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Power MOSFETs for Engineers

This document provides specifications for IXYS HiPerFET power MOSFETs models IXFK 73N30 and IXFN 73N30. The MOSFETs are rated for 300V, can handle currents up to 73A, and have low on-resistances of 45 mΩ. Key features include packages suitable for surface mounting, fast switching times under 100ns, and rugged construction for industrial applications. The document lists detailed electrical ratings and characteristics for the devices.

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0% found this document useful (0 votes)
83 views4 pages

Power MOSFETs for Engineers

This document provides specifications for IXYS HiPerFET power MOSFETs models IXFK 73N30 and IXFN 73N30. The MOSFETs are rated for 300V, can handle currents up to 73A, and have low on-resistances of 45 mΩ. Key features include packages suitable for surface mounting, fast switching times under 100ns, and rugged construction for industrial applications. The document lists detailed electrical ratings and characteristics for the devices.

Uploaded by

puji yatmi
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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www.DataSheet4U.

com

HiPerFETTM V DSS ID25 RDS(on)


Power MOSFETs IXFK 73 N 30 300 V 73 A Ω
45 mΩ
IXFN 73 N 30 300 V 73 A Ω
45 mΩ
trr ≤ 200 ns
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low trr

TO-264 AA (IXFK)
Symbol Test Conditions Maximum Ratings
IXFK IXFN

VDSS TJ = 25°C to 150°C 300 300 V


VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 300 300 V G (TAB)
D
VGS Continuous ±20 ±20 V S

VGSM Transient ±30 ±30 V


miniBLOC, SOT-227 B (IXFN)
ID25 TC = 25°C 73 73 A E153432
S
IDM TC = 25°C, pulse width limited by TJM 292 292 A
G
IAR TC = 25°C 40 40 A
EAR TC = 25°C 30 30 mJ
S
dv/dt IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS, 5 5 V/ns
TJ ≤ 150°C, RG = 2 W D

PD TC = 25°C 500 520 W G = Gate D = Drain


TJ -55 ... +150 °C S = Source TAB = Drain
TJM 150 °C Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
Tstg -55 ... +150 °C
Features
l
TL 1.6 mm (0.063 in) from case for 10 s 300 - °C International standard packages
l
JEDEC TO-264 AA, epoxy meet
VISOL 50/60 Hz, RMS t = 1 min - 2500 V~ UL 94 V-0, flammability classification
IISOL ≤ 1 mA t=1s - 3000 V~ l
miniBLOC with Aluminium nitride
Md Mounting torque 0.9/6 1.5/13 Nm/lb.in. isolation
l
Terminal connection torque - 1.5/13 Nm/lb.in. Low RDS (on) HDMOSTM process
l
Rugged polysilicon gate cell structure
Weight 10 30 g l
Unclamped Inductive Switching (UIS)
rated
l
Low package inductance
l
Fast intrinsic Rectifier

Applications
Symbol Test Conditions Characteristic Values l
DC-DC converters
(TJ = 25°C, unless otherwise specified) l
Synchronous rectification
min. typ. max. l
Battery chargers
l
VDSS V GS = 0 V, ID = 1 mA 300 V Switched-mode and resonant-mode
power supplies
VGS(th) V DS = VGS, ID = 8 mA 2 4 V l
DC choppers
l
IGSS V GS = ±20 VDC, VDS = 0 ±200 nA Temperature and lighting controls
l
Low voltage relays
IDSS V DS = 0.8 VDSS TJ = 25°C 400 uA
V GS = 0 V TJ = 125°C 2 mA Advantages
l
RDS(on) V GS = 10 V, ID = 0.5 ID25 45 mΩ Easy to mount
l
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 % Space savings
l
High power density

© 2001 IXYS All rights reserved 92805J (11/01)


IXFK www.DataSheet4U.com
73N30
IXFN 73N30
TO-264 AA Outline
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.

gfs V DS = 10 V; ID = 0.5 ID25, pulse test 50 S

Ciss 9000 pF
Coss V GS = 0 V, VDS = 25 V, f = 1 MHz 1500 pF
Crss 580 pF

td(on) 30 ns
tr V GS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 80 ns Dim. Millimeter Inches
td(off) RG = 1 Ω (External), 100 ns Min. Max. Min. Max.
A 4.82 5.13 .190 .202
tf 50 ns A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
Qg(on) 360 nC b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
Qgs V GS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 60 nC c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
Qgd 180 nC E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
RthJC TO-264 AA 0.25 K/W J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
RthCK TO-264 AA 0.15 K/W L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
RthJC miniBLOC, SOT-227 B 0.24 K/W Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
RthCK miniBLOC, SOT-227 B 0.05 K/W R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072

Source-Drain Diode Characteristic Values


(TJ = 25°C, unless otherwise specified) miniBLOC, SOT-227 B
Symbol Test Conditions min. typ. max.

IS V GS = 0 V 73 A

ISM Repetitive; pulse width limited by TJM 292 A

VSD IF = 100 A, VGS = 0 V, 1.5 V


Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %

t rr 200 ns
QRM IF = IS, -di/dt = 100 A/µs, VR = 100 V 2 µC
IRM 40 A M4 screws (4x) supplied
Dim. Millimeter Inches
Min. Max. Min. Max.
A 31.50 31.88 1.240 1.255
B 7.80 8.20 0.307 0.323
C 4.09 4.29 0.161 0.169
D 4.09 4.29 0.161 0.169
E 4.09 4.29 0.161 0.169
F 14.91 15.11 0.587 0.595
G 30.12 30.30 1.186 1.193
H 38.00 38.23 1.496 1.505
J 11.68 12.22 0.460 0.481
K 8.92 9.60 0.351 0.378
L 0.76 0.84 0.030 0.033
M 12.60 12.85 0.496 0.506
N 25.15 25.42 0.990 1.001
O 1.98 2.13 0.078 0.084
P 4.95 5.97 0.195 0.235
Q 26.54 26.90 1.045 1.059
R 3.94 4.42 0.155 0.174
S 4.72 4.85 0.186 0.191
T 24.59 25.07 0.968 0.987
U -0.05 0.1 -0.002 0.004
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
IXFK 73N30
www.DataSheet4U.com
IXFN 73N30

Fig. 1 Output Characteristics Fig. 2 Input Admittance

160 160
VGS = 10V 8V
140 7V 140
TJ = 25°C
120 120
TJ = 25°C
ID - Amperes

ID - Amperes
100 100
6V
80 80
60 60
40 40
5V
20 20
0 0
0 2 4 6 8 10 12 14 0 1 2 3 4 5 6 7 8 9 10

VDS - Volts VGS - Volts

Fig. 3 RDS(on) vs. Drain Current Fig. 4 Temperature Dependence


of Drain to Source Resistance
2.0 2.50
TJ = 25°C
2.25
1.8
RDS(on) - Normalized

RDS(on) - Normalized

2.00
1.6
VGS = 10V 1.75
ID = 40A
1.4 1.50
VGS = 15V
1.25
1.2
1.00
1.0
0.75
0.8 0.50
0 40 80 120 160 200 240 -50 -25 0 25 50 75 100 125 150

ID - Amperes TJ - Degrees C

Fig. 5 Drain Current vs. Fig. 6 Temperature Dependence of


Case Temperature Breakdown and Threshold Voltage
80 1.2
VGS(th) BVDSS
70 1.1
BV/VG(th) - Normalized

60
1.0
ID - Amperes

50
0.9
40
0.8
30
0.7
20

10 0.6

0 0.5
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150

TC - Degrees C TJ - Degrees C

© 2001 IXYS All rights reserved


IXFK www.DataSheet4U.com
73N30
IXFN 73N30

Fig.7 Gate Charge Characteristic Curve Fig.8 Capacitance Curves

10 10000
Ciss
VDS = 150V 9000
ID = 42A
8 8000
IG = 10mA

Capacitance - pF
7000
VGE - Volts

6 6000
f = 1MHz
5000
VDS = 25V
4 4000
Coss
3000
2 2000
Crss
1000
0 0
0 50 100 150 200 250 300 350 400 0 5 10 15 20 25
Gate Charge - nCoulombs VDS - Volts

Fig.9 Source Current vs. Source


to Drain Voltage
160

140

120
ID - Amperes

100

80
TJ = 125°C
60

40
TJ = 25°C
20

0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

VSD - Volts

Fig.10 Transient Thermal Impedance


Thermal Response - K/W

0.1

0.01
0.001 0.01 0.1 1

Time - Seconds

IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025

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