Final Report
Final Report
DIS 2018
BY
MAHASRE A/P SELVAM
(02DEE16F1099)
AT
DECEMBER 2018
i
STUDENTS CONFIRMATION
I admit that the final report of this industry practice is the result of my
own except citations and summaries of each of them I have explained
the source.
Signature :……………….…….
Registration No : 02DEE16F1099
ii
APPRECIATION
I am Mahasre A/P Selvam from the Department of Electrical and Electronic Engineering
Diploma conveys my heartfelt thanks and highest appreciation to Mr.Jason Tamil Selvam
Kanisan, Senior Engineer of GES Manufacturing and Service Sdn.Bhd for giving me the
opportunity to undergo training for a period of five months which is from 10 December 2018
until 26 April 2019 in GES Manufacturing and Service Sdn.Bhd located at plo 34, fasa 2 ,
With this opportunity, I would also like to thank the Senior Engineer , Mr.Jason Tamil
Selvam Kanisan and staff at GES Manufacturing and Service Sdn Bhd where they
training , I am also very pleased and grateful that so dedication of all, do not feel
tired, patient attitude and taking the time to provide guidance, to share experiences,
advice and assistance to me. What is learned from this firm will my lesson and apply
In addition, I would like to express appreciation to the Politeknik Sultan Haji Ahmad
Shah, especially the Unit of Electrical Engineering who worked tirelessly to guide
Not to forget also to both parents, uncle and aunt and my friends who always
support and encouragement that there are no limits to me. Encouragement of them
iii
Before I conclude my words, I would like to take this opportunity to apologize to all
parties if there are errors and mistakes that I do not accidentally during this exercise.
Finally, I hope GES Manufacturing and service Sdn Bhd will be developed in line
Thank you.
Yours sincerely,
................................................
iv
LIST OF DIAGRAMS
1 Company logo 8
3 component feeder 26
machine
14 Bubble bag 41
15 Tweezers 42
16 Solder wire 42
17 Solder wick 43
v
18 Cutter 44
20 Brush 46
22 Smoke absorber 48
23 Solder iron 49
24 Mislocated alignment 51
26 Removal of PCB 54
vi
CONTENTS
CONTENTS PAGE
Title i
Student confirmation ii
Appreciation iii
Contents iv
vii
CONTENT
CONTENTS PAGE
INDUSTRIAL TRAINING
4.1 Introduction 21
4.5 Summary 56
BIBLIOGRAPHY / REFERENCE
viii
CHAPTER 1
INTRODUCTION
1.1 Introduction
Industry Training is one of the key conditions required of every student who
finished the High School either public or private institutions to qualify for the award
carried out either in government organisations or in the private sector. All students
1
situations. In the process of industrial training, students will be exposed to
atmosphere in a real working environment where students will encounter and learn
about the ins and outs of the real world of work as well as to build experience in a
students but aims to see how the theory they have learned into practice in the
workplace. As such, each student must pass in the training industry as it is one of
Apart from the above, the students were exposed to various attitudes and
personal and some employers during the training period. Therefore, students need
to be smart to adapt and be agile to deal with the problem - a problem that may
arise due to the attitude of some employers in the workplace at the time to come.
Students will also feel confident that the students themselves with more daring in
shouldering responsibility or any assignment given by the firm. With the courage
students will also appear more confident and bold in expressing opinions and dare
to ask any questions that fly through the heads thereby dismiss attitude of shyness
2
i) To give students the opportunity to apply the knowledge and skills they
ii) To expose students to the real working world through the involve
iii) To give students working experience for the course that they have chosen.
After completion of the training industry for one semester in accordance with
generate status students with soft skills. Arrangement polytechnics requires each
student to undergo training in order to prepare a report typed for work or work
typed report shall be prepared because it is one of the scoring system for this
industry practice.
Moreover, the students were exposed to the attitudes of some employers during
the training period. Therefore, students need to be smart to adapt and be agile to
3
deal with the problem that may arise due to the attitude of some employers in the
workplace at the time to come. Students will also feel confident that the students
by the firm. With the courage and confidence in themselves the students
themselves, and of course, the students will also appear more confident and bold
appraiser. This report also aims to keep a record of practical work done during
just learning theory. Although the students have practical module but the
equipment is provided during internship is not the same as training venues. Typed
report is also important to prepare workers for jobs in the face of the future. This is
because the current working environment students can refer to this report if there
are questions about the work you want done. In other words this report as we
The main aim of the Industrial Training program is to produce graduates who are
ready to face the working world. Moreover the program will produce the
are able to apply the knowledge acquired at university to the working world. The
4
Industrial Training program also provides opportunities for exposure to the working
world, which will make graduates more aware of the hopes and expectations that
With this industrial training, the students can contribute a little bit of opinion on
at the firm. Therefore, this may cause arcing opinions and ideas more effectively
where opinion has been backed up can be combined with the opinions of other
employees. Not only that, it also can deepen relationships and can also forge
friendships with fellow students and employees can communicate better. After a
number of things that can are conducted properly, it should also be able to in still a
high spirit of self-learners and workers to continue to work hard.The program will
also equip students with real work experience. Placing students in industry also
possibility that they will be offered a job in the same place where they do their
training. Apart from this, the training experience will further solidify the on-campus
learning process and activities, while also providing students with relevant work
experience.
Furthermore, the Industrial Training has helped many trainees become familiar in
the use of electrical and electronic equipment and mechanical that is not likely to
be used during the learning process. This is because, in a study session in college,
5
I. Practical work done.
III. How to communicate with superiors, superiors, employees, and comply with
IV. Improve the quality of the individual through perseverance do a job, civilized
V. How to carry out tasks efficiently either maintain or given and will ensure
quality of works.
6
CHAPTER 2
ORGANIZATIONAL BACKGROUND
7
2.1.2 Company address and contacts
ADDRESS :
CONTACTS:
TEL : +6075992511
FAX : +6075992511
WEBSITE : www.venture.com.sg
EMAIL : [email protected]
8
2.2 The background of the establishment of the organization
1990 and is based in Senai, Malaysia. GES Manufacturing Services (M) Sdn.
products.
Venture has built know-how and intellectual property with domain expertise in
9
devices, financial-related equipment and technology, industrial, power and
chain, Venture will continue to tap the knowledge and best-in-class capabilities
with global clusters in Southeast Asia, Northeast Asia, America and Europe and
10
2.3 Organizational activities
requirements
III. consumer products with high quality cosmetic and material finishing
applications
11
2.4 Direction of the organization
Vision
Mission
12
2.5 Organization chart
Dennis Goh
General
manager
Senior Product
manufacturing
Engineer Engineer
Juliana MD Razali
Nur Raimi Binti Abd
Jeanette Ilagan Alvar Hamid
Muraly Balakrishnan Vimala
Krishanansamy
13
CHAPTER 3
SUMMARY OF INDUSTRIAL TRAINING ACTIVITIES
3.1 INTRODUCTION
This chapter summarise the activities conducted weekly during industrial
reflection journal are briefly described in the chapter which covers the tasks
the book of daily reports. Therefore, this section will briefly describe my job and
activities that have been carried out in the twenty weeks during the industrial
training. All activities that has been carried out from week to week in order are
practice for what I have learned at polytechnic, I also have been subjected to the
rules and ethics of the company and it should be practiced whenever I am in the
14
production area and office. My job that has been scheduled by the Senior
Engineer, Mr Jason. In industrial training, I was given time for 9 hours a day,
starting at 8:00 A.M - 5:30 PM daily from Monday - Friday. Here is a summary of
the activities done by me for every week until 20th week of the industrial training.
Week Activity
21/12/2018 ) FINDCHIPS.
Technology ).
15
project.
production.
Process (PPAP).
4. Solderability test
16
1. Identify the disalignment and fix it.
1/2/2019) level.
8/2/2019)
17
1. Identify the PCB defect either pad lift or not.
soldering.
22/2/2019)
4. PCB fabrication.
18
3. SAP lagoon and create a product.
15/3/2019)
22/3/2019 )
29/3/2019 ) solution.
machine.
19
1. Identify the defect in Ball grid Array by x-ray
machine.
26/4/2019
20
CHAPTER 4
TECHNICAL REPORTS
4.1 INTRODUCTION
An electronic component is any physical entity in an electronic system used
to affect the electrons or their associated fields in a manner consistent with the
21
4.2 Process flow in Production Line
(SMT) and Through Hole Technology (THT). SMT is a method for producing
electronic circuits in which the components are mounted or placed directly onto
the surface of Printed Circuit Board (PCB). Through Hole Technology (THT) is a
method for fitting components with wire leads into holes in the circuit board [3].
SMT process is mostly applied in production due to most of the project model’s
requires this process instead of THT process. The flowchart below shows the
process flow of a product from the first stage until the last stage:
22
Store
Receiving
Inspection
23
A
Reflow
Packaging
24
4.3 TYPES OF COMPONENTS THAT ARE BEING USED / SPECIFICATIONS
c) Reflow oven
f) Functional testing
Store is a warehouse where all the parts, materials and components are
received from the suppliers and vendors. All these parts, materials and
Incoming Quality Control (IQC) is where the quality of the parts, materials
25
4.3.3 Part preparation (Kitting Process)
feeds is where the components are supplied on plastic tape in tape reels
that are loaded onto feeders mounted to the pick and place machine.
Figure 3 shows the components feeds that will be loaded onto feeders.
The first step of PCB assembly is applying a solder paste to the board.
PCB. These parts are where components will sit in the finished PCB. The
tin, 3% silver and 0.5% copper. The solder pastes mixes solder with a
flux, which is a chemical designed help the solder melt and bond to a
surface. Solder paste appears as a grey paste and must be applied to the
board at exactly the right places and in precisely the right amounts.
intended areas in precise amounts. The machine then spreads the paste
across the stencil, applying it evenly to every open area. After removing
27
Figure4: Squeegee Blade Printing method
28
Figure6: Solder paste printing Machine
circuit board (PCB). They are used for high speed, high precision placing
like capacitors, resistors, integrated circuits onto the PCBs. Some of the
depends on the type of components and parts. The principle of pick and
29
place is using vacuum pressure and precision nozzles to enable
clamped, the nozzles will pick up individual components from the feeders,
rotate them to correct orientation and place them on the PCB. Figure 7
and 8 shows the components feeds are loaded onto pick and place
nozzle.
2. Holding: Components are steadied for rapid movement while the machine
board.
30
Figure7: Pick and place machine
31
4.3.6 Inspection
of tiny electrical components to their contact pads, after which the entire
pencil.
may also be used for through-hole components by filling the holes with
solder paste and inserting the component leads through the paste. Wave
32
highly application specific through-hole components, onto a circuit board
stencils, may allow for the wave soldering step to be eliminated from the
hole components that must be hand soldered with solder wire or cannot
they travel on the conveyor of the reflow oven. The reflow soldering of
particular circuit board assembly, the size and depth of the ground plane
layer within the board, the number of layers within the board, the number
and size of the components, for example. The temperature profile for a
particular circuit board will allow for reflow of solder onto the adjoining
process, there are usually four stages, called "zones", each having a
33
distinct thermal profile: preheat, thermal soak (often shortened to
34
Figure10:Operation of wave soldering Machine
I. Flux Application:
Flux layer is applied to clean all the components and ensures that solder
II. Pre-Heating:
This process heats the PCB board to prevent any thermal shock before
The PCB board passes over a liquid soldering wave. The bottom layer of
the PCB will make contact with a liquid wave of solder, forming a
solder paste is correctly placed on the PCB using AOI machine. If there is
any failure such as missing components and excess solder paste, the
PCB will be send to rework station. After AOI, the PCB will go through the
35
same process from solder paste printing until AOI for the top side of the
or PTH components.
A plated through-hole is a hole in the PCB that's plated all the way
through the board. PCB components use these holes to pass a signal
36
from one side of the board to the other. In this case, soldering paste won't
do any good, as the paste will run straight through the hole without a
process:
components for this very purpose, but PTH components are still common
Before getting into in-circuit testing, let's review some important aspects
of printed circuit (PR) board manufacturing and testing. As you know, the
I. Firstly, assembly and drill drawings of the board are developed from the
37
placed, where each track (wiring connection) will be etched, where each
II. Then, holes for the component leads are drilled in a blank board and
tracks are etched on the surface of the board to connect the components
together.
III. Next, the components ate mounted on the board. Either by hand or
IV. Finally, the component leads arc soldered to the tracks, usually by
38
After the FCT PCBA process is finished, a final inspection will test the
The test puts the PCB through its paces, simulating the normal
signals run through the PCB in this test while testers monitor the PCB's
outside of a predetermined range, the PCB fails the test. The failed PCB
standards.
Testing is the final and most important step in PCB assembly process, as
it determines the success or failure of the process. This testing is also the
process is so important.
Outgoing Quality Control (OQC) is the last station before packing and the
product will be sent for shipment. OQC is the last inspection for the
product. OQC team will do inspection for 100 boards. If the 32 first batch
of boards pass the inspection, the whole batch will be considered as pass
and proceed for packing process and shipment. If there is any faults such
as wrong part and reversed part in the first 32 batch of boards, the whole
batch will be considered as fail and need to inspection for all board.
39
4.3.13 Packaging
Packing is the final stage before the PCB is sent for shipment. There are
many types of packaging such as carton box, bubble sheet, label and
ESD bag.
40
Figure14: Bubble bag
has been passed the In Circuit Test (ICT), Function Circuit Test (FCT)
examples that require rework are excess solder, lifted part, reversed part,
4.4.1.1 Tweezers
41
Tweezers is a small tools used for picking up small objects and to
Figure15: Tweezers
Solder wire is required when the PCB have faults when the
again. There are two types of solder wire; Lead Free and Leaded.
42
Figure16: Solder wire
Solder wick is use to absorb excess solder on the PCB after re-
solder during rework. The end length of solder wick is placed over
connections are heated with a soldering iron until the solder melts
and is wicked into the solder wick. The Figure 17 below shows a
solder wick.
4.4.1.4 Cutter
cutter.
43
Figure18: Cutter
Sucker solder pump is use to suck away molten solder. The pump
44
Figure 19: Solder sucker pump
4.4.1.6 Brush
brush.
45
Figure20: Brush
PCB board heater is use to melt solder paste on PCB for rework.
46
Figure21: PCB Board Heater
health. When soldering two metal joints, the solder melts and gives
rise to toxic smoke. There are two prominent types of solder; Lead
Oxide and Rosin based flux and colophony. Lead Oxide fumes are
order to remove the oxidation from the base and filler metals, flux
47
Figure22: Smoke Absorber
melt solder so that it can flow into the joint between two parts; the
solder iron.
48
Figure23: Solder Iron
In this subtopic I would like to share one of the processes of work done by
other product engineers. All the tasks required to deal with internal team
confidential and I am not allowed to write it in this report. I also have been
49
4.5.1 The connector doesn’t fit the PCBA and loosen screw
In this subtopic I would like to share one of the processes of work done
insert line. The problem was the connector doesn’t fit into PCB in order
to insert the nut and screw. Firstly, get verification from the operators.
And then I tried myself to Place the PCB onto the screwing jig and insert
the nuts according to the hole. After that, insert the connector on
screwing jig and place the PCB and insert screw. Tighten the screw by
using torque, the setting was 2.5-3.0 lbs. the screw was not get tighten
to the PCB. So, check the torque setting, the setting was 2.8 lbs. And
then, increase the torque setting to 3.0 -3.5 lbs. by using the
In this subtopic I would like to share one of the processes of work done by
me during the Industrial Training. On 7th week I have done identify the
the Ic been dislocated because of the nozzle sucker. And then, the pcba
50
Figure24 : mislocated alignment
After the wave solder , check the solder paste has been pasted or have
any other issue such as bridge solder, cold joint, insufficient wetting,
excessive solder and solder pad lifted by using fish magnifying glass or
Digital microscope visual inspection. Identify the defect and send to rework
station. Take the serial number to check again after full clean oven.
51
Figure 25: Digital Microscope visual inspection
(ball grid assemblies) and other SMT devices. Effective PCB X-ray
camera to examine the piece from all angles. The operator views the
images on a screen, and the camera can capture images for inclusion in
IPC-A-610 inspection criterion for the given class of the assembly is one
criteria for x-ray inspection of BGAs. After that, I Remove the PCB from
static shield bag. Make sure that properly grounded when handling an
52
electronic assembly according to EOS/ESD 2020 guidelines or internal
company guidelines.
And then, I identify the area of interest and mark with a rework label on
the area or device of interest. This thing helped me in locating the source.
The Quality control loads the PCB into the x-ray chamber.Make sure all of
By using the laser pointer in the x-ray system, it is easy to manipulate the
table such that the area of interest shows up on the operator interface x-
ray screen. Locate the BGA requiring x-ray inspection.Inspect looking for
faults such as shorts, opens, bridges and the like. Take snapshots or
videos of these anomalies. Inspect the entire BGA then zoom in to "walk"
voiding and other issues. Analyze the part solder ball images of the BGA
53
Figure26 : Removal of PCB
54
Figure28 : Inspecting the BGA X-ray Images
55
4.6 Summary
In conclusion, from this project I have learnt on how to use X-ray machine
and identify the defect from the result. I also learnt to troubleshooting the
56
CHAPTER 5
SUMMARY
in the field of electronic engineering and the role of the coach in a job. In
addition, it also can balance the knowledge and enhancing their knowledge of
each trainee as an engineering student who is not only capable in theory but in
Therefore, every student will be able to use theoretical and practical skills
to be combined in accordance with the actual situation. With this, not denied any
knowledge during this exercise will be used at the workplace. During the
which they were placed together whether they have been involved in the
gained will be useful to students in order to prepare the workplace true even
within a given time is short training. In this period, students can also
57
communicate with many more people in the field work either with the upper class
In addition, for those who lack proficiency in the language also indirectly
because English is widely used in the industrial sector. With this, the students
should have the initiative to find what is learned and not just expect someone
else. Although only a five-month training period, it should not be a deterrent for
not a true fact that this industry is very useful to add more knowledge and
can train the skills which I learned during the study at the Polytechnic where it
the students to face the real work that will be encountered in the future. This is
because the industry practice has been to provide the appropriate disclosures
about the intricacies of preparing students for work in the working environment.
The training also can not only improve my self-confidence to face the real
working environment but also helped me improve the way I communicate with
people. Cooperation in the training of staff is also very good and has taught me
a sense of the enormity of cooperation. I feel very proud and fortunate to have
the opportunity to undergo training in the industry. The training can also form
58
good interpersonal skills in the students to work more organized and disciplined.
Among them is the way the employer should put the students do assignments
within the prescribed training. As a student in college, students must comply with
the instructions given by the lecturers. With these students can train yourself to
be more disciplined and know how to organize systematic and determine the
the students about the real working and living the ethical values of work and also
have the opportunity to enhance their creativity and contribute ideas appropriate
to the organization with more courage and confidence as well as plant and
The training also can not only improve my self-confidence to face the
real working environment but also helped me improve the way I communicate
with people. Cooperation in the training with staff is also very good and has
taught me a sense of how great cooperation. I feel very proud and fortunate to
present to get a job in any company, we must have the skills on which our office
need actually.
59
company environment . I have learned how to manage time and appreciate
teamwork among colleagues. In fact, I also follow what I have learned in the
and new experience for the students to be bold in taking risks in a real job and a
pretty valuable lesson for students to serve as a guide in the future. Moreover,
make a wise decision to choose a career and use the experience as good as
possible.
60
CHAPTER 6
6.1 COMMENTS
i . Provide guidance and attention to students who will undergo industrial training.
ii. Ensure students receive training in accordance with the courses involved.
61
6.2 SUGGESTIONS
During my training period in the company nothing had happened, but here I
would like to suggest a few things that can be shared to enhance the Polytechnic
and the companies involved in the future. Here is some suggestions that I would
like to give :
ii. Provide employees with the ability to provide tutoring to students who undergoing
industrial training.
iii. Provide more extensive disclosures about the real world of work.
62
BIBLIOGRAPHY / REFERENCE
1. https://qualityinspection.org/functional-tests-smt-china/
2. http://www.suron.com/portfolio/wave-solder-pallets/
3. https://courses.cs.washington.edu/courses/cse467/04wi/lectures/ppt/Intro_to_
SMT.pdf
4. https://www.instructables.com/id/How-to-X-Ray-Inspect-a-BGA/
5. https://www.slideshare.net/billcardoso1/how-to-find-defects-in-smt-
electronics-manufacturing
6. https://www.slideshare.net/abishus/smt-notes