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Final Report

This document is an industrial training final report submitted by Mahasre A/P Selvam. It details their 5 month internship at GES Manufacturing Services from December 2018 to April 2019. The report includes an introduction to industrial training, the company background, a summary of activities during the internship, details about electronic devices processes, and conclusions.

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0% found this document useful (0 votes)
1K views72 pages

Final Report

This document is an industrial training final report submitted by Mahasre A/P Selvam. It details their 5 month internship at GES Manufacturing Services from December 2018 to April 2019. The report includes an introduction to industrial training, the company background, a summary of activities during the internship, details about electronic devices processes, and conclusions.

Uploaded by

Thiruu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
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INDUSTRIAL TRAINING FINAL REPORT

JABATAN KEJURUTERAAN ELEKTRIK

DIS 2018

MAHASRE A/P SELVAM


(02DEE16F1099)

GES MANUFACTURING SERVICES (M) SDN.BHD,


PLO 34, FASA 2 ,
KAWASAN PERINDUSTRIAN SENAI,
81400 SENAI, JOHOR

UNIT PERHUBUNGAN DAN LATIHAN INDUSTRI


POLITEKNIK SULTAN HAJI AHMAD SHAH KUANTAN
JABATAN PENDIDIKAN POLITEKNIK
KEMENTERIAN PENDIDIKAN TINGG
INDUSTRIAL TRAINING FINAL REPORT

BY
MAHASRE A/P SELVAM
(02DEE16F1099)

AT

GES MANUFACTURING SERVICES (M) SDN.BHD,


PLO 34, FASA 2 ,
KAWASAN PERINDUSTRIAN SENAI,
81400 SENAI, JOHOR

Industrial training final report is to be submitted to the


Lecturer Assessment of the Department of Electrical
Engineering for the fulfillment of the conditions of Industrial
Training Assessment and award of a Diploma in Electrical
Engineering

POLITEKNIK SULTAN HAJI AHMAD SHAH

DECEMBER 2018

i
STUDENTS CONFIRMATION

I admit that the final report of this industry practice is the result of my
own except citations and summaries of each of them I have explained
the source.

Signature :……………….…….

Student's Name : MAHASRE A/P SELVAM

Registration No : 02DEE16F1099

Date : 26 April 2019

ii
APPRECIATION

I am Mahasre A/P Selvam from the Department of Electrical and Electronic Engineering

Diploma conveys my heartfelt thanks and highest appreciation to Mr.Jason Tamil Selvam

Kanisan, Senior Engineer of GES Manufacturing and Service Sdn.Bhd for giving me the

opportunity to undergo training for a period of five months which is from 10 December 2018

until 26 April 2019 in GES Manufacturing and Service Sdn.Bhd located at plo 34, fasa 2 ,

kawasan perindustrian senai, 81400 senai, johor .

With this opportunity, I would also like to thank the Senior Engineer , Mr.Jason Tamil

Selvam Kanisan and staff at GES Manufacturing and Service Sdn Bhd where they

gave a lot words of encouragement and advice helpful to me during my industrial

training , I am also very pleased and grateful that so dedication of all, do not feel

tired, patient attitude and taking the time to provide guidance, to share experiences,

advice and assistance to me. What is learned from this firm will my lesson and apply

it in my early clues before me a real working environment.

In addition, I would like to express appreciation to the Politeknik Sultan Haji Ahmad

Shah, especially the Unit of Electrical Engineering who worked tirelessly to guide

and provide adequate guidance to me before my training this industry. Giving

opportunities for industrial training also allows me to distinguish between the

academic and technical (practical).

Not to forget also to both parents, uncle and aunt and my friends who always

support and encouragement that there are no limits to me. Encouragement of them

reinforces my determination not to be discouraged despite problems or allegations.

iii
Before I conclude my words, I would like to take this opportunity to apologize to all

parties if there are errors and mistakes that I do not accidentally during this exercise.

Finally, I hope GES Manufacturing and service Sdn Bhd will be developed in line

with the country's progress.

Thank you.

"SERVICE TO THE NATION"

Yours sincerely,

................................................

(MAHASRE A/P SELVAM)

REGISTRATION NO: 02DEE16F1099

POLITEKNIK SULTAN HAJI AHMAD SHAH.

iv
LIST OF DIAGRAMS

NO.DIAGRAMS TITLE PAGE

1 Company logo 8

2 Flowchart of product of process 23-24

3 component feeder 26

4 Squeege blade printing method 27

5 Solder paste printing 28

6 Solder paste printing machine 29

7 Pick and place machine 30

8 Component Feeds with pick and place 31

machine

9 No-clean solder paste reflow profile 34

10 Operation of wave soldering machine 34

11 Auto optical inspection Machine 36

12 In Circuit testing process 38

13 Elecroststic discharge (ESD) bag 41

14 Bubble bag 41

15 Tweezers 42

16 Solder wire 42

17 Solder wick 43

v
18 Cutter 44

19 Solder sucker pump 45

20 Brush 46

21 PCB board heater 47

22 Smoke absorber 48

23 Solder iron 49

24 Mislocated alignment 51

25 Digital Microscope visual inspection 51

26 Removal of PCB 54

27 Loading BGA into the X-ray chamber 54

28 Inspecting the BGA X-ray images 55

29 Inspecting the BGA X-ray images 55

vi
CONTENTS

CONTENTS PAGE

Title i

Student confirmation ii

Appreciation iii

Contents iv

List of chart and figures vii

CHAPTER 1 INTRODUCTION TO INDUSTRIAL TRAINING

1.1 Introduction 1-2

1.2 Objectives of Industrial Training 2-3

1.3 Objectives of Industrial Training final report 3-4

1.4 Importance of Industrial Training to student 4-6

CHAPTER 2 ORGANIZATIONAL BACKGROUND

2.1 Organizational identity 7-8

2.2 The background of the establishment of the organization 9-10

2.3 Organizational activities 11

2.4 Direction of the organizational 12

2.5 Organizational chart 13

vii
CONTENT

CONTENTS PAGE

CHAPTER 3 SUMMARY OF THE ACTIVITIES DURING

INDUSTRIAL TRAINING

3.1 Introduction 14-15

3.2 Summary of the activities during Industrial Training 15-20

CHAPTER 4 ELECTRONIC DEVICES

4.1 Introduction 21

4.2 Process flow in production line 22-24

4.3 Types of components that are being used/specifications 25-41

4.4 Rework Equipment 41-49

4.4 The process of work done 49-55

4.5 Summary 56

CHAPTER 5 SUMMARY 57-60

CHAPTER 6 COMMENTS AND SUGGESTIONS 61-62

BIBLIOGRAPHY / REFERENCE

viii
CHAPTER 1

INTRODUCTION

1.1 Introduction

Industry Training is one of the key conditions required of every student who

finished the High School either public or private institutions to qualify for the award

of the Certificate, Diploma or Degree. It is a program which aims to provide

supervised practical training within a specified timeframe. This training can be

carried out either in government organisations or in the private sector. All students

will undergo industrial training in either private companies or the government.

Industry training is intended to introduce students to the real world of work

1
situations. In the process of industrial training, students will be exposed to

atmosphere in a real working environment where students will encounter and learn

about the ins and outs of the real world of work as well as to build experience in a

real working environment. It can provide new experiences and knowledge to

students but aims to see how the theory they have learned into practice in the

workplace. As such, each student must pass in the training industry as it is one of

the conditions that must be met before a person is graduating.

Apart from the above, the students were exposed to various attitudes and

personal and some employers during the training period. Therefore, students need

to be smart to adapt and be agile to deal with the problem - a problem that may

arise due to the attitude of some employers in the workplace at the time to come.

Students will also feel confident that the students themselves with more daring in

shouldering responsibility or any assignment given by the firm. With the courage

and confidence in themselves the students themselves, and of course, the

students will also appear more confident and bold in expressing opinions and dare

to ask any questions that fly through the heads thereby dismiss attitude of shyness

and fear to ask within the student.

1.2 Objectives of Industrial Training

Industry training is a mandatory requirement that must be passed by all students or

Polytechnic students resident in Malaysia. Briefly, the Industrial Training program

has six main objectives:

2
i) To give students the opportunity to apply the knowledge and skills they

have acquired in a real-life work situation.

ii) To expose students to the real working world through the involve

directly in many aspects.

iii) To give students working experience for the course that they have chosen.

iv) To expose students to the work environment, common practices,

employment opportunities and work ethics in the relevant field.

v) To in still gritty, patient, trustworthy and responsible in order to perform a

task that has been entrusted to students.

vi) To provide opportunities for students to be offered jobs in the same

organization where they undergo the Industrial Training.

1.3 Objectives of the Industrial Training final report

After completion of the training industry for one semester in accordance with

generate status students with soft skills. Arrangement polytechnics requires each

student to undergo training in order to prepare a report typed for work or work

experience while in training or firm. There are several objectives of the

management of polytechnics requires students to prepare this report. This is a

typed report shall be prepared because it is one of the scoring system for this

industry practice.

Moreover, the students were exposed to the attitudes of some employers during

the training period. Therefore, students need to be smart to adapt and be agile to

3
deal with the problem that may arise due to the attitude of some employers in the

workplace at the time to come. Students will also feel confident that the students

themselves with more daring in shouldering responsibility or any assignment given

by the firm. With the courage and confidence in themselves the students

themselves, and of course, the students will also appear more confident and bold

in expressing opinions and dare to ask any questions to their seniors.

Apart from setting up a daily report, the performance assessment of the

organization, and interviews with industry training will be conducted by lecturers

appraiser. This report also aims to keep a record of practical work done during

training because while in polytechnics work experience cannot be obtained and it is

just learning theory. Although the students have practical module but the

equipment is provided during internship is not the same as training venues. Typed

report is also important to prepare workers for jobs in the face of the future. This is

because the current working environment students can refer to this report if there

are questions about the work you want done. In other words this report as we

referred to after the student completes the polytechnic.

1.4 Importance of Industrial Training to students

The main aim of the Industrial Training program is to produce graduates who are

ready to face the working world. Moreover the program will produce the

knowledgeable, skilled and experienced graduates, demanded by employers, who

are able to apply the knowledge acquired at university to the working world. The

4
Industrial Training program also provides opportunities for exposure to the working

world, which will make graduates more aware of the hopes and expectations that

industry has of them.

With this industrial training, the students can contribute a little bit of opinion on

various aspects, especially in matters relating to the work performed by employees

at the firm. Therefore, this may cause arcing opinions and ideas more effectively

where opinion has been backed up can be combined with the opinions of other

employees. Not only that, it also can deepen relationships and can also forge

friendships with fellow students and employees can communicate better. After a

number of things that can are conducted properly, it should also be able to in still a

high spirit of self-learners and workers to continue to work hard.The program will

also equip students with real work experience. Placing students in industry also

increases their chances of employment after graduation, as there is a strong

possibility that they will be offered a job in the same place where they do their

training. Apart from this, the training experience will further solidify the on-campus

learning process and activities, while also providing students with relevant work

experience.

Furthermore, the Industrial Training has helped many trainees become familiar in

the use of electrical and electronic equipment and mechanical that is not likely to

be used during the learning process. This is because, in a study session in college,

much instruction is theoretical. Reams of firm or company, students have the

opportunity to learn and acquire knowledge in a variety of views, such as:

5
I. Practical work done.

II. System administration and management of a company.

III. How to communicate with superiors, superiors, employees, and comply with

all instructions given by the supervisors.

IV. Improve the quality of the individual through perseverance do a job, civilized

manners among employees, timely and contribute creative ideas.

V. How to carry out tasks efficiently either maintain or given and will ensure

quality of works.

VI. Method of producing a report in accordance with the standards.

6
CHAPTER 2

ORGANIZATIONAL BACKGROUND

2.1 Organizational identity

2.1.1 Company logo

Diagram 1 : Company logo

7
2.1.2 Company address and contacts

ADDRESS :

GES MANUFACTURING SERVICES (M) SDN.BHD,

PLO 34, FASA 2 ,

KAWASAN PERINDUSTRIAN SENAI,

81400 SENAI, JOHOR

CONTACTS:

TEL : +6075992511

FAX : +6075992511

WEBSITE : www.venture.com.sg

EMAIL : [email protected]

8
2.2 The background of the establishment of the organization

GES Manufacturing Services (M) Sdn. Bhd. provides electronics manufacturing

services to original equipment manufacturers. The company was founded in

1990 and is based in Senai, Malaysia. GES Manufacturing Services (M) Sdn.

Bhd. operates as a subsidiary of Venture Corporation Limited.

Venture was founded in 1984 as a global electronics services provider. It is a

leading global provider of technology services, products and solutions with

established capabilities spanning marketing research, design and development,

product and process engineering, design for manufacturability, supply chain

management, as well as product refurbishment and technical support across a

range of high-mix, high-value and complex products .

Venture is a leading global provider of technology solutions, products and

services with established capabilities spanning marketing research, design and

development, product and process engineering, design for manufacturability,

supply chain management, as well as product refurbishment and technical

support across a widely diversified range of high-mix, high-value and complex

products.

Venture has built know-how and intellectual property with domain expertise in

printing and imaging, networking and communications devices, handheld

interactive scanning and computing products, advanced storage systems and

9
devices, financial-related equipment and technology, industrial, power and

energy-related products, test and measurement equipment and instrumentation,

medical and healthcare devices and life science equipment.

In its pursuit to create unparalleled enterprise excellence across design and

engineering, manufacturing and distribution, Venture has forged numerous

meaningful partnerships and alliances. As it assumes a key role in the enterprise

chain, Venture will continue to tap the knowledge and best-in-class capabilities

of global enterprises for breakthrough innovations.

Headquartered in Singapore, the Group comprises more than 30 companies

with global clusters in Southeast Asia, Northeast Asia, America and Europe and

employs over 12,000 people worldwide .

10
2.3 Organizational activities

I. precision mechanisms for accurate positioning and speed control

II. ruggedised products meeting a wide range of operating temperature,

humidity, vibration, shock, drop, tumble and ingress protection

requirements

III. consumer products with high quality cosmetic and material finishing

IV. battery operated products with optimised battery performance

V. wireless connectivity including BT, WiFi, Cellular, ZigBee, LPWAN

VI. microcontroller-based controllers for high performance or low-cost

applications

VII. embedded operating systems and software for real-time control

VIII. intuitive man-machine interface

11
2.4 Direction of the organization

Vision

To be a leading global provider of technology services, products and solutions.

Mission

Relentless pursuit of excellence

Rendering the highest level of total customer satisfaction

Encouraging employees to realise their full potential

Building strong cohesion and teamwork

Fostering creativity and innovation

12
2.5 Organization chart

Dennis Goh
General
manager

Eric Goh Andrew Tay


operating TCS director
director

Jayaram James Seah


Lim Chyi Seng Tan Pei Feng Raymond
Pattabi Pai Jin Long
Production Business
Engineering Quality Process
Manager

Senior Product
manufacturing
Engineer Engineer
Juliana MD Razali
Nur Raimi Binti Abd
Jeanette Ilagan Alvar Hamid
Muraly Balakrishnan Vimala
Krishanansamy

13
CHAPTER 3
SUMMARY OF INDUSTRIAL TRAINING ACTIVITIES

3.1 INTRODUCTION
This chapter summarise the activities conducted weekly during industrial

training. Based on the activities performed which is written in the book of

reflection journal are briefly described in the chapter which covers the tasks

assigned by the supervisor. Each activity or duties performed will be recorded in

the book of daily reports. Therefore, this section will briefly describe my job and

activities that have been carried out in the twenty weeks during the industrial

training. All activities that has been carried out from week to week in order are

concluded in a simpler mean.

In industrial training, I was exposed to many new things. I went through

practice for what I have learned at polytechnic, I also have been subjected to the

rules and ethics of the company and it should be practiced whenever I am in the

company where I undergo industrial training. When undergoing industrial training

at this company, I have been placed in a manufacturing department on

14
production area and office. My job that has been scheduled by the Senior

Engineer, Mr Jason. In industrial training, I was given time for 9 hours a day,

starting at 8:00 A.M - 5:30 PM daily from Monday - Friday. Here is a summary of

the activities done by me for every week until 20th week of the industrial training.

3.2 Summary of Industrial Training activities

Week Activity

1. I get introduced with the staffs.

2. Get to know about the products and

1st WEEK customers of company.

(10/12/2018 – 3. Downlaod study about the component details

14/12/2018) for new project.

4. Revise E-bom and ECN process

(Engineering Change Notice).

1. Learned how to use system application

product (SAP) lagoon .

2nd WEEK 2. Download the template from the SAP

(17/12/2018 – 3. Download the datasheet of component from

21/12/2018 ) FINDCHIPS.

4. Learnt about SMT process ( Surface Mount

Technology ).

5. Create new manufacturing code for new

15
project.

1. Did Bom( Bill of Material) for new project.

2. Search manufacturing part number (MPN)

3rd WEEK From Purchasing BOM of customer and

(24/12/2018 – identify the component part exist in or not.

28/12/2018) 3. PCBA and PCB in SMT line.

4. Incoming work instruction (IQC) process flow.

5. Inventory checking at warehouse for

production.

6. Learnt Production part Approval process

(PPAP) for existing project as new format.

4th WEEK 1. Inventory checking at warehouse for

(31/12/2018 – production and check the quantity.

4/1/2019 ) 2. Did 5 levels of Production Part Approval

Process (PPAP).

3. Receive PCB geber file.

1. Did work instruction for new project as first

5th WEEK step of physical method.

(7/1/2019 – 2. Solve the problem of connector

11/1/2019 ) 3. Made a change in work instruction.

4. Solderability test

5. Fix broken stencil of PCBA.

16
1. Identify the disalignment and fix it.

2. Did work instruction for Top level assembly

6th WEEK (TLA).

(14/1/2019 – 3. Fix the soldering of PCBA by solder iron.

18/1/2019 ) 4. Learnt about SMT Pick and Place.

5. Send PCBA to reflow soldering oven.

1. Learnt to study datasheet of each

component for new project.

7th WEEK ( 2. Fill the each information from datasheet to

21/1/2019 – template of new project.

25/1/2019 ) 3. Did component matrix for new project by

using V-look up.

1. Did component matrix for new project by

8th WEEK using V-look up.

(28/1/2019 – 2. Identify the components Moisture sensitive

1/2/2019) level.

3. Check the AVL template to take component

Part numbers Exist or not.

4. Learnt about the Hot reflow System and use

for heat up the ball grid array (BGA).

9th WEEK 1. Chinese new holiday

(4/2/2019 – 2. Identify the PCB defect either pad lift or not.

8/2/2019)

17
1. Identify the PCB defect either pad lift or not.

10th WEEK 2. Update the Manufacturing part number with

(11/2/2019 – new BOM.

15/2/2019) 3. Send PCBA to wave soldering and reflow

soldering.

4. Download the drawings of new project to

take dimension physically.

5. Download non-electrical part drawing of new

project to take dimension physically.

1. Create new manufacturing codes for new

11th WEEK projects.

(18/2/2019 – 2. Download AVL and ROHS and non-ROHS.

22/2/2019)

1. Identify ECN duplicate number .

12th WEEK 2. Make comparrison between customer BOM

(25/2/2019 – and purchasing BOM.

1/3/2019) 3. Create new manufacturing code requisition

for new manufacturer in new project.

4. PCB fabrication.

1. Read the details all given customer and

13th WEEK check physically in production.

(4/3/2019 – 2. Make comparrison between customer BOM

8/3/2019) and purchasing BOM.

18
3. SAP lagoon and create a product.

1. Check ROHS and non-ROHS for new

14th WEEK project.

(11/3/2019 – 2. ECN template for packaging.

15/3/2019)

1. Run prototype of new project.

15th WEEK 2. Original equipment manufacturing (OEM ) for

(18/3/2019 – quality inspection.

22/3/2019 )

1. Original equipment manufacturing (OEM ) for

16th WEEK quality inspection.

(25/3/2019 – 2. Troubleshooting and defects and possible

29/3/2019 ) solution.

1. Detect the defect of new project in geber

17th WEEK silkscreen.

(1/4/2019 – 2. Packaging types for new PCBA.

5/4/2019 3. Identify the defect in Ball grid Array by x-ray

machine.

19
1. Identify the defect in Ball grid Array by x-ray

machine.

18th WEEK 2. DFM guidelines.

(8/4/2019 – 3. Engineering process change notice (E-PCN )

12/4/2019) For new project.

19th WEEK 1. Engineering process change notice (E-PCN )

(15/4/2019 – For new project.

19/4/2019 ) 2. Check the work flow of new project physically

and in system update.

20th WEEK 1. Check the work flow of new project physically

(22/4/2019 – and in system update.

26/4/2019

20
CHAPTER 4
TECHNICAL REPORTS

4.1 INTRODUCTION
An electronic component is any physical entity in an electronic system used

to affect the electrons or their associated fields in a manner consistent with the

intended function of the electronic system. Components are generally intended

to be connected together, usually by being soldered to a printed circuit board

(PCB), to create an electronic circuit with a particular function. Some common

electronic components are capacitors, inductors, resistors, diode and transistors.

Components are often categorized as active (examples are transistors and

thyristors) or passive (examples are resistors, diodes, inductors and capacitors).

21
4.2 Process flow in Production Line

There are two types of PCBA assembly, Surface Mounting Technology

(SMT) and Through Hole Technology (THT). SMT is a method for producing

electronic circuits in which the components are mounted or placed directly onto

the surface of Printed Circuit Board (PCB). Through Hole Technology (THT) is a

method for fitting components with wire leads into holes in the circuit board [3].

SMT process is mostly applied in production due to most of the project model’s

requires this process instead of THT process. The flowchart below shows the

process flow of a product from the first stage until the last stage:

22
Store

Receiving

Incoming Quality Control (IQC)

Parts preparation ( Kitting)

Solder Place Printing

Pick and Place

Inspection

Reflow Oven Curing

Rework Auto optical inspection

Pick and Place

Solder Paste printing

23
A

Reflow oven curing

Auto Optical Inspection


Rework (AOI)

Manual Insert / Manual


Solder ( MIMS)

Reflow

In-Cicuit Test (ICT)


Debug /
Troubleshooting
Functional Circuit Test
(FCT)
Debug /
Troubleshooting
Outgoing Quality
Control (OQC)

Packaging

Top Level Assembly


(TLA)

Figure2:Flowchart of Product process flow

24
4.3 TYPES OF COMPONENTS THAT ARE BEING USED / SPECIFICATIONS

Throughout my Industrial Training I have been come through different types

of electronic devices and learned about their specifications. In this subtopic,

I will list down the electronic devices/machine and some specifications of

the devices. Here is the list of Machine and electronic devices:

a) Solder paste printing machine

b) Pick and place machine

c) Reflow oven

d) Automatic optical inspection

e) In-circuit test machine

f) Functional testing

4.3.1 Store and Receiving

Store is a warehouse where all the parts, materials and components are

received from the suppliers and vendors. All these parts, materials and

components will be sorted using its sort string sequence.

4.3.2 Incoming Quality Control (IQC)

Incoming Quality Control (IQC) is where the quality of the parts, materials

and components is checked by the operators, supervisors under Quality

Engineer. Once the quality of the parts, materials and components is

passed the inspection, the parts, materials and components will go

through Parts Preparation (Kitting process).

25
4.3.3 Part preparation (Kitting Process)

Parts Preparation (Kitting Process) is a process where all the small

components such as resistors, capacitors and IC are sorted in a

component feeds to be placed in a pick and place machine. Components

feeds is where the components are supplied on plastic tape in tape reels

that are loaded onto feeders mounted to the pick and place machine.

Figure 3 shows the components feeds that will be loaded onto feeders.

Figure3: Component feeder

4.3.4 Solder paste printing

The first step of PCB assembly is applying a solder paste to the board.

This process is like screen-printing a shirt, except instead of a mask, a

thin, stainless-steel stencil is placed over the PCB. This allows

assemblers to apply solder paste only to certain parts of the would-be

PCB. These parts are where components will sit in the finished PCB. The

solder paste itself is a greyish substance consisting of tiny balls of metal,


26
also known as solder. The composition of these tiny metal balls is 96.5%

tin, 3% silver and 0.5% copper. The solder pastes mixes solder with a

flux, which is a chemical designed help the solder melt and bond to a

surface. Solder paste appears as a grey paste and must be applied to the

board at exactly the right places and in precisely the right amounts.

In a professional PCBA line, a mechanical fixture holds the PCB and

solder stencil in place. Applicators then places solder paste on the

intended areas in precise amounts. The machine then spreads the paste

across the stencil, applying it evenly to every open area. After removing

the stencil, the solder paste remains in the intended locations.

27
Figure4: Squeegee Blade Printing method

Figure5: Solder paste printing

28
Figure6: Solder paste printing Machine

4.3.5 Pick and place machine

SMT (surface mount technology) component placement systems,

commonly called pick-and-place machines or P&Ps, are robotic machines

which are used to place surface-mount devices (SMDs) onto a printed

circuit board (PCB). They are used for high speed, high precision placing

of broad range of electronic components,

like capacitors, resistors, integrated circuits onto the PCBs. Some of the

components also will go through Manual Insert Manual Solder (MIMS)

depends on the type of components and parts. The principle of pick and

29
place is using vacuum pressure and precision nozzles to enable

component placement are correct and straightforward. The PCB is

clamped, the nozzles will pick up individual components from the feeders,

rotate them to correct orientation and place them on the PCB. Figure 7

and 8 shows the components feeds are loaded onto pick and place

machine. There are four stages of pick and place process:

1. Picking: SMT components are withdrawn from a feeder by a vacuum

nozzle.

2. Holding: Components are steadied for rapid movement while the machine

detects proper alignment.

3. Transport: Components are transferred from the picking location to the

PCB for assembly.

4. Placement: Components are lowered to their specific location on the circuit

board.

5. Release: Components are released by the nozzle, which returns to the

picking area to restart the process.

30
Figure7: Pick and place machine

Figure8: Component Feeds with pick and place machine

31
4.3.6 Inspection

Automated Optical Inspection (AOI) – a camera scans the PCBs for

variety of surface feature defects such as scratches and stains, open

circuits, short circuits, thinning of the solder as well as missing

components, incorrect components, and incorrectly placed components.

4.3.7 Reflow oven

Reflow soldering is a process in which a solder paste (a sticky mixture of

powdered solder and flux) is used to temporarily attach one or thousands

of tiny electrical components to their contact pads, after which the entire

assembly is subjected to controlled heat. The solder paste reflows in a

molten state, creating permanent solder joints. Heating may be

accomplished by passing the assembly through a reflow oven or under

an infrared lamp or by soldering individual joints with a desoldering hot air

pencil.

Reflow soldering with long industrial convection ovens is the preferred

method of soldering surface mount components to a printed circuit

board or PCB. Each segment of the oven has a regulated temperature,

according to the specific thermal requirements of each assembly. Reflow

ovens meant specifically for the soldering of surface mount components

may also be used for through-hole components by filling the holes with

solder paste and inserting the component leads through the paste. Wave

soldering however, has been the common method of soldering multi-

leaded through-hole components such as through-hole connectors or

32
highly application specific through-hole components, onto a circuit board

designed for surface-mount type components.

When used on boards containing a mix of SMT and PTH components,

through-hole reflow, when achievable by specifically modified paste

stencils, may allow for the wave soldering step to be eliminated from the

assembly process, potentially reducing assembly costs. While this may

be said of lead-tin solder pastes used previously, lead-free solder alloys

such as SAC present a challenge in terms of the limits of oven

temperature profile adjustment and requirements of specialized through-

hole components that must be hand soldered with solder wire or cannot

reasonably withstand the high temperatures directed at circuit boards as

they travel on the conveyor of the reflow oven. The reflow soldering of

through-hole components using solder paste in a convection oven

process is called intrusive soldering.

The reflow oven temperature profile is suited for characteristics of a

particular circuit board assembly, the size and depth of the ground plane

layer within the board, the number of layers within the board, the number

and size of the components, for example. The temperature profile for a

particular circuit board will allow for reflow of solder onto the adjoining

surfaces, without overheating and damaging the electrical components

beyond their temperature tolerance. In the conventional reflow soldering

process, there are usually four stages, called "zones", each having a

33
distinct thermal profile: preheat, thermal soak (often shortened to

just soak), reflow, and cooling.

Figure9: No-clean Solder Paste reflow profile

34
Figure10:Operation of wave soldering Machine

There are three stages operation of wave soldering machine:

I. Flux Application:

Flux layer is applied to clean all the components and ensures that solder

can attach properly to the pins and pads of the components.

II. Pre-Heating:

This process heats the PCB board to prevent any thermal shock before

heads to soldering wave.

III. Soldering Wave:

The PCB board passes over a liquid soldering wave. The bottom layer of

the PCB will make contact with a liquid wave of solder, forming a

connection between each component and the associated hole or part.

4.3.8 Auto optical inspection (AOI)

Auto Optical Inspection is a process to check all the components and

solder paste is correctly placed on the PCB using AOI machine. If there is

any failure such as missing components and excess solder paste, the

PCB will be send to rework station. After AOI, the PCB will go through the

35
same process from solder paste printing until AOI for the top side of the

PCB. Figure 11 shows AOI machine.

Figure11: Auto optical inspection Machine

4.3.9 Manual insert Manual Solder (MIMS)

Manual Insert Manual Solder is a process where certain components

need to insert manually to the PCB and manually soldered by the

operators before send to wave soldering machine. Depending on the type

of board under PCBA, the board may include a variety of components

beyond the usual SMDs. These include plated through-hole components,

or PTH components.

A plated through-hole is a hole in the PCB that's plated all the way

through the board. PCB components use these holes to pass a signal

36
from one side of the board to the other. In this case, soldering paste won't

do any good, as the paste will run straight through the hole without a

chance to adhere. Instead of soldering paste, PTH components require a

more specialized kind of soldering method in later PCB assembly

process:

I. Manual Soldering: Manual through-hole insertion is a straightforward

process. Typically, one person at a single station will be tasked with

inserting one component into a designated PTH. Once they're finished,

the board is transferred to the next station, where another person is

working on inserting a different component. The cycle continues for each

PTH that needs to be outfitted. This can be a lengthy process, depending

on how many PTH components need to be inserted during one cycle of

PCBA. Most companies specifically try to avoid designing with PTH

components for this very purpose, but PTH components are still common

among PCB designs.

4.3.10 In Circuit test (ICT)

Before getting into in-circuit testing, let's review some important aspects

of printed circuit (PR) board manufacturing and testing. As you know, the

design and assembly of pc boards follow certain basic steps:

I. Firstly, assembly and drill drawings of the board are developed from the

schematic diagram. These drawings show where each component will be

37
placed, where each track (wiring connection) will be etched, where each

component mounting hole will be located, etc.

II. Then, holes for the component leads are drilled in a blank board and

tracks are etched on the surface of the board to connect the components

together.

III. Next, the components ate mounted on the board. Either by hand or

automatic insertion equipment.

IV. Finally, the component leads arc soldered to the tracks, usually by

means of a wave-solder machine.

V. Once assembled, the pc board is then tested.

Figure12: In Circuit testing process

4.3.11 Functional circuit test (FCT)

38
After the FCT PCBA process is finished, a final inspection will test the

PCB for its functionality. This inspection is known as a "functional test".

The test puts the PCB through its paces, simulating the normal

circumstances in which the PCB will operate. Power and simulated

signals run through the PCB in this test while testers monitor the PCB's

electrical characteristics. If any of these characteristics, including voltage,

current or signal output, show unacceptable fluctuation or hit peaks

outside of a predetermined range, the PCB fails the test. The failed PCB

can then be recycled or scrapped, depending on the company's

standards.

Testing is the final and most important step in PCB assembly process, as

it determines the success or failure of the process. This testing is also the

reason why regular testing and inspection throughout the assembly

process is so important.

4.3.12 Outgoing Quality control (OQC)

Outgoing Quality Control (OQC) is the last station before packing and the

product will be sent for shipment. OQC is the last inspection for the

product. OQC team will do inspection for 100 boards. If the 32 first batch

of boards pass the inspection, the whole batch will be considered as pass

and proceed for packing process and shipment. If there is any faults such

as wrong part and reversed part in the first 32 batch of boards, the whole

batch will be considered as fail and need to inspection for all board.

39
4.3.13 Packaging

Packing is the final stage before the PCB is sent for shipment. There are

different types of packaging for different product or PCBA. There are

many types of packaging such as carton box, bubble sheet, label and

ESD bag.

Figure13: Electrostatic discharge (ESD) bag

40
Figure14: Bubble bag

4.3.15 Top Level Assembly (TLA)


Top Level Assembly (TLA) is continuous assembly from the PCBA that

has been passed the In Circuit Test (ICT), Function Circuit Test (FCT)

and Outgoing Quality Control (OQC) to complete a full set of a product.

TLA is optional, depends on customer requirements.

4.4 The Rework station

Rework is the process of “touch-up” station to corrected any wrong and

faults part, components and soldering problems on the PCB. Faults

examples that require rework are excess solder, lifted part, reversed part,

wrong part; overflow solder on PCB and wrong orientation.

4.4.1 Rework Equipment

4.4.1.1 Tweezers

41
Tweezers is a small tools used for picking up small objects and to

hold solder wire during soldering. Figure15 shows a tweezers.

Figure15: Tweezers

4.4.1.2 Solder wire

Solder wire is required when the PCB have faults when the

components and parts is not soldered properly, such as excess

solder. Therefore, the components and parts need to be soldering

again. There are two types of solder wire; Lead Free and Leaded.

Figure 16 shows a solder wire.

42
Figure16: Solder wire

4.4.1.3 Solder wick

Solder wick is use to absorb excess solder on the PCB after re-

solder during rework. The end length of solder wick is placed over

the soldered connections of a component being removed. The

connections are heated with a soldering iron until the solder melts

and is wicked into the solder wick. The Figure 17 below shows a

solder wick.

Figure17: Solder wick

4.4.1.4 Cutter

Cutter is use to cut component’s leg. Figure 18 below shows a

cutter.
43
Figure18: Cutter

4.4.1.5 Sucker Solder pump

Sucker solder pump is use to suck away molten solder. The pump

is applied to a heated solder connection, and then operated to

suck the solder away. Figure 19 shows a sucker solder pump.

44
Figure 19: Solder sucker pump

4.4.1.6 Brush

Brush is use to remove the flux residue after soldering. It is

commonly use with an alcohol or acetone. Figure 20 below shows

brush.

45
Figure20: Brush

4.4.1.7 PCB Board Heater

PCB board heater is use to melt solder paste on PCB for rework.

Pre-heat will activate the flux removing oxides or surface films

metal surfaces. Pre-heat also raises the entire assembly to a

temperature slightly below the melting point of solder. Therefore, it

will reduce thermal shock. Thermal shock occurs when rapid

heating increase temperatures inside an assembly at different

rates. Figure 21 shows a PCB board heater.

46
Figure21: PCB Board Heater

4.4.1.8 Smoke Absorber

During soldering, a toxic smoke is emitted and may cause harm to

health. When soldering two metal joints, the solder melts and gives

rise to toxic smoke. There are two prominent types of solder; Lead

Oxide and Rosin based flux and colophony. Lead Oxide fumes are

released during soldering which can even cause lead poisoning. In

order to remove the oxidation from the base and filler metals, flux

is used with the solder. Flux can helps to increase the

effectiveness of the solder. However, if the fume is inhaled it can

cause health problems. Figure 22 shows a smoke absorber.

47
Figure22: Smoke Absorber

4.4.1.9 Solder Iron

A soldering iron is a hand tool used in soldering. It supplies heat to

melt solder so that it can flow into the joint between two parts; the

component with PCB. It is composed of heated metal tip and

insulated handle. Heating achieved electrically, by passing electric

current through resistive heating element. Figure 23 shows a

solder iron.

48
Figure23: Solder Iron

4.5 The process of work done

In this subtopic I would like to share one of the processes of work done by

me during the Industrial Training. I am placed under Department of

Engineering (Product Engineer) for position as a product engineer. My

major scope is in documentation system for every project that handled by

other product engineers. All the tasks required to deal with internal team

and the documents approver. However, the system documentation is very

confidential and I am not allowed to write it in this report. I also have been

assigned a task to spend 4 hours a day to production to know the overall

process of a model or product.

49
4.5.1 The connector doesn’t fit the PCBA and loosen screw

In this subtopic I would like to share one of the processes of work done

by me during the Industrial Training. In 5th week of industrial training, my

supervisor gave me a task to solve the problems which occur at Manual

insert line. The problem was the connector doesn’t fit into PCB in order

to insert the nut and screw. Firstly, get verification from the operators.

And then I tried myself to Place the PCB onto the screwing jig and insert

the nuts according to the hole. After that, insert the connector on

screwing jig and place the PCB and insert screw. Tighten the screw by

using torque, the setting was 2.5-3.0 lbs. the screw was not get tighten

to the PCB. So, check the torque setting, the setting was 2.8 lbs. And

then, increase the torque setting to 3.0 -3.5 lbs. by using the

(equipment). At last the screw get tighten and strong.

4.5.2 Alignment dislocated

In this subtopic I would like to share one of the processes of work done by

me during the Industrial Training. On 7th week I have done identify the

Alignment dislocated and send to rework station.

Firstly , check the PCBA manually by fish zooming. Get a clarification as

the Ic been dislocated because of the nozzle sucker. And then, the pcba

send to rework station.

50
Figure24 : mislocated alignment

4.5.3 Identify the Defect of PCBA after Reflow soldering

After the wave solder , check the solder paste has been pasted or have

any other issue such as bridge solder, cold joint, insufficient wetting,

excessive solder and solder pad lifted by using fish magnifying glass or

Digital microscope visual inspection. Identify the defect and send to rework

station. Take the serial number to check again after full clean oven.

51
Figure 25: Digital Microscope visual inspection

4.5.4 X-ray inspection of BGA

Using a PCB X-ray service can identify defects efficiently by simplifying

troubleshooting and saving the high cost of rework at final assembly

stages. The X-ray equipment pinpoints solder and mounting defects

immediately, even inside or underneath the component, including BGAs

(ball grid assemblies) and other SMT devices. Effective PCB X-ray

inspection identifies such common defects as solder shorts; poor solder

coverage, solder connections, debris under and inside the components,

and many other assembly issues.

X-ray printed circuit board inspection consists of placing the PCB or

assembly in the X-ray equipment and using a remote, joystick controlled

camera to examine the piece from all angles. The operator views the

images on a screen, and the camera can capture images for inclusion in

inspection or certification reports, if necessary. The X-ray inspection helps

ensure that only high-quality PCBs are used in final assembly.

Firstly, I Review the inspection criteria of the contracting customer. An

IPC-A-610 inspection criterion for the given class of the assembly is one

of the default guidelines. I also look at IPC-7095 to derive acceptance

criteria for x-ray inspection of BGAs. After that, I Remove the PCB from

static shield bag. Make sure that properly grounded when handling an

52
electronic assembly according to EOS/ESD 2020 guidelines or internal

company guidelines.

And then, I identify the area of interest and mark with a rework label on

the area or device of interest. This thing helped me in locating the source.

The Quality control loads the PCB into the x-ray chamber.Make sure all of

the necessary precautions are taken before operating an X-ray

machine.Initiate the x-ray. Make sure there is a high enough contrast in

your image so that all voids and opens are in sight.

By using the laser pointer in the x-ray system, it is easy to manipulate the

table such that the area of interest shows up on the operator interface x-

ray screen. Locate the BGA requiring x-ray inspection.Inspect looking for

faults such as shorts, opens, bridges and the like. Take snapshots or

videos of these anomalies. Inspect the entire BGA then zoom in to "walk"

around the area array

device. Notice to ball shape consistency, solder sphericity, solder shorts,

solder balls and other anomalies.

Zoom in to exam the consistency of ball sizes, concentricity of the balls,

voiding and other issues. Analyze the part solder ball images of the BGA

in a set pattern to make sure you cover all of the balls.

53
Figure26 : Removal of PCB

Figure27 : Loading the BGA Into the X-ray Chamber

54
Figure28 : Inspecting the BGA X-ray Images

Figure29 : Inspecting the BGA X-ray Images

55
4.6 Summary
In conclusion, from this project I have learnt on how to use X-ray machine

and identify the defect from the result. I also learnt to troubleshooting the

dislocated alignment and know to do re-work for a PCBA. Lastly I know

troubleshoot the defect in a PCBA .

56
CHAPTER 5

SUMMARY

In conclusion, the industrial training program is a program that many

benefits as well as exposure and recognition to students about various aspects

in the field of electronic engineering and the role of the coach in a job. In

addition, it also can balance the knowledge and enhancing their knowledge of

each trainee as an engineering student who is not only capable in theory but in

practice that is capable of practically be in the highlight.

Therefore, every student will be able to use theoretical and practical skills

to be combined in accordance with the actual situation. With this, not denied any

knowledge during this exercise will be used at the workplace. During the

industrial training, the students were exposed to the working environment in

which they were placed together whether they have been involved in the

engineering field. This gives valuable experience to students. The experiences

gained will be useful to students in order to prepare the workplace true even

within a given time is short training. In this period, students can also

57
communicate with many more people in the field work either with the upper class

or lower for each of individual vested interest in the organization.

In addition, for those who lack proficiency in the language also indirectly

be proficient in the use of this language. This is also an important aspect

because English is widely used in the industrial sector. With this, the students

should have the initiative to find what is learned and not just expect someone

else. Although only a five-month training period, it should not be a deterrent for

students to gather as much knowledge as possible. On completion of training is

not a true fact that this industry is very useful to add more knowledge and

experience to students in the field in future undertakings either directly or

indirectly. It also applies the values and maturity of mind.

Moreover this industrial training is an important thing for me because it

can train the skills which I learned during the study at the Polytechnic where it

can be applied effectively. The training is also a branch to build confidence of

the students to face the real work that will be encountered in the future. This is

because the industry practice has been to provide the appropriate disclosures

about the intricacies of preparing students for work in the working environment.

The training also can not only improve my self-confidence to face the real

working environment but also helped me improve the way I communicate with

people. Cooperation in the training of staff is also very good and has taught me

a sense of the enormity of cooperation. I feel very proud and fortunate to have

the opportunity to undergo training in the industry. The training can also form

58
good interpersonal skills in the students to work more organized and disciplined.

Among them is the way the employer should put the students do assignments

within the prescribed training. As a student in college, students must comply with

the instructions given by the lecturers. With these students can train yourself to

be more disciplined and know how to organize systematic and determine the

future more brilliant.

Although only industrial training, it is like to work as other employees in a

company because the main objective of industrial training is to give exposure to

the students about the real working and living the ethical values of work and also

have the opportunity to enhance their creativity and contribute ideas appropriate

to the organization with more courage and confidence as well as plant and

produce a responsible attitude in yourself to do the work. Indirectly, we also can

learn how to communicate with the public.

The training also can not only improve my self-confidence to face the

real working environment but also helped me improve the way I communicate

with people. Cooperation in the training with staff is also very good and has

taught me a sense of how great cooperation. I feel very proud and fortunate to

have the opportunity to undergo training in the industry. This is because, at

present to get a job in any company, we must have the skills on which our office

need actually.

In addition, I also gained a lot of experience and knowledge that I never

experienced when during my lesson. I also gain exposure in the working

59
company environment . I have learned how to manage time and appreciate

teamwork among colleagues. In fact, I also follow what I have learned in the

course of Polytechnics 'soft skill'.

In conclusion, I can conclude that this industry practice is much benefit

and new experience for the students to be bold in taking risks in a real job and a

pretty valuable lesson for students to serve as a guide in the future. Moreover,

the Industrial Training objectives have been achieved, namely to provide

exposure to the world of work to students before graduation, so students can

make a wise decision to choose a career and use the experience as good as

possible.

60
CHAPTER 6

COMMENTS AND SUGGESTIONS

6.1 COMMENTS

In short, industrial training can:

i . Provide guidance and attention to students who will undergo industrial training.

ii. Ensure students receive training in accordance with the courses involved.

iii. Creating surveys / assessments lecturers to exercise at least twice to keep up

with students who are undergoing industrial training.

61
6.2 SUGGESTIONS

During my training period in the company nothing had happened, but here I

would like to suggest a few things that can be shared to enhance the Polytechnic

and the companies involved in the future. Here is some suggestions that I would

like to give :

i. Gives confidence to students to carry out the task.

ii. Provide employees with the ability to provide tutoring to students who undergoing

industrial training.

iii. Provide more extensive disclosures about the real world of work.

iv. The use of English among students during training industry.

62
BIBLIOGRAPHY / REFERENCE

1. https://qualityinspection.org/functional-tests-smt-china/

2. http://www.suron.com/portfolio/wave-solder-pallets/

3. https://courses.cs.washington.edu/courses/cse467/04wi/lectures/ppt/Intro_to_

SMT.pdf

4. https://www.instructables.com/id/How-to-X-Ray-Inspect-a-BGA/

5. https://www.slideshare.net/billcardoso1/how-to-find-defects-in-smt-

electronics-manufacturing

6. https://www.slideshare.net/abishus/smt-notes

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