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Lab Report Workshop 10

This lab report describes an experiment involving soldering and de-soldering techniques. The objectives were to introduce soldering and provide hands-on experience. Components were successfully soldered onto a circuit board to form connections. The circuit was then connected and its output voltage measured. De-soldering removed the connections effectively. Both soldering and de-soldering were performed according to the procedures and provided practical skills in fundamental electronics work.

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Abdullah Ansari
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2K views

Lab Report Workshop 10

This lab report describes an experiment involving soldering and de-soldering techniques. The objectives were to introduce soldering and provide hands-on experience. Components were successfully soldered onto a circuit board to form connections. The circuit was then connected and its output voltage measured. De-soldering removed the connections effectively. Both soldering and de-soldering were performed according to the procedures and provided practical skills in fundamental electronics work.

Uploaded by

Abdullah Ansari
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOC, PDF, TXT or read online on Scribd
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Lab Report

Experiment 10

Soldering and De-soldering

Abstract:
The aim of this experiment was to introduce soldering techniques and practice soldering and
de-soldering a complex circuit. The objectives were successfully achieved by following the provided
procedure and using the required apparatus. The soldering process involved preparing the soldering
iron, tinning the iron tip, and soldering components onto a Vero board. The circuit was then connected
and the output voltage measured. De-soldering was performed by removing the soldered connections
using a soldering iron and de-soldering tools, and the de-soldered terminals were cleaned. The
experiment provided hands-on experience and practical knowledge in soldering and de-soldering.

Introduction:
Soldering is a fundamental technique in electronics that allows for the joining of metals
by melting and applying solder. It is used to create reliable electrical connections between components
or wires. De-soldering, on the other hand, is the process of removing soldered joints. It is necessary for
repairing or modifying circuits, or correcting soldering mistakes.

Materials and Apparatus:


•Soldering iron

•Soldering iron holder

•10 feet of 22-gauge stranded wire

•Soldering paste

•Wet sponge

•Vero board

•Heat sink
•Resistor, Capacitor, and Inductor components

•De-soldering sucker

Theory:
Soldering is defined as the fusion of alloys with low melting points to join metal surfaces
together. Tinning the soldering iron tip is performed to ensure better heat conduction between the iron
and the wire. Cleaning the soldering iron with a wet sponge helps maintain proper joint strength.
Soldering paste is used as a reducing agent to protect the tip from oxidation.

De-soldering is the process of removing soldered joints. A de-soldering sucker creates pressure to suck
the joint and facilitate its removal.

Procedure:
•Wrap a strand of solder around the soldering iron tip three times before heating it.

•Plug the soldering iron into an AC outlet.

•Once the tip is hot, tin the iron tip by applying solder and removing excess with a moist rag or sponge.

•Connect the resistors on the Vero board in series and solder their ends.

•Solder a wire for input and ground connections, ensuring flat and strong joints.

•Connect the circuit as shown in Figure 10.1 and measure the output voltage.

•De-solder the connections by applying the hot iron tip to the terminal, melting the solder, and prying
the wire off the terminal.

•While still applying heat, remove the solder using a brush or solder sucker.

•Clean the de-soldered terminal with isopropyl alcohol and a clean cloth.

•Return the materials and tools to the storage area, allowing the iron to cool before storage.

Results:
The soldering and de-soldering processes were successfully carried out according to the
procedure. The components were soldered onto the Vero board, forming solid and reliable joints. The
circuit was connected, and the output voltage was measured. During de-soldering, the connections were
effectively removed, and the terminals were cleaned.

Discussion:
The experiment achieved its objectives of introducing soldering techniques and providing
practical experience in soldering and de-soldering. The soldered joints were observed to be flat and
strong, ensuring proper connectivity. The de-soldering process effectively removed the soldered
connections without damaging the components or the board.

Conclusion:
In conclusion, the experiment successfully introduced soldering techniques and provided
hands-on experience in soldering and de-soldering. The soldering process involved tinning the soldering
iron tip, creating strong joints between components on the Vero board. The de-soldering process
effectively removed the soldered connections. This experiment enhanced understanding and proficiency
in soldering, which is essential in electronics and electrical work.

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