General Description Features: Ezbuck™ 1.5A Non-Synchronous Buck Regulator
General Description Features: Ezbuck™ 1.5A Non-Synchronous Buck Regulator
Applications
● Point of load DC/DC conversion
● PCIe graphics cards
● Set top boxes
● DVD drives and HDD
● LCD panels
● Cable modems
● Telecom/networking/datacom equipment
Typical Application
VIN
C1
22µF Ceramic
VIN L1
4.7µH
From µPC EN VOUT
AOZ1015 LX
COMP R2
C4, C6
R1 FB 22µF x 2
Ceramic
C5 AGND PGND R3
C2
1nF
Ordering Information
Part Number Ambient Temperature Range Package Environmental
AOZ1015AI -40°C to +85°C SO-8 RoHS
All AOS Products are offering in packaging with Pb-free plating and compliant to RoHS
standards. www.aosmd.com/media/AOSGreenPolicy.pdf Please visit for additional information.
Pin Configuration
PGND 1 8 LX
VIN 2 7 LX
AGND 3 6 EN
FB 4 5 COMP
SO-8
(Top View)
Pin Description
Pin Number Pin Name Pin Function
1 PGND Power ground. Electrically needs to be connected to AGND.
2 VIN Supply voltage input. When VIN rises above the UVLO threshold the device starts up.
3 AGND Reference connection for controller section. Also used as thermal connection for controller
section. Electrically needs to be connected to PGND.
4 FB The FB pin is used to determine the output voltage via a resistor divider between the output
and GND.
5 COMP External loop compensation pin.
6 EN The enable pin is active HIGH. Connect EN pin to VIN if not used. Do not leave the EN pin
floating.
7, 8 LX PWM output connection to inductor. Thermal connection for output stage.
Block Diagram
VIN
+
ISen
–
Reference
Softstart
& Bias Q1
ILimit
+
+ PWM Level
0.8V PWM
EAmp – Control Shifter
FB – Comp +
Logic
+ FET LX
Driver
COMP
Frequency 500kHz/38kHz
Foldback Oscillator
Comparator
+
0.2V –
Over Voltage
Protection
0.96V Comparator
+
–
AGND PGND
Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.(3)
Vin Vin
ripple ripple
0.1V/div 0.1V/div
Vo Vo
ripple ripple
20mV/div 20mV/div
IL IL
1A/div 1A/div
VLX VLX
10V/div 10V/div
1μs/div 1μs/div
Vin
10V/div Vin
10V/div
Vo
1V/div
Iin Vo
0.5A/div 1V/div
Iin
0.5A/div
400μs/div 400μs/div
Vo
Ripple Vin
50mV/div 5V/div
Vo
1V/div
Io
Iin
1A/div
0.5A/div
100μs/div 1s/div
Vo
2V/div
Vo
2V/div
IL
1A/div IL
1A/div
100μs/div 1ms/div
AOZ1015AI Efficiency
Efficiency (VIN = 12V) vs. Load Current
100
8.0V OUTPUT
95
5.0V OUTPUT
90
Efficieny (%)
85
3.3V OUTPUT
80
75
70
65
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Load Current (A)
Thermal de-rating curves for SO-8 package part under typical input and output condition based on the evaluation board.
25°C ambient temperature and natural convection (air speed < 50LFM) unless otherwise specified.
Derating Curves at 5V Input Derating Curves at 12V Input
2.0 2.0
1.8 1.8
1.6 3.3V, 5.0V Output 1.6 3.3V, 5.0V, 8.0 Output
Output Current (IO)
The previous equation above can also be simplified to: The maximum junction temperature of the AOZ1015 is
150°C, which limits the maximum load current capability.
CO × RL
C C = --------------------- Please see the thermal de-rating curves for the maximum
RC load current of the AOZ1015 under different ambient
temperatures.
An easy-to-use application software which helps to The thermal performance of the AOZ1015 is strongly
design and simulate the compensation loop can be found affected by the PCB layout. Extra care should be taken
at www.aosmd.com. by users during the design process to ensure that the IC
will operate under the recommended environmental
Thermal Management and Layout conditions.
Consideration Several layout tips are listed below for the best electronic
In the AOZ1015 buck regulator circuit, high pulsing and thermal performance. Figure 3 illustrates a single
current flows through two circuit loops. The first loop layer PCB layout example as reference.
starts from the input capacitors, to the VIN pin, to the
1. Do not use thermal relief connection to the VIN and
LX pins, to the filter inductor, to the output capacitor
the PGND pins. Pour a maximized copper area to the
and load, and then returns to the input capacitor through
PGND pin and the VIN pin to help thermal dissipation.
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the 2. The input capacitors should be connected as close
output capacitors and load, to the PGND pin of the as possible to the VIN and PGND pins.
AOZ1015, to the LX pins of the AOZ1015. Current flows 3. A ground plane is preferred. If a ground plane is not
in the second loop when the low side diode is on. used, separate PGND from AGND and connect
In PCB layout, minimizing the two loops area reduces the them only at one point to avoid the PGND pin noise
noise of this circuit and improves efficiency. A ground coupling to the AGND pin. In this case, a decoupling
plane is recommended to connect input capacitor, output capacitor should be connected between VIN and
capacitor, and PGND pin of the AOZ1015. AGND.
In the AOZ1015 buck regulator circuit, the two major 4. Make the current trace from LX pins to L to CO to the
power dissipating components are the AOZ1015 and PGND as short as possible.
the output inductor. The total power dissipation of 5. Pour copper plane on all unused board area and
converter circuit can be measured by input power minus connect it to stable DC nodes, like VIN, GND or
output power. VOUT .
P total_loss = V IN × I IN – V O × I O 6. The two LX pins are connected to the internal PFET
drain. They are low resistance thermal conduction
The power dissipation of the inductor can be approxi- path and a noisy switching node. Connecting a
mately calculated by output current and DCR of inductor. copper plane to the LX pin to help thermal dissipa-
tion. This copper plane should not be too large
P inductor_loss = IO2 × R inductor × 1.1
otherwise switching noise may be coupled to other
parts of the circuit.
The actual AOZ1015 junction temperature can be
calculated with power dissipation in the AOZ1015 and 7. Keep sensitive signal traces such as trace
thermal impedance from junction to ambient. connecting FB and COMP away from the LX pins.
PGND LX Cout
1 8
Cin
VIN 2 SO-8 7 LX
Cd L
AGND 3 6 EN
R3
FB
4 5 COMP
R2
C5 R1
E E1
h x 45°
1 C
θ
7° (4x)
A2 A
0.1
b A1
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
E2 E
See Note 3
B0
K0 D0
A0 P0 Feeding Direction
Unit: mm
Package A0 B0 K0 D0 D1 E E1 E2 P0 P1 P2 T
SO-8 6.40 5.20 2.10 1.60 1.50 12.00 1.75 5.50 8.00 4.00 2.00 0.25
(12mm) ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10
SO-8 Reel
W1
S
G
N
M K
V
R
H
SO-8 Tape
Leader/Trailer
& Orientation
Z1015AI
Part Number Code
FAYWLT
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Applications or uses as critical components in life support devices or systems are not authorized. AOS does not
assume any liability arising out of such applications or uses of its products. AOS reserves the right to make
changes to product specifications without notice. It is the responsibility of the customer to evaluate suitability of the
product for their intended application. Customer shall comply with applicable legal requirements, including all
applicable export control rules, regulations and limitations.
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ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or 2. A critical component in any component of a life
systems which, (a) are intended for surgical implant into support, device, or system whose failure to perform can
the body or (b) support or sustain life, and (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in a significant injury of
the user.