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Panasonic Thermal Management Catalog

This catalog provides information on Panasonic's thermal management solutions, including multilayer NTC thermistors and graphite sheets. The document discusses NTC thermistors, describing their negative temperature coefficient, various shapes, wide resistance value range, and linear resistance-temperature relationship defined by thermistor constant B. It also lists recommended applications for temperature measurement, compensation, and detection. Details are provided on part numbers, specifications, and handling precautions for different product lines.

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0% found this document useful (0 votes)

78 views50 pages

Panasonic Thermal Management Catalog

Uploaded by

venugopalan srinivasan

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Available Formats

Download as PDF, TXT or read online on Scribd

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2019

CATALOG
Thermal Management Solutions

2019.4 industrial.panasonic.com/
Thermal Management Solutions CONTENTS

Product Item Part Number Page

The NTC Thermistors 2

ERT JZ
Multilayer NTC Thermistors ERT J0 3
ERT J1
Handling Precautions 11

ERT J0 M
16
Multilayer NTC Thermistors (Automotive Grade) ERT J1 M

Handling Precautions 21
EYG S
EYG A 26
“PGS” Graphite Sheets EYG E
SSM(Semi-Sealing Material) Minimum order 32

Handling Precautions 34
EYG Y
35
“NASBIS” Insulating Sheet EYG N
Handling Precautions 38

EYG T 39
“Graphite-PAD” high thermal conductivity in z-direction
Handling Precautions 42

“GraphiteTIM (Compressible Type)” PGS EYG S 43

with low thermal resistance Handling Precautions 47

All products in this catalog comply with the RoHS Directive.

The RoHS Directive is “the Directive (2011/65/EU) on the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equipment “ and its revisions.

04 Oct. 2018
–1–
NTC Thermistors

The NTC Thermistors

NTC Thermistors is a negative temperature coefficient resistor that significantly reduces its resistance value as the heat/
ambient temperature rises. Thermistors is sintered in high-temperature (1200 °C to 1500 °C), and manufactured in
various shapes. It’s comprised of 2 to 4 kinds of metal oxides: iron, nickel, cobalt, manganese and copper.

Features Recommended Applications

● Temperature Coefﬁcient of Resistance is negative, ● For temperature measurement or temperature
and it’s extremely large (–2.8 to –5.1 [%/°C]). detection : Thermometer, temperature controller
● Various shapes, especially co mpact size ● For temperature compensation : Transistor, transistor
components are available. circuit, quarts oscillation circuit, and measuring
● Selection of resistance vale is comparatively free, it’s instruments
available from several tens Ω to several hundred kΩ.

Physical Characteristics of NTC Thermistors

Thermistor is a resistor sensitive to temperature that is
utilizing the characteristic of metal oxide semiconductor Fig. 1
having large temperature coefﬁcient. 1000
And its temperature dependency of resistance value is
indicated by the following equation :
100

R=R0 exp [ (B
1
T
1
T0 )] .....................................(1)
10

T0 : Standard Temperature 298.15 K(25 °C)

RT/R25

R0 : Resistance at T0 [K] 1
B : Thermistor Constant [K] B=1000
2000
Temperature coefﬁcient (a) in general meaning is indicated 0.1 3000
as follows : 400
0
500
0
B ....................................................................
a= 2 (2) 0.01 60
00
T
Since the change by temperature is considerably large, a is
not appropriate as a constant. Therefore, B value (constant) 0.001
–40 –20 0 20 40 60 80 100 120 140
is generally used as a coefﬁcient of thermistors. T (˚C)

Major Characteristics of NTC Thermistors

The relation between resistance and temperature of a
thermistor is linear as shown in Fig. 2. The resistance
Fig. 2
value is shown in vertical direction in a logarithmic scale
and reciprocal of absolute temperature (adding 273.15 to 10000000
700
centigrade) is shown in horizontal direction. =4
0 500
B 25/5 44005
=
00=
The B value (constant) determines the gradient of these 1000000 □
104
/55
BB2255/ 0
□
□
straight lines. The B value (constant) is calculated by using 0 EV EP473 4 25
J
T RTJ 0 5 0=
E R B 2 5/
following equation. E
□
100000 03 343
5
E R1 5=
TJ 0 B 25/8
ER 3□
A 5 0
0
=4
knR1 – knR2 10000 0 EG10 /50
B= ....................................................... (3) J 5
ERT
B 2
□
R (Ω)

1 1 02
E T1
T1 T2 TJ0
1000 ER 00
=28
R1: Resistance at T1 K □ B 25/50
1
R2: Resistance at T2 K A10
100 J0E
ERT
When you calculate this equation, you’ll ﬁnd that B value
is not exactly constant. The resistance is expressed by 10
the following equation :
R = AT–C exp D/T ............................................................. (4) 1
In (4), C is a small positive or negative constant and quite 2.4 2.9
1
3.4 3.9 4.4
negligible except for use in precision temperature-measuring (×10 –3K–1)
T
device, therefore, the B value can be considered as constant 125 85 50 25 0 –20 –40
number. T (˚C)
In Fig. 1, the relation between the resistance ratio
RT/R25 (R25 : Resistance at 25 °C, RT : Resistance at T °C)
and B Value is shown with T °C, in the horizontal direction.

Multilayer NTC Thermistors

Series: ERTJ

Features
● Surface Mount Device (0201, 0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 125 °C)
● Environmentally-friendly lead-free
● RoHS compliant

Recommended Applications
● Mobile Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor devices
● Personal Computer and Peripheral Device
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity (Inkjet Printer)
● Battery Pack (secondary battery)
· Temperature detection of battery cells
● Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting (CCFL)

Explanation of Part Numbers

1 2 3 4 5 6 7 8 9 10 11 12

E R T J 0 E G 1 0 3 J A (Example)

Common Code Size Code Packaging B Value Class Code Nominal Resistance Resistance Tolerance
Product Code Type Code Z “0201” Style Code A 2701 to 2800 R25 (Ω) Code
ERT NTC J Chip Type (SMD) 0 “0402” E “0201”, “0402” G 3301 to 3400 The first two digits F ±1% Narrow
Thermistors Multilayer Type 1 “0603” Pressed Carrier M 3801 to 3900 are significant figures Tolerance
Taping of resistance and the G ±2% Type
P 4001 to 4100
Punched Carrier third one denotes
Taping R 4201 to 4300 the number of zeros H ±3% Standard
(Pitch : 2 mm) S 4301 to 4400 following them. J ±5% Type
V “0603” T 4401 to 4500
Special
Punched Carrier V 4601 to 4700 Specification
Taping
(Pitch : 4 mm)

Construction

No. Name
A Semiconductive Ceramics
3
4 B Internal electrode
5
C Substrate electrode
2 Terminal
1 D Intermediate electrode
electrode
E External electrode

Ratings
Size code (EIA) Z(0201) 0(0402) 1(0603)
Operating Temperature Range –40 to 125 °C
Rated Maximum Power Dissipation✽1 33 mW 66 mW 100 mW
✽2 Approximately Approximately Approximately
Dissipation Factor 1 mW/°C 2 mW/°C 3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).

Part Number List of Narrow Tolerance Type (Resistance Tolerance : ±2 %, ±1 %)

● 0201(EIA)
Nominal Resistance Resistance B Value B Value
Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJZEG103□A 10 kΩ (3380 K) 3435 K±1%
ERTJZEP473□ 47 kΩ 4050 K±1 % (4100 K)
ERTJZEP683□ 68 kΩ ±1 %(F) 4050 K±1 % (4100 K)
ERTJZER683□ 68 kΩ or 4250 K±1 % (4300 K)
ERTJZER104□ 100 kΩ ±2 %(G) 4250 K±1 % (4300 K)
ERTJZET104□ 100 kΩ 4500 K±1 % (4550 K)
ERTJZEV104□ 100 kΩ 4700 K±1 % (4750 K)
□ : Resistance Tolerance Code

● 0402(EIA)
Nominal Resistance Resistance B Value B Value
Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJ0EG103□A 10 kΩ (3380 K) 3435 K±1 %
ERTJ0EP333□ 33 kΩ 4050 K±1 % (4100 K)
ERTJ0EP473□ 47 kΩ 4050 K±1 % (4100 K)
±1 %(F)
ERTJ0EP683□ 68 kΩ 4050 K±1 % (4100 K)
or
ERTJ0ER104□ 100 kΩ 4250 K±1 % (4300 K)
±2 %(G)
ERTJ0ES104□ 100 kΩ 4330 K±1 % (4390 K)
ERTJ0EV104□ 100 kΩ 4700 K±1 % (4750 K)
ERTJ0EV224□ 220 kΩ 4700 K±1 % (4750 K)
□ : Resistance Tolerance Code

● 0603(EIA)
Nominal Resistance Resistance B Value B Value
Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJ1VG103□A 10 kΩ ±1 %(F) (3380 K) 3435 K±1 %
or
ERTJ1VS104□A 100 kΩ ±2 %(G) (4330 K) 4390 K±1 %
□ : Resistance Tolerance Code

Part Number List of Standard Type (Resistance Tolerance : ±5 %, ±3 %)

● 0201(EIA)
Nominal Resistance Resistance B Value B Value
Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJZET202□ 2.0 kΩ 4500 K±2 % (4450 K)
ERTJZET302□ 3.0 kΩ 4500 K±2 % (4450 K)
ERTJZET472□ 4.7 kΩ 4500 K±2 % (4450 K)
ERTJZEG103□A 10 kΩ (3380 K) 3435 K±1 %
ERTJZEP473□ 47 kΩ 4050 K±2 % (4100 K)
ERTJZEP683□ 68 kΩ ±3 %(H) 4050 K±2 % (4100 K)
or
ERTJZER683□ 68 kΩ ±5 %(J) 4250 K±2 % (4300 K)
ERTJZER104□ 100 kΩ 4250 K±2 % (4300 K)
ERTJZET104□ 100 kΩ 4500 K±2 % (4550 K)
ERTJZEV104□ 100 kΩ 4700 K±2 % (4750 K)
ERTJZET154□ 150 kΩ 4500 K±2 % (4750 K)
ERTJZET224□ 220 kΩ 4500 K±2 % (4750 K)
□ : Resistance Tolerance Code

● 0402(EIA)

Nominal Resistance Resistance B Value B Value

Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJ0EA220□ 22 Ω 2750 K±3 % (2700 K)
ERTJ0EA330□ 33 Ω 2750 K±3 % (2700 K)
ERTJ0EA400□ 40 Ω 2750 K±3 % (2700 K)
ERTJ0EA470□ 47 Ω 2750 K±3 % (2700 K)
ERTJ0EA680□ 68 Ω 2800 K±3 % (2750 K)
ERTJ0EA101□ 100 Ω 2800 K±3 % (2750 K)
ERTJ0EA151□ 150 Ω 2800 K±3 % (2750 K)
ERTJ0ET102□ 1.0 kΩ 4500 K±2 % (4450 K)
ERTJ0ET152□ 1.5 kΩ 4500 K±2 % (4450 K)
ERTJ0ET202□ 2.0 kΩ 4500 K±2 % (4450 K)
ERTJ0ET222□ 2.2 kΩ 4500 K±2 % (4450 K)
ERTJ0ET302□ 3.0 kΩ 4500 K±2 % (4450 K)
ERTJ0ER332□ 3.3 kΩ 4250 K±2 % (4300 K)
ERTJ0ET332□ 3.3 kΩ 4500 K±2 % (4450 K)
ERTJ0ET472□ 4.7 kΩ 4500 K±2 % (4450 K)
ERTJ0ER472□ 4.7 kΩ 4250 K±2 % (4300 K)
ERTJ0ER682□ 6.8 kΩ 4250 K±2 % (4300 K)
ERTJ0EG103□A 10 kΩ (3380 K) 3435 K±1 %
ERTJ0EM103□ 10 kΩ 3900 K±2 % (3970 K)
ERTJ0ER103□ 10 kΩ ±3 %(H) 4250 K±2 % (4300 K)
ERTJ0ER153□ 15 kΩ or 4250 K±2 % (4300 K)
ERTJ0ER223□ 22 kΩ ±5 %(J) 4250 K±2 % (4300 K)
ERTJ0EP333□ 33 kΩ 4050 K±2 % (4100 K)
ERTJ0ER333□ 33 kΩ 4250 K±2 % (4300 K)
ERTJ0ET333□ 33 kΩ 4500 K±2 % (4580 K)
ERTJ0EP473□ 47 kΩ 4050 K±2 % (4100 K)
ERTJ0ET473□ 47 kΩ 4500 K±2 % (4550 K)
ERTJ0EV473□ 47 kΩ 4700 K±2 % (4750 K)
ERTJ0EP683□ 68 kΩ 4050 K±2 % (4100 K)
ERTJ0ER683□ 68 kΩ 4250 K±2 % (4300 K)
ERTJ0EV683□ 68 kΩ 4700 K±2 % (4750 K)
ERTJ0EP104□ 100 kΩ 4050 K±2 % (4100 K)
ERTJ0ER104□ 100 kΩ 4250 K±2 % (4300 K)
ERTJ0ES104□ 100 kΩ 4330 K±2 % (4390 K)
ERTJ0ET104□ 100 kΩ 4500 K±2 % (4580 K)
ERTJ0EV104□ 100 kΩ 4700 K±2 % (4750 K)
ERTJ0ET154□ 150 kΩ 4500 K±2 % (4580 K)
ERTJ0EV154□ 150 kΩ 4700 K±2 % (4750 K)
ERTJ0EV224□ 220 kΩ 4700 K±2 % (4750 K)
ERTJ0EV334□ 330 kΩ 4700 K±2 % (4750 K)
ERTJ0EV474□ 470 kΩ 4700 K±2 % (4750 K)

□ : Resistance Tolerance Code

● 0603(EIA)

Nominal Resistance Resistance B Value B Value

Part Number
at 25 °C Tolerance at 25/50(K) at 25/85(K)
ERTJ1VA220□ 22 Ω 2750 K±3 % (2700 K)
ERTJ1VA330□ 33 Ω 2750 K±3 % (2700 K)
ERTJ1VA400□ 40 Ω 2800 K±3 % (2750 K)
ERTJ1VA470□ 47 Ω 2800 K±3 % (2750 K)
ERTJ1VA680□ 68 Ω 2800 K±3 % (2750 K)
ERTJ1VA101□ 100 Ω 2800 K±3 % (2750 K)
ERTJ1VT102□ 1.0 kΩ 4500 K±2 % (4450 K)
ERTJ1VT152□ 1.5 kΩ 4500 K±2 % (4450 K)
ERTJ1VT202□ 2.0 kΩ 4500 K±2 % (4450 K)
ERTJ1VT222□ 2.2 kΩ 4500 K±2 % (4450 K)
ERTJ1VT302□ 3.0 kΩ 4500 K±2 % (4450 K)
ERTJ1VT332□ 3.3 kΩ 4500 K±2 % (4450 K)
ERTJ1VR332□ 3.3 kΩ 4250 K±2 % (4300 K)
ERTJ1VR472□ 4.7 kΩ 4250 K±2 % (4300 K)
ERTJ1VT472□ 4.7 kΩ ±3 %(H) 4500 K±2 % (4450 K)
or
ERTJ1VR682□ 6.8 kΩ ±5 %(J) 4250 K±2 % (4300 K)
ERTJ1VG103□A 10 kΩ (3380 K) 3435 K±1%
ERTJ1VR103□ 10 kΩ 4250 K±2 % (4300 K)
ERTJ1VR153□ 15 kΩ 4250 K±2 % (4300 K)
ERTJ1VR223□ 22 kΩ 4250 K±2 % (4300 K)
ERTJ1VR333□ 33 kΩ 4250 K±2 % (4300 K)
ERTJ1VP473□ 47 kΩ 4100 K±2 % (4150 K)
ERTJ1VR473□ 47 kΩ 4250 K±2 % (4300 K)
ERTJ1VV473□ 47 kΩ 4700 K±2 % (4750 K)
ERTJ1VR683□ 68 kΩ 4250 K±2 % (4300 K)
ERTJ1VV683□ 68 kΩ 4700 K±2 % (4750 K)
ERTJ1VS104□A 100 kΩ (4330 K) 4390 K±1%
ERTJ1VV104□ 100 kΩ 4700 K±2 % (4750 K)
ERTJ1VV154□ 150 kΩ 4700 K±2 % (4750 K)
ERTJ1VT224□ 220 kΩ 4500 K±2 % (4580 K)
□ : Resistance Tolerance Code

● Temperature and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□A~ ERTJ□□G~ ERTJ□□M~ ERTJ□□P~ ERTJ□□R~ ERTJ0ES~ ERTJ1VS~ ERTJ□□T~ ERTJ□□T~ ERTJ□□V~
B25/50 2750 K 2800 K (3375 K) 3900 K 4050 K 4250 K 4330 K (4330 K) 4500 K 4500 K 4700 K
B25/85 (2700 K) (2750 K) 3435 K (3970 K) (4100 K) (4300 K) (4390 K) 4390 K (4450 K) (4580 K) (4750 K)
T(°C) ✽1 ✽2
-40 13.05 13.28 20.52 32.11 33.10 43.10 45.67 45.53 63.30 47.07 59.76
-35 10.21 10.40 15.48 23.29 24.03 30.45 32.08 31.99 42.92 33.31 41.10
-30 8.061 8.214 11.79 17.08 17.63 21.76 22.80 22.74 29.50 23.80 28.61
-25 6.427 6.547 9.069 12.65 13.06 15.73 16.39 16.35 20.53 17.16 20.14
-20 5.168 5.261 7.037 9.465 9.761 11.48 11.91 11.89 14.46 12.49 14.33
-15 4.191 4.261 5.507 7.147 7.362 8.466 8.743 8.727 10.30 9.159 10.31
-10 3.424 3.476 4.344 5.444 5.599 6.300 6.479 6.469 7.407 6.772 7.482
-5 2.819 2.856 3.453 4.181 4.291 4.730 4.845 4.839 5.388 5.046 5.481
0 2.336 2.362 2.764 3.237 3.312 3.582 3.654 3.650 3.966 3.789 4.050
5 1.948 1.966 2.227 2.524 2.574 2.734 2.778 2.776 2.953 2.864 3.015
10 1.635 1.646 1.806 1.981 2.013 2.102 2.128 2.126 2.221 2.179 2.262
15 1.380 1.386 1.474 1.567 1.584 1.629 1.642 1.641 1.687 1.669 1.710
20 1.171 1.174 1.211 1.247 1.255 1.272 1.277 1.276 1.293 1.287 1.303
25 1 1 1 1 1 1 1 1 1 1 1
30 0.8585 0.8565 0.8309 0.8072 0.8016 0.7921 0.7888 0.7890 0.7799 0.7823 0.7734
35 0.7407 0.7372 0.6941 0.6556 0.6461 0.6315 0.6263 0.6266 0.6131 0.6158 0.6023
40 0.6422 0.6376 0.5828 0.5356 0.5235 0.5067 0.5004 0.5007 0.4856 0.4876 0.4721
45 0.5595 0.5541 0.4916 0.4401 0.4266 0.4090 0.4022 0.4025 0.3874 0.3884 0.3723
50 0.4899 0.4836 0.4165 0.3635 0.3496 0.3319 0.3251 0.3254 0.3111 0.3111 0.2954
55 0.4309 0.4238 0.3543 0.3018 0.2881 0.2709 0.2642 0.2645 0.2513 0.2504 0.2356
60 0.3806 0.3730 0.3027 0.2518 0.2386 0.2222 0.2158 0.2161 0.2042 0.2026 0.1889
65 0.3376 0.3295 0.2595 0.2111 0.1985 0.1832 0.1772 0.1774 0.1670 0.1648 0.1523
70 0.3008 0.2922 0.2233 0.1777 0.1659 0.1518 0.1463 0.1465 0.1377 0.1348 0.1236
75 0.2691 0.2600 0.1929 0.1504 0.1393 0.1264 0.1213 0.1215 0.1144 0.1108 0.1009
80 0.2417 0.2322 0.1672 0.1278 0.1174 0.1057 0.1011 0.1013 0.09560 0.09162 0.08284
85 0.2180 0.2081 0.1451 0.1090 0.09937 0.08873 0.08469 0.08486 0.08033 0.07609 0.06834
90 0.1974 0.1871 0.1261 0.09310 0.08442 0.07468 0.07122 0.07138 0.06782 0.06345 0.05662
95 0.1793 0.1688 0.1097 0.07980 0.07200 0.06307 0.06014 0.06028 0.05753 0.05314 0.04712
100 0.1636 0.1528 0.09563 0.06871 0.06166 0.05353 0.05099 0.05112 0.04903 0.04472 0.03939
105 0.1498 0.1387 0.08357 0.05947 0.05306 0.04568 0.04340 0.04351 0.04198 0.03784 0.03308
110 0.1377 0.1263 0.07317 0.05170 0.04587 0.03918 0.03708 0.03718 0.03609 0.03218 0.02791
115 0.1270 0.1153 0.06421 0.04512 0.03979 0.03374 0.03179 0.03188 0.03117 0.02748 0.02364
120 0.1175 0.1056 0.05650 0.03951 0.03460 0.02916 0.02734 0.02742 0.02702 0.02352 0.02009
125 0.1091 0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367 0.02351 0.02017 0.01712
✽1 Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 °C less than 10 kΩ. ✽2 Applied only to ERTJ0ET104□.
✽2 Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 °C of 10 kΩ or more. ✽2 Applied only to ERTJ0ET104□.

kn (R25/R50) kn (R25/R85) R25=Resistance at 25.0±0.1 °C

B25/50= B25/85= R50=Resistance at 50.0±0.1 °C
1/298.15–1/323.15 1/298.15–1/358.15 R85=Resistance at 85.0±0.1 °C

Specification and Test Method

Item Specification Test Method
Rated Zero-power Within the specified tolerance. The value is measured at a power that the influence
Resistance (R25) of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value Shown in each Individual Specification. The Zero-power resistances; R1 and R2, shall be
✽ Individual Specification shall specify B25/50 or measured respectively at T1 (deg.C) and T2 (deg.C).
B25/85. The B value is calculated by the following equation.

kn (R1)–kn (R2)
BT1/T2=
1/(T1+273.15)–1/(T2+273.15)
T1 T2
B25/50 25.0 ±0.1 °C 50.0 ±0.1 °C
B25/85 25.0 ±0.1 °C 85.0 ±0.1 °C
Adhesion The terminal electrode shall be free from peeling Applied force :
or signs of peeling. Size 0201 :2N
Size 0402, 0603 : 5 N
Duration : 10 s

Size : 0201, 0402

0.3/Size:0201
1.0 0.5R 0.5/Size:0402

Test Sample Board

Size : 0603

1.0
Test
Sample Unit : mm

Bending Strength There shall be no cracks and other mechanical Bending distance : 1 mm
damage. Bending speed : 1 mm/s
R25 change : within ±5 %
20
distance
Bending

R340

45±2 45±2
Unit : mm
Resistance to There shall be no cracks and other mechanical Soldering bath method
Soldering Heat damage. Solder temperature : 270 ±5 °C
Nallow Tol. type Standard type Dipping period : 4.0 ±1 s
R25 change : within ±2 % within ±3 % Preheat condition :
B Value change : within ±1 % within ±2 % Step Temp (°C) Period (s)
1 80 to 100 120 to 180
2 150 to 200 120 to 180
Solderability More than 95 % of the soldered area of both Soldering bath method
terminal electrodes shall be covered with fresh Solder temperature : 230 ±5 °C
solder. Dipping period : 4 ±1 s
Solder : Sn-3.0Ag-0.5Cu

Specification and Test Method

Item Speciﬁcation Test Method
Temperature Nallow Tol. type Standard type Conditions of one cycle
Cycling R25 change : within ±2 % within ±3 % Step 1 : –40 °C, 30±3 min
B Value change : within ±1 % within ±2 % Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
Humidity Nallow Tol. type Standard type Temperature : 85 ±2 °C
R25 change : within ±2 % within ±3 % Relative humidity : 85 ±5 %
B Value change : within ±1 % within ±2 % Test period : 1000 +48/0 h
Biased Humidity Nallow Tol. type Standard type Temperature : 85 ±2 °C
R25 change : within ±2 % within ±3 % Relative humidity : 85 ±5 %
B Value change : within ±1 % within ±2 % Applied power : 10 mW(D.C.)
Test period : 500 +48/0 h
Low Temperature Nallow Tol. type Standard type Specimens are soldered on the testing board
Exposure R25 change : within ±2 % within ±3 % shown in Fig.2.
B Value change : within ±1 % within ±2 % Temperature : –40 ±3 °C
Test period : 1000 +48/0 h
High Temperature Nallow Tol. type Standard type Specimens are soldered on the testing board
Exposure R25 change : within ±2 % within ±3 % shown in Fig.2.
B Value change : within ±1 % within ±2 % Temperature : 125 ±3 °C
Test period : 1000 +48/0 h

Typical Application
● Temperature Detection
Writing current control of HDD

Vcc

GMR Head

R
R L
AD
converter
NTC

Rth

CPU Interface

● Temperature Compensation (Pseudo-linearization) ● Temperature Compensation (RF circuit)

Contrast level control of LCD Temperature compensation of TCXO

Vcc PMIC
ADC

R LCD

NTC
NTC

Rth R

Rth

Dimensions in mm (not to scale)

L
(Unit : mm)

W Size Code (EIA) L W T L1, L2

Z(0201) 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05
0(0402) 1.0±0.1 0.50±0.05 0.50±0.05 0.25±0.15
T
1(0603) 1.60±0.15 0.8±0.1 0.8±0.1 0.3±0.2
L1 L2

Packaging Methods
● Standard Packing Quantities ● Reel for Taping
Size Thickness Pitch Quantity
Kind of Taping W1
Code (mm) (mm) (pcs./reel)
E
Z(0201) 0.3 Pressed Carrier Taping 2 15,000
C
0(0402) 0.5 2 10,000
Punched Carrier Taping

B
1(0603) 0.8 4 4,000 D

● Pitch 2 mm (Pressed Carrier Taping) : Size 0201 W2

t Feeding hole Chip pocket A

fD0

fA fB
E

Symbol C D E W1 W2
A
Dim. 180 0
60.0
+1.0
13.0±0.5 21.0±0.8 2.0±0.5 9.0
+1.0
11.4±1.0
F
W

–3 0 0
(mm)
B

K0 Chip component P 1 P2 P0 Tape running direction

● Leader Part and Taped End
Symbol A B W F E P1 P2 P0 fD 0 t K0
Leader part
Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36
(mm) ±0.03 ±0.03 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1 0 max. ±0.03
Top cover tape

● Pitch 2 mm (Punched Carrier Taping) : Size 0402 100 min.

Vacant position
t1 Feeding hole Chip pocket 400 min.
fD0
E

Taped end
A
F
W
B

t2 160 min.
Chip component P1 P2 P0 Tape running direction
Vacant position (Unit : mm)

Symbol A B W F E P1 P2 P0 fD 0 t1 t2
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 1.0
(mm) ±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1 0 max. max.
Minimum Quantity / Packing Unit
Part Number Minimum Quantity Packing Quantity Carton
● Pitch 4 mm (Punched Carrier Taping) : Size 0603 (Size) / Packing Unit in Carton L×W×H (mm)
t1 Feeding hole Chip pocket ERTJZ
15,000 300,000 250×200×200
fD0 (0201)
ERTJ0
E

A 10,000 200,000 250×200×200

(0402)
W
F
B

ERTJ1
4,000 80,000 250×200×200
Tape running direction
(0603)
t2 Chip component P1 P2 P0
Part No., quantity and country of origin are designated
Symbol A B W F E P1 P2 P0 fD 0 t1 t2 on outer packages in English.
Dim. 1.0 1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4
(mm) ±0.1 ±0.1 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 0 max. max.

Multilayer NTC Thermistors

Series: ERTJ
Handling Precautions

Safety Precautions
Multilayer NTC Thermistors (hereafter referred to as “Thermistors”) should be used for general purpose applications
found in consumer electronics (audio/visual, home, office, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as
noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be degraded, or become
failure mode, such as short circuit mode and open-circuit mode. If you use under the condition of short-circuit, heat
generation of thermistors will occur by running large current due to application of voltage. There are possibilities of
smoke emission, substrate burn-out, and, in the worst case, fire.
For products which require higher safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for product of special specification not found in
this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as
death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment

Operating Conditions and Circuit Design [Maximum power dissipation]

1. Circuit Design · The Maximum power that can be continuously
1.1 Operating Temperature and Storage Temperature applied under static air at a certain ambient
When operating a components-mounted circuit, temperature. The Maximum power dissipation under
please be sure to observe the “Operating Temperature an ambient temperature of 25 °C or less is the same
Range”, written in delivery specifications. Please with the rated maximum power dissipation, and
remember not to use the product under the condition Maximum power dissipation beyond 25 °C depends
that exceeds the specified maximum temperature. on the Decreased power dissipation curve below.
Storage temperature of PCB after mounting
Decreased power dissipation curve
Thermistors, which is not operated, should be within
/ Rated maximum power dissipation (%)

the specified “Storage Temperature Range” in the

Maximum power dissipation

delivery specifications. 100

1.2 Operating Power

50
The electricity applied to between terminals of
Thermistors should be under the specified maximum
power dissipation.
There are possibilities of breakage and burn-out due 25 75 125
Ambient temperature (°C)
to excessive self-heating of Thermistors, if the power
exceeds maximum power dissipation when operating. [Dissipation factor]
Please consider installing protection circuit for your · The constant amount power required to raise the
circuit to improve the safety, in case of abnormal temperature of the Thermistor 1 °C through self
voltage application and so on. heat generation under stable temperatures.
Thermistors’ performance of temperature detection Dissipation factor (mW/°C) = Power consumption
would be deteriorated if self-heating occurs, of Thermistor / Temperature rise of element
even when you use it under the maximum power
dissipation.
Please consider the maximum power dissipation and
dissipation factor.

1.3 Environmental Restrictions (2) The land size shall be designed to have equal
The Thermistors shall not be operated and/or space, on both right and left sides. If the
stored under the following conditions. amount of solder on both sides is not equal,
(1) Environmental conditions the component may be cracked by stress,
(a) Under direct exposure to water or salt water since the side with a larger amount of solder
solidifies later during cooling.
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases Recommended Amount of Solder
such as hydrogen sulfide, sulfurous acid, (a) Excessive amount (b) Proper amount (c) Insufﬁcient amount
chlorine and ammonia
(2) Mechanical conditions
The place where vibration or impact that
exceeds specified conditions written in delivery
specification is loaded.
2.3 Utilization of Solder Resist
1.4 Measurement of Resistance (1) Solder resist shall be utilized to equalize the
The resistance of the Thermistors varies depending amounts of solder on both sides.
on ambient temperatures and self-heating. To (2) Solder resist shall be used to divide the
measure the resistance value when examining circuit pattern for the following cases;
configuration and conducting receiving inspection · Components are arranged closely.
and so on, the following points should be taken into · The Thermistor is mounted near a component
consideration: with lead wires.
1 Measurement temp : 25±0.1 °C · The Thermistor is placed near a chassis.
Measurement in liquid (silicon oil, etc.) is Refer to the table below.
recommended for a stable measurement temperature.
2 Power : 0.10 mW max. Prohibited Applications and Recommended Applications
4 terminal measurement with a constant-current
power supply is recommended. Prohibited Improved applications
Item
applications by pattern division

2. Design of Printed Circuit Board The lead wire of a Solder resist

component with lead wires
2.1 Selection of Printed Circuit Boards Mixed mounting
There is a possibility of performance deterioration with a component
with lead wires
by heat shock (temperature cycles), which causes
cracks, from alumina substrate.
Chassis
Please confirm that the substrate you use does Solder resist
Solder
not deteriorate the Thermistors’ quality. Arrangement (Ground solder)
near chassis

2.2 Design of Land Pattern Electrode pattern

(1) Recommended land dimensions are shown below. A lead wire of
Use the proper amount of solder in order Soldering Retro-ﬁtted
Retro-ﬁtting of iron component
to prevent cracking. Using too much solder Solder resist
component with
places excessive stress on the Thermistors.
lead wires

Portion to be
Recommended Land Dimensions excessively soldered
Solder resist
SMD
Lateral Land
Land arrangement

Solder resist
c

2.4 Component Layout

To prevent the crack of Thermistors, try to
b a place it on the position that could not easily
be affected by the bending stress of substrate
Unit (mm) while mounting procedures or procedures
Component afterwards.
Size Code
dimensions a b c Placement of the Thermistors near heating
(EIA)
L W T elements also requires the great care to be
Z(0201) 0.6 0.3 0.3 0.2 to 0.3 0.25 to 0.30 0.2 to 0.3 taken in order to avoid stresses from rapid
0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 heating and cooling.
1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8

(1) To minimize mechanical stress caused by the 2. Chip Mounting Consideration

warp or bending of a PC board, please follow (1) When mounting the Thermistors/components
the recommended Thermistors’ layout below. on a PC board, the Thermistor bodies shall
Prohibited layout Recommended layout be free from excessive impact loads such
as mechanical impact or stress due to the
positioning, pushing force and displacement of
vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip
Layout the Thermistors sideways Mounter must be performed regularly.
against the stressing direction (3) If the bottom dead center of the vacuum
nozzle is too low, the Thermistor will crack from
(2) The following layout is for your reference since excessive force during mounting.
mechanical stress near the dividing/breaking The following precautions and recommendations
position of a PC board varies depending on are for your reference in use.
the mounting position of the Thermistors. (a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
E board after correcting the warp of the PC board.
D (b) Set the pushing force of the vacuum nozzle
Perforation during mounting to 1 to 3 N in static load.
C (c) For double surface mounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
A
B board in order to minimize the impact of the
Slit vacuum nozzles. Typical examples are shown
Magnitude of stress A>B=C>D>E in the table below.

(3) The magnitude of mechanical stress applied to

the Thermistors when dividing the circuit board Item Prohibited mounting Recommended mounting
in descending order is as follows: The supporting pin does not necessarily
have to be positioned beneath the
push back < slit < V-groove < perforation. Thermistor.
Crack
Also take into account the layout of the Single surface
Thermistors and the dividing/breaking method. mouting
(4) When the Thermistors are placed near heating Supporting
elements such as heater, etc., cracks from thermal pin

stresses may occur under following situation:

· Soldering the Thermistors directly to heating
elements. Double surface
· Sharing the land with heating elements. mounting
If planning to conduct above-mentioned mounting Separation of Solder Crack
Supporting
pin
and/or placement, please contact us in advance.
(d) Adjust the vacuum nozzles so that their bottom
2.5 Mounting Density and Spaces dead center during mounting is not too low.
Intervals between components should not be too (4) The closing dimensions of the positioning
narrow to prevent the influence from solder bridges chucks shall be controlled. Maintenance
and solder balls. The space between components and replacement of positioning chucks shall
should be carefully determined. be performed regularly to prevent chipping
or cracking of the Thermistors caused by
mechanical impact during positioning due to
Precautions for Assembly worn positioning chucks.
(5) Maximum stroke of the nozzle shall be
1. Storage adjusted so that the maximum bending of PC
(1) The Thermistors shall be stored between 5 to board does not exceed 0.5 mm at 90 mm
40 °C and 20 to 70 % RH, not under severe span. The PC board shall be supported by an
conditions of high temperature and humidity. adequate number of supporting pins.
(2) If stored in a place where humidity, dust, or
corrosive gasses (hydrogen sulfide, sulfurous 3. Selection of Soldering Flux
acid, hydrogen chloride and ammonia, etc.) are Soldering flux may seriously affect the performance
contained, the solderability of terminal electrodes
of the Thermistors. The following shall be confirmed
will be deteriorated.
In addition, storage in a places where the heat before use.
or direct sunlight exposure occur will cause (1) The soldering flux should have a halogen based
mounting problems due to deformation of tapes content of 0.1 wt% (converted to chlorine) or below.
and reels and components and taping/reels Do not use soldering flux with strong acid.
sticking together. (2) When applying water-soluble soldering flux,
(3) Do not store components longer than 6 wash the Thermistors sufficiently because
months. Check the solderability of products the soldering flux residue on the surface of
that have been stored for more than 6 months PC boards may deteriorate the insulation
before use resistance on the Thermistors’ surface.

4. Soldering (b) Preheating:

4.1 Reflow Soldering Conduct sufficient pre-heating, and make
The reflow soldering temperature conditions are sure that the temperature difference
composed of temperature curves of Preheating, between solder and Thermistors’ surface
Temp. rise, Heating, Peak and Gradual cooling. is 150 °C or less.
Large temperature difference inside the Thermistors (c) Temperature of Iron tip: 300 °C max.
caused by rapid heat application to the Thermistors (The required amount of solder shall be
may lead to excessive thermal stresses, contributing melted in advance on the soldering tip.)
to the thermal cracks. The Preheating temperature (d) Gradual cooling:
requires controlling with great care so that tombstone After soldering, the Thermistors shall be
phenomenon may be prevented. cooled gradually at room temperature.

Temperature
Item Period or Speed Recommended profile of Hand soldering (EX)
1Preheating 140 to 180 °C 60 to 120 sec
Preheating temp
2Temp. rise 2 to 5 °C /sec Gradual cooling
to Peak temp.

△T
3Heating 220 °C min. 60 sec max.
4Peak 260 °C max. 10 sec max.
Peak temp. Preheating
5Gradual cooling 1 to 4 °C /sec
to 140 °C
60 to 120 sec 3 sec max.
Recommended profile of Reflow soldering (EX)
4 Peak △T : Allowable temperature difference △T < 150 °C
260
2 Temp. rise
(2) Condition 2 (without preheating)
△T

220
Temperature (°C)

5 Gradual Hand soldering can be performed without

180 cooling
preheating, by following the conditions below:
140 (a) Soldering iron tip shall never directly
touch the ceramic and terminal electrodes
of the Thermistors.
1 Preheating 3 Heating
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
Time iron tip to the terminal electrodes of the
60 to 120 sec 60 sec max. Thermistors for soldering.
△T : Allowable temperature difference △T < 150 °C
Conditions of Hand soldering without preheating
The rapid cooling (forced cooling) during Gradual Item Condition
cooling part should be avoided, because this may
Temperature of Iron tip 270 °C max.
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning Wattage 20 W max.
solvent, make sure that the surface temperatures of Shape of Iron tip f3 mm max.
the devices do not exceed 100 °C. Soldering time with
3 sec max.
Per for ming reflow soldering twice under a soldering iron
the conditions shown in the figure above
[Recommended profile of Reflow soldering (EX)] will 5. Post Soldering Cleaning
not cause any problems. However, pay attention to 5.1 Cleaning solvent
the possible warp and bending of the PC board. Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent.
4.2 Hand Soldering This may deteriorate the electrical characteristics
Hand soldering typically causes significant temperature and reliability of the Thermistors.
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc. 5.2 Cleaning conditions
In order to prevent any defects, the following should Inappropriate cleaning conditions such as insufficient
be observed. cleaning or excessive cleaning may impair the electrical
· The temperature of the soldering tips should be characteristics and reliability of the Thermistors.
controlled with special care. (1) Insufficient cleaning can lead to:
· The direct contact of soldering tips with the (a) The halogen substance found in the residue
Thermistors and/or terminal electrodes should be of the soldering flux may cause the metal of
avoided. terminal electrodes to corrode.
· Dismounted Thermistors shall not be reused. (b) The halogen substance found in the residue
(1) Condition 1 (with preheating) of the soldering flux on the surface of the
(a) Soldering: Thermistors may change resistance values.
Use thread solder (f1 mm or below) which (c) Water-soluble soldering flux may have more
contains flux with low chlorine, developed remarkable tendencies of (a) and (b) above
for precision electronic equipment. compared to those of rosin soldering flux.

(2) Excessive cleaning can lead to: (2) Dividing/Breaking of the PC boards shall be
(a) When using ultrasonic cleaner, make sure that the done carefully at moderate speed by using a jig
output is not too large, so that the substrate will or apparatus to protect the Thermistors on the
not resonate. The resonation causes the cracks boards from mechanical damage.
in Varistors and/or solders, and deteriorates the (3) Examples of PCB dividing/breaking jigs:
strength of the terminal electrodes. Please follow The outline of PC board breaking jig is shown
these conditions for Ultrasonic cleaning: below. When PC boards are broken or divided,
Ultrasonic wave output : 20 W/L max. loading points should be close to the jig to minimize
Ultrasonic wave frequency : 40 kHz max. the extent of the bending
Ultrasonic wave cleaning time : 5 min. max. Also, planes with no parts mounted on should be
5.3 Contamination of Cleaning solvent used as plane of loading, in order to prevent tensile
Cleaning with contaminated cleaning solvent may stress induced by the bending, which may cause
cause the same results as insufficient cleaning cracks of the Thermistors or other parts mounted on
due to the high density of liberated halogen. the PC boards.

Outline of Jig
6. Inspection Process V-groove
The pressure from measuring terminal pins might PC board
bend the PCB when implementing circuit inspection
after mounting Thermistors on PCB, and as a result,
cracking may occur.
(1) Mounted PC boards shall be supported by an PC board
adequate number of supporting pins on the back splitting jig

with bend settings of 90 mm span 0.5 mm max.

(2) Conﬁrm that the measuring pins have the right Prohibited dividing Recommended dividing
tip shape, are equal in height, have the right Loading Loading direction
Loading direction
pressure, and are set in the correct positions. point
V-groove
The following figures are for your reference to PC
board Chip component
avoid bending the PC board. PC
Chip
board
component Loading
Recommended V-groove point
Item Prohibited setting
setting

Check pin Check pin

Bending of 9. Mechanical Impact
PC board (1) The Thermistors shall be free from any excessive
Separated, Crack Supporting pin
mechanical impact.
The Thermistor body is made of ceramics and
7. Protective Coating may be damaged or cracked if dropped.
When the surface of a PC board on which the N eve r use a T h ermisto r w hich has be en
Thermistors have been mounted is coated with resin dropped; their quality may be impaired and
to protect against moisture and dust, it shall be failure rate increased.
confirmed that the protective coating does not affect the (2) When handling PC boards with Thermistors mounted
performance of Varistors. on them, do not allow the Thermistors to collide
(1) Choose the material that does not emit the with another PC board.
decomposition and/or reaction gas. The Gas may When mounted PC boards are handled or stored
affect the composing members of the Varistors. in a stacked state, the corner of a PC board might
(2) Shrinkage and expansion of resin coating when strike Thermistors, and the impact of the strike may
curing may apply stress to the Varistors and may cause damage or cracking and can deteriorate the
lead to occurrence of cracks. withstand voltage and insulation resistance of the
Thermistor.
8. Dividing/Breaking of PC Boards
(1) Please be careful not to stress the substrate with Mounted PCB
Crack
bending/twisting when dividing, after mounting
components including Varistors. Abnormal and
excessive mechanical stress such as bending or Crack
torsion shown below can cause cracking in the
Floor
Thermistors.

Bending Torsion Other

The various precautions described above are typical.
For special mounting conditions, please contact us.

Multilayer NTC Thermistors (Automotive Grade)

Series: ERTJ-M

Features
● Surface Mount Device (0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 150 °C)
● Environmentally-friendly lead-free
● AEC-Q200 qualiﬁed
● RoHS compliant

Recommended Applications
● For car audio system
● For ECUs
● For electric pumps and compressors
● For LED lights
● For batteries
● For temperature detection of various circuits

Explanation of Part Numbers

1 2 3 4 5 6 7 8 9 10 11 12

E R T J 0 E G 1 0 3 F M (Example)

Common Code Size Code Packaging B Value Class Code Nominal Resistance Resistance Tolerance
Product Code Type Code 0 “0402” Style Code A 2701 to 2800 R25 (Ω) Code
ERT NTC J Chip Type (SMD) 1 “0603” E “0402” G 3301 to 3400 The first two digits F ±1% Narrow
Thermistors Multilayer Type Pressed Carrier M 3801 to 3900 are significant figures Tolerance
Taping of resistance and the G ±2% Type
P 4001 to 4100
Punched Carrier third one denotes
Taping R 4201 to 4300 the number of zeros H ±3% Standard
(Pitch : 2 mm) S 4301 to 4400 following them. J ±5% Type
V “0603” T 4401 to 4500
Automotive
Punched Carrier V 4601 to 4700 M
component
Taping
(Pitch : 4 mm)

Construction

No. Name
A Semiconductive Ceramics
3
4 B Internal electrode
5
C Substrate electrode
2 Terminal
1 D Intermediate electrode
electrode
E External electrode

Ratings
Size code (EIA) 0(0402) 1(0603)
Operating Temperature Range –40 to 150 °C
Rated Maximum Power Dissipation✽1 66 mW 100 mW
Dissipation Factor✽2 Approximately 2 mW/°C Approximately 3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).

Part Number List

● 0402(EIA) ● 0603(EIA)
Nominal Resistance B Value B Value Nominal Resistance B Value B Value
Part Number Part Number
at 25 °C at 25/50(K) at 25/85(K) at 25 °C at 25/50(K) at 25/85(K)
ERTJ0EG202GM 2 kΩ±2 % (3380 K) 3410 K±0.5 % ERTJ1VK102□M 1 kΩ 3650 K±1 % (3690 K)
ERTJ0EG202HM 2 kΩ±3 % (3380 K) 3410 K±0.5 % ERTJ1VG103□M 10 kΩ 3380 K±1 % 3435 K±1 %
ERTJ0EG202JM 2 kΩ±5 % (3380 K) 3410 K±0.5 % ERTJ1VP473□M 47 kΩ 4100 K±1 % (4150 K)
ERTJ0EG103□M 10 kΩ 3380 K±1 % 3435 K±1 % ERTJ1VR104□M 100 kΩ 4200 K±1 % (4250 K)
ERTJ0EP473□M 47 kΩ 4050 K±1 % (4100 K) ERTJ1VV104□M 100 kΩ 4700 K±1 % (4750 K)
ERTJ0ER104□M 100 kΩ 4250 K±1 % (4300 K) ERTJ1VT224□M 220 kΩ 4485 K±1 % (4550 K)
ERTJ0ET104□M 100 kΩ 4485 K±1 % (4550 K) □ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
ERTJ0EV104□M 100 kΩ 4700 K±1 % (4750 K)
ERTJ0EV474□M 470 kΩ 4700 K±1 % (4750 K)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)

● Temperature and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□G to ERTJ1VK to ERTJ0EP to ERTJ1VP to ERTJ0ER to ERTJ1VR to ERTJ□□T to ERTJ□□V to
B25/50 (3380 K) 3650 K 4050 K 4100 K 4250 K 4200 K 4485 K 4700 K
B25/85 3435 K (3690 K) (4100 K) (4150 K) (4300 K) (4250 K) (4550 K) (4750 K)
T(°C)
-40 20.52 25.77 33.10 34.56 42.40 40.49 46.47 59.76
-35 15.48 19.10 24.03 24.99 29.96 28.81 32.92 41.10
-30 11.79 14.29 17.63 18.26 21.42 20.72 23.55 28.61
-25 9.069 10.79 13.06 13.48 15.50 15.07 17.00 20.14
-20 7.037 8.221 9.761 10.04 11.33 11.06 12.38 14.33
-15 5.507 6.312 7.362 7.546 8.370 8.198 9.091 10.31
-10 4.344 4.883 5.599 5.720 6.244 6.129 6.729 7.482
-5 3.453 3.808 4.291 4.369 4.699 4.622 5.019 5.481
0 2.764 2.993 3.312 3.362 3.565 3.515 3.772 4.050
5 2.227 2.372 2.574 2.604 2.725 2.694 2.854 3.015
10 1.806 1.892 2.013 2.030 2.098 2.080 2.173 2.262
15 1.474 1.520 1.584 1.593 1.627 1.618 1.666 1.710
20 1.211 1.229 1.255 1.258 1.271 1.267 1.286 1.303
25 1 1 1 1 1 1 1 1
30 0.8309 0.8185 0.8016 0.7994 0.7923 0.7944 0.7829 0.7734
35 0.6941 0.6738 0.6461 0.6426 0.6318 0.6350 0.6168 0.6023
40 0.5828 0.5576 0.5235 0.5194 0.5069 0.5108 0.4888 0.4721
45 0.4916 0.4639 0.4266 0.4222 0.4090 0.4132 0.3896 0.3723
50 0.4165 0.3879 0.3496 0.3451 0.3320 0.3363 0.3123 0.2954
55 0.3543 0.3258 0.2881 0.2837 0.2709 0.2752 0.2516 0.2356
60 0.3027 0.2749 0.2386 0.2344 0.2222 0.2263 0.2037 0.1889
65 0.2595 0.2330 0.1985 0.1946 0.1831 0.1871 0.1658 0.1523
70 0.2233 0.1984 0.1659 0.1623 0.1516 0.1554 0.1357 0.1236
75 0.1929 0.1696 0.1393 0.1359 0.1261 0.1297 0.1117 0.1009
80 0.1672 0.1456 0.1174 0.1143 0.1054 0.1087 0.09236 0.08284
85 0.1451 0.1255 0.09937 0.09658 0.08843 0.09153 0.07675 0.06834
90 0.1261 0.1087 0.08442 0.08189 0.07457 0.07738 0.06404 0.05662
95 0.1097 0.09440 0.07200 0.06969 0.06316 0.06567 0.05366 0.04712
100 0.09563 0.08229 0.06166 0.05957 0.05371 0.05596 0.04518 0.03939
105 0.08357 0.07195 0.05306 0.05117 0.04585 0.04786 0.03825 0.03308
110 0.07317 0.06311 0.04587 0.04415 0.03929 0.04108 0.03255 0.02791
115 0.06421 0.05552 0.03979 0.03823 0.03378 0.03539 0.02781 0.02364
120 0.05650 0.04899 0.03460 0.03319 0.02913 0.03059 0.02382 0.02009
125 0.04986 0.04336 0.03013 0.02886 0.02519 0.02652 0.02043 0.01712
130 0.04413 0.03849 0.02629 0.02513 0.02184 0.02307 0.01755 0.01464
135 0.03916 0.03426 0.02298 0.02193 0.01898 0.02013 0.01511 0.01256
140 0.03483 0.03058 0.02013 0.01918 0.01654 0.01762 0.01304 0.01080
145 0.03105 0.02736 0.01767 0.01680 0.01445 0.01546 0.01127 0.00931
150 0.02774 0.02454 0.01553 0.01476 0.01265 0.01361 0.00976 0.00806

kn (R25/R50) kn (R25/R85) R25=Resistance at 25.0±0.1 °C

B25/50= B25/85= R50=Resistance at 50.0±0.1 °C
1/298.15–1/323.15 1/298.15–1/358.15 R85=Resistance at 85.0±0.1 °C

Specification and Test Method

Size : 0402
1.0 0.5R 0.5

Test Sample Board

Size : 0603

1.0
Test
Sample Unit : mm

Bending Strength There shall be no cracks and other mechanical Bending distance : 2 mm
damage. Bending speed : 1 mm/s
R25 change : within ±5 %
20 distance
Bending

R340

45±2 45±2
Unit : mm

Resistance to There shall be no cracks and other mechanical Solder samples on a testing substrate, then
Vibration damage. apply vibration to them.
Acceleration :5G
R25 change : within ±2 % Vibrational frequency : 10 to 2000 Hz
B Value change : within ±1 % Sweep time : 20 minutes
12 cycles in three directions,
which are perpendicular to each other
Resistance to There shall be no cracks and other mechanical Solder samples on a testing substrate, then apply
Impact damage. impacts to them.
Pulse waveform : Semisinusoidal wave, 11 ms
R25 change : within ±2 % Impact acceleration : 50 G
B Value change : within ±1 % Impact direction : X-X', Y-Y', Z-Z' In 6 directions,
three times each

Specification and Test Method

Item Speciﬁcation Test Method
Resistance to There shall be no cracks and other mechanical Soldering bath method
Soldering Heat damage. Solder temperature : 260 ±5 °C, 270 ±5 °C
Dipping period : 3.0 ±0.5 s, 10.0 ±0.5 s
R25 change : within ±2 % Preheat condition :
B Value change : within ±1 % Step Temp (°C) Period (s)
1 80 to 100 120 to 180
2 150 to 200 120 to 180
Solderability More than 95 % of the soldered area of both Soldering bath method
terminal electrodes shall be covered with fresh Solder temperature : 230 ±5 °C
solder. Dipping period : 4 ±1 s
Solder : Sn-3.0Ag-0.5Cu
Temperature R25 change : within ±2 % Conditions of one cycle
Cycling B Value change : within ±1 % Step 1 : –55±3 °C, 30±3 min.
Step 2 : Room temp., 3 min. max.
Step 3 : 125±5 °C, 30±3 min.
Step 4 : Room temp., 3 min. max.
Number of cycles: 2000 cycles
Humidity R25 change : within ±2 % Temperature : 85 ±2 °C
B Value change : within ±1 % Relative humidity : 85 ±5 %
Test period : 2000 +48/0 h
Biased Humidity R25 change : within ±2 % Temperature : 85 ±2 °C
B Value change : within ±1 % Relative humidity : 85 ±5 %
Applied power : 10 mW(D.C.)
Test period : 2000 +48/0 h
Low Temperature R25 change : within ±2 % Temperature : –40 ±3 °C
Exposure B Value change : within ±1 % Test period : 2000 +48/0 h
High Temperature R25 change : within ±2 % Temperature : 125 ±3 °C
Exposure 1 B Value change : within ±1 % Test period : 2000 +48/0 h
High Temperature R25 change : within ±3 % Temperature : 150 ±3 °C
Exposure 2 B Value change : within ±2 % Test period : 1000 +48/0 h

Dimensions in mm (not to scale)

W (Unit : mm)
Size Code (EIA) L W T L1, L2
0 (0402) 1.0±0.1 0.50±0.05 0.50±0.05 0.25±0.15
T
1 (0603) 1.60±0.15 0.8±0.1 0.8±0.1 0.3±0.2
L1 L2

Packaging Methods
● Standard Packing Quantities ● Reel for Taping
Size Thickness Pitch Quantity
Kind of Taping W1
Code (mm) (mm) (pcs./reel)
E
0 (0402) 0.5 2 10,000
Punched Carrier Taping C
1 (0603) 0.8 4 4,000

B
D

W2
● Pitch 2 mm (Punched Carrier Taping) : Size 0402
A
t1 Feeding hole Chip pocket
fD0
Symbol fA fB C D E W1 W2
E

Dim. 180 0
–3 60.0
+1.0
13.0±0.5 21.0±0.8 2.0±0.5 9.0
+1.0
11.4±1.0
A (mm)
0 0
F
W
B

t2
Chip component P1 P2 P0 Tape running direction ● LeaderPart and Taped End
Symbol A B W F E P1 P2 P0 fD 0 t1 t2
Leader part
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 1.0 Top cover tape
(mm) ±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1 0 max. max.

100 min.
● Pitch 4 mm (Punched Carrier Taping) : Size 0603 Vacant position
400 min.
t1 Feeding hole Chip pocket
fD0
Taped end
E

A
W
F
B

Tape running direction 160 min.

t2 Chip component P1 P2 P0
Vacant position (Unit : mm)

Symbol A B W F E P1 P2 P0 fD 0 t1 t2
Dim. 1.0 1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4
(mm) ±0.1 ±0.1 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 0 max. max.

Minimum Quantity / Packing Unit

Minimum Quantity/ Packing Packing Quantity Carton
Part Number (Size)
Unit in Carton L×W×H (mm)
ERTJ0 (0402) 10,000 200,000 250×200×200
ERTJ1 (0603) 4,000 80,000 250×200×200
Part No., quantity and country of origin are designated on outer packages in English.

Multilayer NTC Thermistors (Automotive Grade)

Series: ERTJ-M
Handling Precautions

Safety Precautions
The Multilayer NTC Thermistors (Automotive Grade), hereafter referred to as Thermistors, is designed for use in
automotive devices. When subjected to severe electrical, environmental, and/or mechanical stress beyond the
specifications, as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be
degraded, or become failure mode, such as short circuit mode and open-circuit mode. If you use under the
condition of short-circuit, heat generation of thermistors will occur by running large current due to application of
voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire.
For products which require higher safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for product of special specification not found in
this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as
death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment

Operating Conditions and Circuit Design [Maximum power dissipation]

the specified “Storage Temperature Range” in the 120

Maximum power dissipation/

delivery specifications. 100

80
1.2 Operating Power 60
The electricity applied to between terminals of
40
Thermistors should be under the specified maximum
20
power dissipation.
0
There are possibilities of breakage and burn-out due −25 0 25 50 75 100 125 150 175
to excessive self-heating of Thermistors, if the power Ambient temperature (°C)
exceeds maximum power dissipation when operating. [Dissipation factor]
Please consider installing protection circuit for your · The constant amount power required to raise the
circuit to improve the safety, in case of abnormal temperature of the Thermistor 1 °C through self
voltage application and so on. heat generation under stable temperatures.
Thermistors’ performance of temperature detection Dissipation factor (mW/°C) = Power consumption
would be deteriorated if self-heating occurs, of Thermistor / Temperature rise of element
even when you use it under the maximum power
dissipation.
Please consider the maximum power dissipation and
dissipation factor.

2. Design of Printed Circuit Board The lead wire of a Solder resist

2.2 Design of Land Pattern Electrode pattern

Portion to be
Recommended Land Dimensions excessively soldered
Solder resist
SMD
Lateral Land
Land arrangement

Solder resist
c

2.4 Component Layout

To prevent the crack of Thermistors, try to
b a place it on the position that could not easily
be affected by the bending stress of substrate
Unit (mm) while mounting procedures or procedures
Component afterwards.
Size Code
dimensions a b c Placement of the Thermistors near heating
(EIA)
L W T elements also requires the great care to be
0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 taken in order to avoid stresses from rapid
1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8 heating and cooling.

(1) To minimize mechanical stress caused by the 2. Chip Mounting Consideration

(3) The magnitude of mechanical stress applied to

stresses may occur under following situation:

4. Soldering (b) Preheating:

Temperature
Item Period or Speed Recommended profile of Hand soldering (EX)
1Preheating 140 to 180 °C 60 to 120 sec
Preheating temp
2Temp. rise 2 to 5 °C /sec Gradual cooling
to Peak temp.

220
Temperature (°C)

5 Gradual Hand soldering can be performed without

with bend settings of 90 mm span 0.5 mm max.

Check pin Check pin

Bending Torsion Other

The various precautions described above are typical.
For special mounting conditions, please contact us.

“PGS” Graphite Sheets

Type: EYG
“PGS (Pyrolytic Graphite Sheet)” is a ther mal
interface material which is very thin, synthetically
made, has high thermal conductivity, and is made
from a higly oriented graphite polymer film. It
is ideal for providing thermal management/heat-
sinking in limited spaces or to provide supplemental
heat-sinking in addition to conventional means.
This material is flexible and can be cut into
customizable shapes.
"SSM(Semi-Sealing Material)" is the product which is
compounding PGS Graphite sheet and High thermal
conductive Elastomer resin. It has a function to absorb
heat by resin and release the heat by utilizing high
thermal conductivity of PGS Graphite sheet. It also
enables taking better attachment to the component
which has different height on the electronic board,
reducing stress to the electronic board.

Features
● Excellent thermal conductivity : 700 to 1950 W/(m·K)
(2 to 5 times as high as copper, 3 to 8 time as high as aluminum)
● Lightweight: Speciﬁc gravity : 0.85 to 2.13 g/cm3
(1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density)
● Flexible and easy to be cut or trimmed. (withstands repeated bending)
● Low thermal resistance
● Low heat resistance with ﬂexible Graphite sheet (SSM)
● Low repulsion and easy to keep the product's shape after attaching (SSM)
● Siloxane Free(SSM)
● High dielectric voltage : 17 kVac/mm (SSM)
● RoHS compliant

Recommended applications
● Smart phones, Mobile phones, DSC, DVC, Tablet PCs, PCs and peripherals, LED Devices
● Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers)
● Optical communications equipment

Explanation of Part Numbers

● PGS only (EYGS✽✽✽✽✽✽)

1 2 3 4 5 6 7 8 9 10

E Y G S 0 9 1 2 1 0
Product Code
Style Dimension PGS thickness✽
S PGS only 0912 90 mm × 115 mm 10 100 μm
1218 115 mm × 180 mm 07 70 μm
1823 180 mm × 230 mm 05 50 μm
04 40 μm
03 25 μm
✽ PGS thickness of 17 μm, 10 μm does not
support as single item.

● Taping (EYGA✽✽✽✽✽✽✽✽)

1 2 3 4 5 6 7 8 9 10 11 12

E Y G A 0 9 1 2 1 0 D M
Product Code
Style Dimension✽✽ PGS thickness Sufﬁx
A Taping 0912 90 mm × 115 mm 10 100 μm A
1218 115 mm × 180 mm 07 70 μm M
05 50 μm F
04 40 μm PA Lamination type
✽ Please refer to
03 25 μm PM Composition
✽✽ Please contact us for other dimensions other
than those above. 02 17 μm DM example.
01 10 μm DF
V
RV

● Thermally conductive elastomer processing (EYGE✽✽✽✽✽✽✽✽)

1 2 3 4 5 6 7 8 9 10 11 12

E Y G E 0 9 1 2 X B 6 D
Product Code

Style Dimension✽✽ PGS thickness Elastomer thickness Tape thickness

Elastomer 0912 90 mm × 115 mm A 100 μm 5 0.5 mm Q PET tape 8 μm
E
processing B 70 μm 6 1.0 mm D PET tape 10 μm
C 50 μm 7 1.5 mm P PET tape 30 μm
SSM type G 40 μm 8 2.0 mm F Acrylic adhesive tape 6 μm
D 25 μm 9 3.0 mm M Acrylic adhesive tape 10 μm
E 17 μm A Acrylic adhesive tape 30 μm
✽✽ Please contact us for other dimensions other
than those above. F 10 μm

Characteristics of PGS Graphite Sheets

100 μm 70 μm 50 μm 40 μm
Thickness
0.10±0.03 mm 0.07±0.015 mm 0.050±0 .015 mm 0.040±0 .012 mm
Density 0.85 g/cm3 1.21 g/cm3 1.70 g/cm3 1.80 g/cm3
Thermal conductivity a-b plane 700 W/(m·K) 1000 W/(m·K) 1300 W/(m·K) 1350 W/(m·K)
Electrical conductivity 10000 S/cm 10000 S/cm 10000 S/cm 10000 S/cm
Extensional strength 20.0 MPa 20.0 MPa 20.0 MPa 25.0 MPa
a-b plane 9.3×10-7 1/K -7
9.3×10 1/K 9.3×10-7 1/K 9.3×10-7 1/K
Expansion coefﬁcient
c axis 3.2×10-5 1/K -5
3.2×10 1/K 3.2×10-5 1/K 3.2×10-5 1/K
Heat resistance✽ 400 °C
Bending(angle 180,R5) 10000 cycles

25 μm 17 μm 10 μm
Thickness
0.025±0 .010 mm 0.017±0 .005 mm 0.010±0 .002 mm
Density 1.90 g/cm3 2.10 g/cm3 2.13 g/cm3
Thermal conductivity a-b plane 1600 W/(m·K) 1850 W/(m·K) 1950 W/(m·K)
Electrical conductivity 20000 S/cm 20000 S/cm 20000 S/cm
Extensional strength 30.0 MPa 40.0 MPa 40.0 MPa
a-b plane 9.3×10-7 1/K 9.3×10-7 1/K 9.3×10-7 1/K
Expansion coefﬁcient
c axis 3.2×10-5 1/K 3.2×10-5 1/K 3.2×10-5 1/K
Heat resistance✽ 400 °C
Bending(angle 180,R5) 10000 cycles
✽ Withstand temperature refers to PGS only.
(Lamination material such as PET tape etc. is not included)
✽✽ Values are for reference, not guaranteed.

Characteristics of SSM (Elastomer)

Thickness 1 mm 2 mm 3 mm
Speciﬁc heat 1.4 J/(g∙C)
Density 1.88 g/cm3
Thermal conductivity 1.6 W/(m·K)✽✽
2
100 kPa 7.53 (C·cm )/W 14.82 (C·cm2)/W 19.48 (C·cm2)/W
Thermal
200 kPa 6.71 (C·cm2)/W 13.17 (C·cm2)/W 16.01 (C·cm2)/W
resistance
300 kPa 5.90 (C·cm2)/W 10.73 (C·cm2)/W 11.38 (C·cm2)/W
100 kPa 4.93 % 4.05 % 4.43 %
Compressibility 200 kPa 9.58 % 8.66 % 14.04 %
300 kPa 18.41 % 22.13 % 40.49 %
14
Resistivity > 10×10 Ω∙cm
Dielectric voltage > 17 kVac/mm
Hardness (Type E) 39
SUS 39 mN/cm
Adhesive
Aluminum 31 mN/cm
force
Glass 38 mN/cm
✽ Characteristics refer to Elastomer resin only.
✽✽ Typical values, not guaranteed.

Comparison of thermal conductivity (a-b plane) Layered structure of PGS

Diamond
1950 W/(m·K)
PGS 10 μm
1850 W/(m·K) 3.354∼3.356
PGS 17 μm
×10-8cm
1600 W/(m·K)

C axis
PGS 25 μm
1350 W/(m·K)
PGS 40 μm
1300 W/(m·K)
PGS 50 μm
PGS 70 μm 1000 W/(m·K)

700 W/(m·K) a-b plane C : 99.9 % above

PGS 100 μm
Thermal conductivity:
Pure copper 2 to 5 times as high as copper,
Speciﬁc gravity:
Aluminum
1/10 to 1/4 that of copper
Magnesium alloy
Stainless steel
Heat-conductive sheet

0 200 400 600 800 1000 1200 1400 1600 1800 2000
Coefﬁcient of thermal conductivity (W/(m·k))

Electric field shield performance

a-b plane(KEC method)
140
130 Effect of shield (dB)=–20 log (Vs/V0)
120
110
Effect of shield (dB)

100
90 Effect of electric ﬁeld shield
80
70
60
50
40
30
Effect of magnetic ﬁeld shield
20
10
0
10 100 1000 10000
Frequency (MHz)

Lamination type/Composition example

● Standard series ( PGS 100, 70, 50, 40, 25, 17, 10 μm)
PGS Only Adhesive Type
Type
S type A-A type A -M type A -F type
Front face – – – –
Rear face – Insulative adhesion type 30 μm Insulative thin adhesion type 10 μm Insulative thin adhesion type 6 μm
PGS PGS PGS PGS
Graphite sheet Graphite sheet Graphite sheet Graphite sheet

Structure

Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive

tape 30 μm tape 10 μm tape 6 μm
Separating paper Separating paper Separating paper
· High Thermal Conductivity · With insulation material · With insulation material on · With insulation material on
High Flexibility on one side one side one side
Features · Low Thermal Resistance · With strong adhesive · Low thermal resistance · Low thermal resistance
· Available up to 400 °C tape for putting chassis comparison with A-A type comparison with A-A type
· Conductive Material · Withstanding Voltage : 2 kV · Withstanding Voltage : 1 kV
Withstand temperature 400 °C 100 °C 100 °C 100 °C
Standard size 115 × 180 mm 90 × 115 mm 90 × 115 mm 90 × 115 mm
Maximum size 180 × 230 mm (25 μm to) 115 × 180 mm 115 × 180 mm 115 × 180 mm
100 Part No. EYGS121810 EYGA091210A EYGA091210M EYGA091210F
μm Thickness 100 μm 130 μm 110 μm 106 μm
70 Part No. EYGS121807 EYGA091207A EYGA091207M EYGA091207F
μm Thickness 70 μm 100 μm 80 μm 76 μm
50 Part No. EYGS121805 EYGA091205A EYGA091205M EYGA091205F
μm Thickness 50 μm 80 μm 60 μm 56 μm
40 Part No. EYGS121804 EYGA091204A EYGA091204M EYGA091204F
μm Thickness 40 μm 70 μm 50 μm 46 μm
25 Part No. EYGS121803 EYGA091203A EYGA091203M EYGA091203F
μm Thickness 25 μm 55 μm 35 μm 31 μm
17 Part No. – EYGA091202A EYGA091202M EYGA091202F
μm Thickness – 47 μm 27 μm 23 μm
10 Part No. – EYGA091201A EYGA091201M EYGA091201F
μm Thickness – 40 μm 20 μm 16 μm

Laminated type (Insulation & Adhesive)

Type
A-PA type A-PM type A-DM type A-DF type
Front face Polyester tape standard type 30 μm Polyester tape standard type 30 μm Polyester tape thin type 10 μm Polyester tape thin type 10 μm
Rear face Insulative adhesion type 30 μm Insulative thin adhesion type 10 μm Insulative thin adhesion type 10 μm Insulative thin adhesion type 6 μm
PGS Polyester(PET) PGS Polyester(PET) PGS Polyester(PET) PGS Polyester(PET)
Graphite sheet tape 30 μm Graphite sheet tape 30 μm Graphite sheet tape 10 μm Graphite sheet tape 10 μm

Structure

Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive

tape 30 μm tape 10 μm tape 10 μm tape 6 μm
Separating paper Separating paper Separating paper Separating paper
· With insulation material on · With insulation material on · With insulation material on · With insulation material on
both side both side both side both side
Features · Withstanding Voltage · Withstanding Voltage · Withstanding Voltage · Withstanding Voltage
PET tape : 4 kV PET tape : 4 kV PET tape : 1 kV PET tape : 1 kV
Adhesive Tape : 2 kV Adhesive Tape : 1 kV Adhesive Tape : 1 kV
Withstand temperature 100 °C 100 °C 100 °C 100 °C
Standard size 90 × 115 mm 90 × 115 mm 90 × 115 mm 90 × 115 mm
Maximum size 115 × 180 mm 115 × 180 mm 115 × 180 mm 115 × 180 mm
100 Part No. EYGA091210PA EYGA091210PM EYGA091210DM EYGA091210DF
μm Thickness 160 μm 140 μm 120 μm 116 μm
70 Part No. EYGA091207PA EYGA091207PM EYGA091207DM EYGA091207DF
μm Thickness 130 μm 110 μm 90 μm 86 μm
50 Part No. EYGA091205PA EYGA091205PM EYGA091205DM EYGA091205DF
μm Thickness 110 μm 90 μm 70 μm 66 μm
40 Part No. EYGA091204PA EYGA091204PM EYGA091204DM EYGA091204DF
μm Thickness 100 μm 80 μm 60 μm 56 μm
25 Part No. EYGA091203PA EYGA091203PM EYGA091203DM EYGA091203DF
μm Thickness 85 μm 65 μm 45 μm 41 μm
17 Part No. EYGA091202PA EYGA091202PM EYGA091202DM EYGA091202DF
μm Thickness 77 μm 57 μm 37 μm 33 μm
10 Part No. EYGA091201PA EYGA091201PM EYGA091201DM EYGA091201DF
μm Thickness 70 μm 50 μm 30 μm 26 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.

Lamination type/Composition example

● High heat resistance series ( PGS 100, 70, 50, 40, 25, 17, 10 μm)
High heat resistance type
Type
A-V type A-RV type
High heat resistance and insulation
Front face – type 13 μm
High heat resistance and insulation High heat resistance and insulation
Rear face adhesion type 18 μm adhesion type 18 μm
PGS PGS Heat-resistance
Graphite sheet Graphite sheet PEEK tape 13 μm

Structure

Heat-resistance Heat-resistance
Acrylic adhesive Acrylic adhesive
tape 18 μm Separating paper tape 18 μm Separating paper

· With high heat resistance and insulation · With high heat resistance and insulation
tape on one side tape on both side
· Withstanding Voltage Adhesive tape · Withstanding Voltage
Features
: 2 kV PEEK tape : 2 kV
Adhesive tape : 2 kV

Withstand temperature 150 °C 150 °C

Standard Size 90 × 115 mm 90 × 115 mm
Maximam size 115 × 180 mm 115 × 180 mm
100 Part No. EYGA091210V EYGA091210RV
μm Thickness 118 μm 131 μm
70 Part No. EYGA091207V EYGA091207RV
μm Thickness 88 μm 101 μm
50 Part No. EYGA091205V EYGA091205RV
μm Thickness 68 μm 81 μm
40 Part No. EYGA091204V EYGA091204RV
μm Thickness 58 μm 71 μm
25 Part No. EYGA091203V EYGA091203RV
μm Thickness 43 μm 56 μm
17 Part No. EYGA091202V EYGA091202RV
μm Thickness 35 μm 48 μm
10 Part No. EYGA091201V EYGA091201RV
μm Thickness 28 μm 41 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.

● Standard series (SSM)

Type E-6 type E-8 type E-9 type
Elastomer thickness 1.0 mm 2.0 mm 3.0 mm

PGS PET tape PGS PET tape PGS PET tape

Graphite Sheet 10 μm Graphite Sheet 10 μm Graphite Sheet 10 μm

Structure
Acrylic Adhesive
tape Acrylic Adhesive Acrylic Adhesive
Elastomer tape Elastomer tape Elastomer
1.0 mm 2.0 mm 3.0 mm

· Soft and low thermal resistance · Soft and low thermal resistance · Soft and low thermal resistance
(Elastomer) (Elastomer) (Elastomer)
Features
· Low repulsion · Low repulsion · Low repulsion
· Withstanding Voltage : 1.7 kV · Withstanding Voltage : 1.7 kV · Withstanding Voltage : 1.7 kV

Withstand temperature 100 °C 100 °C 100 °C

Standard Size 90 × 115 mm 90 × 115 mm 90 × 115 mm

70 Part No. EYGE0912XB6D EYGE0912XB8D EYGE0912XB9D

μm Thickness 1.09 mm 2.09 mm 3.09 mm

25 Part No. EYGE0912XD6D EYGE0912XD8D EYGE0912XD9D

μm Thickness 1.05 mm 2.05 mm 3.05 mm

Minimum order
Item Type Part No. Size Minimum order
EYGS091210 90×115 mm 20
S type
EYGS121810 115×180 mm 10
100 μm
EYGS182310 180×230 mm 10
EYGS091207 90×115 mm 20
S type
EYGS121807 115×180 mm 10
70 μm
EYGS182307 180×230 mm 10
EYGS091205 90×115 mm 20
PGS Graphite Sheet S type
EYGS121805 115×180 mm 10
Only 50 μm
EYGS182305 180×230 mm 10
EYGS091204 90×115 mm 20
S type
EYGS121804 115×180 mm 10
40 μm
EYGS182304 180×230 mm 10
EYGS091203 90×115 mm 20
S type
EYGS121803 115×180 mm 10
25 μm
EYGS182303 180×230 mm 10
A-A type EYGA091207A 90×115 mm 20
70 μm EYGA121807A 115×180 mm 10
A-A type EYGA091203A 90×115 mm 20
25 μm EYGA121803A 115×180 mm 10
A-A type EYGA091202A 90×115 mm 20
PGS 70, 25, 17 μm 17 μm EYGA121802A 115×180 mm 10
Adhesive Type
[Standard series] A-M type EYGA091207M 90×115 mm 20
70 μm EYGA121807M 115×180 mm 10
A-M type EYGA091203M 90×115 mm 20
25 μm EYGA121803M 115×180 mm 10
A-M type EYGA091202M 90×115 mm 20
17 μm EYGA121802M 115×180 mm 10
A-PA type EYGA091207PA 90×115 mm 20
70 μm EYGA121807PA 115×180 mm 10
A-PA type EYGA091203PA 90×115 mm 20
25 μm EYGA121803PA 115×180 mm 10
A-PA type EYGA091202PA 90×115 mm 20
17 μm EYGA121802PA 115×180 mm 10
A-PM type EYGA091207PM 90×115 mm 20
PGS 70, 25, 17 μm
70 μm EYGA121807PM 115×180 mm 10
Laminated Type A-PM type EYGA091203PM 90×115 mm 20
(Insulation & Adhesive) 25 μm EYGA121803PM 115×180 mm 10
[Standard series] EYGA091202PM 90×115 mm 20
A-PM type
17 μm EYGA121802PM 115×180 mm 10
A-DM type EYGA091207DM 90×115 mm 20
70 μm EYGA121807DM 115×180 mm 10
A-DM type EYGA091203DM 90×115 mm 20
25 μm EYGA121803DM 115×180 mm 10
A-DM type EYGA091202DM 90×115 mm 20
17 μm EYGA121802DM 115×180 mm 10
✽ Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
✽✽ PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
✽✽✽ The above-listed part number is sample part number for testing.
✽✽✽✽ Please contact us about your request of custom part number which will be arranged separately.
✽✽✽✽✽ Please contact us if quantity is below Minimum Order Quantity.

Minimum order
Item Type Part No. Size Minimum order
A-V type EYGA091207V 90×115 mm 20
70 μm EYGA121807V 115×180 mm 10
A-V type EYGA091203V 90×115 mm 20
25 μm EYGA121803V 115×180 mm 10
A-V type EYGA091202V 90×115 mm 20
PGS 70, 25, 17 μm 17 μm EYGA121802V 115×180 mm 10
[High heat resistance type] A-RV type EYGA091207RV 90×115 mm 20
70 μm EYGA121807RV 115×180 mm 10
A-RV type EYGA091203RV 90×115 mm 20
25 μm EYGA121803RV 115×180 mm 10
A-RV type EYGA091202RV 90×115 mm 20
17 μm EYGA121802RV 115×180 mm 10
E-9 type
Elastomer 3.0 mm, EYGE0912XB9D 90×115 mm 5
PGS 70 μm
E-9 type
Elastomer 3.0 mm, EYGE0912XD9D 90×115 mm 5
PGS 25 μm
SSM E-8 type
Elastomer 2.0 mm, EYGE0912XB8D 90×115 mm 5
Elastomer PGS 70 μm
3.0, 2.0, 1.0 mm E-8 type
PGS 70, 25 μm Elastomer 2.0 mm, EYGE0912XD8D 90×115 mm 5
PGS 25 μm
E-6 type
Elastomer 1.0 mm, EYGE0912XB6D 90×115 mm 5
PGS 70 μm
E-6 type
Elastomer 1.0 mm, EYGE0912XD6D 90×115 mm 5
PGS 25 μm
✽ Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
✽✽ PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
✽✽✽ The above-listed part number is sample part number for testing.
✽✽✽✽ Please contact us about your request of custom part number which will be arranged separately.
✽✽✽✽✽ Please contact us if quantity is below Minimum Order Quantity.

“PGS” (Pyrolytic Graphite Sheet) Heat sink sheet

Handling Precautions
Safety Precautions
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage
to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

PGS (Pyrolytic Graphite Sheet) Heat sink sheet (hereafter referred to as PGS) may result in accidents or trouble
when subjected to severe conditions of electrical, environmental and /or mechanical stress beyond the specified
“Rating” and specified “Conditions” found in the Specifications. Please follow the recommendations in “Safety
Precautions” and “Application Notes”. Contact our engineering staff or the factory with any questions.

1. Safety Precautions
1.1 The PGS shall be used within the specified operating temperature range.
1.2 The PGS is soft, do not rub or touch it with rough materials to avoid scratching it.
1.3 Lines or folds in the PGS may affect thermal conductivity.
1.4 The PGS shall not be used with acid.
The PGS shall not be used in contact with a soldering iron at 400 °C or more
1.5 The PGS shall not be exposed to salt water or direct sunlight during use. The PGS shall not be used in corrosive
gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.).
1.6 Our PGS has been developed for general industry applications. Prior to using the PGS for special applications
such as medical, work please contact our engineering staff or the factory.
1.7 Never touch a PGS during use because it may be extremely hot.
1.8 Since SSM Elastomer resin is soft, please do not store the parts under a load.
1.9 Please do not use the parts in the condition of jamming by contaminants such as metals in SSM Elastomer side.

2. Application notes
2.1 Use protective materials when handling and/or applying the PGS, do not use items with sharp edges as they
might tear or puncture the PGS.
2.2 The PGS does not work properly if overheated.
2.3 Thermal conductivity is dependant on the way it is used.
Test the adaptability of PGS to your application before use.
2.4 The PGS has conductivity.
If required, the PGS should be provided insulation.
2.5 Long term storage
• The PGS shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydrogen
sulﬁde, sulfurous acid, chlorine, ammonia etc.).
• The PGS shall not be stored near acid.
• Please store SSM packed at room temperature and humidity while not in use.
2.6 Once applying to the adherent which has dents, SSM Elastomer resin keeps its shape so it cannot be re-ap-
plied to different portion.

<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.

“NASBIS” Insulating Sheet

Type: EYGY/EYGN
“NASBIS” is a heat insulating sheet, which is composed of silica
aerogel and fiber sheet, created through impregnation process. Pore
size of silica aerogel is 10 to 60nm, which means it has smaller
space than the mean free path of the air, 68nm. Air molecules do not
collide against each other inside the pores, and thus the component
shows excellecnt heat insulation performace.

Furthermore, combining NASBIS and PGS Graphite Sheet enables

controlling the direction of heat. Composite type provides greater
heat insulating performance.

Features
● Low thermal conductivity : 0.020 W/m · K typ.
● Created thin-ﬁlm sheet ; Thickness : 100 μm to 1000 μm
● Various proposals are available when combined with PGS Graphite sheet
● RoHS compliant

Recommended applications
● Smartphone, Wearable equipment, Digital Still Camera, Notebook PCs, Tablet PCs

Explanation of Part Numbers

● NASBIS Pouch Type (EYGY✽✽✽✽✽✽✽✽)

1 2 3 4 5 6 7 8 9 10 11 12

E Y G Y 0 9 1 2 Q N 6 P

Product Code Dimension Type Thickness of PGS Thickness of NASBIS PET + Adhesive
NASBIS 0912 90 mm × 115 mm Q Normal type N PGS free type 3 1000 μm S PET(10 μm)+Adhesive(10 μm)
4 500 μm P PET(30 μm)+Adhesive(10 μm)
PET tape
6 100 μm
NASBIS
Adhesive tape
Separator
✽ Please consult the other configurations separately.

● NASBIS and PGS Composit Type (EYGN✽✽✽✽✽✽✽✽)

1 2 3 4 5 6 7 8 9 10 11 12

E Y G N 0 9 1 2 Q D 6 P

Product Code Dimension Type Thickness of PGS Thickness of NASBIS PET + Adhesive
NASBIS 0912 90 mm × 115 mm Q Normal type B 70 μm 3 1000 μm S PET(10 μm)+Adhesive(10 μm)
D 25 μm 4 500 μm P PET(30 μm)+Adhesive(10 μm)
PET tape 6 100 μm
NASBIS
Adhesive tape
6 μm
PGS ✽ Please consult the other configurations separately.
Adhesive tape
Separator
Normal type

Characteristics of NASBIS
Thickness 100 μm 500 μm 1000 μm
Thermal conductivity (W/(m·K)) 0.018 to 0.026 0.018 to 0.026 0.018 to 0.026
Operating temperature limit (°C) −20 to 100 −20 to 100 −20 to 100
Size / Laminate pouch (mm) 90 × 115 90 × 115 90 × 115
Heatproof temperature(°C) 100 100 100
Typical values, not guaranteed.

Appearance of silica aerogel and its nanostructure

Pore diameter
10 to 60 nm

Diameter of silica
about 10 nm

Composition example
● NASBIS Pouch Type
Type Y - S type Y - P type

PET 10 μm PET 30 μm
Structure NASBIS✽ NASBIS✽
Adhesive 10 μm Adhesive 10 μm

Heatproof temperature 100 °C 100 °C

✽ Standard Part No. EYGY0912QN6S EYGY0912QN6P
100 μm
Thickness (μm) 120 140
✽ Standard Part No. EYGY0912QN4S EYGY0912QN4P
500 μm
Thickness (μm) 520 540
✽ Standard Part No. EYGY0912QN3S EYGY0912QN3P
1000 μm
Thickness (μm) 1020 1040

● NASBIS and PGS Composit Type

Normal type

Type N - S type N - S type N - P type N - P type

PET 10 μm PET 10 μm PET 30 μm PET 30 μm

NASBIS✽ NASBIS✽ NASBIS✽ NASBIS✽
Structure Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm
PGS 70 μm PGS 25 μm PGS 70 μm PGS 25 μm
Adhesive 10 μm Adhesive 10 μm Adhesive 10 μm Adhesive 10 μm

Heatproof temperature 100 °C 100 °C 100 °C 100 °C

✽ Standard Part No. EYGN0912QB6S EYGN0912QD6S EYGN0912QB6P EYGN0912QD6P
100 μm
Thickness (μm) 196 151 216 171
✽ Standard Part No. EYGN0912QB4S EYGN0912QD4S EYGN0912QB4P EYGN0912QD4P
500 μm
Thickness (μm) 596 551 616 571
✽ Standard Part No. EYGN0912QB3S EYGN0912QD3S EYGN0912QB3P EYGN0912QD3P
1000 μm
Thickness (μm) 1096 1051 1116 1071

✽✽ Part numbers listed above are all standard samples for evaluation and selection.
Above is not for mass production.
Customized service available for mass production spec.

■ Minimum order 10 pcs.

“NASBIS” (NAno Silica Baloon InSulator) Insulating Sheet

Our products may result in accidents or trouble when subjected to severe conditions of electrical, environmental
and /or mechanical stress beyond the specified “Rating” and specified “Conditions” found in the Specifications.
Please follow the recommendations in “Safety Precautions” and “Application Notes”. Contact our engineering
staff or the factory with any questions.

1. Safety Precautions
1.1 Our products shall be used within the specified operating temperature range.
1.2 Our products are destroyed easily, so don't scratch or rub with hard materials or touch on laminate surfaces.
Please note about the damage due to use the sharp-edged tool (metal tweezers) when you use our products.
1.3 Please do not strongly bent or cut.
1.4 Lines or folds in our products may affect thermal conductivity.
1.5 Our products shall not be used with acid, alkali.
Our products shall not be used in contact with a soldering iron at 400 °C or more
1.6 Our products shall not be exposed to salt water or direct sunlight during use. Our products shall not be used
in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.).
1.7 Our products has been developed for general industry applications. Prior to using our products for special applications
such as medical, work please contact our engineering staff or the factory.
1.8 Never touch our products during use because it may be extremely hot.
1.9 Please do not store the parts under a load.
1.10 Please do not use the parts at the status of hard foreign materials stuck such as metals.

2. Application notes
2.1 Use protective materials when handling and/or applying our products, do not use items with sharp edges as
they might tear or puncture our products
2.2 Our products does not work properly if overheated.
2.3 Thermal conductivity is dependant on the way it is used.
Test the adaptability of our products to your application before use.
2.4 Long term storage
• Please stored at a temperature of between 80 degrees -20 degrees.
• Our products shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydro-
gen sulﬁde, sulfurous acid, chlorine, ammonia etc.).
• Our products shall not be stored near acid, alkali.

<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016
– 38 –
“Graphite-PAD” high thermal conductivity in z-direction

“Graphite-PAD” high thermal conductivity

in z-direction
Type: EYGT
Graphite-PAD is a thermal interface material (TIM) that compatibly
obtained excellent thermal conductivity in thickness direction (Z-axis
direction) and high flexibility (deformable with a low load). The
properties are greater than that of existing TIMs. The product is
created by filling PGS Graphite Sheet into silicon resin.

Features
● High thermal conductivity : 13 W/m ∙ K
● Excellent compressibility : 50 % (t=2 mm, Pressure 300 kPa)
● Thermal resistance: ﬁt into uneven parts and provide excellent thermal resistance with a low load
● High reliability : correspond to −40 to 150 °C and maintains long-term reliability
● Thickness range : 0.5/1.0/1.5/2.0/2.5/3.0 mm
● RoHS compliant

Recommended applications
Cooling of heat generating components, such as electronic devices, semiconductor memory device, etc.
● General-purpose inverter, medical equipment, and DSC
● Car-mounted camera, motor control unit, automotive lighting (LED), car navigation,
luminous source of laser HUD
● Base station, IGBT module

Explanation of Part Numbers

● Graphite-PAD (EYGT✽✽✽✽✽✽✽✽)
1 2 3 4 5 6 7 8 9 10 11 12

E Y G T 3 5 3 5 A 2 0 A

Product Code Dimension Type Thickness of PAD Ex. code

Graphite-PAD 3535 35 mm × 35 mm A Material code 30 3.0 mm
7070 70 mm × 70 mm 25 2.5 mm
20 2.0 mm
15 1.5 mm
10 1.0 mm
05 0.5 mm

✽ Please confirm other condition separately.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Oct. 2017
– 39 –
“Graphite-PAD” high thermal conductivity in z-direction

Typical characteristics
Test
Items Condition Data
equipment/method
Thickness (mm) 0.5 1.0 1.5 2.0 2.5 3.0
Thermal resistance (K·cm2/W) TIM Tester 100 kPa 0.96 1.34 1.56 1.93 2.10 2.36
Compressibility (%) TIM Tester 100 kPa (50 °C) 5.78 10.29 17.46 17.8 17.6 17.9
Thermal conductivity of
Graphite-PAD with a unit (W/m·K) TIM Tester 100 kPa 5.08 7.02 7.80 8.60 9.66 10.10
(including contact resistance)
Thermal conductivity of the
(ASTM D5470) 50 kPa 13
Graphite-PAD (W/m·K)
Hardness (ASTM D2240) TYPE E 25
Adhesive Adhesive on both faces
Volume resistivity (Ω·cm) (ASTM D257) 4×105
Operating temperature range (°C) −40 to 150
Siloxane Σ (D4-D10) < 70 ppm

Structure

Embossed separator
Graphite-PAD

Separator

Silicone resin Filler

Thermal resistance and Compressibility

Thickness 0.5 mm Thickness 2.0 mm Thickness 0.5 mm Thickness 2.0 mm

Thickness 1.0 mm Thickness 3.0 mm Thickness 1.0 mm Thickness 3.0 mm
Thickness 1.5 mm Thickness 1.5 mm
Thermal resistance (K∙cm2/W)

3.0 70
60
Compressibility (%)

2.5
2.0 50
40
1.5
30
1.0
20
0.5 10
0 0
0 100 200 300 400 0 100 200 300 400
Pressure (kPa) Pressure (kPa)

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Oct. 2017
– 40 –
“Graphite-PAD” high thermal conductivity in z-direction

Composition example

Embossed separator

Structure Graphite-PAD

Separator

Operating temperature range −40 °C to 150 °C

Standard dimension 35 × 35 mm 70 × 70 mm
Standard Part No. EYGT3535A05A EYGT7070A05A
0.5 mm
Thickness 0.5 mm 0.5 mm
Standard Part No. EYGT3535A10A EYGT7070A10A
1.0 mm
Thickness 1.0 mm 1.0 mm
Standard Part No. EYGT3535A15A EYGT7070A15A
1.5 mm
Thickness 1.5 mm 1.5 mm
Standard Part No. EYGT3535A20A EYGT7070A20A
2.0 mm
Thickness 2.0 mm 2.0 mm
Standard Part No. EYGT3535A25A EYGT7070A25A
2.5 mm
Thickness 2.5 mm 2.5 mm
Standard Part No. EYGT3535A30A EYGT7070A30A
3.0 mm
Thickness 3.0 mm 3.0 mm
✽ Part numbers listed above are all standard samples for your consideration.
✽✽ Contact us for custom-made samples.
We can make samples in various forms and/or dimensions other than standard samples.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Oct. 2017
– 41 –
“Graphite-PAD” high thermal conductivity in z-direction

“'Graphite-PAD” high thermal conductivity in z-direction

Graphite-PAD may result in accidents or trouble when subjected to severe conditions of electrical, environmental
and /or mechanical stress beyond the specified “Rating” and specified “Conditions” found in the Specifications.
Please follow the recommendations in “Safety Precautions” and “Application Notes”. Contact our engineering
staff or the factory with any questions.

1. Safety Precautions
1.1 The Graphite-PAD shall be used within the specified operating temperature range.
1.2 The Graphite-PAD is soft, do not rub or touch it with rough materials to avoid scratching it.
1.3 Lines or folds in the Graphite-PAD may affect thermal conductivity.
1.4 The Graphite-PAD shall not be used with acid.
The Graphite-PAD shall not be used in contact with a soldering iron at 150 °C or more.
1.5 The Graphite-PAD shall not be exposed to salt water or direct sunlight during use. The Graphite-PAD shall not
be used in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.).
1.6 Our Graphite-PAD has been developed for general industry applications. Prior to using the Graphite-PAD for
special applications such as medical, work please contact our engineering staff or the factory.
1.7 Never touch a Graphite-PAD during use because it may be extremely hot.

2. Application notes
2.1 Do not use items with sharp edges as they might tear or puncture the Graphite-PAD.
2.2 The Graphite-PAD does not work properly if overheated.
2.3 Thermal conductivity is dependant on the way it is used.
Test the adaptability of Graphite-PAD to your application before use.
2.4 The Graphite-PAD has conductivity. Use the product at a position/place where you do not need any insulation.
2.5 Long term storage
• The Graphite-PAD shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases
(hydrogen sulﬁde sulfurous acid, chlorine, ammonia etc.).
• The Graphite-PAD shall not be stored near acid.

<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Aug. 2016
– 42 –
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

“GraphiteTIM(Compressible Type)” PGS

with low thermal resistance
Type: EYGS
GraphiteTIM(Compressible Type) is a graphite sheet that is dedicated for
use as a thermal interface material.
The GraphiteTIM(Compressible Type) has very high compressibility
compared to standard PGS, which enables reducing the thermal
resistance by following gap, warpage, and distortion of targets/substrates.
Excellent heat resistance and reliability of the GraphiteTIM help obtaining
longer service life and higher performance of various components, such
as power modules.
The GraphiteTIM(Compressible Type) is cost-saving, because it may
allow you to reduce your existing processes. Unlike grease, there is no
necessity for printing process , since it is a sheet-type product.
There are no problems that are found in grease and phase change
materials in the GraphiteTIM, which makes it excellent TIM.

Features
● Thermal resistance : 0.2K∙cm2/W (600 kPa)
To draw a good thermal resistance from sheet, pressure the GraphiteTIM.
A close adherence would make the product ﬁt into the uneven part and
enhance the performance.
● Thermal conductivity : X-Y direction 400W/m∙K, Z direction (28W/m∙K)
● Compressibility : 40 % (600k Pa)
● High and long term reliability : operating temperature range –55 to 400 °C After pressure
● RoHs compliant

Recommended applications
For cooling/heat transfer of electronic devices that generates heat, Install in IGBT module
such as power modules. IGBT module
● Inverters and converters
● Car-mounted camera, motor control unit, automotive LED, GraphiteTIM

luminous source of laser HUD, medical equipment

● Base station, Server Heatsink

Explanation of Part Numbers

● GraphiteTIM(EYGS✽✽✽✽ZL✽✽)

1 2 3 4 5 6 7 8 9 10 11 12

E Y G S 0 9 1 8 Z L X 2
Sufﬁx

Product Code Style Dimension Thickness of GraphiteTIM

PGS Graphite sheet S PGS only 0909 90 mm × 90 mm ZL 200 μm
0918 90 mm × 180 mm
1818 180 mm × 180 mm
✽ Please contact us for custom-made products.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 05 Sep. 2018
– 43 –
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

Typical characteristics
Items Test method Condition Data
Thickness (µm) 200
Thermal resistance (K·cm2/W) TIM Tester 600 kPa 0.2
Compressibility (%) TIM Tester 600 kPa 40
X-Y 400 (300 to 600)
Thermal conductivity (W/m·K) Laser PIT
Z (28)
Flame resistance UL-94V V-0
Operating temperature range (°C) −55 to 400
Typical values, not guaranteed.

Thermal resistance and compressibility

2.0 60
1.8
Thermal resistance (K∙cm2/W)

50
1.6

Compressibility (%)
1.4
40
1.2
1.0 30
0.8
20
0.6
0.4
10
0.2
0 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600 700
Pressure (kPa) Pressure (kPa)

Lamination type/Composition example

● GraphiteTIM(Compressible Type) standard form
Sheet only
Type
S Type
Process for IGBT mounting −
b

Front a
Structure

Side c

Operating
−55 to 400 °C
Temperature Range
Thickness: c 200 μm
90 × 90 mm EYGS0909ZLX2
Standard
90 ×180 mm EYGS0918ZLX2
Part No.
180 ×180 mm EYGS1818ZLX2
✽ Part numbers listed above are all standard samples for your consideration.
✽✽ Contact us for custom-made samples.
We can make samples in various forms and/or dimensions other than standard samples.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 05 Sep. 2018
– 44 –
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

● PGS in IGBT forms

Sheet only
Type
S Type
Process for IGBT mounting Lamination

b
e

a d
Front
Structure
✽ This shape is an example, please
contact us for detailed shape of each
part no.

Side c

Operating
−55 to 400 °C
Temperature Range
Thickness: c 200 µm

a : Lateral size b : Longitudinal Hole d : Lateral e : Longitudinal

Standard Hole
No. size diameter hole pitch hole pitch
Part No. number
(mm) (mm) (0mm) (mm) (mm)
1 EYGS1431ZLAA 140 308 12 6 126 290
2 EYGS0925ZLWA 85 246 14 6 73 234
3 EYGS1419ZLWB 136 186 8 7.5 124 171
4 EYGS0917ZLWC 85 168 10 6 73 156
5 EYGS1316ZLAC 125 163 8 6.1 110 150
6 EYGS1216ZLWD 120 160 8 6 110 150
7 EYGS1116ZLMA 108.8 158 8 6 92.75 144
8 EYGS1315ZLGA 129.5 150 8 7 118.5 137.5
9 EYGS1314ZLWE 126 136 6 7.5 114 124
10 EYGS1014ZLAD 97.8 138 4 6.8 86 127
11 EYGS0714ZLAE 70 138 4 5.7 57 128
12 EYGS0714ZLAF 69 136 4 7.2 57 124
13 EYGS1113ZLMB 106 132 4 5.7 95 121
14 EYGS1313ZLGB 128 128 4 6.7 110 110
15 EYGS0713ZLAG 66 126 4 5.7 50 116
16 EYGS0813ZLMD 71 123 2 4.7 Center 116
17 EYGS1212ZLGC 120 120 4 5.7 110 110
18 EYGS0912ZLGD 88 120 4 5.7 78 110
19 EYGS0612ZLWF 60 120 4 5.7 50 110
20 EYGS0512ZLGE 53 118 2 5.7 Center 106
21 EYGS0811ZLGH 80 113 4 5.7 70 103
22 EYGS0811ZLWG 78 108 4 6.7 62 93
23 EYGS0611ZLWH 60 106 4 6.7 48 93
24 EYGS0411ZLWJ 43 105.5 2 5.7 Center 93
25 EYGS0610ZLAH 59.4 104.4 4 6.7 48 93
26 EYGS0410ZLAJ 43 102.8 2 5.7 Center 93
27 EYGS1010ZLME 98 98 4 6.7 87 87

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 05 Sep. 2018
– 45 –
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

a : Lateral size b : Longitudinal Hole d : Lateral e : Longitudinal

Standard Hole
No. size diameter hole pitch hole pitch
Part No. number
(mm) (mm) (0mm) (mm) (mm)
28 EYGS0409ZLGJ 44 93 2 6.7 Center 80
29 EYGS0509ZLGK 46 92 2 6.7 Center 80
30 EYGS0309ZLMF 32 92 2 6.7 Center 80
31 EYGS0409ZLMG 41 88 2 5.7 Center 80
32 EYGS0309ZLAK 29.5 89.5 2 6.6 Center 80
33 EYGS0509ZLMH 51 86 2 4.7 – 80
34 EYGS0508ZLMJ 46.2 83 2 4.7 – 77
35 EYGS0608ZLMK 55 78 2 4.5 Center 40
36 EYGS0607ZLGL 58 69.7 4 5.7 50 62
37 EYGS0507ZLML 45.3 66 2 4.7 – 60
38 EYGS0407ZLAL 40 65.5 1 7.7 Center Center
39 EYGS0506ZLMM 48 55 1 4.5 Center Center
40 EYGS0404ZLMP 36 38 1 4.5 Center Center
41 EYGS1018ZLSA 104.5 182.5 8 7 93 171
42 EYGS1516ZLSB 148 158 8 5 137 150
43 EYGS1116ZLSC 112 158 8 5 101 150
44 EYGS0715ZLSD 67 153 4 5.6 57 143
45 EYGS0613ZLSE 61 127.5 4 5.6 50 116
46 EYGS0612ZLSF 63.3 124 4 5.6 50 110
47 EYGS0612ZLSG 61.5 124 4 5.6 50 110
48 EYGS1012ZLSH 104.5 121 4 6.7 93 109.5
49 EYGS0410ZLSJ 43 103 2 5.7 Center 93
50 EYGS0609ZLSK 61.5 91 4 5.6 50 77
51 EYGS0606ZLSL 58 61.5 2 5.6 44 50
52 EYGS0305ZLSM 27 51 1 4.6 Center Center
53 EYGS0204ZLSN 24 36.5 1 4.6 Center Center
54 EYGS0303ZLSP 29 32 1 4.5 Center Center
55 EYGS0911ZLDA 92 109 4 6 78 93
56 EYGS1014ZLDB 98 138 4 6.7 86 127

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 05 Sep. 2018
– 46 –
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

“GraphiteTIM (Compressible Type)” PGS with low thermal resistance

GraphiteTIM (Compressible Type) may result in accidents or trouble when subjected to severe conditions of
electrical, environmental and /or mechanical stress beyond the specified “Rating” and specified “Conditions”
found in the Specifications. Please follow the recommendations in “Safety Precautions” and “Application Notes”.
Contact our engineering staff or the factory with any questions.

1. Safety Precautions
1.1 The GraphiteTIM (Compressible Type) shall be used within the specified operating temperature range.
1.2 The GraphiteTIM (Compressible Type) is soft and liable to be scratched, do not rub or touch it with rough materials
to avoid scratching it.
1.3 Lines or folds in the GraphiteTIM (Compressible Type) may affect thermal conductivity.
1.4 The GraphiteTIM (Compressible Type) shall not be used with acid.
The GraphiteTIM (Compressible Type) shall not be used in contact with a soldering iron at 400 °C or more.
1.5 The GraphiteTIM (Compressible Type) shall not be exposed to salt water or direct sunlight during use. The GraphiteTIM
(Compressible Type) shall not be used in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.).
1.6 Our GraphiteTIM (Compressible Type) has been developed for general industry applications. Prior to using the GraphiteTIM
(Compressible Type) for special applications such as medical, work please contact our engineering staff or the factory.
1.7 Never touch a GraphiteTIM (Compressible Type) during use because it may be extremely hot.

2. Application notes
2.1 Do not use items with sharp edges as they might tear or puncture the GraphiteTIM (Compressible Type).
2.2 Force applied in peeling direction can cause delamination of the GraphiteTIM (Compressible Type), so give a care-
ful consideration when designing a product.
2.3 The GraphiteTIM (Compressible Type) does not work properly if overheated.
2.4 Thermal resistance and thermal conductivity is dependant on the way it is used.
Test the adaptability of GraphiteTIM (Compressible Type) to your application before use.
2.5 The GraphiteTIM (Compressible Type) has conductivity. Use the product at a position/place where you do not
need any insulation.
2.6 Long term storage
• The GraphiteTIM (Compressible Type) shall not be stored under severe conditions of salt water, direct sunlight or
corrosive gases
(hydrogen sulﬁde sulfurous acid, chlorine, ammonia etc.).
• The GraphiteTIM (Compressible Type) shall not be stored near acid.

<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Sep. 2018
– 47 –
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$SU
CAUTION AND WARNING
1. The electronic components contained in this catalog are designed and produced for use in home electric appliances, office equipment, information equipment,
communications equipment, and other general purpose electronic devices.
Before use of any of these components for equipment that requires a high degree of safety, such as medical instruments, aerospace equipment, disaster-prevention
equipment, security equipment, vehicles (automobile, train, vessel),
please be sure to contact our sales representative.
2. When applying one of these components for equipment requiring a high degree of safety, no matter what sort of application it might be, be sure to install a protective
circuit or redundancy arrangement to enhance the safety of your equipment. In addition, please carry out the safety test on your own responsibility.
3. When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance.
4. Technical information contained in this catalog is intended to convey examples of typical performances and/or applications and is not intended to make any
warranty with respect to the intellectual property rights or any other related rights of our company or any third parties nor grant any license under such rights.
5. In order to export products in this catalog, the exporter may be subject to the export license requirement under the Foreign Exchange and Foreign Trade Law of
Japan.
6. No ozone-depleting substances (ODSs) under the Montreal Protocol are used in the manufacturing processes of Industrial Solutions Company, Panasonic Corporation.
7. The information contained on this material may not be reprinted or reproduced whether wholly or in part, without the prior written permission of Panasonic Corporation.

Safety Precautions
● When using our products, no matter what sort of equipment they might be used for, be sure to confirm the applications
and environmental conditions with our specifications in advance.

● Please contact ● Factory

Device Solutions Business Division

Industrial Solutions Company
Panasonic Corporation
1006 Kadoma, Kadoma City, Osaka 571-8506,
JAPAN

The information in this catalog is valid as of April. 2019.

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