SIM7600E-H-R

Hardware Design
LTE Module

SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633, Jinzhong Road
Changning District, Shanghai P.R. China
Tel: 86-21-31575100
[email protected]
 SIM7600E-H-R Hardware Design V1.01

Document Title: SIM7600E-H-R Hardware Design

Version: 1.01
Date: 2020-04-24
Status: Released

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.
THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO
SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH
FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE
CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED
BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE
CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED
HEREIN ARE SUBJECT TO CHANGE.

COPYRIGHT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY

OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT,
ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE
PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY
TECHNICAL INFORMATION ， INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A
PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO
CHANGE WITHOUT NOTICE AT ANY TIME.

SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633 Jinzhong Road, Changning District, Shanghai P.R.China
Tel: +86 21 31575100
Email: [email protected]

For more information, please visit:

https://www.simcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ or email to: [email protected]

Copyright © 2020 SIMCom Wireless Solutions Limited All Rights Reserved.

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 SIM7600E-H-R Hardware Design V1.01

Version History
Date Version Description of change Author
2019-11-15 1.00 Original Ma Hong gang
2020-04-24 V1.01 Update document format Wang Ya ling

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 SIM7600E-H-R Hardware Design V1.01

Contents

Contents.......................................................................................................................................................................... 4

Table Index...................................................................................................................................................................... 6

Figure Index....................................................................................................................................................................8

1. Introduction........................................................................................................................................................10
1.1 Product Outline................................................................................................................................................ 10
1.2 Hardware Interface Overview........................................................................................................................10
1.3 Hardware Block Diagram............................................................................................................................... 11
1.4 Functional Overview....................................................................................................................................... 12

2. Package Information........................................................................................................................................14
2.1 Pin Assignment Overview.............................................................................................................................. 14
2.2 Pin Description.................................................................................................................................................16
2.3 Mechanical Information.................................................................................................................................. 21
2.4 Footprint Recommendation........................................................................................................................... 22

3. Interface Application....................................................................................................................................... 23
3.1 Power Supply...................................................................................................................................................23
3.1.1 Power Supply Design Guide.................................................................................................................. 24
3.1.2 Recommended Power Supply Circuit...................................................................................................25
3.1.3 Voltage Monitor.........................................................................................................................................26
3.2 Power on/Power off/Reset Function............................................................................................................ 26
3.2.1 Power on....................................................................................................................................................26
3.2.2 Power off....................................................................................................................................................27
3.2.3 Reset Function..........................................................................................................................................29
3.3 UART Interface................................................................................................................................................ 29
3.3.1 UART Design Guide................................................................................................................................ 30
3.3.2 RI and DTR Behavior.............................................................................................................................. 32
3.4 USB Interface...................................................................................................................................................32
3.4.1. USB diagram......................................................................................................................................... 33
3.4.2. USB_BOOT........................................................................................................................................... 33
3.4.3. USB_ID...................................................................................................................................................34
3.5 HSIC interface..................................................................................................................................................35
3.6 SGMII Interface................................................................................................................................................36
3.6.1 Reference schematic with AR8033....................................................................................................... 36
3.6.2 Reference schematic with BCM89820................................................................................................. 37
3.7 USIM Interface.................................................................................................................................................37
3.7.1 USIM Application Guide.......................................................................................................................... 38
3.7.2 USIM Design Notice.................................................................................................................................39
3.7.3 Recommended USIM Card Holder....................................................................................................... 39
3.8 PCM Interface.................................................................................................................................................. 40

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3.8.1 PCM timing................................................................................................................................................ 41

3.8.2 PCM Application Guide........................................................................................................................... 42
3.9 SD Interface..................................................................................................................................................... 42
3.10 I2C Interface................................................................................................................................................. 44
3.11 SDIO Interface..............................................................................................................................................45
3.12 SPI Interface................................................................................................................................................. 45
3.13 Network status..............................................................................................................................................46
3.14 Flight Mode Control..................................................................................................................................... 47
3.15 LCD controller...............................................................................................................................................47
3.16 Other interface..............................................................................................................................................48
3.16.1 Sink Current Source............................................................................................................................. 48
3.16.2 ADC.........................................................................................................................................................49
3.16.3 LDO......................................................................................................................................................... 50

4. RF Specifications........................................................................................................................................... 51
4.1 GSM/UMTS/LTE RF Specifications............................................................................................................. 51
4.2 GSM /UMTS/LTE Antenna Design Guide................................................................................................... 54
4.3 GNSS................................................................................................................................................................ 56
4.3.1 GNSS Technical specification................................................................................................................ 56
4.3.2 GNSS Application Guide.........................................................................................................................56

5. Electrical Specifications...............................................................................................................................58
5.1 Absolute maximum ratings............................................................................................................................ 58
5.2 Operating conditions.......................................................................................................................................58
5.3 Operating Mode...............................................................................................................................................59
5.3.1 Operating Mode Definition...................................................................................................................... 59
5.3.2 Sleep mode............................................................................................................................................... 60
5.3.3 Minimum functionality mode and Flight mode.....................................................................................61
5.4 Current Consumption..................................................................................................................................... 61
5.5 ESD Notes........................................................................................................................................................63

6. SMT Production Guide..................................................................................................................................64

6.1 Top and Bottom View of module...................................................................................................................64
6.2 Label Information.............................................................................................................................................65
6.3 Typical SMT Reflow Profile............................................................................................................................65
6.4 Moisture Sensitivity Level (MSL).................................................................................................................. 66
6.5 Stencil Foil Design Recommendation..........................................................................................................67

7. Packaging......................................................................................................................................................... 68

8. Appendix........................................................................................................................................................... 70
8.1 Coding Schemes and Maximum Net Data Rates over Air Interface...................................................... 70
8.2 Related Documents........................................................................................................................................ 72
8.3 Terms and Abbreviations................................................................................................................................74
8.4 Safety Caution................................................................................................................................................. 76

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Table Index

Table 1: Module frequency bands...................................................................................................................... 10

Table 2: General features.................................................................................................................................... 12
Table 3: Pin definition........................................................................................................................................... 14
Table 4: IO parameters definition....................................................................................................................... 16
Table 5: Pin description........................................................................................................................................17
Table 6: VBAT pins electronic characteristic.................................................................................................... 23
Table 7: Recommended TVS list........................................................................................................................ 25
Table 8: Power on timing and electronic characteristic.................................................................................. 27
Table 9: Power off timing and electronic characteristic.................................................................................. 28
Table 10: RESET pin electronic characteristic.................................................................................................29
Table 11: USB_BOOT description......................................................................................................................33
Table 12: USB_ID description.............................................................................................................................35
Table 13: Key differences between HSIC and HS-USB.................................................................................35
Table 14: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V).............................................. 38
Table 15: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)................................................ 38
Table 16: Amphenol USIM socket pin description........................................................................................... 40
Table 17: PCM format...........................................................................................................................................40
Table 18: PCM timing parameters......................................................................................................................42
Table 19: SD/MMC electronic characteristic as 2.85V................................................................................... 43
Table 20: SD/MMC/eMMC electronic characteristic as 1.8V.........................................................................43
Table 21: NETLIGHT pin status..........................................................................................................................46
Table 22: FLIGHTMODE pin status................................................................................................................... 47
Table 23: Sink current electronic characteristic............................................................................................... 48
Table 24: Electronic characteristics................................................................................................................... 49
Table 25: Electronic characteristic..................................................................................................................... 50
Table 26: Conducted transmission power.........................................................................................................51
Table 27: Operating frequencies........................................................................................................................ 52
Table 28: E-UTRA operating bands................................................................................................................... 52
Table 29: Conducted receive sensitivity............................................................................................................53
Table 30: Reference sensitivity (QPSK)............................................................................................................53
Table 31: Trace loss..............................................................................................................................................54
Table 32: Recommended TVS............................................................................................................................55
Table 33: Absolute maximum ratings.................................................................................................................58
Table 34: Recommended operating ratings..................................................................................................... 58
Table 35: 1.8V Digital I/O characteristics*.............................................................................................................58
Table 36: Operating temperature....................................................................................................................... 59
Table 37: Operating mode Definition................................................................................................................. 60
Table 38: Current consumption on VBAT Pins (VBAT=3.8V)........................................................................ 61
Table 39: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)...................63
Table 40: The description of label information................................................................................................. 65

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Table 41: Moisture sensitivity level and floor life............................................................................................. 66

Table 42: Tray size................................................................................................................................................ 68
Table 43: Small carton size................................................................................................................................. 69
Table 44: Big carton size......................................................................................................................................69
Table 45: Coding schemes and maximum net data rates over air interface.............................................. 70
Table 46: Related documents............................................................................................................................. 72
Table 47: Terms and abbreviations.................................................................................................................... 74
Table 48: Safety caution...................................................................................................................................... 76

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 SIM7600E-H-R Hardware Design V1.01

Figure Index

Figure 1: Module block diagram......................................................................................................................... 11

Figure 2: Pin assignment overview....................................................................................................................14
Figure 3: Dimensions (Unit: mm)....................................................................................................................... 22
Figure 4: Footprint recommendation (Unit: mm)............................................................................................. 22
Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)..............................................................23
Figure 6: Power supply application circuit........................................................................................................ 24
Figure 7: Linear regulator reference circuit...................................................................................................... 25
Figure 8: Switching mode power supply reference circuit............................................................................. 25
Figure 9: Reference power on/off circuit........................................................................................................... 26
Figure 10: Power on timing sequence...............................................................................................................27
Figure 11: Power off timing sequence............................................................................................................... 28
Figure 12: Reference reset circuit......................................................................................................................29
Figure 13: UART full modem...............................................................................................................................30
Figure 14: UART null modem............................................................................................................................. 30
Figure 15: Reference circuit of level shift..........................................................................................................31
Figure 16: level matching circuit.........................................................................................................................31
Figure 17: RI behaviour（SMS and URC report）......................................................................................... 32
Figure 18: RI behaviour（voice call）...............................................................................................................32
Figure 19: USB reference circuit........................................................................................................................ 33
Figure 20: USB_BOOT circuit.............................................................................................................................34
Figure 21: Force download port......................................................................................................................... 34
Figure 22: USB_OTG diagram........................................................................................................................... 35
Figure 23: Reference circuit with AR8033........................................................................................................ 37
Figure 24: Reference circuit with BCM89820.................................................................................................. 37
Figure 25: USIM interface reference circuit......................................................................................................38
Figure 26: USIM interface reference circuit with USIM_DET........................................................................39
Figure 27: Amphenol SIM card socket.............................................................................................................. 40
Figure 28: PCM_SYNC timing............................................................................................................................ 41
Figure 29: EXT codec to module timing............................................................................................................41
Figure 30: Module to EXT codec timing............................................................................................................41
Figure 31: Audio codec reference circuit.......................................................................................................... 42
Figure 32: SD reference circuit...........................................................................................................................43
Figure 33: eMMC reference circuit.....................................................................................................................44
Figure 34: I2C reference circuit.......................................................................................................................... 45
Figure 35: NETLIGHT reference circuit.............................................................................................................46
Figure 36: Flight mode switch reference circuit............................................................................................... 47
Figure 37: LCD diagram...................................................................................................................................... 48
Figure 38: ISINK reference circuit......................................................................................................................49
Figure 39: Antenna matching circuit (MAIN_ANT).......................................................................................... 55
Figure 40: Antenna matching circuit (AUX_ANT)............................................................................................55
Figure 41: Active antenna circuit........................................................................................................................ 57
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Figure 42: Passive antenna circuit (Default).................................................................................................... 57

Figure 43: Top and bottom view of module...................................................................................................... 64
Figure 44: Label information............................................................................................................................... 65
Figure 45: The ramp-soak-spike reflow profile of module..............................................................................66
Figure 46: Stencil Foil...........................................................................................................................................67
Figure 47: Packaging diagram............................................................................................................................68
Figure 48: Tray drawing....................................................................................................................................... 68
Figure 49: Small carton drawing.........................................................................................................................69
Figure 50: Big carton drawing.............................................................................................................................69

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 SIM7600E-H-R Hardware Design V1.01

1. Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom module. With the help of this document and other
software application notes/user guides, users can understand and use module to design and develop
applications quickly.

1.1 Product Outline

Aimed at the global market, the module support GSM, WCDMA, LTE-TDD and LTE-FDD. Users can choose
the module according to the wireless network configuration. The supported radio frequency bands are
described in the following table.

Table 1: Module frequency bands

Standard Frequency bands

GSM 900MHz/1800M Hz
WCDMA B1/B5/B8
LTE(TDD) B41
LTE(FDD) B1/B3/B5/B8/B20
GNSS GPS/GLONASS/BeiDou

With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the module can meet
almost any space requirement in users’ applications, such as smart phone, PDA, industrial handheld,
machine-to-machine and vehicle application, etc.

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

● Power Supply
● USB2.0 Interface
● UART Interface
● MMC/SD Interface
● SDIO Interface

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● USIM Interface
● SPI Interface
● GPIO
● ADC
● LDO Power Output
● Current Sink Source
● PCM Interface
● I2C Interface
● HSIC Interface
● SGMII Interface

1.3 Hardware Block Diagram

The block diagram of the module is shown in the figure below.

Figure 1: Module block diagram

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1.4 Functional Overview

Table 2: General features

Feature Implementation
Power supply Single supply voltage 3.4～4.2V, Recommend supply voltage 3.8V
Power saving Current in sleep mode : <5mA
Radio frequency bands Please refer to the table 1
GSM/GPRS power class:
--GSM850: 4 (2W)
--EGSM900: 4 (2W)
--DCS1800: 1 (1W)
--PCS1900: 1 (1W)
EDGE power class:
Transmitting power --GSM850: E2 (0.5W)
--EGSM900: E2 (0.5W)
--DCS1800: E1 (0.4W)
--PCS1900: E1 (0.4W)
UMTS power class:
--WCDMA :3 (0.25W)
LTE power class: 3 (0.25W)
GPRS multi-slot class 12
EDGE multi-slot class 12
UMTS R99 speed: 384 kbps DL/UL
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
Data Transmission HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL)
Throughput LTE CAT 1: 10 Mbps(DL)
5 Mbps(UL)
LTE-FDD CAT4 ：150 Mbps (DL)，50 Mbps (UL)

LTE-TDD CAT4 ：130 Mbps (DL)，35 Mbps (UL)

GSM/UMTS/LTE main antenna.

Antenna UMTS/LTE auxiliary antenna
GNSS antenna
GNSS engine (GPS,GLONASS and BD)
GNSS
Protocol: NMEA 0183
MT, MO, CB, Text and PDU mode
SMS SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
USIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
USIM application toolkit
Support USAT

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Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

Support PCM interface
Audio feature Only support PCM master mode and short frame sync, 16-bit linear data
formats
UART1 :
A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
Can be used as the AT commands or data stream channel
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol

UART2:
Baud rate: 300bps to 4Mbps(default:115200bps)
UART interface Can be used as the AT commands or Bluetooth data.
Support RTS/CTS hardware handshake

UART3:
Can be used for printing kernel log

UART4:
Baud rate: 300bps to 4Mbps(default:115200bps)
Can be used as the AT commands
Support RTS/CTS hardware handshake
MMC/SD Support MMC and SD cards with 2.85 V on SD port
SDIO Support SDIO with 1.8 V only on SDIO port
USB 2.0 high speed interface, Can used be send AT command, Software
USB
update, GNSS NMEA,USB voice function etc.
Firmware upgrade Firmware upgrade over USB interface or FOTA
Size:30*30*2.9m
Physical characteristics
Weight:5.7 g
Normal operation temperature: -30°C to +80°C
Temperature range Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C

NOTE

Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE
traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the
temperature is outside the normal operating temperature range and still within the extreme operating
temperature range.

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2. Package Information

2.1 Pin Assignment Overview

All functions of the module will be provided through 143 pads that will be connected to the users’ platform.
The following Figure is a high-level view of the pin assignment of the module.

Figure 2: Pin assignment overview

Table 3: Pin definition

PIN No PIN Name PIN No PIN Name

1 GND 2 GND
3 PWRKEY 4 RESET

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5 GND 6 UART2 _RTS/SPI_CLK

7 LCD_D3 8 LCD_D1
9 UART2_CTS/SPI_CS 10 GND
11 USB_VBUS 12 USB_DN
13 USB_DP 14 GND
15 VDD_1V8 16 USB_ID
17 USIM_DATA 18 USIM_RST
19 USIM_CLK 20 USIM_VDD
21 SD_CMD 22 SD_DATA0
23 SD_DATA1 24 SD_DATA2
25 SD_DATA3 26 SD_CLK
27 SDIO_DATA1 28 SDIO_DATA2
29 SDIO_CMD 30 SDIO_DATA0
31 SDIO_DATA3 32 SDIO_CLK
33 WL_PWR_EN 34 WL_SLP_CLK
35 HSIC_STROBE 36 HSIC_DATA
37 GND 38 VBAT
39 VBAT 40 GND
41 GND 42 UART3_TXD
43 GND 44 VDD_AUX
45 ISINK 46 ADC2
47 ADC1 48 GPIO26
49 STATUS 50 COEX_TXD
51 SDA/NETLIGHT 52 PCM_SYNC
53 BT_EN/USIM_DET* 54 PCM_IN/FLIGHTMODE
55 UART3_RTS 56 UART3_CTS
57 GND 58 GND
59 AUX_ANT 60 GND
61 GND 62 VBAT
63 VBAT 64 GND
65 GND 66 UART1_RTS
67 UART1_CTS 68 SGMII_RX_P
69 SGMII_RX_M 70 UART1_RI
71 UART1_DCD 72 UART1_DTR/LCD_RESET*
73 UART4_CTS/LCD_D8* 74 UART4_RXD
75 UART4_TXD/LCD_TE* 76 UART4_RTS/LCD_CS*
77 GND 78 GND
79 GNSS_ANT/NC 80 GND
81 GND 82 MAIN_ANT
83 WLAN_EN● 84 WoWWAN
85 USB_BOOT/COEX_RXD●* 86 PCM_CLK●

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87 PCM_OUT 88 LCD_D4
89 LCD_D5 90 LCD_D6
91 UART2_RXD/SPI_MISO 92 UART2_TXD/SPI_MOSI
93 LCD_D2 94 LCD_D0
95 LCD_RS 96 GPIO24
97 GPIO25 98 GPIO43●
99 GPIO53 100 GPIO54
101 GPIO47● 102 GPIO49
103 GPIO58● 104 GND
105 GND 106 UART3_RXD
107 GPIO75 108 SGMII_RST_N
109 SGMII_INT_N 110 GND
111 GND 112 UART1_RXD
113 UART1_TXD 114 SGMII_TX_M
115 SGMII_TX_P 116 SGMII_MDATA
117 SGMII_MCLK 118 GND
119 SCL 120 LCD_D7
121 ADC0 122 LCD_OE_N
123 LCD_WE_N 124 GPIO1_PM
125 GND 126 GPIO2_PM
127 GPIO4_PM 128~143 GND

NOTE

● Means before the normal power up, these pins cannot be pulled up; otherwise module will not be
powered up normally.* Means that pins has a MUX function.

2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level

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DOL Digital output with low level

PU Pull up
PD Pull down

Table 5: Pin description

Default status
Pin name Pin No Description Comment
Domain IO
Power supply
38,39,62 Power supply, voltage range:
VBAT - PI
,63 3.4～4.2V.
LDO power output for other
If used SGMII
external circuits with Max function , this
150mA current output. Its pin used for
VDD_AUX 44 - PO output voltage is 2.85V by SGMII
function.
default.（The voltage can be
If unused, keep
configured from 1.7V to 3.05V
it open.
by AT command）.
1.8 output with Max 50mA
current output for external If unused, keep
VDD_1V8 15 - PO
circuit, such as level shift it open.
circuit.
1,2,5,10,
14,37,40
,41,43,5
7,58,60,
61,64,65
GND ,77,78,8 - - Ground
0,81,104
,105,110
,111,118,
125,128
~143
System Control
System power on/off control The high
PWRKEY 3 - DI,PU
input, active low. voltage is 0.8V;
RESET has
been pulled up
System reset control input, to 1.8V via
RESET 4 - DI,PU
active low. 40Kohm
resistor
internally.
SDC Interface
SD_CMD 21 P2 I/O,PD SDIO command
If unused, keep
SD_DATA0 22 P2 I/O,PD SDIO data
them open.
SD_DATA1 23 P2 I/O,PD

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SD_DATA2 24 P2 I/O,PD
SD_DATA3 25 P2 I/O,PD
SD_CLK 26 P2 DO SDIO clock
USIM Interface
USIM Card data I/O, which
has been pulled up via a
USIM_DATA 17 P5 I/O,PU 10KR resistor to USIM_VDD
internally. Do not pull it up or
down externally.
DO,
USIM_RST 18 P5 USIM Reset
PD
DO,
USIM_CLK 19 P5 USIM clock
PD
Power output for USIM card,
its output Voltage depends on
USIM_VDD 20 - PO USIM card type automatically.
Its output current is up to
50mA.
SGMII Interface
SGMII_RST_N 108 P6 DO PHY Reset
SGMII_INT_N 109 P3 DI PHY Int
SGMII Bus receive data
SGMII_RX_P 68 - AI
positive
SGMII_RX_M 69 - AI SGMII Bus receive data minus
SGMII Bus transmit Data
SGMII_TX_M 114 - AO
positive
SGMII Bus transmit Data
SGMII_TX_P 115 - AO
minus
SGMII_MDATA 116 P6 I/O SGMII control data
SGMII_MCLK 117 P6 DO SGMII control clock
USB Interface
USB_VBUS 11 - AI USB insert detect（3.0~5.25V）
USB_DN 12 - AI,AO USB data minus
USB_DP 13 - AI,AO USB data positive
It must be kept
pen。If
customer use
OTG function,
Please refer to
“SIM7600
USB_ID 16 - AI USB ID Series
EMMC-Refere
nce Design”
and
“SIM7600 USB
-OTG Applicati
on Note ”

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Full function UART1

UART1_RTS 66 P3 DOH Request to send
UART1_CTS 67 P3 DI Clear to Send
UART1_RXD 112 P3 DI Receive Data
UART1_RI 70 P3 DOH Ring Indicator If unused, keep
UART1_DCD 71 P3 DOH Carrier detects them open.
UART1_TXD 113 P3 DOH Transmit Data
UART1_DTR/LCD DTE get ready/
72 P3 DI,PU
_RESET LCD_RESET signal
UART2 (Bluetooth data, can be configured to SPI interface)
UART2_RTS/SPI_ Request to send
6 P3 DOH
CLK /SPI bus clock
Receive Data
UART2_RXD/SPI_
91 P3 DI /SPI bus master input slave
MISO
output Bluetooth data
Transmit Data interface.
UART2_TXD/SPI_
92 P3 DOH /SPI bus master output slave
MOSI
input
UART2_CTS/SPI_ Clear to Send
9 P3 DI
CS /SPI bus chip select
UART3 (Debug log)
UART3_TXD 42 P3 DOH Log output. Only log
UART3_RXD 106 P3 DI Log input. function.
UART4
UART4_CTS/LCD Clear to Send/
73 P3 DI
_D8 LCD bus data8
UART4_RTS/LCD Request to send/
76 P3 DO
_CS LCD bus chip select
UART4_TXD/LCD Transmit Data/
75 P3 DO
_TE LCD bus chip/ select (tearing)
UART4_RXD 74 P3 DI Receive Data
I2C
SCL 119 P3 OD I2C clock output If unused, keep
open, or else
pull them up
SDA/NETLIGHT 51 P3 OD I2C data input/output via 2.2KΩ
resistors to
1.8V.
SDIO Interface
SDIO_DATA1 27 P3 I/O SDIO bus data1 It can be used
SDIO_DATA2 28 P3 I/O SDIO bus data2 for WLAN
SDIO_CMD 29 P3 I/O SDIO bus command function.
SDIO_DATA0 30 P3 I/O SDIO bus data0 If unused,
SDIO_DATA3 31 P3 I/O SDIO bus data3 please keep
SDIO_CLK 32 P3 DO SDIO bus clock them open.
HSIC Interface

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HSIC_STROBE 35 P8 I/O HSIC strobe If use, please

refer to
document [27]
Otherwise
HSIC_DATA 36 P8 I/O HSIC data
please keep
them open.
9bit LCD Interface
LCD_D4 88 P3 DO LCD bus data bit4
LCD_D5 89 P3 DO LCD bus data bit5
LCD_D6 90 P3 DO LCD bus data bit6
LCD_D3 7 P3 DO LCD bus data bit3
LCD_D1 8 P3 DO LCD bus data bit1
LCD_D2 93 P3 DO LCD bus data bit2
LCD_D0 94 P3 DO LCD bus data bit0
LCD_D7 120 P3 DO LCD bus data bit7 If unused,
UART4_CTS/LCD please keep
73 P3 DO LCD bus data bit8
_D8
them open.
LCD_RS 95 P3 DO LCD bus data/command
LCD_OE_N 122 P3 DO LCD bus host read
LCD_WE_N 123 P3 DO LCD host write
UART1_DTR/LCD
72 P3 DO LCD bus reset
_RESET
UART4_RTS/LCD
76 P3 DO LCD bus chip select
_CS
UART4_TXD/LCD
75 P3 DO LCD bus chip select (tearing)
_TE
PCM Interface
PCM_OUT 87 P3 DO,PD PCM data output.
PCM_IN/FLIGHTM If unused,
54 P3 DI,PD PCM data input.
ODE please keep
PCM_SYNC 52 P3 I/O,PD PCM data frame sync signal. them open.
PCM_CLK● 86 P3 I/O,PU PCM data bit clock.
GPIO
Operating status output.
High level: Power on and
STATUS 49 P3 DO,PU
firmware ready
Low level: Power off If unused,
Default: GPIO please keep
SD card insertion them open.
GPIO26 48 P3 IO,PD detect(option)
H: SD card is removed
L: SD card is inserted
GPIO24 96 P3 IO,PD Default: GPIO
GPIO25 97 P3 IO,PD Default: GPIO
GPIO43● 98 P3 IO,PD Default: GPIO
GPIO53 99 P3 IO,PD Default: GPIO
GPIO54 100 P3 IO,PD Default: GPIO
GPIO47● 101 P3 IO,PD Default: GPIO
GPIO49 102 P3 IO,PD Default: GPIO
GPIO58● 103 P3 IO,PD Default: GPIO
GPIO75 107 P3 IO,PD Default: GPIO
GPIO19 119 P3 IO,PD Default: GPIO

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GPIO1_PM 124 P3 IO,PD Default: GPIO

GPIO2_PM 126 P3 IO,PD Default: GPIO
GPIO4_PM 127 P3 IO,PD Default: GPIO
Antenna
MAIN_ANT 82 - AIO MAIN antenna soldering pad
Auxiliary antenna soldering
AUX_ANT 59 - AI
pad
GNSS_ANT 79 - AI GNSS antenna soldering pad
Others
Ground-referenced current
ISINK 45 - PI
sink.
Analog-digital converter input
ADC1 47 - AI If unused,
1
Analog-digital converter input please keep
ADC2 46 - AI
2 them open.
Analog-digital converter input
ADC0 121 - AI
0
If unused,
WL_PWR_EN 33 P3 DO，PU WIFI power enable please keep
them open.
WL_SLP_CLK 34 P3 AO WIFI sleep clock
Wi-Fi/BT coexistence engine;
COEX_TXD 50 P3 DI
LTE/BT coexistence.
WLAN_EN● 83 P3 I/O WIFI enable
WoWWAN 84 P3 I/O -
If pulled up to 1.8V before
power on, then the module Do place 2 test
points for
would enter in download debug.
USB_BOOT/COE mode.
85 P3 DI
X_RXD● Do not pull up
USB_BOOT
WIFI version:
during normal
Wi-Fi/BT coexistence engine; power up!
LTE/BT coexistence.
WIFI version:
BT_EN/USIM_DET 53 P3 DI,PU
Bluetooth enable.

2.3 Mechanical Information

The following figure shows the package outline drawing of module.

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Figure 3: Dimensions (Unit: mm)

2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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3. Interface Application

3.1 Power Supply

The power supply pins of module include 4 pins (pin 62&63, pin 38&39) named VBAT. The 4 VBAT pads
supply the power to RF and baseband circuits directly. On VBAT pads, the ripple current up to 2A typically,
due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the power supply for these
pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more
than 300mV. The following figure shows the VBAT voltage ripple wave at the maximum power transmit
phase.

Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)

NOTE

The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 µF tantalum capacitor
(ESR=0.7Ω) and Cf=100nF (Please refer to Figure 6—Application circuit).

Table 6: VBAT pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 3.4 3.8 4.2 V
IVBAT(peak) Module power peak current in normal mode. - - 2 A
IVBAT(average) Module power average current in normal mode Please refer to the table 38
IVBAT(sleep) Power supply current in sleep mode
IVBAT(power-off) Module power current in power off mode. - - 20 uA

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3.1.1 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit burst, when
current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF performance may be
affected.

NOTE

If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are
recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid of the
voltage drop more than 300mV.

Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be
used for EMC.

These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on
circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the
recommended circuit.

Recommend Bead for VBAT filter are BLM21PG300SN1D and MPZ2012S221A。

Figure 6: Power supply application circuit

NOTE

1. In order to guard for over voltage protection, it is suggested to use TVS.

2. User could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the
module.

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Table 7: Recommended TVS list

No. Manufacturer Part Number Power dissipation Package

1 JCET ESDBW5V0A1 5V DFN1006-2L
2 WAYON WS05DPF-B 5V DFN1006-2L
3 WILLSEMI ESD5611N 5V DFN1006-2L
4 WILLSEMI ESD56151W05 5V SOD-323
5* PRISEMI PESDHC2FD4V5BH 4.5V DFN1006-2L
6* WAYON WS4.5DPV 4.5V DFN1610-2L

NOTE

1. If user chooses TVS, please pay attention to Clamping Voltage in datasheet. For example when the
surge input is 100V,the Clamping Voltage is less than 10V.
2. VBAT is higher than 3.8V, do not choose 5 and 6.

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used. It is
important to make sure that all the components used in the power supply circuit can resist a peak current up
to 2A.The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.

Figure 7: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is
extremely important, then a switching mode power supply will be preferable. The following figure shows the
switching mode power supply reference circuit.

Figure 8: Switching mode power supply reference circuit

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NOTE

The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic
Interference and ripple current from depraving RF performance.

3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.For monitoring the VBAT voltage
outside or within a special range, the AT command “AT+CVALARM” can be used to enable the
under-voltage warning function.If users need to power off module, when the VBAT voltage is out of a range,
the AT command “AT+CPMVT” can be used to enable under-voltage power-off function.

NOTE

Under-voltage warning function and under-voltage power-off function are disabled by default. For more
information about these AT commands, please refer to Document [1].

3.2 Power on/Power off/Reset Function

3.2.1 Power on

Module can be powered on by pulling the PWRKEY pin down to ground. The PWRKEY pin has been pulled
up with a diode to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended
to put a100nF capacitor, an ESD protection diode, close to the PWRKEY pin as it would strongly enhance
the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference
circuit.

Figure 9: Reference power on/off circuit

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NOTE

Module could be automatically power on by connecting PWRKEY pin to ground via 0R resistor directly.

The power-on scenarios are illustrated in the following figure.

Figure 10: Power on timing sequence

Table 8: Power on timing and electronic characteristic

Symbol Parameter Min. Typ. Max. Unit

The time of active low level impulse of PWRKEY pin
Ton 100 500 - ms
to power on module
The time from power-on issue to STATUS pin output 15 16 -
Ton(status) s
high level(indicating power up ready )
Ton(uart) The time from power-on issue to UART port ready 13 14 - s
Ton(vdd_aux) The time from power-on issue to VDD_AUX ready 2.5 - s
Ton(usb) The time from power-on issue to USB port ready 11 12 - s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off module.

● Method 1: Power off module by pulling the PWRKEY pin down to ground.
● Method 2: Power off module by AT command “AT+CPOF”.
● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by AT
command “AT+CPMVT”.

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● Method 4: over-temperature or under-temperature automatic power off.

NOTE
1. If the temperature is outside the range of -30~+80℃, some warning will be reported via AT port. If
the temperature is outside the range of -40~+85℃, module will be powered off automatically.
2. For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

These procedures will make module disconnect from the network and allow the software to enter a safe
state, and save data before module be powered off completely. The power off scenario by pulling down the
PWRKEY pin is illustrated in the following figure.

Figure 11: Power off timing sequence

Table 9: Power off timing and electronic characteristic

Time value
Symbol Parameter Unit
Min. Typ. Max.
The active low level time pulse on PWRKEY pin to
Toff -- 2.5 -- s
power off module
The time from power-off issue to STATUS pin output low
Toff(status) 25 26 - s
level(indicating power off )*
Toff(uart) The time from power-off issue to UART port off 14 15 - s
Toff(usb) The time from power-off issue to USB port off 27 28 - s
Toff-on The buffer time from power-off issue to power-on issue 0 - - s

●
NOTE

The STATUS pin can be used to detect whether module is powered on or not. When module has been
powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level.

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3.2.3 Reset Function

Module can be reset by pulling the RESET pin down to ground.

●
NOTE

This function is only used as an emergency reset, when AT command “AT+CPOF” and the PWRKEY
pin all have lost efficacy.

The RESET pin has been pulled up with a 40KΩ resistor to 1.8V internally, so it does not need to be pulled
up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the
RESET pin. Please refer to the following figure for the recommended reference circuit.

Figure 12: Reference reset circuit

Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit

The active low level time impulse on RESET
Treset 100 200 500 ms
pin to reset module
VIH Input high level voltage 1.17 1.8 2.1 V
VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

Module provides 4 UART (universal asynchronous serial transmission) interface as DCE (Data
Communication Equipment). AT commands and data transmission can be performed through UART
interface.
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3.3.1 UART Design Guide

The following figures show the reference design.

Figure 13: UART full modem

Figure 14: UART null modem

The module UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface, the
level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas
Instruments is recommended. The following figure shows the voltage matching reference design.

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Figure 15: Reference circuit of level shift

User can use another level shifter circuits as follow.

Figure 16: level matching circuit

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect module to the
RS-232-C interface, for example SP3238ECA, etc.

●
NOTE

1. User need to use high speed transistors such as MMBT3904.

2. Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,
57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate
is 115200bps.

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3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU.
Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming,
and then it will change to low level.

Figure 17: RI behaviour（SMS and URC report）

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with
5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is
answered or hung up.

Figure 18: RI behaviour（voice call）

●
NOTE

For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake module from sleep. When module enters sleep mode, pulling down DTR can
wake module.

3.4 USB Interface

The module contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB
charging function is not supported.

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3.4.1. USB diagram

Module can be used as a USB device. module supports the USB suspend and resume mechanism which
can reduce power consumption. If there is no data transmission on the USB bus, module will enter suspend
mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc.

Figure 19: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction
capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It
is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On
Semiconductor (www.onsemi.com ).

D3 is suggested to select the diode with anti-ESD and voltage surge function, or user could add a TVS for
surge clamping. The recommend TVS please refer to table 7.

●
NOTE

The USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.

3.4.2. USB_BOOT

Module can enter in force download mode by USB_BOOT.

Table 11: USB_BOOT description

PIN No PIN Name I/O description Power domain Default status Index
85 USB_BOOT DI USB boot 1.8V B-PD

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If the module download failed, then customer can make module enter download mode via this Pin. Before
the module power on, pull up the USB_BOOT to VDD_1V8，then push the PWRKEY to power on module,
when the module enter download mode, the pull up should be removed.

Figure 20: USB_BOOT circuit

Customer can check the download port in the device management.

Figure 21: Force download port

3.4.3. USB_ID

Module support OTG function ， but the USB_VBUS(PIN 11) can not supply device with 5V, so customer
should design the circuit to power the USB device.For the detail circuit, customer could refer to SIM7600
Series EMMC-Reference Design.

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Table 12: USB_ID description

PIN No PIN I/O Function description Domain Default index

Name Status
High level: module in USB
device mode.
16 USB_ID DI 1.8V DI-PH
Low level: module in USB
host mode.

Figure 22: USB_OTG diagram

3.5 HSIC interface

HSIC is a 2-signal source synchronous serial interface which uses 240MHz DDR signaling to provide
High-Speed 480Mbps USB transfers which are 100% host driver compatible with traditional USB
cable-connected topologies. Full-Speed (FS) and Low-Speed (LS) USB transfers are not directly supported
by the HSIC interface (a HSIC enabled hub can provide FS and LS support, as well as IC_USB support)
The differences between HSIC and USB2.0 are listed below:

Table 13: Key differences between HSIC and HS-USB

HSIC USB2.0
Signal-ended signaling at 1.2 V Differential signaling
Two signals – STROBE, DATA Four wires – Ground, D+, D-, VBUS
Double data rate signaling Data inferred from differential signaling
HS-USB 480 Mbps only HS/FS/LS support
Maximum trace length of 10 cm Maximum cable length of 5 m
No HS chirp protocol HS chirp protocol

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Lower power consumption (digital) Higher power consumption (analog)

No concept of disconnect Hot plug/play support

Module implements a HSIC interface compliant with the HSIC1.0 specification which can be used to
connect to the external IC.

●
NOTE

The module HSIC default work as HSIC to LAN function, if user have any other question, please
contact SIMCom for more details.

3.6 SGMII Interface

Module provides a SGMII interface with an Ethernet MAC embedded, users could add a PHY to connect to
the Ethernet, and the PHY device could be controlled by the MDIO interface and other dedicated signals.
Two Ethernet PHY are supported: AR8031/AR8033 (Qualcomm) and BCM89820 (Broadcom). The
AR8031/AR8033 is used for the industrial field and the BCM89820 is dedicated for the automotive field.
Main features of SGMII:

 Ethernet Mac integrated in the module

 IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF
 Supports IEEE 1588, Precision Time Protocol (PTP)
 Full duplex rated to 1 Gbps
 Half/full duplex for 10/100 Mbps
 Can be connected to external Ethernet PHY like AR8031/AR8033(industrial 10/100/1000Mbps),
BCM89820(automotive 10/100Mbps)
 Uses 8B10B encoding of data with effective baud data rate of 1 Gbps, data rate is always 1.25 Gbps
(or DDR clock is always at 625 MHz)

Main features of MDIO:

 Host mode only
 Dual voltage: 1.8 V or 2.85 V operation
 Default signal frequency: 6.25MHz
 MDIO_DATA is OD-gate, and requires an external 1.5 kΩ pull-up resistor to VMDIO.

For the AR8031/AR8033, User should provide 3.3V to power the external Ethernet PHY system and the
current should be more than 200mA.

3.6.1 Reference schematic with AR8033

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Figure 23: Reference circuit with AR8033

For the BCM89820, Users should provide 3.3V and 1.2V to power the external Ethernet PHY system and
the data interface of PHY. The current of 3.3V and 1.2V should be more than 100mA and 150mA.

3.6.2 Reference schematic with BCM89820

Figure 24: Reference circuit with BCM89820

●
NOTE

The module SGMII function default closed. If user need, please contact SIMCom for more details or
refer to document [28]

3.7 USIM Interface

Module supports both 1.8V and 3.0V USIM Cards.

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Table 14: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

Symbol Parameter Min. Typ. Max. Unit

USIM_V
LDO power output voltage 1.75 1.8 1.95 V
DD
VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V
VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V
VOL Low-level output voltage 0 0 0.45 V

Table 15: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

USIM_V
LDO power output voltage 2.75 2.95 3.05 V
DD
VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V
VIL Low-level input voltage -0.3 0 0.25*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V
VOL Low-level output voltage 0 0 0.45 V

3.7.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit
should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference
circuit.

Figure 25: USIM interface reference circuit

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●
NOTE

USIM_DATA has been pulled up with a 10KΩ resistor to USIM_VDD in module. A 100nF capacitor on
USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer
to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be
less than 40ns, otherwise the USIM card might not be initialized correctly.

The USIM_DET pin is used for detection of the USIM card hot plug in. User can select the 8-pin USIM card
holder to implement USIM card detection function.

The following figure shows the 8-pin SIM card holder reference circuit.

Figure 26: USIM interface reference circuit with USIM_DET

If the USIM card detection function is not used, user can keep the USIM_DET pin open.

3.7.2 USIM Design Notice

SIM card circuit is susceptible; the interference may cause the SIM card failures or some other situations,
so it is strongly recommended to follow these guidelines while designing:

 Make sure that the SIM card holder should be far away from the antenna while in PCB layout.
 SIM traces should keep away from RF lines, VBAT and high-speed signal lines.
 The traces should be as short as possible.
 Keep SIM holder’s GND connect to main ground directly.
 Shielding the SIM card signal by ground.
 Recommended to place a 0.1～1uF capacitor on USIM_VDD line and keep close to the holder.
 The rise/fall time of USIM_CLK should not be more than 40ns.
 Add some TVS and the parasitic capacitance should not exceed 60pF.

3.7.3 Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User
can visit http://www.amphenol.com for more information about the holder.
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Figure 27: Amphenol SIM card socket

Table 16: Amphenol USIM socket pin description

Pin Signal Description

C1 USIM_VDD USIM Card Power supply.
C2 USIM_RST USIM Card Reset.
C3 USIM_CLK USIM Card Clock.
C5 GND Connect to GND.
C6 VPP NC
C7 USIM_DATA USIM Card data I/O.

3.8 PCM Interface

Module provides a PCM interface for external codec, which can be used in master mode with short sync
and 16 bits linear format.

Table 17: PCM format

Characteristics Specification
Line Interface Format Linear(Fixed)
Data length 16bits(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)

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PCM Clock Rate 2048 KHz (Fixed)

PCM Sync Format Short sync(Fixed)
Data Ordering MSB

●
NOTE

For more details about PCM AT commands, please refer to document [1].

3.8.1 PCM timing

Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 28: PCM_SYNC timing

Figure 29: EXT codec to module timing

Figure 30: Module to EXT codec timing

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Table 18: PCM timing parameters

Paramete
Description Min. Typ. Max. Unit
r
T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high level time – 488 – ns
T(syncl) PCM_SYNC low level time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high level time – 244 – ns
T(clkl) PCM_CLK low level time – 244 – ns
PCM_SYNC setup time high before falling edge of
T(susync) – 244 – ns
PCM_CLK
PCM_SYNC hold time after falling edge of
T(hsync) – 244 – ns
PCM_CLK
T(sudin) PCM_IN setup time before falling edge of PCM_CLK 60 – – ns
T(hdin) PCM_IN hold time after falling edge of PCM_CLK 10 – – ns
T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns
T(zdout) Delay from PCM_CLK falling to PCM_OUT HIGH-Z – 160 - ns

3.8.2 PCM Application Guide

The following figure shows the external codec reference design.

Figure 31: Audio codec reference circuit

3.9 SD Interface

Module provides a 4-bit SD/MMC/eMMC interface with clock rate up to 200 MHz.
When connected to a SD or MMC card, the voltage of SD interface is 1.8/2.85V, which is compatible with

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Secure Digital Physical Layer Specification version 3.0 and SDIO Card Specification version 3.0.It supports
up to 128GB SD cards.When connected to a eMMC card, the interface voltage will be a single 1.8V, which
is compatible with eMMC Specification, version 4.5. It supports up to 128GB eMMC cards.

Table 19: SD/MMC electronic characteristic as 2.85V

Symbol Parameter Min. Typ. Max. Unit

VIH High-level input voltage 0.65*2.85 - 2.85+0.3 V
VIL Low-level input voltage -0.3 0 0.25*2.85 V
VOH High-level output voltage 0.75*2.85 2.85 2.85 V
VOL Low-level output voltage 0 0 0.15*2.85 V

Table 20: SD/MMC/eMMC electronic characteristic as 1.8V

Symbol Parameter Min. Typ. Max. Unit

VIH High-level input voltage 0.7*1.8 - 1.8+0.2 V
VIL Low-level input voltage -0.3 0 0.3*1.8 V
VOH High-level output voltage 1.8-0.4 1.8 1.8 V
VOL Low-level output voltage 0 0 0.45 V

Users should provide 2.85V to power SD card system and the current should more than 350mA, which is
showed below as VCC_SD. ESD/EMI components should be arranged beside SD card socket. Refer to the
following application circuit.

Figure 32: SD reference circuit

Users should provide 2.85V to power eMMC card system and 1.8V to power the SDIO_DATA/CMD/CLK
signals. The source of 2.85V should be able to provide more than 500mA* which showed below as
VCC_eMMC, as the source of 1.8V should be able to provide more than 300mA* which showed below as
VCCQ_1V8. ESD/EMI components should be arranged close to the eMMC card. Refer to the following
application circuit.

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Figure 33: eMMC reference circuit

●
NOTE

For the current of VCC_eMMC and VCCQ_1V8, users should better refer to the related datasheet of
eMMC which is used. The listed current of 500mA and 300mA are just for your reference.

SD/MMC/eMMC card layout guide lines:

● Protect SD card signals from noisy signals (clocks, SMPS, etc.).

● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance
● CLK to DATA/CMD length matching < 1 mm
● Total routing length < 50 mm
● Spacing to all other signals = 2x line width
● Bus capacitance < 10 pF

3.10 I2C Interface

Module provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400
kbps. Its operation voltage is 1.8V.

The following figure shows the I2C bus reference design.

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Figure 34: I2C reference circuit

●
NOTE

1. SDA and SCL do not have pull-up resistors in module. So, 2 external pull up resistors are needed in
application circuit.
2. “AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the I2C
peripheral devices. For more details about AT commands please refer to document [1].

3.11 SDIO Interface

Module provides a 4 bit 1.8V SDIO interface for WLAN solution with W58 module.

●
NOTE

Please refer to document “SIM7600+W58 Reference Design”.

3.12 SPI Interface

Module provides SPI interface and the clock rate is 50MHZ, it an only be used as master mode, and the IO
is 1.8V.

●
NOTE

This function is reserved. For detail information please contact with FAE.

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3.13 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following
figure.

Figure 35: NETLIGHT reference circuit

●
NOTE

The value of the resistor named “R” depends on the LED characteristic.

Table 21: NETLIGHT pin status

NETLIGHT pin status Module status

Always On Searching Network; Call Connect(include VOLTE,SRLTE)
200ms ON, 200ms OFF Data Transmit; 4G registered;
800ms ON, 800ms OFF 2G/3G registered network
OFF Power off ;Sleep

●
NOTE

NETLIGHT output low level as “OFF”, and high level as “ON”.

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3.14 Flight Mode Control

The FLIGHTMODE pin can be used to control module to enter or exit the Flight mode. In Flight mode, the
RF circuit is closed to prevent interference with other equipments and minimize current consumption.
Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin, its reference circuit is
shown in the following figure.

Figure 36: Flight mode switch reference circuit

Table 22: FLIGHTMODE pin status

FLIGHTMODE pin status Module operation

Input Low Level Flight Mode: RF is closed
AT+CFUN=0: RF is closed
Input High Level
AT+CFUN=1:RF is working

3.15 LCD controller

LCD controller features include:

● 9Data interface width: 8 bit and 9 bits

● Resolution: HVGA, 320 (V) × 480 (H) pixels at up to 30 fps
Resolution is scalable; for example, HVGA 480x320 is usable at 30 fps
Support for smart panel LCD devices
● Color depth: up to 18 bits/pixel
● LCD interfaces:
MIPI DBI version 2.0, type B

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8-bit and 9-bit parallel data interface – 8-bit interface uses the lower 8 bits of the LCD bus (D0 to D7)
● Autonomous data movement capabilities (via BAM)

Figure 37: LCD diagram

3.16 Other interface

3.16.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD backlight and
white LED, etc. Its output current can be up to 40mA and be set by the AT command “AT+ CLEDITST”.

Table 23: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit

VISINK Voltage tolerant 0.5 - VBAT V
IISINK Current tolerant 0 - 40 mA

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

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Figure 38: ISINK reference circuit

●
NOTE

The sinking current can be adjusted to meet the design requirement through the AT command “AT+
CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the current from 0mA to 40mA
by 5mA step.

3.16.2 ADC

Module has 3 dedicated ADC pins named ADC0, ADC1 and ADC2.They are available for digitizing analog
signals such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 24: Electronic characteristics

Characteristics Min. Typ. Max. Unit

Resolution – 15 – Bits
Conversion time – 442 – us
Input Range 0.1 1.7 V
Input serial resistance 1 – – MΩ

●
NOTE

“AT+CADC0”, “AT+CADC” and “AT+CADC2” can be used to read the voltage of the ADC0, ADC1 and
ADC2 pins, for more details, please refer to document [1].

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3.16.3 LDO

Module has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default, Users can
switch the LDO on or off by the AT command “AT+CVAUXS” and configure its output voltage by the AT
command “AT+CVAUXV”.

Table 25: Electronic characteristic

Symbol Description Min. Typ. Max. Unit

VVDD_AUX Output voltage 1.7 2.85 3.05 V
IO Output current - - 150 mA

●
NOTE

For more details of AT commands about VDD_AUX, please refer to document [1].

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4. RF Specifications

4.1 GSM/UMTS/LTE RF Specifications

Table 26: Conducted transmission power

Frequency Power Min.

GSM850 33dBm ±2dB 5dBm ± 5dB
EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
PCS1900 30dBm ±2dB 0dBm ± 5dB
GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
PCS1900 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA B1 24dBm +1/-3dB <-50dBm
WCDMA B2 24dBm +1/-3dB <-50dBm
WCDMA B4 24dBm +1/-3dB <-50dBm
WCDMA B5 24dBm +1/-3dB <-50dBm
WCDMA B6 24dBm +1/-3dB <-50dBm
WCDMA B8 24dBm + 1/-3dB <-50dBm
WCDMA B19 24dBm +1/-3dB <-50dBm
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-FDD B2 23dBm +/-2.7dB <-40dBm
LTE-FDD B3 23dBm +/-2.7dB <-40dBm
LTE-FDD B4 23dBm +/-2.7dB <-40dBm
LTE-FDD B5 23dBm +/-2.7dB <-40dBm
LTE-FDD B7 23dBm +/-2.7dB <-40dBm
LTE-FDD B8 23dBm +/-2.7dB <-40dBm
LTE-FDD B12 23dBm +/-2.7dB <-40dBm
LTE-FDD B13 23dBm +/-2.7dB <-40dBm
LTE-FDD B18 23dBm +/-2.7dB <-40dBm
LTE-FDD B19 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
LTE-FDD B25 23dBm +/-2.7dB <-40dBm

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LTE-FDD B26 23dBm +/-2.7dB <-40dBm

LTE-FDD B28 23dBm +/-2.7dB <-40dBm
LTE-FDD B66 23dBm +/-2.7dB <-40dBm
LTE-TDD B34 23dBm +/-2.7dB <-40dBm
LTE-TDD B38 23dBm +/-2.7dB <-40dBm
LTE-TDD B39 23dBm +/-2.7dB <-40dBm
LTE-TDD B40 23dBm +/-2.7dB <-40dBm
LTE-TDD B41 23dBm +/-2.7dB <-40dBm

Table 27: Operating frequencies

Frequency Receiving Transmission

GSM850 869～894MHz 824～849 MHz
EGSM900 925～960MHz 880～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
PCS1900 1930~1990 MHz 1850~1910 MHz
WCDMA B1 2110～2170 MHz 1920～1980 MHz
WCDMA B2 1930~1990 MHz 1850~1910 MHz
WCDMA B4 2110~2155MHz 1710~1755MHz
WCDMA B5 869～894 MHz 824～849 MHz
WCDMA B6 877~882MHz 832~837MHz
WCDMA B8 925～960 MHz 880～915 MHz
WCDMA B19 875~890MHz 835~845MHz
The LTE Operating frequencies are shown in the following table 24.
Note: Operating frequencies of LTE TDD B41 for the module is 100MHz BW, 2555～2655 MHz
GPS 1574.4 ～1576.44 MHz -
GLONASS 1598 ～1606 MHz -
BD 1559 ～1563 MHz

Table 28: E-UTRA operating bands

E-UTRA
Uplink (UL) operating Downlink (DL) operating Duplex
Operating
band band Mode
Band
1 1920 ~1980 MHz 2110 ~2170 MHz FDD
2 1850~1910 MHz 1930~1990 MHz FDD
3 1710 ~1785 MHz 1805 ~1880 MHz FDD
4 1710~1755MHz 2110~2155MHz FDD
5 824～849 MHz 869～894MHz FDD
7 2500~2570MHz 2620~2690MHz FDD
8 880 ~915 MHz 925 ~960 MHz FDD

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12 699~716MHz 728~746MHz FDD

13 777~787MHz 746~757MHz FDD
18 815~830MHz 860~875MHz FDD
19 830~845MHz 875~890MHz FDD
20 832~862MHz 791~ 821MHz FDD
25 1850~1915MHz 1930~1995MHz FDD
26 814~849MHz 859~894MHz FDD
28 703~748MHz 758~803MHz FDD
66 1710~1780MHz 2110~2200MHz FDD
34 2010~2025MHz 2010~2025MHz TDD
38 2570 ~2620 MHz 2570 ~2620 MHz TDD
39 1880~1920MHz 1880~1920MHz TDD
40 2300 ~2400 MHz 2300 ~2400 MHz TDD
41 2496~2696 MHz 2496~2696 MHz TDD

Table 29: Conducted receive sensitivity

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

GSM850 < -109dBm 3GPP
EGSM900 < -109dBm 3GPP
DCS1800 < -109dBm 3GPP
PCS1900 < -109dBm 3GPP
WCDMA B1 < -110dBm 3GPP
WCDMA B2 < -110dBm 3GPP
WCDMA B4 < -110dBm 3GPP
WCDMA B5 < -110dBm 3GPP
WCDMA B6 < -110dBm 3GPP
WCDMA B8 < -110dBm 3GPP
WCDMA B19 < -110dBm 3GPP
LTE FDD/TDD See table 26. 3GPP

Table 30: Reference sensitivity (QPSK)

E-UTRA 3GPP standard Test

band Value
1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz
FDD B1 - - -100 -97 -95.2 -94 -985
FDD B2 -102.7 -99.7 -98 -95 -93.2 -92 -98.5
FDD B3 -101.7 -98.7 -97 -94 -92.2 -91 -99
FDD B4 -104.7 -101.7 -100 -97 -95.2 -94 -98

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FDD B5 -103.2 -100.2 -98 -95 -99.5

FDD B7 -98 -95 -93.2 -92 -96.5
FDD B8 -102.2 -99.2 -97 -94 -98.5
FDD B12 -101.7 -98.7 -97 -94 -98.5
FDD B13 -97 -94 -97.5
FDD B18 -100 -97 -95.2 -99.5
FDD B19 -100 -97 -95.2 -99.5
FDD B20 -97 -94 -91.2 -90 -96.5
FDD B25 -101.2 -98.2 -96.5 -93.5 -91.7 -90.5 -98.5
FDD B26 -102.7 -99.7 -97.5 -94.5 -92.7 -99.5
FDD B28 -100.2 -98.5 -95.5 -93.7 -91 99.5
FDD B66 -104.7 -101.7 -100 -97 -95.2 -94 -98.5
FDD B34 -100 -97 -95.2 -99
FDD B38 - - -100 -97 -95.2 -94 -97.5
FDD B39 -100 -97 -95.2 -99.5
FDD B40 - - -100 -97 -95.2 -94 -98
FDD B41 - - -99 -96 -94.2 -93 -99

NOTE

Test value @ 10MHz

4.2 GSM /UMTS/LTE Antenna Design Guide

Users should connect antennas to module’s antenna pads through micro-strip line or other types of RF
trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss
between the antenna pads and antennas should meet the following requirements:

Table 31: Trace loss

Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.

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Figure 39: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of
components can only be achieved after the antenna tuning and usually provided by antenna vendor. By
default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS
for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close as to
the module’s MAIN_ANT pin. The traces impedance between module and antenna must be controlled in
50Ω.

Figure 40: Antenna matching circuit (AUX_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are
0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for
users according to application environment. Two TVS are recommended in the table below.

Table 32: Recommended TVS

Package Part Number Vender

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata

NOTE

SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the
designing of LTE-TDD, such as band38, band40 and band41. Because of the high insert loss of the RF

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cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the
authentication without the diversity antenna. For more details about auxiliary antenna design notice,
please refer to document [25].

4.3 GNSS

Module merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a high-availability
solution that offers industry-leading accuracy and performance. This solution performs well, even in very
challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to
enable wireless operators to address both location-based services and emergency mandates.

4.3.1 GNSS Technical specification

 Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）/-159 dBm（BD）

 Cold-start sensitivity: -148 dBm
 Accuracy (Open Sky): 2.5m (CEP50)
 TTFF (Open Sky) : Hot start <1s, Cold start<35s
 Receiver Type: 16-channel, C/A Code
 GPS L1 Frequency: 1575.42±1.023MHz
 GLONASS: 1597.5~1605.8 MHz
 BD: 1559.05~1563.14 MHz
 Update rate: Default 1 Hz
 GNSS data format: NMEA-0183
 GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins)
 GNSS antenna: Passive/Active antenna

●
NOTE

If the antenna is active type, the power should be given by main board because there is no power
supply on the GPS antenna pad. If the antenna is passive, we suggest add external LNA .

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna to module. If using a passive antenna, an external
LNA is a must to get better performance. The following figures are the reference circuits.

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Figure 41: Active antenna circuit

Figure 42: Passive antenna circuit (Default)

In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the
components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used
for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by
the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power
supplies which should be considered according to active antenna and LNA characteristic. LDO/DCDC is
recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is
not working.

GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically.
NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure
module in proper operating mode by AT command. Please refer to related documents for details. module
can also get position location information through AT directly.

●
NOTE

GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the
first is on/off, and the second is GNSS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Please refer to
document [24] for more details.

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5. Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of module are listed in the following table:

Table 33: Absolute maximum ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT -0.5 - 4.7 V
Voltage at USB_VBUS -0.5 - 5.5 V
Voltage at digital pins
-0.3 - 2.1 V
(RESET,SPI,Keypad,GPIO,I2C,UART,PCM)
Voltage at digital pins (SD,USIM) -0.3 - 3.05 V
Voltage at PWRKEY -0.3 - 1.8 V

5.2 Operating conditions

Table 34: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.4 3.8 4.2 V
Voltage at USB_VBUS 3.0 5.0 5.25 V

Table 35: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V
VIL Low-level input voltage -0.3 0 0.63 V
VOH High-level output voltage 1.35 - 1.8 V
VOL Low-level output voltage 0 - 0.45 V
IOH High-level output current(no pull - 2 - mA

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down resistor)
Low-level output current(no pull
IOL - -2 - mA
up resistor)
Input high leakage current (no
IIH - - 1 uA
pull down resistor)
Input low leakage current(no pull
IIL -1 - - uA
up resistor)

●
NOTE

These parameters are for digital interface pins, such as SPI, GPIOs (STATUS, USIM_DET), SDIO, I2C,
UART, PCM, COEXn, and USB_BOOT.

The operating temperature of module is listed in the following table.

Table 36: Operating temperature

Parameter Min. Typ. Max. Unit

Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃

●
NOTE

Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/ UMTX/LTE
traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the
temperature is outside the normal operating temperature range and still within the extreme operating
temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of module product.

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Table 37: Operating mode Definition

Mode Function
In this case, the current consumption of module will be reduced to the
GSM /UMTS/LTE
minimal level and the module can still receive paging message and
Sleep
SMS.
Software is active. Module is registered to the network, and the module
GSM/UMTS/LTE Idle
is ready to communicate.
Normal operation

Connection between two subscribers is in progress. In this case, the

GSM/UMTS/LTE Talk power consumption depends on network settings such as DTX off/on,
FR/EFR/HR, hopping sequences, and antenna.
Module is ready for data transmission, but no data is currently sent or
GPRS/EDGE/
received. In this case, power consumption depends on network
UMTS/LTE Standby
settings.
GPRS/EDGE/ There is data transmission in progress. In this case, power
UMTS/LTE consumption is related to network settings (e.g. power control level);
Data transmission uplink/downlink data rates, etc.
AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the
module to a minimum functionality mode without removing the power
Minimum functionality supply. In this mode, the RF part of the module will not work and the
mode USIM card will not be accessible, but the serial port and USB port are
still accessible. The power consumption in this mode is lower than
normal mode.
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE pin
can be used to set the module to flight mode without removing the
Flight mode power supply. In this mode, the RF part of the module will not work,
but the serial port and USB port are still accessible. The power
consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command
“AT+CPOF” or pull down the PWRKEY pin, normally. In this mode the
Power off
power management unit shuts down the power supply, and software is
not active. The serial port and USB are is not accessible.

5.3.2 Sleep mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still
receive paging message and SMS.Several hardware and software conditions must be satisfied together in
order to let module enter into sleep mode:

1. UART condition
2. USB condition
3. Software condition

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●
NOTE

Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26]
for more details.

5.3.3 Minimum functionality mode and Flight mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power consumption.
This mode is set by the AT command which provides a choice of the functionality levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode

If module has been set to minimum functionality mode, the RF function and USIM card function will be
closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be
unavailable.

If module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB
are still accessible, but RF function will be unavailable.

When module is in minimum functionality or flight mode, it can return to full functionality by the AT command
“AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

Table 38: Current consumption on VBAT Pins (VBAT=3.8V)

GNSS
GNSS supply current
@ -140dBm，Tracking Typical: 35mA
(AT+CFUN=0,with USB connection)
GSM sleep/idle mode
GSM/GPRS supply current Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8mA
(GNSS off，without USB connection) Idle mode@ BS_PA_MFRMS=2 Typical: 18mA
UMTS sleep/idle mode
WCDMA supply current Sleep mode @DRX=9 Typical: 3.3mA
(GNSS off，without USB connection) Idle mode @DRX=9 Typical: 17.5mA
EVDO supply current Sleep mode Typical：2.0mA

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(GNSS off，without USB connection) Idle mode Typical：17.8mA

LTE sleep/idle mode
LTE supply current Sleep mode Typical: 4.6mA
(GNSS off，without USB connection) Idle mode Typical: 17.5mA
GSM Talk
EGSM900 @power level #5 Typical: 220mA
DCS1800 @ power level #5 Typical: 162mA
UMTS Talk
WCDMA B1 @Power 24dBm Typical: 540mA
WCDMA B5 @Power 24dBm Typical: 431mA
WCDMA B8 @Power 24dBm Typical: 385mA
GPRS
EGSM900 ( 1 Rx,4 Tx ) @power level #5 Typical: 230 mA
DCS1800 ( 1 Rx,4 Tx ) @power level #0 Typical: 195 mA
EGSM900 (3Rx, 2 Tx ) @power level #5 Typical: 370 mA
DCS1800 (3Rx, 2 Tx ) @power level #0 Typical: 275 mA
EDGE
EGSM900 ( 1 Rx,4 Tx ) @power level #8 Typical: 400 mA
DCS1800 ( 1 Rx,4 Tx ) @power level #2Typical: 300 mA
EGSM900 (3Rx, 2 Tx ) @power level #8 Typical: 320 mA
DCS1800 (3Rx, 2 Tx ) @power level #2 Typical: 230 mA
HSDPA data
WCDMA B1 @Power 24dBm Typical: 487mA
WCDMA B5 @Power 24dBm Typical: 450mA
WCDMA B8 @Power 24dBm Typical: 430 mA
LTE data
@5MHz Typical: 577mA
LTE-FDD B1 @10MHz Typical: 617mA
@20MHz Typical: 700mA
@5MHz Typical: 572mA
LTE-FDD B3 @10MHz Typical: 577mA
@20MHz Typical: 622mA
@5MHz Typical: 548mA
LTE-FDD B5 @10MHz Typical: 566mA
@20MHz Typical: 603mA
@5MHz Typical: 711mA
@10MHz Typical: 735mA
LTE-FDD B7
@15MHz Typical: 776mA
@20MHz Typical: 787mA
@5MHz Typical: 550mA
LTE-FDD B8
@10MHz Typical: 579mA
@5MHz Typical: 561mA
@10MHz Typical: 575mA
LTE-FDD B20
@15MHz Typical: 600mA
@20MHz Typical: 616mA
@5MHz Typical: 270mA
LTE-TDD B39 @10MHz Typical: 280mA
@20MHz Typical: 305mA
@5MHz Typical: 390mA
LTE-TDD B41 @10MHz Typical: 396mA
@20MHz Typical: 420mA

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5.5 ESD Notes

Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is
mounted on the users’ mother board, the ESD components should be placed beside the connectors which
human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table
shows the module ESD measurement performance without any external ESD component.

Table 39: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge

VBAT,GND +/-5K +/-10K
Antenna port +/-5K +/-10K
USB +/-2K +/-3K
UART +/-2K +/-3K
Other PADs +/-1K +/-2K

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6. SMT Production Guide

6.1 Top and Bottom View of module

Figure 43: Top and bottom view of module

NOTE

The above is the design effect diagram of the module for reference. The actual appearance is subject to
the actual product.

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6.2 Label Information

Figure 44: Label information

Table 40: The description of label information

No. Description
A Project name
B Module part number
C Serial number
D International mobile equipment identity
E CE certification
F QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic
recommendation and should be adjusted to the specific application and manufacturing constraints.

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Figure 45: The ramp-soak-spike reflow profile of module

●
NOTE

For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the
prescribed time limit is exceeded, users should bake module for 192 hours in drying equipment (<5% RH) at
40+5/-0°C, or 72 hours at 85+5/-5°C, or bake the module for 8 hours at 120+5/-0°C. Note that plastic tray is
not heat-resistant, and only can be baked at 45° C.

Table 41: Moisture sensitivity level and floor life

Moisture Sensitivity Floor Life (out of bag) at factory ambient≤30°C/60% RH or

Level (MSL) as stated
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.

●
NOTE

NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

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6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.15mm.

Figure 46: Stencil Foil

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7. Packaging

Module support tray packaging.

Figure 47: Packaging diagram

Module tray drawing：

Figure 48: Tray drawing

Table 42: Tray size

Length（±3mm） Width（±3mm） Number

242.0 161.0 15

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Small carton drawing：

Figure 49: Small carton drawing

Table 43: Small carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

270 180 120 15*20=300

Big carton drawing：

Figure 50: Big carton drawing

Table 44: Big carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

380 280 280 300*4=1200

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8. Appendix

8.1 Coding Schemes and Maximum Net Data Rates over Air Interface

Table 45: Coding schemes and maximum net data rates over air interface

Multislot definition(GPRS/EDGE)
DL slot UL slot
Slot class Active slot number
number number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK
EDGE coding scheme Max data rata（4 slots） Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK

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MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK

MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK
HSDPA device category Max data rate（peak） Modulation type
Category 1 1.2Mbps 16QAM,QPSK
Category 2 1.2Mbps 16QAM,QPSK
Category 3 1.8Mbps 16QAM,QPSK
Category 4 1.8Mbps 16QAM,QPSK
Category 5 3.6Mbps 16QAM,QPSK
Category 6 3.6Mbps 16QAM,QPSK
Category 7 7.2Mbps 16QAM,QPSK
Category 8 7.2Mbps 16QAM,QPSK
Category 9 10.2Mbps 16QAM,QPSK
Category 10 14.4Mbps 16QAM,QPSK
Category 11 0.9Mbps QPSK
Category 12 1.8Mbps QPSK
Category 13 17.6Mbps 64QAM
Category 14 21.1Mbps 64QAM
Category 15 23.4Mbps 16QAM
Category 16 28Mbps 16QAM
Category 17 23.4Mbps 64QAM
Category 18 28Mbps 64QAM
Category 19 35.5Mbps 64QAM
Category 20 42Mbps 64QAM
Category 21 23.4Mbps 16QAM
Category 22 28Mbps 16QAM
Category 23 35.5Mbps 64QAM
Category 24 42.2Mbps 64QAM
HSUPA device category Max data rate（peak） Modulation type
Category 1 0.96Mbps QPSK
Category 2 1.92Mbps QPSK
Category 3 1.92Mbps QPSK
Category 4 3.84Mbps QPSK
Category 5 3.84Mbps QPSK
Category 6 5.76Mbps QPSK
LTE-FDD device category
Max data rate（peak） Modulation type
(Downlink)
Category 1 10Mbps QPSK/16QAM/64QAM
Category 2 50Mbps QPSK/16QAM/64QAM
Category 3 100Mbps QPSK/16QAM/64QAM
Category 4 150Mbps QPSK/16QAM/64QAM
LTE-FDD device category Max data rate（peak） Modulation type

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(Uplink)
Category 1 5Mbps QPSK/16QAM
Category 2 25Mbps QPSK/16QAM
Category 3 50Mbps QPSK/16QAM
Category 4 50Mbps QPSK/16QAM

8.2 Related Documents

Table 46: Related documents

NO. Title Description

SIM7500_SIM7600 Series_AT
[1] AT Command Manual
Command Manual_V1.xx
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS) and
Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
[6] GSM 11.14 Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2)；
[9] GSM 11.10 Mobile Station (MS) conformance specification； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals and
[11] 3GPP TS 34.124
ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and
[12] 3GPP TS 34.121
ancillary equipment.
Technical Specification Group Radio Access Network;
[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
[15] EN 301 908-02 V2.2.1
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread

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(UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
[16] EN 301 489-24 V1.2.1 radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[18] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
[21] Module Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
[22] SIM7X00 This document describes how to use UART interface of
Series_UART_Application SIMCom modules.
Note_V1.xx
SIM7100_SIM7500_SIM7600
Series_USB
[23] USB AUDIO Application Note
AUDIO_Application
Note_V1.xx
[24] SIM7X00 GPS Application Note
Series_GPS_Application
Note_V1.xx
[25] Antenna design guidelines for Antenna design guidelines for diversity receiver system
diversity receiver system
[26] SIM7100_SIM7500_SIM7600_ Sleep Mode Application Note
Sleep Mode_Application
Note_V1.xx
[27] 7600CE-LAN-Reference HSIC Application Note
Design V1.0
[28] SIM7600_Series_SGMII-Refer SGMII Reference Design
ence_Design_V1.00

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8.3 Terms and Abbreviations

Table 47: Terms and abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
HSPA High Speed Packet Access
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution

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MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
NMEA National Marine Electronics Association
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter

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8.4 Safety Caution

Table 48: Safety caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

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