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T-Top800 T-Top800 Top81

This document provides information on the T-top81 gap filler product from SH IU L I T E C HNOGY CO., L TD. T-top81 is a high deflection, thermally conductive silicone gap filler designed to fill small air gaps and ensure efficient heat transfer. It has a thermal conductivity of 8.0 W/m*K, compressibility up to 68% at 50 psi, and is UL 94 V-0 qualified. T-top81 is suitable for applications between a CPU and heat sink or other components requiring thermal coupling over an air gap.

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92 views1 page

T-Top800 T-Top800 Top81

This document provides information on the T-top81 gap filler product from SH IU L I T E C HNOGY CO., L TD. T-top81 is a high deflection, thermally conductive silicone gap filler designed to fill small air gaps and ensure efficient heat transfer. It has a thermal conductivity of 8.0 W/m*K, compressibility up to 68% at 50 psi, and is UL 94 V-0 qualified. T-top81 is suitable for applications between a CPU and heat sink or other components requiring thermal coupling over an air gap.

Uploaded by

CADTDD
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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SH IU L I T E C HNOGY CO.

, L TD

T-top800
top81
T-TOP81-25-25-1.5
7852190-00

Ultra Soft & Highly Thermally Conductive Gap Filler


Construction-
LiPOLY T-top81 is a high deflection gap Series Characteristics
pad,with outstanding thermal conductivi- T-top81 Silicone compound with weak sticky surfaces.
ty and low thermal resistance in form-
shape. T-top81 offers excellent compres-
sion, filling small air gaps on uneven Typical Properties-
surfaces, ensuring an efficient and
consistent transfer of heat. T-top81 was PROPERTY T-top81 TEST METHOD UNIT
designed for thermal modules with limited
Color Purple Visual -
gap sizes and low compression force.
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm

Features- Density 3.4 ASTM D792


• Thermal conductivity: 8.0 W/m*K Hardness 35 ASTM D2240 Shore OO
• High compression rate
TML <0.1 By LiPOLY %
• Low thermal impedance
• Silicone compound Application temperature -60~150 -
• UL 94V-0 qualified [email protected]
Deflection @10 psi 7 ASTM D5470 modify %
Typical Applications-
Deflection @20 psi 20 ASTM D5470 modify %
• Between CPU and heat sink.
• Between a component and heat sink Deflection @30 psi 43 ASTM D5470 modify %
• Flat-panel displays Deflection @40 psi 64 ASTM D5470 modify %
• Power supplies
Deflection @50 psi 68 ASTM D5470 modify %
• High speed mass storage drives
• Telecommunication hardware ELECTRICAL
Dielectric breakdown 8 ASTM D149 KV/mm
Surface resistivity 1
ASTM D257 Ohm
Volume resistivity 0
ASTM D257 Ohm-m
Heat Sink
Dielectric constant@10M Dk 9.0 ASTM D150 -
CHIP CHIP T-top81
Dielectric constant@1G Dk 9.1 ASTM D150 -
PCB
Dielectric [email protected] Dk 10.1 ASTM D150 -
Dielectric factor@10M Dk 0.006 ASTM D150 -
Dielectric factor@1G Dk 0.001 ASTM D150 -
Dielectric [email protected] Dk 0.021 ASTM D150 -
THERMAL
Thermal Conductivity 8.0 ASTM D5470 W/m*K
Thermal impedance@10psi 0.260 ASTM D5470
Thermal impedance@20psi 0.221 ASTM D5470
Thermal impedance@30psi 0.148 ASTM D5470
Thermal impedance@40psi 0.122 ASTM D5470
Thermal impedance@50psi 0.112 ASTM D5470
Coefficient of thermal expansion -236.67x ASTM E228 1/K
FLAME RATING
UL Flammability class V-0 UL94 -

13

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