés, es responsabilidad del cliente ofrecer un servicio de traducción.
No se deberá dar servicio técnico al equipo, sin haber consultado y
comprendido este manual de servicio.
La no observancia del presente aviso puede dar lugar a que el proveedor de
servicios, el operador o el paciente sufran lesiones provocadas por causas
eléctricas, mecánicas o de otra naturaleza.

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LANGUAGE
ATENÇÃO Este Manual de Assistência Técnica só se encontra disponível em Inglês.
Se qualquer outro serviço de assistência técnica, quE não a GEMS, solicitar
estes manuais noutro idioma, é da responsabilidade do cliente fornecer os
serviços de tradução.
Não tente reparar o equipamento sem ter consultado e compreendido este
Manual de Assistência Técnica.
O não cumprimento deste aviso pode por em perigo a segurança do técnico,
operador ou paciente devido a‘ choques elétricos, mecânicos ou outros.
AVVERTENZA Il presente manuale di manutenzione è disponibile soltanto in inglese.
Se un addetto alla manutenzione esterno alla GEMS richiede il manuale in
una lingua diversa, il cliente è tenuto a provvedere direttamente alla
traduzione.
Si proceda alla manutenzione dell’apparecchiatura solo dopo aver
consultato il presente manuale ed averne compreso il contenuto.
Non tenere conto della presente avvertenza potrebbe far compiere
operazioni da cui derivino lesioni all’addetto alla manutenzione,
all’utilizzatore ed al paziente per folgorazione elettrica, per urti meccanici od
altri rischi.

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DAMAGE IN TRANSPORTATION

All packages should be closely examined at time of delivery. If damage is apparent write “Damage In
Shipment” on ALL copies of the freight or express bill BEFORE delivery is accepted or “signed for” by a
GE representative or hospital receiving agent. Whether noted or concealed, damage MUST be reported
to the carrier immediately upon discovery, or in any event, within 14 days after receipt, and the contents
and containers held for inspection by the carrier. A transportation company will not pay a claim for
damage if an inspection is not requested within this 14 day period.
Call Traffic and Transportation, Milwaukee, WI (414) 785 5052 or 8*323 5052 immediately after damage
is found. At this time be ready to supply name of carrier, delivery date, consignee name, freight or
express bill number, item damaged and extent of damage. Complete instructions regarding claim
procedure are found in Section S of the Policy And Procedures Bulletins. 14 July 1993

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

All electrical Installations that are preliminary to positioning of the equipment at the site prepared for the
equipment shall be performed by licensed electrical contractors. In addition, electrical feeds into the
Power Distribution Unit shall be performed by licensed electrical contractors. Other connections between
pieces of electrical equipment, calibrations and testing shall be performed by qualified GE Medical
personnel. The products involved (and the accompanying electrical installations) are highly sophisticated,
and special engineering competence is required. In performing all electrical work on these products, GE
will use its own specially trained field engineers. All of GE’s electrical work on these products will comply
with the requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GE’s field engineers, personnel
of third-party service companies with equivalent training, or licensed electricians) to perform electrical
servicing on the equipment.

IMPORTANT...X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained
should be thoroughly read and understood by everyone who will use the equipment before you attempt to
place this equipment in operation. The General Electric Company, Medical Systems Group, will be glad
to assist and cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful
beam, no practical design of equipment can provide complete protection. Nor can any practical design
compel the operator to take adequate precautions to prevent the possibility of any persons carelessly
exposing themselves or others to radiation.
It is important that anyone having anything to do with x-radiation be properly trained and fully acquainted
with the recommendations of the National Council on Radiation Protection and Measurements as
published in NCRP Reports available from NCRP Publications, 7910 Woodmont Avenue, Room 1016,
Bethesda, Maryland 20814, and of the International Commission on Radiation Protection, and take
adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems
Group, its agents, and representatives have no responsibility for injury or damage which may result from
improper use of the equipment. Various protective materials and devices are available. It is urged that
such materials or devices be used.

OMISSIONS & ERRORS

Customers, please contact your GE Sales or Service represenatives. GE personnel, please use the
GEMS CQA Process to report all omissions, errors, and defects in this publication.

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REVISION HISTORY
REVISON HISTORY

Revision Date Reason for change

01 09/02/04 Initial Release

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TABLE OF CONTENTS
Legal Notes .................................................................................................................................................3
TRADEMARKS.......................................................................................................................................... 3
OMISSIONS & ERRORS .......................................................................................................................... 3
COPYRIGHTS ............................................................................................................................................... 3
Important Precautions .................................................................................................................................4
LANGUAGE .................................................................................................................................................. 4
LANGUAGE .................................................................................................................................................. 5
Revision History ..........................................................................................................................................7
Table of Contents........................................................................................................................................8
Chapter 1 – Steering Guide ........................................................................................................................9
Chapter 2 - RIP Motorola Bd Replacement ..............................................................................................10
SECTION 1 - PERSONNEL REQUIREMENTS................................................................................................... 10
SECTION 2 - PRELIMINARY REQUIREMENTS ................................................................................................. 11
2.1 Parts Ordering........................................................................................................................... 11
2.2 - Tools and Test Equipment.......................................................................................................... 12
2.3 - Required Conditions .................................................................................................................... 12
SECTION 3 - PROCEDURE........................................................................................................................... 12
3.1 - Power Down (Off) the Console.................................................................................................... 12
3.2 - Remove Original RIP MVME Motorola Board ............................................................................. 13
3.3 - Remove Daughter Cards............................................................................................................. 14
3.4 - Install Daughter Cards onto NEW Motorola Board ..................................................................... 16
3.5 - Mounting Motorola Board Assembly into VME Card Cage ......................................................... 17
3.6 - Connecting Cables to Motorola Bd Assembly in VME Card Cage.............................................. 18
3.7 - Power Up (On) Console and PFLASH ........................................................................................ 19
3.8 - PFLASH ....................................................................................................................................... 19
Appendix – Example pFLASH output .......................................................................................................20

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CHAPTER 1 – STEERING GUIDE

The following Steering Guide is to be used for the MVME Replacement procedure for ALL CT scanners
using RIP Board P/N 2339284 and its successor 2370825. (This procedure applies only to CT-only
scanners – it does NOT apply to Discovery LS.)

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CHAPTER 2 - RIP MOTOROLA BD REPLACEMENT

SECTION 1 - PERSONNEL REQUIREMENTS

Required Persons Procedure Finalization
1 45 min

NOTE: If SW LFC procedure needs to be completed, then plan for one complete day (8hr)

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SECTION 2 - PRELIMINARY REQUIREMENTS

2.1 PARTS ORDERING
1. Find the system type you are servicing in the table below.
Using the top row, select the system and version of software currently loaded on your CT system. Given this selection, order the “X’ed” parts listed in
that column. These parts support the replacement of your MVME2400 SBC (GEMS P/N 2339284) replacement with MVME2400 SBC (GEMS P/N
2370825).
IRIX-Based Systems Linux-Based Systems

HS QX/I LS 3X LS 4X LS 4X LS 3X LS 4X HS QX/I (Linux) LS 3X (Linux) LS 4X (Linux)

Find System 4 Slice 4 or 8 Slice 16 Slice 16 Slice 4 or 8 Slice 16 Slice 4 Slice 4 or 8 Slice 16 Slice
S/W Version S/W Version S/W Version S/W Version S/W Version S/W Version S/W Version S/W Version S/W Version
Needed Parts 101I.4_HSQXIM4 308I.2_H3.1M5 405I.2_H4.0M5 405I.3_H4.0M5.1 305.4_H3.1M4 401.8_H4.0M4 102L.1_HSQXILINUXM3 308L.5_H3.3M4 408L.5_H4.2M4

MVME 2400 Kit

(SBC + Install Doc) X X X X X X X X X
5114901

HighSpeed QXI (IRIX) S/W

2401246 (FMI 25902) X
101I.2_HSQXIM5

LightSpeed 3X (IRIX) S/W

2395177 X
308I.2_H3.1M5

LightSpeed 4X (IRIX) S/W

5116050 X X
405I.3_H4.0M5.1

HighSpeed QXI (Linux) S/W

2401245 X
103L.4_HSQXIM4

LightSpeed 4X (Linux) S/W

5111370 (FMI 25338) X
405L.8_H4.2M4

HighSpeed QX/I (IRIX)

S/W LFC Procedure X
2340896-100

LightSpeed 3X & 4X (IRIX)

S/W LFC Procedure X X X
2348269-100

HighSpeed QX/I (Linux)

S/W LFC Procedure X
2379286-100

LightSpeed 3X & 4X (Linux)

S/W LFC Procedure X
2362590-100

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2. To determine if the software release is loaded on the system, do the following:

a. Open a Unix Shell.
b. Type: showprods | grep LightSpeed
3. If you needed to order the SW LFC procedure, then you must proceed with the SW LFC.

2.2 - TOOLS AND TEST EQUIPMENT

Screw Driver

2.3 - REQUIRED CONDITIONS

ESD-Safe Environment.

SECTION 3 - PROCEDURE
NOTE: There are Sub Parts attached or connected to the RIP board (e.g., DIP daughter-card, SCSI
daughter). These parts must be removed/detached from the SBC and stored properly (I.E. ESD bags).
They will be later reconnected to the replacement RIP Board.
NOTE: After the RIP Board has been replaced in the Operator console, the Pflash procedure needs to be
performed.

3.1 - POWER DOWN (OFF) THE CONSOLE

1. Power off the Operator Console following one of the two methods:
a. If Applications are up:

i. Select the Shutdown Icon,

ii. Select [SHUTDOWN]
iii. Select [OK]
b. When the console is shutdown, a message on the Operator Console monitor is
displayed:

Figure 1 – Message Operator Console Monitor

c. If Applications are down:

Open a Unix Shell from the Tool chest and type the following:

i. su – <enter>

ii. password: #bigguy <enter>

iii. shutdown

The Operator Console monitor will display a 'Power down' message.

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2. Power OFF the console at the front switch.

3.2 - REMOVE ORIGINAL RIP MVME MOTOROLA BOARD

1. Remove the front Operator Console cover. For detailed instructions on how to do this, refer to:
• Direction 2243314 LS2.x System Service Manual, Book 3, Chapter 5, Section 3.2.1
• Direction 2399875-800 LS 3.x Service Methods -> Parts Replacement -> Console
(GOC1 or GOC2) -> SRU Replacements - Global Consoles-> Access to the SRU’s
Interior
• Direction 5112256-800 LS4.x Service Methods -> Parts Replacement -> Console (GOC1 or
GOC2) -> SRU Replacements - Global Consoles -> RIP Board Replacement
2. Remove all cable connections to the MVME RIP / Motorola Board. For detailed instructions on
how, refer to:
• Direction 2243314 LS2.x System Service Manual, Book 3, Chapter 5, Section 3.2.1
• Direction 2399875-800 LS 3.x Service Methods -> Parts Replacement -> Console
(GOC1 or GOC2) -> HTSRU Replacements - Global Consoles ->RIP Board
Replacement
• Direction 5112256-800 LS4.x Service Methods -> Parts Replacement -> Console
(GOC1 or GOC2) -> SRU Replacements - Global Consoles -> RIP Board
Replacement
3. Verify each cable label is present and clearly marked. If necessary, add a label for clarity (to
make reassembly easier) .
• RJ45 DEBUG Cable
• RJ45 10/100 BaseT Cable
• PCI Mezzanine Card SCSI Daughter Board Cable A
• DIP Board Daughter Board Fiber optic RX Cable
• DIP Board Daughter Board DIP Scan Abort Cable
4. Place the original Motorola Board on a static mat.

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3.3 - REMOVE DAUGHTER CARDS

3.3.1 - REMOVING SCSI BOARD FROM MOTOROLA BOARD

NOTE: Do not follow steps in the Illustration. This Illustration shows the proper card placement and screw
locations. DO use the following steps:
• Direction 2243314 LS2.x System Service Manual, Book 3, Chapter 5, Section 3.2.1
• Direction 2399875-800 LS 3.x Service Methods -> Parts Replacement -> Console (GOC1 or
GOC2) -> SRU Replacements - Global Consoles -> RIP Board Replacement
• Direction 5112256-800 LS4.x Service Methods -> Parts Replacement -> Console (GOC1 or
GOC2) -> SRU Replacements - Global Consoles -> RIP Board Replacement

1. SCSI board should already have four standoffs mounted as illustrated in Figure 2 below.
2. On the bottom side of the Motorola Board remove and retain the four (4) screws holding the
Daughter SCSI board in place.
3. Remove the Daughter SCSI Card from the Motorola Mother Board and place on the static mat.

PART NUMBER DESCRIPTION QUANTITY

2265396 SCSI board 1
46-328421P4 Screws 4

Figure 2 – Removing SCSI Board from the Motorola Board

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3.3.2 - UNMOUNTING DIP BOARD FROM MOTOROLA BOARD

NOTE: Do not follow steps in the Illustration (provided here for RIP illustration value). This Illustration
shows the proper card placement and screw locations. DO use the following steps:
• Direction 2243314 LS2.x System Service Manual, Book 3, Chapter 5, Section 3.2.1
• Direction 2399875-800 LS 3.x Service Methods -> Parts Replacement -> Console (GOC1 or
GOC2) -> HTSRU Replacements - Global Consoles -> RIP Board Replacement
• Direction 5112256-800 LS4.x Service Methods -> Parts Replacement -> Console (GOC1 or
GOC2) -> SRU Replacements - Global Consoles -> RIP Board Replacement

1. DIP board should already have four standoffs mounted as illustrated in Figure 3 below.
2. On the bottom side of the Motorola Board remove and retain the four (4) screws holding the
Daughter DIP board in place.
3. Remove the Daughter DIP Card from the Motorola Mother Board and place on the static mat.

PART NUMBER DESCRIPTION QUANTITY

2259530 DIP board 1
2209277 Standoff 4
46-328421P4 Screw 4
2280022 Knurled thumbscrews 2

Figure 3 – Unmounting DIP Board From Motorola Board

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3.4 - INSTALL DAUGHTER CARDS ONTO NEW MOTOROLA BOARD

3.4.1 MOUNTING SCSI BOARD TO MOTOROLA BOARD

1. Verify SCSI board gasket is removed from front faceplate groove.

Verify jumpers J1 and J2 are installed on SCSI board.
2. SCSI board should already have 4 standoffs mounted as illustrated in Figure 4 below.
3. Remove front panel filler blank(s), if applicable.
4. Mount SCSI board to Motorola board, using the 4 screws {46-328421P4}.

PART NUMBER DESCRIPTION QUANTITY

2265396 SCSI board 1
46-328421P4 Screws 4

Figure 4 – Mounting SCSI Board to Motorola Board

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3.4.2 - MOUNTING DIP BOARD TO MOTOROLA BOARD

1. DIP board should already have 4 standoffs mounted as illustrated in Figure 5 below.
2. Verify DIP board gasket is removed from front faceplate groove.
3. Remove front panel filler blank(s), if applicable.
4. Mount DIP board to Motorola board, using the 4 screws {46-328421P4}.
Verify orientation as shown in the following figure:

Figure 5 – Mounting DIP Board to Motorola Board

PART NUMBER DESCRIPTION QUANTITY

2259530 DIP board 1
2209277 Standoff 4
46-328421P4 Screw 4
2280022 Knurled thumbscrews 2

3.5 - MOUNTING MOTOROLA BOARD ASSEMBLY INTO VME CARD CAGE

Install Motorola board Assembly into VME cage and tighten knurled thumbscrews.
NOTE: Finger tight is appropriate; do not over-torque knurled thumbscrews.
NOTE: When board is properly inserted, all faceplates are flush.

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3.6 - CONNECTING CABLES TO MOTOROLA BD ASSEMBLY IN VME CARD CAGE

1. If a plug half is present, verify that the plug is in the DIP Board TX bottom.
2. Connect DEBUG (topmost RJ45 port) cable to Motorola board.
3. Connect 10/100 Base T (center RJ45 port) cable to Motorola board.

Figure 6 – Connecting Cables To Motorola Board Assembly In The Vme Card Cage

4. Connect SCSI cable A to SCSI Daughter PCI Mezzanine CARD.

Figure 7 – Connect SCSI cable A to SCSI Daughter PCI Mezzanine CARD

5. Connect DIP fiber cable to top (RX) port on the DIP Daughter board.
6. Connect DIP board DIP Scan Abort cable to DIP Daughter board.
7. Hand-tighten knurled thumbscrews into front panel faceplate of Motorola board (top and bottom).

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3.7 - POWER UP (ON) CONSOLE AND PFLASH

1. Power ON the console at the front breaker.
2. Stop Applications from auto-starting at the 5 second PINK Box.

Figure 8 – Power Up (On) The Console And Pflash - 1

Figure 9 – Power Up (On) The Console And Pflash - 2

3.8 - PFLASH
NOTE: ONLY perform pflash with Applications Down.
1. Open a Unix Shell from the Tool chest.
2. Execute the following command:
Type:
cu ice ENTER
Press the ENTER key.
3. Verify the PPCIBUG prompt is present.
Type:
~. ENTER
4. Type:
cd /usr/g/ice/bin ENTER
pflash ENTER
/usr/g/ice/bin/sbcutil –info ENTER
See Appendix – Example pFLASH output, for example output.
5. Start up the Application software:
Type:
st ENTER
6. Close the Unix Shell.
7. If required for your upgrade, proceed with the LFC (see Dir 2348269-100).

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APPENDIX – EXAMPLE PFLASH OUTPUT

reading board information
Connecting to the ice (serial connection)
We are Connected !!!
debug> timeout=30

debug> setPromptPPCBUG
cnfg
Board (PWA) Serial Number = "5349018 "
Board Identifier = "MVME2433-4
"
Artwork (PWA) Identifier = "01-W3839F27A
"
MPU Clock Speed = "350"
BUS Clock Speed = "100"
Ethernet Address = 0001AF0A086D
Primary SCSI Identifier = "07"
System Serial Number = "
"
System Identifier = "
"
License Identifier = "5349018 "
PPC4-Bug>ver
Debugger/Diagnostics
Type/Revision..................=PPC4/1.2
Debugger/Diagnostics Revision
Date..................=02/15/99 RM01
MicroProcessor
Version/Revision.....................=0008/83
02
MicroProcessor Internal Clock Speed
(MHZ)...........=350
MicroProcessor External Clock Speed
(MHZ)...........=100
Board Type
Identifier...............................=MVM
E2400
PCI Bus Clock Speed
(MHZ)...........................=33
Local Memory
Size...................................=10000
000 (256MB)
L2 Cache
(External).................................=0
KB
L2 Cache (P0-In-

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Line)...............................=1024KB
L2 Cache (P1-In-
Line)...............................=0KB
Super I/O Device
Offset/ID/Revision.................=UNKNOWN
PCI Function 00/00/0 (00000000)
ID/Revision.........=48031057/03
PCI Function 00/0B/0 (00005800)
ID/Revision.........=056510AD/17
PCI Function 00/0B/1 (00005900)
ID/Revision.........=010510AD/17
PCI Function 00/0D/0 (00006800)
ID/Revision.........=000010E3/02
PCI Function 00/0E/0 (00007000)
ID/Revision.........=00191011/41
PCI Function 00/10/0 (00008000)
ID/Revision.........=435417B6/00
PCI Function 00/11/0 (00008800)
ID/Revision.........=00211000/01
PCI Function 00/11/1 (00008900)
ID/Revision.........=00211000/01
PPC4-Bug>
Process Complete !
/usr/g/ice/bin/sbcutil -env
setting PPCBug NVRAM parameters

Connecting to the ice (serial connection)

We are Connected !!!
debug> timeout=30
debug> setPromptPPCBUG
debug> timeout=15

Process Complete !
/usr/g/ice/bin/sbcutil -bs
FLASHing bootstrap to allow dual FLASH boot

Connecting to the ice (serial connection)

We are Connected !!!
debug> timeout=30
debug> setPromptPPCBUG
debug> timeout=15

Process Complete !
/usr/g/ice/bin/sbcutil -br
FLASHing VxWorks bootrom

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Connecting to the ice (serial connection)

We are Connected !!!
debug> timeout=30
debug> setPromptPPCBUG
inetEthernet=192.9.220.11
debug> timeout=90

tftp vxWorks BootRom Code into Memory...

debug> timeout=15
debug> timeout=15
Performing Board Reset
debug> timeout=15

Process Complete !
/usr/g/ice/bin/sbcutil -config
setting VxWorks NVRAM parameters

Connecting to the ice (serial connection)

We are Connected !!!
debug> timeout=30
debug> setPromptVxWorksBoot
debug> bootConfigVxWorks

Process Complete !

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GE Medical Systems
3000 N Grandview Blvd,
Waukesha, WI 53188 U.S.A.