BG95-M3 Mini PCIe

Hardware Design

LPWA Module Series

Version: 1.1

Date: 2021-08-31

Status: Released

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 LPWA Module Series

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: +86 21 5108 6236
Email: [email protected]

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http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
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Or email us at: [email protected].

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent analysis
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To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes distraction
and can lead to an accident. Please comply with laws and regulations restricting the
use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in hospitals,
clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.

The cellular terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to TV
sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other cellular terminals.
Areas with explosive or potentially explosive atmospheres include fueling areas,
below decks on boats, fuel or chemical transfer or storage facilities, and areas
where the air contains chemicals or particles such as grain, dust or metal powders.

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About the Document

Revision History

Version Date Author Description

Speed SUN/
1.0 2020-05-15 Watt ZHU/ Initial
Hyman DING
1. Added the description of the share of hardware blocks
between WWAN and GNSS Rx chains (Chapter 2.1).
2. Updated the USB serial drivers (Table 2).
3. Updated the description of USB_VBUS (Footnote 2
and Chapter 3.7).
4. Added the description of Sleep Mode (Table 5).
5. Added the Power Saving chapter (Chapter 3.4).
6. Added high-speed mode supported by USB interface
(Chapter 3.7).
Lex LI/ 7. Added description of DTR signal (Chapter 3.10.2).
1.1 2022-08-31 Pearl Guo/ 8. Updated GNSS performance data (Table 16).
Matt YE 9. Added a note about the choice of GNSS antenna
when LTE B13 is supported (Chapter 5.3).
10. Updated the contact discharge and air discharge data
(Table 27).
11. Added the operating and storage temperatures
information (Chapter 6.7).
12. Updated power consumption in PSM, Sleep and Idle
modes and GNSS power consumption (Table 29 and
30).
13. Updated the packaging specification (Chapter 7.3).

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Contents

Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 5
Table Index ................................................................................................................................................... 7
Figure Index ................................................................................................................................................. 8

1 Introduction .......................................................................................................................................... 9

2 Product Overview .............................................................................................................................. 10

2.1. Frequency Bands and Functions .............................................................................................. 10
2.2. Key Features ............................................................................................................................. 11
2.3. Functional Diagram ................................................................................................................... 13
2.4. EVB Kit ...................................................................................................................................... 14

3 Application Interfaces ....................................................................................................................... 15

3.1. Pin Assignment ......................................................................................................................... 15
3.2. Pin Description .......................................................................................................................... 16
3.3. Operating Modes....................................................................................................................... 19
3.4. Power Saving ............................................................................................................................ 19
3.4.1. Sleep Mode .................................................................................................................... 19
3.4.2. Airplane Mode ................................................................................................................ 20
3.5. Power Supply ............................................................................................................................ 20
3.6. (U)SIM Interface ........................................................................................................................ 21
3.7. USB Interface ............................................................................................................................ 23
3.8. UART Interface.......................................................................................................................... 24
3.9. PCM and I2C Interfaces............................................................................................................ 25
3.10. Control and Indication Signals .................................................................................................. 26
3.10.1. RI .................................................................................................................................... 27
3.10.2. DTR ................................................................................................................................ 27
3.10.3. W_DISABLE# ................................................................................................................. 27
3.10.4. PERST# ......................................................................................................................... 28
3.10.5. LED_WWAN#................................................................................................................. 28
3.10.6. WAKE# ........................................................................................................................... 30

4 GNSS ................................................................................................................................................... 31
4.1. General Description .................................................................................................................. 31
4.2. GNSS Performance .................................................................................................................. 31

5 Antenna Connector............................................................................................................................ 33
5.1. Main Antenna Connector .......................................................................................................... 33
5.1.1. Description of Main Antenna Connector ........................................................................ 33
5.1.2. Operating Frequency ..................................................................................................... 34
5.2. GNSS Antenna Connector ........................................................................................................ 35
5.2.1. Description of GNSS Antenna Connector ...................................................................... 35

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5.2.2. GNSS Frequency ........................................................................................................... 35

5.3. Antenna Design Requirements ................................................................................................. 35
5.4. RF Connector Recommendation .............................................................................................. 36

6 Electrical Characteristics and Reliability ........................................................................................ 38

6.1. General Description .................................................................................................................. 38
6.2. Power Supply Ratings ............................................................................................................... 38
6.3. Digital I/O Characteristics ......................................................................................................... 38
6.4. Tx Power ................................................................................................................................... 39
6.5. Rx Sensitivity............................................................................................................................. 40
6.6. ESD Protection.......................................................................................................................... 41
6.7. Operating and Storage Temperatures ...................................................................................... 42
6.8. Power Consumption .................................................................................................................. 42
6.9. Notification ................................................................................................................................ 45
6.9.1. Coating ........................................................................................................................... 45
6.9.2. Cleaning ......................................................................................................................... 45

7 Mechanical Information ..................................................................................................................... 46

7.1. General Description .................................................................................................................. 46
7.2. Mechanical Dimensions ............................................................................................................ 46
7.3. Packaging Specification ............................................................................................................ 47
7.3.1. Blister Tray ..................................................................................................................... 47
7.3.2. Packaging Process ........................................................................................................ 48

8 Appendix References ........................................................................................................................ 49

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Table Index

Table 1: Frequency Bands and Functions ................................................................................................. 10

Table 2: Key Features .................................................................................................................................11
Table 3: Definition of I/O Parameters ......................................................................................................... 16
Table 4: Pin Description ............................................................................................................................. 16
Table 5: Overview of Operating Modes ...................................................................................................... 19
Table 6: Definition of VCC_3V3 and GND Pins ......................................................................................... 20
Table 7: Pin Definition of (U)SIM Interface ................................................................................................. 21
Table 8: Pin Definition of USB Interface ..................................................................................................... 23
Table 9: Pin Definition of UART Interface .................................................................................................. 24
Table 10: Pin Definition of PCM and I2C Interfaces .................................................................................. 25
Table 11: Pin Definition of Control and Indication Signals ......................................................................... 26
Table 12: Airplane Mode Control (Hardware Method) ............................................................................... 28
Table 13: Airplane Mode Control (Software Method) ................................................................................. 28
Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting)................................. 29
Table 15: Indications of Network Status (AT+QCFG="ledmode",1) .......................................................... 29
Table 16: GNSS Performance .................................................................................................................... 31
Table 17: Description of Main Antenna Connector..................................................................................... 34
Table 18: Operating Frequency .................................................................................................................. 34
Table 19: Description of GNSS Antenna Connector .................................................................................. 35
Table 20: GNSS Frequency ....................................................................................................................... 35
Table 21: Antenna Design Requirements .................................................................................................. 36
Table 22: Power Supply Ratings ................................................................................................................ 38
Table 23: 3.3 V Digital I/O Characteristics ................................................................................................. 39
Table 24: 1.8 V Digital I/O Characteristics ................................................................................................. 39
Table 25: Tx Power..................................................................................................................................... 39
Table 26: Rx Sensitivity .............................................................................................................................. 40
Table 27: ESD Discharge Characteristics .................................................................................................. 41
Table 28: Operating and Storage Temperatures ........................................................................................ 42
Table 29: Power Consumption ................................................................................................................... 42
Table 30: GNSS Power Consumption ........................................................................................................ 45
Table 31: Related Documents .................................................................................................................... 49
Table 32: Terms and Abbreviations ............................................................................................................ 49

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Figure Index

Figure 1: Functional Diagram ..................................................................................................................... 13

Figure 2: Pin Assignment ........................................................................................................................... 15
Figure 3: Reference Design of Power Supply............................................................................................ 21
Figure 4: Reference Design of (U)SIM Interface with 8-Pin (U)SIM Card Connector ............................... 22
Figure 5: Reference Design of (U)SIM Interface with 6-Pin (U)SIM Card Connector ............................... 22
Figure 6: Reference Design of USB Interface ........................................................................................... 23
Figure 7: Reference Design of UART Interface ......................................................................................... 25
Figure 8: Reference Design of PCM and I2C Application with Audio Codec ............................................ 26
Figure 9: RI Behavior ................................................................................................................................. 27
Figure 10: Reset Timing ............................................................................................................................. 28
Figure 11: Reference Design of LED_WWAN# ......................................................................................... 29
Figure 12: WAKE# Behaviors .................................................................................................................... 30
Figure 13: Main and GNSS Antenna Connectors ...................................................................................... 33
Figure 14: Dimensions of the Receptacle (Unit: mm) ................................................................................ 36
Figure 15: Specifications of Mated Plugs .................................................................................................. 37
Figure 16: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 37
Figure 17: Mechanical Dimensions of BG95-M3 Mini PCIe ...................................................................... 46
Figure 18: Blister Tray Dimension Drawing ............................................................................................... 47
Figure 19: Packaging Process ................................................................................................................... 48

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1 Introduction
This document defines Quectel BG95-M3 Mini PCIe module, and describes its air interfaces and
hardware interfaces that are connected with your applications.

This document can help you quickly understand the interface specifications, electrical characteristics,
mechanical specifications and other related information of the module. To facilitate application designs, it
also includes some reference designs for your reference. The document, coupled with application notes
and user guides, makes it easy to design and set up mobile applications with BG95-M3 Mini PCIe.

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2 Product Overview

2.1. Frequency Bands and Functions

BG95-M3 Mini PCIe is an embedded IoT (LTE Cat M1, LTE Cat NB2 and EGPRS) wireless
communication module with PCI Express Mini Card 1.2 standard interface. It provides data connectivity
on LTE HD-FDD and GPRS/EGPRS networks. It also provides GNSS and voice 1 functionality to meet
your specific application demands.

The module is based on an architecture in which WWAN (LTE) and GNSS Rx chains share certain
hardware blocks. However, the module does not support concurrent operation of WWAN and GNSS. The
solution adopted in the module is a form of coarse time-division multiplexing (TDM) between WWAN and
GNSS Rx chains. Given the relaxed latency requirements of most LPWA applications, time-division
sharing of resources can be made largely transparent to applications. For more details, see document
[1].

BG95-M3 Mini PCIe is an industrial-grade module for industrial and commercial applications only.

The module can be applied to the following fields:

⚫ Wireless POS systems

⚫ Tracking systems
⚫ Intelligent meter reading systems
⚫ Security systems

Table 1: Frequency Bands and Functions

Frequency Bands/
BG95-M3 Mini-PCIe
Functions
LTE HD-FDD:
LTE Cat M1
B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B25/B26/B27/B28/B66/B85
LTE HD-FDD:
LTE Cat NB2
B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B25/B28/B66/B71/B85

1 BG95-M3 Mini PCIe supports VoLTE (Voice over LTE) under LTE Cat M1 network and CS voice under GSM network.

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EGPRS GSM850/EGSM900/DCS1800/PCS1900

Power Class Power Class 5 (21 dBm) @ LTE HD-FDD bands

GNSS GPS, GLONASS, BDS, Galileo, QZSS

Digital Audio Supports PCM for VoLTE and GSM CS voice

2.2. Key Features

The following table describes the detailed features of BG95-M3 Mini PCIe module.

Table 2: Key Features

Features Details

Function Interface PCI Express Mini Card 1.2 Standard Interface

⚫ Supply voltage: 3.0–3.6 V

Power Supply
⚫ Typical supply voltage: 3.3 V
⚫ Class 5 (21 dBm +1.7/-3 dB) for LTE HD-FDD bands
⚫ Class 4 (33 dBm ±2 dB) for GSM850
⚫ Class 4 (33 dBm ±2 dB) for EGSM900
⚫ Class 1 (30 dBm ±2 dB) for DCS1800
Transmitting Power ⚫ Class 1 (30 dBm ±2 dB) for PCS1900
⚫ Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
⚫ Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
⚫ Supports 3GPP Rel-14
⚫ Supports LTE Cat M1 and LTE Cat NB2
⚫ Supports 1.4 MHz RF bandwidth for LTE Cat M1
LTE Features
⚫ Supports 200 kHz RF bandwidth for LTE Cat NB2
⚫ Cat M1: Max. 588 kbps (DL)/1119 kbps (UL)
⚫ Cat NB2: Max.127 kbps (DL)/158.5 kbps (UL)
GPRS:
⚫ Supports GPRS multi-slot class 33 (33 by default)
⚫ Coding scheme: CS-1, CS-2, CS-3 and CS-4
GSM Features ⚫ Max. 107 kbps (DL)/85.6 kbps (UL)
EDGE:
⚫ Supports EDGE multi-slot class 33 (33 by default)
⚫ Supports GMSK and 8-PSK for different MCS (Modulation and Coding

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Scheme)
⚫ Downlink coding schemes: MCS 1–9
⚫ Uplink coding schemes: MCS 1–9
⚫ Max. 296 kbps (DL)/236.8 kbps (UL)
⚫ Supports PPP/TCP/UDP/SSL/TLS/FTP(S)/HTTP(S)/NITZ/PING/
MQTT/LwM2M/CoAP/IPv6 protocols
Internet Protocol Features ⚫ Supports PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) protocols which are
usually used for PPP (Point-to-Point Protocol) connections
⚫ Text and PDU mode
⚫ Point-to-point MO and MT
SMS
⚫ SMS cell broadcast
⚫ SMS storage: ME by default

(U)SIM Interface Supports 1.8 V USIM/SIM card only

⚫ Baud rate can reach up to 230400 bps, 115200 bps by default

UART Interfaces
⚫ Used for AT command communication and data transmission
⚫ Supports one digital audio interface: PCM interface for VoLTE and
Audio Feature
GSM CS voice only
⚫ Compliant with USB 2.0 specification (slave only)
⚫ Used for AT command communication, data transmission, GNSS
2
USB Interface NMEA sentence output, software debugging and firmware upgrade
⚫ Supports USB serial drivers for Windows 7/8/8.1/10/11, Linux
2.6–5.18, Android 4.x–12.x
⚫ Main antenna connector
Antenna Connectors
⚫ GNSS antenna connector
⚫ Protocol: NMEA 0183
GNSS Features
⚫ Data update rate: 1 Hz by default
⚫ 3GPP TS 27.007 and 3GPP TS 27.005 AT commands
AT Commands
⚫ Quectel enhanced AT commands
⚫ Size: 51.0 mm × 30.0 mm × 4.9 mm
Physical Characteristics
⚫ Weight: approx. 7.2 g
⚫ Operating temperature range: -35 to +75 °C 3

Temperature Range ⚫ Extended temperature range: -40 to +80 °C 4

⚫ Storage temperature range: -40 to +90 °C

Firmware Upgrade ⚫ USB interface

2 The USB interface remains powered after BG95-M3 Mini PCIe is turned on, since USB_VBUS on BG95-M3 has been
internally connected to BG95-M3’s VBAT pins.
3 Within the operating temperature range, the module meets 3GPP specifications.
4 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice,
SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced,
while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns
to the operating temperature range, the module meets 3GPP specifications again.

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⚫ DFOTA

RoHS All hardware components are fully compliant with EU RoHS directive

2.3. Functional Diagram

The following figure shows the block diagram of BG95-M3 Mini PCIe.

VCC_3V3 Boost VBAT Automatic

Power-on
Circuit Circuit

Main
USB Main Antenna
Antenna
Connector
Mini PCI Express

PCM & I2C

UART
Interface

BG95-M3
Module
(U)SIM
GNSS
GNSS
Antenna
(U)SIM Card Antenna
Connector Connector
(Optional)

W_DISABLE#
PERST#
DTR
WAKE#
RI
LED_WWAN#

Figure 1: Functional Diagram

NOTE

The integrated (U)SIM card connector shares the same (U)SIM bus with the external (U)SIM card
connector that is connected to Mini PCI Express (U)SIM interface. It does not support (U)SIM card
detection function, and cannot be used simultaneously with the external (U)SIM card connector. When
unused, it has no effect on the external (U)SIM card connector.

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2.4. EVB Kit

To help you develop applications with the module, Quectel supplies an evaluation board (Mini PCIe EVB
User Guide) with accessories to control or test the module. For more details, see document [2].

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3 Application Interfaces
The physical connections and signal levels of BG95-M3 Mini PCIe comply with PCI Express Mini Card
Electromechanical Specification Revision 1.2. This chapter mainly describes the definition and application
of the following interfaces of BG95-M3 Mini PCIe:

⚫ Power supply
⚫ (U)SIM interface
⚫ USB interface
⚫ UART interface
⚫ PCM and I2C interfaces
⚫ Control and indication Signals

3.1. Pin Assignment

The following figure shows the pin assignment of BG95-M3 Mini PCIe module. The top side contains
BG95-M3 module and antenna connectors.

Pin Name Pin No. Pin No. Pin Name

WAKE# 1 2 VCC_3V3
RESERVED 3 4 GND
RESERVED 5 6 RESERVED
RESERVED 7 8 USIM_VDD
GND 9 PIN1 PIN2 10 USIM_DATA
UART_RX 11 12 USIM_CLK
UART_TX 13 14 USIM_RST
GND 15 16 RESERVED

RI 17 18 GND
RESERVED 19 TOP BOT 20 W_DISABLE#
GND 21 22 PERST#
UART_CTS 23 24 RESERVED
UART_RTS 25 26 GND
GND 27 28 RESERVED
GND 29 PIN51 PIN52 30 I2C_SCL
DTR 31 32 I2C_SDA
RESERVED 33 34 GND
GND 35 36 USB_DM
GND 37 38 USB_DP
VCC_3V3 39 40 GND
VCC_3V3 41 42 LED_WWAN#
GND 43 44 USIM_DET
PCM_CLK 45 46 RESERVED
PCM_DOUT 47 48 RESERVED
PCM_DIN 49 50 GND
PCM_SYNC 51 52 VCC_3V3

Figure 2: Pin Assignment

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3.2. Pin Description

The following tables show the pin definition and description of BG95-M3 Mini PCIe.

Table 3: Definition of I/O Parameters

Type Description

AIO Analog Input/Output

DI Digital Input

DO Digital Output

DIO Digital Input/Output

OC Open Collector

OD Open Drain

PI Power Input

PO Power Output

Table 4: Pin Description

Pin No. Pin Name I/O Description Comment

1 WAKE# OC Wake up the host Active low

3.0–3.6 V DC power
2 VCC_3V3 PI
supply, typically 3.3 V

3 RESERVED Reserved

4 GND Ground

5 RESERVED Reserved

6 RESERVED Reserved

7 RESERVED Reserved

8 USIM_VDD PO (U)SIM card power supply 1.8 V only

9 GND Ground

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10 USIM_DATA DIO (U)SIM card data 1.8 V only

11 UART_RX DI UART receive

12 USIM_CLK DO (U)SIM card clock 1.8 V only

13 UART_TX DO UART transmit

14 USIM_RST DO (U)SIM card reset 1.8 V only

15 GND Ground

16 RESERVED Reserved

17 RI DO Ring indication Active low

18 GND Ground

19 RESERVED Reserved

Pulled up by default.
20 W_DISABLE# DI Airplane mode control
Active low.

21 GND Ground

Pulled up by default.
22 PERST# DI Fundamental reset
Active low.
DCE clear to send signal
23 UART_CTS DI
from DTE

24 RESERVED Reserved

DCE request to send

25 UART_RTS DO
signal to DTE

26 GND Ground

27 GND Ground

28 RESERVED Reserved

29 GND Ground

Require external
5
I2C serial clock (for pull-up to 1.8 V.
30 I2C_SCL OD
external codec) For VoLTE and GSM
CS voice only.

31 DTR DI Data terminal ready

5 PCM and I2C interfaces support VoLTE and GSM CS voice.

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Require external
I2C serial data (for external pull-up to 1.8 V.
32 I2C_SDA 5 OD
codec) For VoLTE and GSM
CS voice only.

33 RESERVED Reserved

34 GND Ground

35 GND Ground

36 USB_DM AIO USB differential data (-)

37 GND Ground

38 USB_DP AIO USB differential data (+)

3.0–3.6 V DC power
39 VCC_3V3 PI
supply, typically 3.3 V

40 GND Ground

3.0–3.6 V DC power
41 VCC_3V3 PI
supply, typically 3.3 V
LED signal for indicating
42 LED_WWAN# OC the network status of the Active low
module

43 GND Ground

44 USIM_DET DI (U)SIM card detect

1.8 V power domain.

5
45 PCM_CLK DO PCM clock For VoLTE and GSM
CS voice only.

46 RESERVED Reserved

1.8 V power domain.

5
47 PCM_DOUT DO PCM data output For VoLTE and GSM
CS voice only.

48 RESERVED Reserved

1.8 V power domain.

5
49 PCM_DIN DI PCM data input For VoLTE and GSM
CS voice only.

50 GND Ground

1.8 V power domain.

5
51 PCM_SYNC DO PCM frame sync For VoLTE and GSM
CS voice only.

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3.0–3.6 V DC power
52 VCC_3V3 PI
supply, typically 3.3 V

NOTE

1. The module can be reset by driving PERST# low for 2–3.8 s.

2. Keep all reserved and unused pins unconnected.

3.3. Operating Modes

The following table briefly outlines the operating modes in the undermentioned chapters.

Table 5: Overview of Operating Modes

Mode Details

The module is connected to network. Its power consumption varies

Connected
Full Functionality with the network setting and data transfer rate.
Mode The module remains registered on network, and is ready to send and
Idle
receive data. In this mode, the software is active.
Minimum AT+CFUN=0 command can set the module to a minimum functionality mode without
Functionality removing the power supply. In this case, both RF function and (U)SIM card will be
Mode invalid.
AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In
Airplane Mode
this case, RF function will be invalid.
The module remains the ability to receive paging message, SMS and TCP/UDP data
Sleep Mode from the network normally. In this mode, the power consumption is reduced to a low
level.

See details about AT+CFUN=4 and AT+CFUN=0 in document [4].

3.4. Power Saving

3.4.1. Sleep Mode

BG95-M3 Mini PCIe is able to minimize the power consumption in sleep mode. The following three
conditions should be met to make the module enter sleep mode. See the AT command below in
document [4].

⚫ Execute AT+QSCLK=1 to enable sleep mode.

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⚫ Drive the DTR pin high or leave it open.

⚫ The host’s USB, which connects to the module’s USB interface, enters suspend mode.

Adopt either way below to wake up the module from sleep mode:
⚫ Pull down DTR and keep it low
⚫ exit the host's USB suspend mode

3.4.2. Airplane Mode

When the module enters airplane mode, its RF function will be disabled, and all related AT commands will
be inaccessible. For more details, see chapter 3.10.3.

3.5. Power Supply

The following table shows the definition of VCC_3V3 and ground pins.

Table 6: Definition of VCC_3V3 and GND Pins

Pin Name Pin No. I/O Description Comment

Power supply for the 3.0–3.6 V DC power

VCC_3V3 2, 39, 41, 52 PI
module supply, typically 3.3 V

GND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50

The typical supply voltage of BG95-M3 Mini PCIe is 3.3 V. In 2G network, the input peak current may
reach 2.7 A during the transmitting time. Therefore, the power supply should be able to provide a rated
current of 2.7 A at least, and a low-ESR bypass capacitor not less than 470 µF should be used to prevent
the voltage from dropping. If the switching power supply is used to supply power to the module, the power
device and power supply routing traces of the switching power supply should avoid the antennas as much
as possible to prevent EMI interference.

The following figure shows a reference design of the power supply where R2 and R3 are 1 % tolerance
resistors and C3 is a low-ESR capacitor.

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MIC29302WU U1
LDO_IN VCC_3V3
2 IN OUT 4

GND

ADJ
EN
D1 R1 R2
C1 C2
82K 1 % R4

5
470 μF 100 nF
51K C3 C4 C5 C6

R3 470R 470 μF 100 nF 33 pF 10 pF

R5 47K 1 %
4.7K

MCU_POWER R6
_ON/OFF 47K

Figure 3: Reference Design of Power Supply

3.6. (U)SIM Interface

The (U)SIM interface circuit meets ETSI and IMT-2000 requirements. Only 1.8 V (U)SIM card is
supported. The following table shows the pin definition of (U)SIM interface.

Table 7: Pin Definition of (U)SIM Interface

Pin Name Pin No. I/O Description Comment

USIM_VDD 8 PO (U)SIM card power supply

USIM_DATA 10 DIO (U)SIM card data

USIM_CLK 12 DO (U)SIM card clock 1.8 V

USIM_RST 14 DO (U)SIM card reset

USIM_DET 44 DI (U)SIM card detect

The module supports (U)SIM card hot-plug via USIM_DET, and support both high-level and low-level
detections. The function is disabled by default. See AT+QSIMDET in document [4] for details. The
following figure shows a reference design of (U)SIM interface with an 8-pin (U)SIM card connector.

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1.8 V USIM_VDD
100 nF

Module 51K 15K

(U)SIM Card Connector
GND
USIM_VDD VCC GND
USIM_RST 0R RST VPP
USIM_CLK 0R IO
CLK
USIM_DET
0R
USIM_DATA

GND
33 pF 33 pF 33 pF

TVS array

GND GND

Figure 4: Reference Design of (U)SIM Interface with 8-Pin (U)SIM Card Connector

If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference design
of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

USIM_VDD 100 nF
Module
15K
GND (U)SIM Card Connector

USIM_VDD VCC GND

USIM_RST 0R RST VPP
USIM_CLK 0R CLK IO

USIM_DATA 0R

33 pF 33 pF 33 pF
TVS array

GND GND

Figure 5: Reference Design of (U)SIM Interface with 6-Pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM card in your applications, please follow the
criteria below in (U)SIM circuit design:

⚫ Keep the placement of (U)SIM card connector to the module as close as possible. The trace length
should not be more than 200mm, and the shorter, the better.
⚫ Keep (U)SIM card signals away from RF and power supply traces.
⚫ Assure the ground between the module and the (U)SIM card connector short and wide. Keep the
trace width of ground not less than 0.5 mm to maintain the same electric potential. The decouple
capacitor between USIM_VDD and GND should be not more than 1 μF and be placed close to the
(U)SIM card connector.

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⚫ To avoid crosstalk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫ In order to offer good ESD protection, it is recommended to add a TVS array with parasitic
capacitance not exceeding 15 pF. The 0 Ω resistors should be added in series between the module
and the (U)SIM card connector so as to facilitate debugging. The 33 pF capacitors are used for
filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to
the (U)SIM card connector.
⚫ The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.

3.7. USB Interface

The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB
2.0 specification and supports operation at low-speed (1.5 Mbps) full-speed (12 Mbps) and high-speed
(480 Mbps) modes. The USB interface is used for AT command communication, data transmission,
GNSS NMEA sentence output, software debugging, and firmware upgrade.

The following table shows the pin definition of USB interface.

Table 8: Pin Definition of USB Interface

Pin Name Pin No. I/O Description Comment

USB_DM 36 AIO USB differential data (-)

Require differential impedance of 90 Ω
USB_DP 38 AIO USB differential data (+)

The following figure shows a reference design of USB interface.

Test Points
Minimize these stubs

Module MCU
R1 NM_0R
R2 NM_0R

TVS Array
L1 USB_DM
USB_DM
USB_DP USB_DP

Close to the Module GND

GND

Figure 6: Reference Design of USB Interface

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A common mode choke L1 is recommended to be added in series between the module and the MCU in
order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors R1 and R2 should be added in
series between the module and the test points so as to facilitate debugging, and the resistors are not
mounted by default. In order to ensure the integrity of USB data line signal, L1/R1/R2 should be placed
close to the module, and also R1/R2 should be placed close to each other. The extra stubs of trace should
be as short as possible.

Comply with the following rules to design the USB interface, so as to meet USB 2.0 specification.

⚫ It is important to route the USB signal traces as differential pairs with ground surrounded. The
impedance of USB differential trace is 90 Ω.
⚫ Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer of the PCB, and surround the traces with
ground on that layer and with ground planes above and below.
⚫ Junction capacitance of the ESD protection component might cause influences on USB data lines, so
please pay attention to the selection of the components. The junction capacitance should be less
than 2 pF.
⚫ Keep the ESD protection components as close to the USB connector as possible.

NOTE

1. The module can only be used as a slave device.

2. The USB interface remains powered after BG95-M3 Mini PCIe is turned on, since USB_VBUS on
BG95-M3 has been internally connected to BG95-M3’s VBAT pins.

3.8. UART Interface

The UART interface supports 9600, 19200, 38400, 57600, 115200 and 230400 bps baud rates. The
default baud rate is 115200 bps. This interface can be used for AT command communication and data
transmission.

Table 9: Pin Definition of UART Interface

Pin Name Pin No. I/O Description Comment

UART_RX 11 DI UART receive

UART_TX 13 DO UART transmit

3.3 V
UART_CTS 23 DI DCE clear to send signal from DTE

UART_RTS 25 DO DCE request to send signal to DTE

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The power domain of UART interface is 3.3 V. Pay attention to the signal direction while connecting the
UART interface to a peripheral MCU/RAM. A reference design of UART interface is provided below:

MCU/ARM Module

TXD UART_TX
RXD UART_RX

RTS UART_RTS

CTS UART_CTS

GND GND

Voltage level: 3.3 V Voltage level: 3.3 V

Figure 7: Reference Design of UART Interface

NOTE

AT+IPR can be used to set the baud rate of UART interface, and AT+IFC can be used to set the hardware
flow control disabled by default. See document [4] for details.

3.9. PCM and I2C Interfaces

BG95-M3 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface
for VoLTE and GSM CS voice.

The following table shows the pin definition of PCM and I2C interfaces that can be applied to audio codec
design.

Table 10: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Description Comment

PCM_CLK 45 DO PCM clock 1.8 V

PCM_DOUT 47 DO PCM data output 1.8 V

PCM_DIN 49 DI PCM data input 1.8 V

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PCM_SYNC 51 DO PCM frame sync 1.8 V

I2C_SCL 30 OD I2C serial clock (for external codec)

Require external pull-up
to 1.8 V.
I2C_SDA 32 OD I2C serial data (for external codec)

The following figure shows a reference design of PCM and I2C interfaces with an external codec IC.

MIC_BIAS
PCM_CLK BCLK
PCM_SYNC FS MIC+

BIAS
PCM_DOUT DACIN MIC-
PCM_DIN ADCOUT

SPKOUT+
I2C_SCL SCLK
I2C_SDA SDIN SPKOUT-

Module Codec
2.2K

2.2K

1.8V

Figure 8: Reference Design of PCM and I2C Application with Audio Codec

NOTE

PCM and I2C interfaces support VoLTE and GSM CS voice.

3.10. Control and Indication Signals

The following table shows the pin definition of control and indication interfaces.

Table 11: Pin Definition of Control and Indication Signals

Pin Name Pin No. I/O Description Comment

RI 17 DO Ring indication 3.3 V

DTR 31 DI Data terminal ready 3.3 V

Pulled up by default.
W_DISABLE# 20 DI Airplane mode control
Active low. 3.3 V

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Pulled up by default.
PERST# 22 DI Fundamental reset
Active low.
LED signal for indicating the network
LED_WWAN# 42 OC Active low.
status of the module

WAKE# 1 OC Wake up the host

NOTE

The module can be reset by driving PERST# low for 2–3.8 s.

3.10.1. RI

RI is used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin
after executing AT+QCFG="risignaltype","physical", see document [3] for details.

120 ms
High

Low
URC return

Figure 9: RI Behavior

3.10.2. DTR

DTR signal is for sleep mode control and is pulled up by default. Driving it low wakes up the module from
sleep mode. For more details about how to make the module enter sleep mode, see Chapter 3.4.1.

3.10.3. W_DISABLE#

W_DISABLE# enables/disables the RF function (excluding GNSS). It is pulled up by default, and driving it
low makes the module enter airplane mode.

The pin function is disabled by default, and AT+QCFG="airplanecontrol",1 can be used to enable this
function. See document [3] for details about the AT command.

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Table 12: Airplane Mode Control (Hardware Method)

W_DISABLE# RF Function Status Module Operation Mode

High level (default) RF enabled Full Functionality Mode

Low level RF disabled Airplane Mode

The RF function can also be enabled/disabled with AT+CFUN=<fun>, and details are listed below.

Table 13: Airplane Mode Control (Software Method)

AT+CFUN=<fun> RF Function Status Module Operation Mode

<fun>=0 RF and (U)SIM disabled Minimum Functionality Mode

<fun>=1 RF enabled Full Functionality Mode

<fun>=4 RF disabled Airplane Mode

3.10.4. PERST#

PERST# forces a hardware reset on the module. The module is reset by driving PERST# low for 2–3.8 s
and then releasing it. The reset timing is illustrated in the following figure.

VCC_3V3
≤ 3.8 s

≥2s
PERST# VIH ≥ 2.3 V
VIL ≤ 0.45 V

Module Running Resetting Restart

Status

Figure 10: Reset Timing

3.10.5. LED_WWAN#

LED_WWAN# indicates the network status of the module, and it absorbs a current up to 40 mA.

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According to the following circuit, in order to reduce the current of the LED, a resistor should be placed in
series with the LED. The LED is powered on when LED_WWAN# is pulled low.

LED_WWAN# R
VCC

Figure 11: Reference Design of LED_WWAN#

LED_WWAN# supports two indication modes which can be switched through AT+QCFG="ledmode":

⚫ AT+QCFG="ledmode",0 (Default setting)

⚫ AT+QCFG="ledmode",1

The following tables show the detailed network status indications of LED_WWAN#.

Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting)

Pin Status Description

Flicker slowly (200 ms low/1800 ms high) Network searching

Flicker slowly (1800 ms low/200 ms high) Idle

Flicker quickly (125 ms low/125 ms high) Data transfer is ongoing

Always low Voice calling

Table 15: Indications of Network Status (AT+QCFG="ledmode",1)

Pin Status Description

Low Level (Light on) Registered on network successfully

⚫ No network coverage or not registered

High-impedance (Light off) ⚫ W_DISABLE# is at low level (airplane mode)
⚫ AT+CFUN=0 or AT+CFUN=4

See document [4] for details about the AT commands mentioned above.

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3.10.6. WAKE#

WAKE# is an open collector signal which is similar to RI, but you need to add an external pull-up resistor
in the design of this pin. When a URC returns, a 120 ms low level pulse will be output. The state of
WAKE# is shown as below. See document [3] for details about the AT command mentioned above.

120 ms
High
(external pull-up)

Low
URC return

Figure 12: WAKE# Behaviors

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4 GNSS

4.1. General Description

The module includes a fully integrated global navigation satellite system solution that supports GPS,
GLONASS, BDS, Galileo and QZSS.

The module supports standard NMEA 0183 protocol, and outputs GNSS NMEA sentences at 1 Hz data
update rate via USB interface by default.

By default, the GNSS engine is switched off. It has to be switched on via AT command. See document [1]
for more details about GNSS engine technology and configurations.

4.2. GNSS Performance

The following table shows the GNSS performance of BG95-M3 Mini PCIe.

Table 16: GNSS Performance

Parameter Description Conditions Typ. Unit

Acquisition Autonomous -146 dBm

Sensitivity Reacquisition Autonomous -157 dBm

Tracking Autonomous -157 dBm

Autonomous 31.01 s
Cold start
@ open sky
XTRA enabled 10.4 s

TTFF Autonomous 30.58 s

Warm start
@ open sky
XTRA enabled 1.53 s

Hot start Autonomous 1.6 s

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@ open sky XTRA enabled 1.5 s

Accuracy CEP-50 Autonomous @ open sky 2.5 m

NOTE

1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep
positioning for at least 3 minutes continuously).
2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock
within 3 minutes after loss of lock.
3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position
successfully within 3 minutes after executing cold start command.

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5 Antenna Connector
BG95-M3 Mini PCIe is mounted with two antenna connectors for external antenna connection: a main
antenna connector and a GNSS antenna connector. The impedance of the antenna ports is 50 Ω.

Main Antenna GNSS Antenna

Connector Connector

Figure 13: Main and GNSS Antenna Connectors

5.1. Main Antenna Connector

5.1.1. Description of Main Antenna Connector

The details of main antenna connector are shown below.

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Table 17: Description of Main Antenna Connector

Connector I/O Description Comment

Main Antenna AIO Main antenna connector 50 Ω impedance

5.1.2. Operating Frequency

Table 18: Operating Frequency

3GPP Band Transmit Receive Unit

LTE HD-FDD B1 1920–1980 2110–2170 MHz

LTE HD-FDD B2, PCS1900 1850–1910 1930–1990 MHz

LTE HD-FDD B3, DCS1800 1710–1785 1805–1880 MHz

LTE HD-FDD B4 1710–1755 2110–2155 MHz

LTE HD-FDD B5, GSM850 824–849 869–894 MHz

LTE HD-FDD B8, EGSM900 880–915 925–960 MHz

LTE HD-FDD B12 699–716 729–746 MHz

LTE HD-FDD B13 777–787 746–756 MHz

LTE HD-FDD B18 815–830 860–875 MHz

LTE HD-FDD B19 830–845 875–890 MHz

LTE HD-FDD B20 832–862 791–821 MHz

LTE HD-FDD B25 1850–1915 1930–1995 MHz

6
LTE HD-FDD B26 814–849 859–894 MHz

LTE HD-FDD B27 6 807–824 852–869 MHz

LTE HD-FDD B28 703–748 758–803 MHz

LTE HD-FDD B66 1710–1780 2110–2180 MHz

6 LTE HD-FDD B26 and B27 are supported by Cat M1 only.

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7
LTE HD-FDD B71 663–698 617–652 MHz

LTE HD-FDD B85 698–716 728–746 MHz

5.2. GNSS Antenna Connector

5.2.1. Description of GNSS Antenna Connector

The following tables show details of GNSS antenna connector.

By default, the GNSS antenna connector supports active antennas with 3.3 V power supply design. It also
supports passive antennas.

Table 19: Description of GNSS Antenna Connector

Connector I/O Description Comment

GNSS Antenna AI GNSS antenna connector 50 Ω impedance

5.2.2. GNSS Frequency

Table 20: GNSS Frequency

Type Frequency Unit

GPS 1575.42 ±1.023 MHz

GLONASS 1597.5–1605.8 MHz

Galileo 1575.42 ±2.046 MHz

BDS 1561.098 ±2.046 MHz

QZSS 1575.42 ±1.023 MHz

5.3. Antenna Design Requirements

The following table shows the requirements on main and GNSS antennas.

7 LTE HD-FDD B71 is supported by Cat NB2 only.

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Table 21: Antenna Design Requirements

Type Requirements

⚫ Frequency range 1: 1559–1609 MHz

⚫ Polarization: RHCP or linear
⚫ VSWR: < 2 (Typ.)
⚫ Passive antenna gain: > 0 dBi
GNSS
⚫ Active antenna noise figure: < 1.5 dB
⚫ Active antenna gain: > 0 dBi
⚫ Active antenna embedded LNA gain: < 17 dB
⚫ Active antenna power supply: 3.3 V
⚫ VSWR: ≤ 2
⚫ Efficiency: > 30%
⚫ Max Input Power: 50 W
LTE/GSM
⚫ Input Impedance: 50 Ω
⚫ Cable Insertion Loss: < 1 dB: LB (<1 GHz)
⚫ Cable Insertion Loss: < 1.5 dB: MB (1–2.3 GHz)

NOTE
It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active
antenna may generate harmonics which will affect the GNSS performance.

5.4. RF Connector Recommendation

The module is mounted with antenna connectors (receptacles) for convenient antenna connection. The
dimensions of receptacles are shown as below.

Figure 14: Dimensions of the Receptacle (Unit: mm)

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U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT.

Figure 15: Specifications of Mated Plugs

The following figure describes the space factor of mated connectors.

Figure 16: Space Factor of Mated Connectors (Unit: mm)

For more details of the recommended mating plugs, please visit http://www.hirose.com.

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6 Electrical Characteristics and

Reliability

6.1. General Description

The following subchapters mainly describe the following electrical and radio characteristics of BG95-M3
Mini PCIe:

⚫ Power supply ratings

⚫ Digital I/O characteristics
⚫ Tx power
⚫ Rx sensitivity
⚫ ESD characteristics
⚫ Power consumption

6.2. Power Supply Ratings

The input voltage of the module is 3.3 V ±9 % (3.0–3.6 V), as specified by PCI Express Mini Card
Electromechanical Specification Revision 1.2. The following table shows the power supply ratings of the
module.

Table 22: Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

The actual input voltages should be kept

VCC_3V3 Power Supply between the minimum and maximum 3.0 3.3 3.6 V
values.

6.3. Digital I/O Characteristics

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The following table shows the digital I/O characteristics of the module.

Table 23: 3.3 V Digital I/O Characteristics

Parameter Description Min. Max. Unit

VIH Input high voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V

VIL Input low voltage -0.3 0.3 × VCC_3V3 V

VOH Output high voltage VCC_3V3 - 0.5 VCC_3V3 V

VOL Output low voltage 0 0.4 V

Table 24: 1.8 V Digital I/O Characteristics

Parameter Description Min. Max. Unit

VIH Input high voltage 1.2 2.0 V

VIL Input low voltage -0.3 0.6 V

VOH Output high voltage 1.35 1.8 V

VOL Output low voltage 0 0.45 V

NOTE

1. The PCM and I2C interfaces belong to 1.8 V power domain and other I/O interfaces belong to
VCC_3V3 power domain.
2. The maximum voltage value of VIL for PERST# and W_DISABLE# is 0.5 V.

6.4. Tx Power

The following tables show the Tx power of the module.

Table 25: Tx Power

Frequency Max. Min.

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LTE HD-FDD: B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/

21 dBm + 1.7/-3 dB < -39 dBm
B25/B26 8/B27 8/B28/B66/B71 9/B85

GSM850/EGSM900 33 dBm ± 2 dB 5 dBm ± 5 dB

DCS1800/PCS1900 30 dBm ± 2 dB 0 dBm ± 5 dB

GSM850/EGSM900 (8-PSK) 27 dBm ± 3 dB 5 dBm ± 5 dB

DCS1800/PCS1900 (8-PSK) 26 dBm ± 3 dB 0 dBm ± 5 dB

6.5. Rx Sensitivity

Table 26: Rx Sensitivity

Sensitivity (dBm)
Band Primary Diversity
10/3GPP
Cat M1/3GPP Cat NB2

LTE HD-FDD B1 -106/-102.3 -115/-107.5

LTE HD-FDD B2 -104.9/-100.3 -115/-107.5

LTE HD-FDD B3 -102.9/-99.3 -115/-107.5

LTE HD-FDD B4 -104.4/-102.3 -114/-107.5

LTE HD-FDD B5 -104.4/-100.8 -116/-107.5

LTE HD-FDD B8 -104.1/-99.8 -113/-107.5

√ -
LTE HD-FDD B12 -104.4/-99.3 -116/-107.5

LTE HD-FDD B13 -104.4/-99.3 -115.5/-107.5

LTE HD-FDD B18 -104.4/-102.3 -116/-107.5

LTE HD-FDD B19 -104.4/-102.3 -115.5/-107.5

LTE HD-FDD B20 -104.1/-99.8 -115.5/-107.5

LTE HD-FDD B25 -104.5/-100.3 -115.5/-107.5

8 LTE HD-FDD B26 and B27 are supported by Cat M1 only.

9 LTE HD-FDD B71 is supported by Cat NB2 only.
10 3GPP has no requirements for LTE Cat NB Rx sensitivity level with repetitions.

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LTE HD-FDD B26 8 -104.5/-100.3 -

LTE HD-FDD B27 8 -104.5/-100.8 -

LTE HD-FDD B28 -104/-100.8 -116/-107.5

LTE HD-FDD B66 -103.9/-101.8 -115.5/-107.5

LTE HD-FDD B71 9 - -115/-107.5

LTE HD-FDD B85 -104.3/-99.3 -116/-107.5

Sensitivity (dBm)
Band Primary Diversity
GSM/3GPP

GSM850/EGSM900 -107/-102
√ -
DCS1800/PCS1900 -107/-102

NOTE

“√” means supported and “-” means not supported or not applicable.

6.6. ESD Protection

Static electricity occurs naturally and it may damage the module. Therefore, it is imperative to adopt
proper ESD countermeasures and handling methods. For example, wear anti-static gloves during the
development, production, assembly and testing of the module; add ESD protection components to the
ESD sensitive interfaces and points in the product design.

Table 27: ESD Discharge Characteristics

Tested Interfaces Contact Discharge Air Discharge Unit

GND ±6 ±8 kV

VCC_3V3 ±6 ±8 kV

Main antenna connector ±5 ±6 kV

GNSS antenna connector ±5 ±6 kV

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6.7. Operating and Storage Temperatures

Table 28: Operating and Storage Temperatures

Parameter Temperature Range

11
Operating Temperature Range -30 to +75 °C

12
Extended Temperature Range -40 to +80 °C

Storage Temperature Range -40 to +90 °C

6.8. Power Consumption

The following tables describe the current consumption of the module.

Table 29: Power Consumption

Description Conditions Average Unit

PSM Power Saving Mode (USB Suspend) 2.47 mA

AT+CFUN=0 @ Sleep Mode 2.55 mA

LTE Cat M1 DRX = 1.28 s 3.84 mA

LTE Cat NB1 DRX = 1.28 s 3.68 mA

Sleep Mode LTE Cat M1

2.74 mA
(USB Suspend) e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s
LTE Cat NB1
2.72 mA
e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s

EGSM900 DRX = 5 3.26 mA

DCS1800 DRX = 5 3.33 mA

11 Within the operating temperature range, the module meets 3GPP specifications.
12 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice,
SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced,
while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns
to the operating temperature range, the module meets 3GPP specifications again.

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LTE Cat M1 DRX = 1.28 s 24.80 mA

LTE Cat NB1 DRX = 1.28 s 20.65 mA

LTE Cat M1
24.15 mA
Idle e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s
(USB Suspend) LTE Cat NB1
20.27 mA
e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s

EGSM900 DRX = 5 18.23 mA

DCS1800 DRX = 5 18.31 mA

LTE Cat M1 DRX = 1.28 s 29.49 mA

LTE Cat NB1 DRX = 1.28 s 29.43 mA

LTE Cat M1
28.41 mA
Idle e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s
(USB Active) LTE Cat NB1
28.55 mA
e-I-DRX = 81.92 s, PTW = 2.56 s, DRX = 1.28 s

EGSM900 DRX = 5 28.90 mA

DCS1800 DRX = 5 29.04 mA

Band 1 @ 21.35 dBm 250 mA

Band 2 @ 21.53 dBm 240 mA

Band 3 @ 21.18 dBm 242 mA

Band 4 @ 21.48 dBm 260 mA

Band 5 @ 21.38 dBm 260 mA

LTE Cat M1 data Band 8 @ 22.46 dBm 259 mA

transfer
(GNSS OFF) Band 12 @ 21.45 dBm 235 mA

Band 13 @ 21.46 dBm 254 mA

Band 18 @ 22.29 dBm 254 mA

Band 19 @ 21.39 dBm 244 mA

Band 20 @ 22.27 dBm 259 mA

Band 25 @ 21.46 dBm 256 mA

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Band 26 @ 22.16 dBm 256 mA

Band 27 @ 21.8 dBm 250 mA

Band 28A @ 21.3 dBm 253 mA

Band 28B @ 21.2 dBm 244 mA

Band 66 @ 22.82 dBm 249 mA

Band 85 @ 21.27 dBm 237 mA

Band 1 @ 21.14 dBm 204 mA

Band 2 @ 21.11 dBm 371 mA

Band 3 @ 21.65 dBm 206 mA

Band 4 @ 21.51 dBm 203 mA

Band 5 @ 21.33 dBm 400 mA

Band 8 @ 21.13dBm 393 mA

Band 12 @ 21.09 dBm 203 mA

LTE Cat NB1 data Band 13 @ 21.21 dBm 412 mA

transfer
(GNSS OFF) Band 18 @ 21.38 dBm 215 mA

Band 19 @ 20.78 dBm 390 mA

Band 20 @ 21.13 dBm 395 mA

Band 25 @ 21.57 dBm 206 mA

Band 28 @ 21.06dBm 378 mA

Band 66 @ 21.62 dBm 370 mA

Band 71 @ 20.78 dBm 148 mA

Band 85 @ 20.07 dBm 357 mA

GPRS GSM850 4UL/1DL @ 29.58 dBm 862 mA

GPRS data
transfer (GNSS GPRS EGSM900 4UL/1DL @ 29.65 dBm 857 mA
OFF)
GPRS DCS1800 4UL/1DL @ 26.16 dBm 565 mA

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GPRS PCS1900 4UL/1DL @ 25.88 dBm 587 mA

EDGE GSM850 4UL/1DL @ 22.58 dBm 523 mA

EDGE data EDGE EGSM900 4UL/1DL @ 22.66 dBm 521 mA

transfer (GNSS
OFF) EDGE DCS1800 4UL/1DL @ 21.7 dBm 470 mA

EDGE PCS1900 4UL/1DL @ 22.23 dBm 486 mA

Table 30: GNSS Power Consumption

Parameter Description Conditions Typ. Unit

Cold start @ Passive Antenna 100.67 mA

Searching
(AT+CFUN=0)
Lost state @ Passive Antenna 101.87 mA

IVBAT Instrument environment 59.37 mA

Tracking
Open Sky @ Passive Antenna TBD mA
(AT+CFUN=0)
Open Sky @ Active Antenna TBD mA

6.9. Notification

Please follow the rules below in the module application.

6.9.1. Coating

If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and it is essential to prevent the coating material from flowing into
the module.

6.9.2. Cleaning

Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.

6.9.3. Assembly Requirement

It is recommended to fix the module on the plane when the module is inserted to a socket.

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7 Mechanical Information

7.1. General Description

This chapter mainly describes mechanical dimensions as well as packaging specification of the module.
All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.15 mm unless
otherwise specified.

7.2. Mechanical Dimensions

30.00±0.15
24.20±0.2
8.35 Φ2.6±0.1
2.90±0.15 1.00±0.1
6.39 6.39 2.055±0.15
2.90±0.15
11.85±0.15

2.25±0.2
47.75±0.15

23.60±0.2
50.95±0.15

1.40±0.1

19.90±0.2 5.05±0.15 10.15±0.1

2.40 0.25 Max.

4.00±0.1
7.38±0.1
0.25 Max.
0.4 Max. R0.50
0.25Max
Top View Side View

Figure 17: Mechanical Dimensions of BG95-M3 Mini PCIe

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7.3. Packaging Specification

This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:

7.3.1. Blister Tray

Dimension details are as follow:

Figure 18: Blister Tray Dimension Drawing

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7.3.2. Packaging Process

Pack 10 modules in each blister tray. Stack 10 Pack 11 blister trays together and then put
blister trays with modules together, and put 1 blister trays into conductive bag, seal and
empty blister tray on the top. pack the conductive bag.

Put the seal-packed blister trays into the mini box. Put 4 packaged mini boxes into 1 carton box
1 mini box can pack 100 modules. and then seal it. 1 carton box can pack 400
modules.

Figure 19: Packaging Process

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8 Appendix References

Table 31: Related Documents

Document Name

[1] Quectel_BG95&BG77&BG600L_Series_GNSS_Application_Note

[2] Quectel_Mini_PCIe_EVB_User_Guide

[3] Quectel_BG95&BG77&BG600L_Series_QCFG_AT_Commands_Manual

[4] Quectel_BG95&BG77&BG600L_Series_AT_Commands_Manual

Table 32: Terms and Abbreviations

Abbreviation Description

bps Bits Per Second

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CTS Clear to Send

DFOTA Delta Firmware upgrade Over-The-Air

DL Downlink

DTE Data Terminal Equipment

DTR Data Terminal Ready

EDGE Enhanced Data Rates for GSM Evolution

EGPRS Enhanced General Packet Radio Service

EMI Electromagnetic Interference

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ESD Electrostatic Discharge

ESR Equivalent Series Resistance

FDD Frequency Division Duplexing

GLobalnaya Navigazionnaya Sputnikovaya Sistema, the Russian Global

GLONASS
Navigation Satellite System

GMSK Gaussian Minimum Shift Keying

GNSS Global Navigation Satellite System

GPRS General Packet Radio Service

GPS Global Positioning System

GSM Global System for Mobile Communications

kbps kilobits per second

LED Light Emitting Diode

LTE Long Term Evolution

Mbps Million Bits Per Second

MCS Modulation and Coding Scheme

MCU Micro Control Unit

ME Mobile Equipment

NMEA National Marine Electronics Association

PAP Password Authentication Protocol

PCI Peripheral Component Interconnect

PCIe Peripheral Component Interconnect Express

PCM Pulse Code Modulation

PDA Personal Digital Assistant

PDU Protocol Data Unit

POS Point of Sale

PPP Point-to-Point Protocol

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RF Radio Frequency

RTS Ready To Send

RX Receive Direction

SMS Short Message Service

TX Transmitting Direction

TVS Transient Voltage Suppressor

UART Universal Asynchronous Receiver & Transmitter

UL Uplink

URC Unsolicited Result Code

USB Universal Serial Bus

(U)SIM (Universal) Subscriber Identification Module

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