Preliminary Specification Number : SP-ABZ-S

1 / 23

Sub-G Module Data Sheet

ta
ra
Mu
my

Sample Part Number: CMWX1ZZABZ-TEMP

om
fr

CMWX1ZZABZ-TEMP-1
,

MP Part Number: CMWX1ZZABZ-078

ly

98
on

80

CMWX1ZZABZ-091
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
2 / 23

Revision History
Revision
Date Description Comments
Code
A June 8, 2016 Initial Draft
B July 1, 2016 Updated height and package info
Revised some formats and ΔRF_OPH_V test condition
C July 30, 2016 from 2.4-3.7V to 2.2-3.6V. Updated some electronic
Characteristics. Added the recommended land pattern.
Updated the RF performance, Electrical Characteristics
D Aug 29, 2016
and power up sequence.
E Sep 28, 2016 Amended the pin description of PA0/WKUP1
Amended the pin description of PA3 and PA2
F Oct 12, 2016
Added label information
G Oct 13, 2016 Amended the pin description of MCU_nRST and BOOT0.
H Nov 7, 2016 Added Sample Part Number and MP Part Number
I Dec 1, 2016 Added weight info
J Dec 12, 2016 Added Sleep current info
K Feb 14, 2017 Added FCC and IC statements
L June 6, 2017 Updated Part number
Revised document title
ta

Added Sample Part Number and MP Part Number

M Nov 7, 2017
ra

Added SIGFOX Transceiver Specification

Mu

Added reference schematic for SigFox modem usage.

my

Added supplemental comments to Electrical

N Dec 21, 2017
Characterisitics.
om

O Jan 12, 2018 Revised reference schematic for LoRa usage

fr

P May 14, 2018 Revised Label information

,
ly

R July 4, 2019 Revised Label information by adding Anatel ID

98
on

S Feb 18,2020 Revised Label information by adding part number

80
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
3 / 23

TABLE OF CONTENTS
1. Features ······················································································································· 4
2. Part Number ················································································································· 4
3. Block Diagram ··············································································································· 4
4. Dimensions, Marking and Terminal Configurations ···························································· 5
5. Label Information ·········································································································· 8
6. Absolute Maximum Ratings ····························································································· 9
7. Operating Condition ······································································································· 9
8. Electrical Characteristics ································································································ 9
8.1. FSK/OOK Transceiver Specification ············································································ 9
8.2. LoRa Transceiver Specification ·················································································· 10
8.3. SIGFOX Transceiver Specification ············································································· 10
8.4. Low power mode current ··························································································· 11
9. Power Sequences ··········································································································· 11
10. Recommend Land Pattern····························································································· 12
11. Reference circuit ·········································································································· 13
12. Tape and Reel packing·································································································· 15
13. Notice ························································································································ 18
14. Regulatory Statements ································································································· 20
ta
ra
Mu
my
om
fr
,
ly

98
on

80
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
4 / 23

1. Features

Interfaces : I2C, UART, USB, SPI

Main ICs : STM32L, SX1276
Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm)
and 32.768KHz clock (frequency error=±20 ppm)
Supported Frequencies : 868 MHz, 915 MHz
Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max)
Weight : 0.48g (Typ)
Package : Metal Shield can
RoHS : This module is compliant with the RoHS directive

2. Part Number

Ordering Part Number MCU Secure element Description

CMWX1ZZABZ-TEMP STM32L082 NA Engineering sample
CMWX1ZZABZ-EVK STM32L082 NA Evaluation board
CMWX1ZZABZ-078 STM32L082 NA MP P/N
ta

CMWX1ZZABZ-TEMP-1 STM32L072 NA Engineering sample

ra

CMWX1ZZABZ-EVK-1 STM32L072 NA Evaluation board

Mu

CMWX1ZZABZ-091 STM32L072 NA MP P/N

my
om
fr

3. Block Diagram
,
ly

98
on

80
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
5 / 23

4. Dimensions, Marking and Terminal Configurations

Top View Bottom View

ta
ra

Side View
Mu
my
om
fr
,
ly

98
on

80

Table 1 Dimension (Unit: mm)

e

03

Mark Dimension Mark Dimension Mark Dimension

nc

on
10
re

L W T
ti

12.5±0.20 11.6±0.20 1.76 max

fe

ca

a1 0.50±0.10 a2 0.50±0.10 a3 1.50±0.10

Re

uy

20

fi

b1 0.20±0.15 b2 1.60±0.15 b3 3.00±0.15

m.

20

ti
,

b4 3.50±0.15 b5 0.20±0.15 b6 1.15±0.15

al

co

no
,

b7 2.55±0.15 c1 0.80±0.10 c2 0.80±0.10

ti

l.

06

c3 1.50±0.10 e1 0.30±0.10 e2 0.30±0.10

en

te

ou
er
id

e3 1.00±0.10 e4 1.00±0.10
an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
6 / 23

Terminal Configurations
< Top View >

ta
ra
Mu

Table 2 Terminal Configurations

my

Pin NO. Terminal Name Type Connection to Description

om

IC terminal
fr

1 PA12/USB_DP I/O STM32L082_PA12 GPIO Mode:PA12.(Power supplied by

,

VDD_USB)
ly

98
on

USB_DP
80
e

2 PA11/USB_DM I/O
03

STM32L082_PA11 GPIO Mode:PA11,( Power supplied by

.
nc

on
10

VDD_USB)
re

ti
fe

USB_DM
ca
Re

uy

20

fi

3 GND Ground - Ground

m.

20

ti
,

4 VDD_USB Power - Power supply for USB

al

co

no
,
ti

5 VDD_MCU Power - Power supply for MCU

l.

06

t
en

te

ou

6 VDD_RF Power - Power supply for RF IC

er
id

an

th
mb

7 GND Ground - Ground

nf

wi
@

ve

8 DBG_SX1276_DIO2 I/O SX1276_DIO2 Debug pin for SX1276, customer cannot use it
Co

ta

No

y
pl

9 DBG_SX1276_DIO3 I/O SX1276_DIO3 Debug pin for SX1276, customer cannot use it
ot

ap
gs

10 SX1276_DIO4 I/O SX1276_DIO4 SX1276 DIO4. Possible to connect to Pin21

ay

PA5 for future usage. Contact ST for further

id

ma
Fr

information
ge

11 DBG_SX1276_DIO5 I/O SX1276_DIO5 Debug pin for SX1276. Possible to connect to

an
Ch

Pin22 PA4 for future usage. Contact ST for

further information
12 DBG_SX1276_DIO1 I/O SX1276_DIO1 Debug pin for SX1276, customer cannot use it
13 DBG_SX1276_DIO0 I/O SX1276_DIO0 Debug pin for SX1276, customer cannot use it

14 PB15/SPI2_MOSI I/O STM32L082_PB15 GPIO Mode:PB15

SPI2_MOSI
15 PB14/SPI2_MISO I/O STM32L082_PB14 GPIO Mode:PB14
SPI2_ MISO

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
7 / 23

16 PB13/SPI2_SCK I/O STM32L082_PB13 GPIO Mode:PB13

SPI2_SCK
17 PB12/SPI2_NSS I/O STM32L082_PB12 GPIO Mode:PB12
SPI2_NSS
18 PA10/USART1_RX I/O STM32L082_PA10 GPIO Mode:PA10
USART1_RX
19 PA9/USART1_TX I/O STM32L082_PA9 GPIO Mode:PA9
USART1_TX
20 PA8/MCO I/O STM32L082_PA8 GPIO Mode:PA8
MCO
21 PA5/ADC5/DAC2 I/O STM32L082_PA5 GPIO Mode:PA5
COMP2_INM
ADC_IN5
DAC_OUT2
Possible to connect to Pin10 for future usage.
Contact ST for more information
22 PA4/ADC4/DAC1 I/O STM32L082_PA4 GPIO Mode:PA4
COMP2_INM
ADC_IN4
ta

DAC_OUT1
ra
Mu

Possible to connect to Pin11 for future usage.

Contact ST for more information
my

23 PA3/ADC3 I/O STM32L082_PA3 GPIO Mode:PA3

om

COMP2_ INP
fr

ADC_IN3
,
ly

USART2_RX
98
on

80

24 PA2/ADC2 I/O STM32L082_PA2 GPIO Mode:PA2

e

03

.
nc

COMP2_OUT
on
10
re

ti

ADC_IN2
fe

ca

USART2_TX
Re

uy

20

fi

25 GND Ground - Ground

m.

20

ti
,
al

co

no

26 ANT A,I/O - Transmit / Receive Antenna

,
ti

l.

06

27 GND Ground - Ground

t
en

te

ou
er

28 DBG_CRF1 I/O STM32L082_PA1 Debug pin. Cannot be used as GPIO

id

an

th
mb
nf

29 DBG_CRF3 I/O STM32L082_PC1 Debug pin. Cannot be used as GPIO

wi
@

ve
Co

30 DBG_CRF2 I/O STM32L082_PC2 Debug pin. Cannot be used as GPIO

ta

No

y
pl
ot

31 STSAFE_nRST I - Reset for Security IC

ap
gs

32 VREF+ Power - Reference Voltage For ADC and DAC

ay

y
id

ma

33 PA0/WKUP1 I/O STM32L082_PA0 GPIO Mode:PA0

Fr

ge

COMP1_OUT
an

ADC_IN0
Ch

34 MCU_nRST I STM32L082_ nRST NRST

35 PB8/I2C1_SCL I/O STM32L082_ PB8 GPIO Mode:PB8
I2C mode: SCL
36 PB9/I2C1_SDA I/O STM32L082_ PB9 GPIO Mode: PB9
I2C mode: SDA
37 PB2/LPTIM1_OUT I/O STM32L082_PB2 GPIO Mode:PB2
LPTIM1_OUT
38 PB7/LPTIM1_IN2 I/O STM32L082_PB7 GPIO Mode:PB7

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
8 / 23

LPTIM1_IN2
39 PB6/LPTIM1_ETR I/O STM32L082_ PB6 GPIO Mode:PB6
LPTIM1_ETR
40 PB5/LPTIM1_IN1 I/O STM32L082_ PB5 GPIO Mode:PB5
LPTIM1_IN1
41 PA13/SWDIO I/O STM32L082_PA13 GPIO Mode:PA13
SWDIO
LPUART1_RX
42 PA14/SWCLK I/O STM32L082_PA14 GPIO Mode:PA14
SWCLK
LPUART1_TX
43 BOOT0 I STM32L082_BOOT0 Boot Option
44 GND Ground - -
45 PH1-OSC_OUT I/O STM32L082_PH1 GPIO Mode:PH1
High-speed external clock OSC output
46 PH0-OSC_IN I/O STM32L082_PH0 GPIO Mode:PH0
High-speed external clock OSC input
47 TCXO_OUT O - Internal TCXO output
48 VDD _TCXO Power - Power supply for the TCXO IC
ta

49~57 GND Ground - Ground

ra
Mu

Notes: GPIO pins are to be left OPEN if not used.

my
om
fr

5. Label Information Part Number

,
ly

078 or 091
98
on

80
e

03

.
nc

on
10
re

ti
fe

ca

_078
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

_091

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
9 / 23

6. Absolute Maximum Ratings

Table 3 Maximum ratings

Parameters Min Typ Max Unit
Storage Temperature -40 25 +90 degC
Input RF Level - - 10 dBm
VDD_USB -0.3 - 3.9 V
Supply Voltage VDD_MCU, VDD_RF, VDD_TCXO -0.3 - 3.9 V
VREF+ -0.3 - VDD_MCU+0.4 V

7. Operating Condition

Table 4 Operating specification

Parameters Min Typ Max Unit
Operating Temperature -40 25 +85 degC
VDD_USB (USB peripheral used) (1) 3.0 - 3.6 V
VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max V
Supply Voltage
VDD_MCU,VDD_RF,VDD_TCXO 2.2(3) - 3.6 V
VREF+(2) 1.8 - VDD_MCU V
ta
ra

(1) VDD_USB must respect the following conditions:

Mu

- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
my

- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
om

- In operating mode, VDD_USB could be lower or higher than VDD_MCU.

fr

- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is
,
ly

on the STM32L082*** datasheet and user guider.

98
on

(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.
80
e

03

.
nc

on

8. Electrical Characteristics
10
re

ti

8.1. FSK/OOK Transceiver Specification

fe

ca

Conditions:
Re

uy

20

fi

Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation
m.

20

ti
,

without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx
al

co

no
,

and Tx path matching, unless otherwise specified.

ti

l.

06

t
en

te

ou

FSK/OOK Receiver Specification

er
id

an

th
mb

Symbol Description Conditions Min. Typ Max Unit

nf

wi
@

ve

RFS_F_HF LnaBoost is turned on FDA = 5 kHz, BR = 4.8 kb/s -117.5 dBm

Co

ta

No

Supply current in Receive LnaBoost Off, band 1 22 mA

pl

IDDR (*)
ot

mode LnaBoost On, band 1 23 mA

ap
gs

,
ay

y
id

FSK/OOK Transmitter Specification

ma
Fr

Symbol Description Conditions Min. Typ Max Unit

ge

RF output power in 50 ohms Max 14 dBm

an

Programmable with
RF_OP on RFO pin ( High efficiency
Ch

steps Min -5 dBm

PA)
RF output power in 50 ohms Max 18.5 dBm
Programmable with
RF_OPH on PA_BOOST pin( Regulated
1dB steps Min 2 dBm
PA)
RF output power stability on
ΔRF_
PA_BOOST pin versus voltage VDD = 2.2 V to 3.6 V +/-1 dB
OPH_V
supply.
RF output power stability
ΔRF_T versus temperature on From T = -40 °C to +85 °C +/-1.5 dB
PA_BOOST pin.
IDDT (*) Supply current in Transmit RFOP = +20 dBm, on 128 mA

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
10 / 23

mode with impedance PA_BOOST

matching RFOP = +17 dBm, on
106
PA_BOOST mA
RFOP = +14 dBm, on
47
RFO_HF pin mA
RFOP = + 7 dBm, on
34
RFO_HF pin mA
(*) IDDR and IDDT are total current consumption including MCU in active.

8.2. LoRa Transceiver Specification

Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error
Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes.
With matched impedances

LoRa Receiver Specification

Symbol Description Conditions Min. Typ Max Unit
Band 1, BW = 125 kHz 21.5 mA
Supply current in receiver
IDDR_L (*) Band 1, BW = 250 kHz 22.2 mA
LoRa mode, LnaBoost off
Band 1, BW = 500 kHz 23.6 mA
SF = 6 -117.5 dBm
RF sensitivity, Long-Range SF = 7 -122.5 dBm
ta

Mode, highest LNA gain, SF = 8 -125.5 dBm

ra

RFS_L125_HF LnaBoost for Band1, using SF = 9 -128.5 dBm

Mu

split Rx/Tx path SF = 10 -131.0 dBm

125 kHz bandwidth
my

SF = 11 -133.5 dBm
SF = 12 -135.5 dBm
om

SF = 6 -114.0 dBm
fr

RF sensitivity, Long-Range SF = 7 -119.0 dBm

,
ly

Mode, highest LNA gain, SF = 8 -122.0 dBm

98
on

RFS_L250_HF LnaBoost for Band1, using SF = 9 -125.0 dBm

80

split Rx/Tx path SF = 10 -127.5 dBm

e

03

.
nc

250 kHz bandwidth

on

SF = 11 -130.0 dBm
10
re

ti

SF = 12 -133.0 dBm
fe

ca
Re

uy

20

fi

LoRa Transmitter Specification

m.

20

ti
,

Symbol Description Conditions Min. Typ Max Unit

al

co

no
,

RFOP setting = 14 dBm 47 mA

ti

Supply current in transmitter

l.

06

IDDT_L (*)
t

mode
en

te

RFOP setting = 10 dBm 36 mA

ou
er
id

an

th

Supply current in transmitter Using PA_BOOST pin

mb

IDDT_H_L (*) 128 mA

nf

wi

mode RFOP setting = 20 dBm

@

ve
Co

(*) IDDR_L, IDDT_L and IDDT_H_L are total current consumption including MCU in active.
ta

No

y
pl
ot

ap

8.3. SIGFOX Transceiver Specification

gs

,
ay

Conditions:
y
id

ma

The table below gives the electrical specifications for the transceiver operating with SIGFOX modulation. Following
Fr

conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C. With matched
ge

impedances.
an
Ch

Notes: To operate as SIGFOX mode, the following configuration is required.

- TCXO_OUT (Pin 47) must be connected to PH0-OSC_IN (Pin46).
- PA12 (Pin 1) must be connected to TXCO_VCC (Pin48).
- SX1276_DIO4 (Pin10) must be connected to PA5 (Pin21).

SIGFOX Receiver Specification

Symbol Description Conditions Min. Typ Max Unit
AT$SB=x,1, AT$SF=x,1,
RFS_F_HF TBD dBm
AT$SR PER<0.1
Supply current in Receive
IDDR_S AT$TM=3,10 23 mA
mode

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
11 / 23

SIGFOX Transmitter Specification

Symbol Description Conditions Min. Typ Max Unit
Programmable with Max 18.5 dBm
RF output power in 50 ohms
RF_OP_S steps
on RF pin Min 4.5 dBm
AT$SF
Output power setting 20 dBm
Supply current in Transmit 128
AT$SF mA
IDDT_S mode with impedance
Output power setting 14 dBm
matching 44
AT$SF mA

8.4. Low power mode current

Conditions:
Power supply: 3.3V, Temp: Room, TCXO_VDD (pin 48 of the module) is connected to PA12 (Pin1 of the module)
Mode Description Min. Typ Max Unit
(*1) (*3)
STM32L0 in Stop mode with RTC (Real Time Clock)
Mode0 1.65 uA
SX1276 in Sleep mode
(*2)
STM32L0 in Standby mode with RTC (Real Time Clock)
Mode1 1.40 uA
SX1276 in Sleep mode

(*1) The Stop mode achieves the lowest power consumption while retaining the RAM and register contents and real
time clock. All clocks in the VCORE domain are stopped, the PLL, MSI RC, HSE crystal and HSI RC oscillators are
disabled. The LSE or LSI is still running. The voltage regulator is in the low-power mode.
Some peripherals featuring wakeup capability can enable the HSI RC during Stop mode to detect their wakeup
ta

condition. The device can be woken up from Stop mode by any of the EXTI line, in 3.5us, the processor can serve
ra

the interrupt or resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the comparator 1
Mu

event or comparator 2 event (if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup
events, the USB/USART/I2C/LPUART/LPTIMER wakeup events.
my
om

(*2) The Standby mode is used to achieve the lowest power consumption and real time clock. The internal voltage
fr

regulator is switched off so that the entire VCORE domain is powered off. The PLL, MSI RC, HSE crystal and HSI
RC oscillators are also switched off. The LSE or LSI is still running. After entering Standby mode, the RAM and
,
ly

register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32
98

KHz oscillator, RCC_CSR register). The device exits Standby mode in 60 μs when an external reset (NRST pin), an
on

80

IWDG reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B), RTC tamper event, RTC
e

03

.
nc

timestamp event or RTC Wakeup event occurs.

on
10
re

ti

(*3) STM SigFox Firmware is always in stop mode by default, it wakes up automatically when receiving one
fe

ca

character. Else it wakes up automatically when an interrupt is to be processed and returns in stop mode when
Re

uy

20

fi

finished.
m.

20

ti
,
al

co

no
,

9. Power Sequences
ti

l.

06

t
en

te

ou
er
id

an

th

9.1 Power Up Sequence

mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-S
12 / 23

10. Recommend Land Pattern

ta
ra
Mu
my
om
fr
,
ly

98
on

80
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
13 / 22

11. Reference circuit

In case of using the module as LoRa
VDD

J1
1
SWCLK 2 1
3 2
SWDIO 4 3
5 4 SWD connector
6 5
For VDD_TCXO connection 6
Option1:Connect VDD_TCXO to VDD Optional R1
Option2:Connect VDD_TCXO to PA12 so
10K
that MCU can control TCXO on/off
Module reset do not need
VDD_TCXO external pull up resistor.
a ta Because there is an about
M ur 45K permanent pull up
resistor inside of module.
The VDD_USB is the power supply for
my

53
52
51
50
49

48
47
46
45
44
43
42
41
40
39
38
37
PA11 and PA12.
om

BOOT0
VDD_TCXO

PA13/SWDIO/LPUART1_RX
PA14/SWCLK/LPUART1_TX

PB5/LPTIM1_IN1

PB7/LPTIM1_IN2
GND
GND
GND
GND
GND

TCXO_OUT

PH1-OSC_OUT
PH0-OSC_IN

GND

PB2/LPTIM1_OUT
PB6/LPTIM1_ETR
54
55 GND fr Button1
1 2
Notes for VREF+:

VDD_USB
56
57
GND
GND ly, 1. VREF+ can be grounded or floating

on
GND
0 98 when DAC and ADC function are not active.
2. VREF+ should be connected to VDD
C1 C2 ce
n1 038 . C6 0.1uF if module is battery powered and need to
10uF 0.1uF e 10 n 36
er 2 PA12/USB_DP
io
PB9/I2C1_SDA 35 monitor the battery voltage
f 3 -
PA11/USB_DM
at PB8/I2C1_SCL 34 module reset
Re yGND c MCU_nRST

PA3/ADC3/USART2_RX/LPUART1_RX
4
0 33

PA2/ADC2/USART2_TX/LPUART1_TX
VDD
, 5
m .u VDD_USB
VDD_MCU
2 02 i fi PA0/WKUP1
VREF+
32 VREF+
VDD
l 6
ot
31
ia co 7 VDD_RF
6, n
STSAFE_nRST 30 C7
C3
10uF
C4
e
1uFnt C5
0.1uF e l. 8
9
GND
0
DBG_SX1276_DIO2 t
DBG_CRF2
DBG_CRF3
29
28 1uF
id nt 10
er
DBG_SX1276_DIO3
ou DBG_CRF1 27 J2

nf a 11
mb
SX1276_DIO4
th GND 26 2

wi
DBG_SX1276_DIO5 ANT
@ e
12 25
DBG_SX1276_DIO0

Co
PA10/USART1_RX

ov
DBG_SX1276_DIO1 GND 1 3
a
PA9/USART1_TX
PB14/SPI2_MISO
PB15/SPI2_MOSI

PA5/ADC5/DAC2
PA4/ADC4/DAC1
y
PB13/SPI2_SCK
PB12/SPI2_NSS

t N
pl
L1
ot 5 4
gs , ap
PA8/MCO

d ay y C8 C9

Fr
i U1
ma
ge
CMWX1ZZABZ-078/091
n
SMA connector
ha
13
14
15
16
17
18
19
20
21
22
23
24

C
USART2_TX
USART2_RX

USART1_TX
USART1_RX

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
14 / 23

In case of using the module as SigFox modem with STM SigFox firmware
VDD
J1
1
SWCLK 2 1
3 2
SWDIO 4 3
5 4 SWD connector
6 5
6

R1
10K

Module reset do not need

VDD_TCXO external pull up resistor.
a ta Because there is an about
M ur 45K permanent pull up
resistor inside of module.
my
53
52
51
50
49

48
47
46
45
44
43
42
41
40
39
38
37
om
fr

PA14/SWCLK/LPUART1_TX
PA13/SWDIO/LPUART1_RX
PB5/LPTIM1_IN1

PB7/LPTIM1_IN2
VDD_TCXO

BOOT0

PB6/LPTIM1_ETR

PB2/LPTIM1_OUT
PH1-OSC_OUT
TCXO_OUT
PH0-OSC_IN
GND
GND
GND
GND
GND

GND
54 Button1
55 GND 1 2
56 GND y ,
57 GND
onl 98
The VDD_USB is must. GND
c e 3 80
Because it is the power
00 .
supply for PA11 and PA12. 1r
en 1 i on 36
C1 0.1uF

fe2 PA12/USB_DP - t
PB9/I2C1_SDA
caPB8/I2C1_SCL
35
Re 3
uy
PA11/USB_DM
20 f i 34 module reset
GND. MCU_nRST

PA3/ADC3/USART2_RX/LPUART1_RX
l,
4
20 33

PA2/ADC2/USART2_TX/LPUART1_TX
VDD 5 om
VDD_USB ti PA0/WKUP1 32
ia
VREF+
t 6. cVDD_MCU
06
, no VREF+ 31 VDD

en t el7 VDD_RF
ut
STSAFE_nRST 30
er
GND DBG_CRF2
C3 C4
f idC5 an
8
9 DBG_SX1276_DIO2
b h o DBG_CRF3
29
28
C6
10uF
on
1uF 0.1uF
@ 10
v em
DBG_SX1276_DIO3
w it DBG_CRF1 27
1uF J2
C SX1276_DIO4 GND
ta
11 26 2
No DBG_SX1276_DIO5 y ANT
pl
12 25
DBG_SX1276_DIO0

ot
PA10/USART1_RX

DBG_SX1276_DIO1 GND 1 3
PA9/USART1_TX
PB14/SPI2_MISO
PB15/SPI2_MOSI

ap
PA5/ADC5/DAC2
PA4/ADC4/DAC1

gs ,
PB13/SPI2_SCK
PB12/SPI2_NSS

y L1
da y 5 4

Fr
i ma
PA8/MCO

n ge C8 C9
ha
C U1 SMA connector
13
14
15
16
17
18
19
20
21
22
23
24

CMWX1ZZABZ-099

Host Interf ace USART_TX

Host Interf ace USART_RX

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
15 / 23

12. Tape and Reel packing

12.1 Dimension of Tape (Plastic tape)

1.75±0.10

2.0±0.1
4.0±0.1 *1 1.5+0.1/-0.0 0.30±0.05
11.5±0.1
24.0±0.3

13±0.1

1.5+0.1/-0 24.0±0.1 12.1±0.1

ta
ra

feeding direction 2±0.15

Mu
my

(unit : mm)
om

12.2 Dimensions of Reel

fr
,
ly

98
on

80
e

03

.
nc

on
10

Label
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve

R80
Co

ta

No

y
pl
ot

R135
ap

φ330±2

φ
gs

,
ay

10 R5
y

φ13±0.2
id

φ 80±1
ma

22 5
Fr

ge
an

120
Ch

W1

W2

Reel inside width W1: 25.5±1.0

Reel outside width W2: 29.5±1.0
Unit: mm
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
16 / 23

12.3 Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62μm in thickness

[4] Base tape : As specified in (1)

[3]
[1]

[2]

ta [3]

[4]
ra
Mu
my

Feeding Hole
om
fr
,
ly

Feeding Direction
98
on

80
e

03

.
nc

on
10
re

ti

Chip
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

12.4 Leader and Tail tape

06

t
en

te

ou
er
id

an

th

Tail tape
mb
nf

wi

(No components) Components No components

@

ve
Co

ta

No

y
pl

Leader tape
ot

ap

(Cover tape alone)

gs

,
ay

y
id

ma
Fr

ge
an
Ch

40 to 200mm 150mm min. 250mm min.

Feeding direction

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
17 / 23

- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
- The cover tape and base tape are not adhered at no components area for 250mm min.
- Tear off strength against pulling of cover tape : 5N min.
- Packaging unit : 1000 pcs/ reel
- Material
 Base tape : Plastic
 Reel : Plastic
 Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.3N max. in the direction of peeling as shown below.

1.3 N max.
0.7 N max.

165 to 180 °
Cover tape
ta
ra

Base tape
Mu

- Packaging (Humidity proof Packing)

my
om

Label
表示ラべル
fr

Desiccant
,

乾燥剤
ly

98
on

Humidity
80

　湿度
e

03

Indicator
.

インジケ－タ
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

表示ラベル
wi

Label
@

ve
Co

ta

No

y
pl

防湿梱包袋
Anti-humidity
ot

ap
gs

Plastic Bag
,
ay

y
id

ma
Fr

ge

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
an

and the humidity indicator.

Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
18 / 23

13. Notice

13.1 Storage Conditions

Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35 °C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)

- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be
used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125 +5/-0 °C, 24 hours, 1 time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
ta
ra
Mu

13.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may
my

break products.
om
fr

Handle with care if products may have cracks or damages on their terminals, the characteristics of
,

products may change. Do not touch products with bear hands that may result in poor solderability.
ly

98
on

80

13.3 Standard PCB Design (Land Pattern and Dimensions)

e

03

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
.
nc

on
10

should be provided between IN and OUT terminals. Please refer to the specifications for the standard
re

ti

land dimensions.
fe

ca
Re

uy

20

fi

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
m.

20

ti
,
al

co

may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
no
,
ti

l.

06

method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
t
en

te

ou

characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
er
id

an

th
mb
nf

wi

13.4 Notice for Chip Placer :

@

ve
Co

When placing products on the PCB, products may be stressed and broken by uneven forces from a
ta

No

y
pl

worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
ot

ap
gs

follow the specifications for the maintenance of the chip placer being used. For the positioning of
ay

products on the PCB, be aware that mechanical chucking may damage products.
id

ma
Fr

ge

13.5 Soldering Conditions：

an

The recommendation conditions of soldering are as in the following figure.

Ch

When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.

Contact Murata before use if concerning other soldering conditions.

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
19 / 23

Reflow Soldering Standard Conditions (Example)

Within 3 s

240 ~ 250 °C

220 °C Cooling down

Slowly
180 °C

150 °C

Pre-heating

Within 120 s Within 60 s time(s)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
ta
ra
Mu

13.6 Cleaning :
my

Since this Product is Moisture Sensitive, any cleaning is not permitted.

om

13.7 Operational Environment Conditions :

fr

Products are designed to work for electronic products under normal environmental conditions (ambient
,

temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
ly

98

conditions to the above-mentioned. However, if products are used under the following circumstances, it
on

80

may damage products and leakage of electricity and abnormal temperature may occur.
e

03

.
nc

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

on
10
re

ti

- In an atmosphere containing combustible and volatile gases.

fe

ca

- Dusty place.
Re

uy

20

fi

- Direct sunlight place.

m.

20

ti

- Water splashing place.

,
al

co

no

- Humid place where water condenses.

,
ti

l.

06

- Freezing place.
t
en

te

ou
er
id

an

th
mb

If there are possibilities for products to be used under the preceding clause, consult with Murata before
nf

wi
@

ve

actual use.
Co

ta

No

y
pl
ot

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
ap
gs

,
ay

static electricity or excessive voltage while assembling and measuring.

y
id

ma
Fr

13.8 Input Power Capacity :

ge

Products shall be used in the input power capacity as specified in this specifications.
an

Inform Murata beforehand, in case that the components are used beyond such input power capacity
Ch

range.

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
20 / 23

14. Regulatory Statements

14.1 FCC Statements

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.

Cet appareil est conforme à la section 15 des réglementations de la FCC. Le fonctionnement de

l’appareil est sujetaux deux conditions suivantes :
(1) cet appareil ne doit pas provoquer d’interférences néfastes, et
(2) cet appareil doit tolérer les interférences reçues, y compris celles qui risquent de provoquer un
fonctionnement indésirable.

Note: This product has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This product generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this product does cause harmful interference to radio or television
ta

reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
ra

correct the interference by one or more of the following measures:

Mu

—Reorient or relocate the receiving antenna.

my

—Increase the separation between the equipment and receiver.

—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
om
fr

—Consult the dealer or an experienced radio/TV technician for help.

,
ly

Please take attention that changes or modification not expressly approved by the party responsible for
98
on

compliance could void the user’s authority to operate the equipment.

80
e

03

.
nc

on
10

This equipment should be installed and operated with a minimum distance 20cm between the radiator
re

ti

and your body

fe

ca
Re

uy

20

fi
m.

Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre
20

ti
,
al

co

no

corps
,
ti

l.

06

t
en

te

ou

When the FCC ID is not visible when the module is installed inside another device, then the outside of
er
id

an

th

the device into which the module is installed must also display a label referring to the enclosed module.
mb
nf

wi

This exterior label can be use wording ”Contains transmitter module FCC ID: VPYCMABZ” or “Contains
@

ve
Co

ta

No

FCC ID: VPYCMABZ”.

pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
21 / 23

14.2 IC Statements

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts
de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential
radio interference to other users, the antenna type and its gain should be so chosen that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par
Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée
ta

équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication

ra

satisfaisante.
Mu
my

When the Industry Canada certification number is not visible when the module is installed inside another
device, then the outside of the device into which the module is installed must also display a label
om

referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module
fr

IC: 772C-CMABZ”or “Contains IC: 772C-CMABZ”.

,
ly

98
on

14.3 General Statements

80
e

03

.
nc

on
10

The module is limited to OEM installation ONLY.

re

ti
fe

ca

The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or
Re

uy

20

fi

install module.
m.

20

ti
,
al

co

no
,
ti

l.

Therefore, the final host product must be submitted to [SyChip] for confirmation that the installation for
06

t
en

te

ou

the module into the host is in compliance with regulations of FCC and IC Canada. Specially, if an
er
id

an

th

antenna other than the model documented in the Filing is used, a Class 2 Permissive Change must be
mb
nf

wi

filed with the FCC.

@

ve
Co

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
ta

No

y
pl
ot

operate the equipment.

ap
gs

,
ay

The LoRa module is for use with external antenna ONLY.

id

ma
Fr

ge

The antenna is Monopole Antenna and maximum gain is 1.04dBi.

an
Ch

This module has been approved by FCC to operate with the antenna types with the maximum
permissible gain indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
22 / 23

CAUTION
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for
the specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the
premise that our product is used for the purpose, under the condition and in the environment specified in
this specification. You are requested not to use our product deviating from the condition and the
environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the
specifications provided herein. Accordingly, we shall not be responsible for any defects in products or
equipment incorporating such products, which are caused under the conditions other than those
specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR
IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR
PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for
the prevention of such defect as may directly cause damage to the third party's life, body or property. You
acknowledge and agree that, if you use our products in such applications, we will not be responsible for
any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL
ta

CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT
ra

LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH
Mu

APPLICATIONS.
- Aircraft equipment.
my

- Aerospace equipment
om

- Undersea equipment.
fr

- Power plant control equipment

- Medical equipment.
,
ly

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

98
on

- Traffic signal equipment.

80

- Disaster prevention / crime prevention equipment.

e

03

- Burning / explosion control equipment

nc

on
10

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
re

ti
fe

ca

We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and
Re

uy

20

fi

reproducing our product. Our product cannot be used for the product which is prohibited from being
m.

20

ti

manufactured, used, and sold by the regulations and laws in the world.
,
al

co

no
,
ti

l.

06

We do not warrant or represent that any license, either express or implied, is granted under any our
t
en

patent right, copyright, mask work right, or our other intellectual property right relating to any combination,
te

ou
er

machine, or process in which our products or services are used. Information provided by us regarding
id

an

th
mb

third-party products or services does not constitute a license from us to use such products or services or
nf

wi
@

ve

a warranty or endorsement thereof. Use of such information may require a license from a third party
Co

ta

No

under the patents or other intellectual property of the third party, or a license from us under our patents or
pl
ot

other intellectual property.

ap
gs

,
ay

Please do not use our products, our technical information and other data provided by us for the
y
id

ma

purpose of developing of mass-destruction weapons and the purpose of military use.

Fr

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export
ge

administration regulations", etc.

an
Ch

Please note that we may discontinue the manufacture of our products, due to reasons such as end of
supply of materials and/or components from our suppliers.
Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or
alleged defect of Products only at the level required for consumer grade Products, and thus such
analysis may not always be available or be in accordance with your request (for example, in cases
where the defect was caused by components in Products supplied to Murata from a third party).
By signing on specification sheet or approval sheet, you acknowledge that you are the legal
representative for your company and that you understand and accept the validity of the contents herein.
When you are not able to return the signed version of specification sheet or approval sheet within 90
days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
 Preliminary Specification Number : SP-ABZ-R
23 / 23

on the content of specification sheet or approval sheet.

Customer acknowledges that engineering samples may deviate from specifications and may contain
defects due to their development status.
We reject any liability or product warranty for engineering samples.
In particular we disclaim liability for damages caused by
・the use of the engineering sample other than for evaluation purposes, particularly the installation or
integration in the product to be sold by you,
・deviation or lapse in function of engineering sample,
・improper use of engineering samples.
We disclaims any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.

ta
ra
Mu
my
om
fr
,
ly

98
on

80
e

03

.
nc

on
10
re

ti
fe

ca
Re

uy

20

fi
m.

20

ti
,
al

co

no
,
ti

l.

06

t
en

te

ou
er
id

an

th
mb
nf

wi
@

ve
Co

ta

No

y
pl
ot

ap
gs

,
ay

y
id

ma
Fr

ge
an
Ch

Preliminary & Confidential

< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.