PRODUCT PROFILE
ELECTROLOY NO CLEAN
                                              LEAD FREE WIRE
Product Name                                                                                                 Product Code
#75 FLUX CORED SOLDER                                                                                        EM#75-315W
-LEAD FREE ALLOY-Sn99.0/Ag0.3/Cu0.7
The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assure legal
responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or
products referred to herein. No warranty of fitness for a particular purpose is made. Properties are typical and not to be used as specifications.
DOC CATEGORY: 3                                                                                   PF – EM#75-315W – 22052017 – REV.B – Page 1 of 4
                                          . China . Malaysia . Singapore
PRODUCT DESCRIPTION
EM#75-315W* is a halogen free† no-clean cored flux lead free wire with alloy composition 99.0%Tin,
0.3%Silver and 0.7%Copper. This type of cored flux wire provides good wetting and leaves clear
residue. This is a RoHS compliance lead free solder wire.
* Patent No : US 5527628
† Halogen free as per specification of the standard IPC 4101B, IEC 61249-2-21 and JPCA-ES01
CHEMICAL COMPOSITION OF ALLOY
Quality of Electroloy’s EM#75-315W lead free solder wire in terms of composition of alloy is controlled
strictly under Electroloy’s Lead Free Specification LF-315.
                                          Elements                                             Specification
                                                                                                 (%wt/wt)
                                          Tin                    Sn                             Remainder
                                          Lead                   Pb                             Max 0.050
                                          Aluminium              Al                             Max 0.005
                                          Antimony               Sb                             Max 0.050
                                          Arsenic                As                             Max 0.030
                                          Bismuth                Bi                             Max 0.050
                                          Copper                 Cu                              0.6 – 0.8
                                          Iron                   Fe                             Max 0.010
                                          Zinc                   Zn                             Max 0.003
                                          Cadmium                Cd                             Max 0.002
                                          Silver                 Ag                              0.2 – 0.4
                                          Nickel                 Ni                             Max 0.010
                                          Indium                 In                             Max 0.050
                                          Gold                   Au                             Max 0.050
The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assure legal
responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or
products referred to herein. No warranty of fitness for a particular purpose is made. Properties are typical and not to be used as specifications.
DOC CATEGORY: 3                                                                                   PF – EM#75-315W – 22052017 – REV.B – Page 2 of 4
                                          . China . Malaysia . Singapore
CHEMICAL COMPOSITION OF FLUX
The standard flux content for this type of solder wire is 2.5 +/- 0.2%. However, other percentages of
flux are available upon request. The range for the flux percentage is 2.0% – 3.5%.
FEATURES OF CORED FLUX
      Flux
     Cored                                                    Features                                                     Cleaning Method
     Type
                          Halogen free† with clear flux residue suited for no-clean
  No- Clean
                          hand soldering assemblies. Exhibit good wetting
  Halogen
                          characteristics. Widely and most popular choice for                                                     No-clean
    Free†
                          assemblies       requiring  no-clean,    clear    residue
   EM#75
                          characteristics.
                                     CHARACTERISTICS OF CORED FLUX EM#75
      Physical Properties
              and                                     Specification                          Test Method                        Result (Typical)
        Reliability Data
                                                                                                                                    Halogen Free†
Flux Type                                                        -                                      -
                                                                                                                                      No Clean
Class Type                                        Refer to J-STD-004                              -                                     ROL1
Color/Appearance                                            -                                     -                                  Milky Yellow
Odor                                                        -                                     -                                      Mild
Halide Content (%)                                                                           JIS Z 3197,
                                                        Max 0.08 %                                                                       0.00 %
(Chloride and Bromide)                                                                     Method 8.1.4.2.1
                                                                                              J-STD-004,
Corrosion Test                                                Pass                           IPC-TM-650,                                   Pass
                                                                                             Method 2.6.15
SIR,IPC(Typical)                                                                               J-STD-004,
85°C / 85% RH                                           Min   1×108                          IPC-TM-650,                             ≥1.0×109 
After 168 hours                                                                              Method 2.6.3.3
                                                         Min 65%
                                                                                         JIS Z 3197, Method
Spreading (%)                                       Lead Free Solder                                                                      ≥80%
                                                                                               8.3.1.1
                                                     (JIS 3283:2006)
The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assure legal
responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or
products referred to herein. No warranty of fitness for a particular purpose is made. Properties are typical and not to be used as specifications.
DOC CATEGORY: 3                                                                                   PF – EM#75-315W – 22052017 – REV.B – Page 3 of 4
                                          . China . Malaysia . Singapore
PHYSICAL APPEARANCE
Electroloy’s solder wire exhibits a shinning appearance and in grey uniform color. A wide range of
diameter for the wire is available, 0.2– 2.4mm (+/-0.05mm) , 2.5mm – 3.5mm (+/-0.1mm) ,3.6mm –
4.5mm (+/-0.2mm) and ≥4.6mm(+/-0.3mm).
CLEANING
The flux residue is not conductive and is not corrosive to metal parts. Therefore, cleaning is not
required in most application.
APPLICATION
Solder iron tip temperature should be between 350 – 430oC. Hold the solder iron tip at a 45o to 60o
angle with work surface. The solder iron should contact both the component lead and PCB pad
surface.
PACKAGING
Each spool of solder wire is approximately 0.5kg or 1.0kg and shall be secured by paper and rolling
tape. The solder wire shall be packed in carton boxes of about 10kg per box. Other special size and
packaging requirement can be requested. The traceable information will be shown on the box such as
vendor’s name, alloy composition, net weight and lot number.
DELIVERY
Each shipment shall be accompanied with Certificate of Analysis for each lot, which indicate the
amount of constituents and impurities.
STORAGE AND SHELF LIFE
Electroloy’s EM#75-315W lead free solder wire has limited shelf life which is 18 months from the date
of manufactured when handled properly. Dry and non-corrosive storage environment is needed to
minimize the wires from further oxidation. Ensure that the packaging is not damaged and the wires
are not exposed to dust and other foreign materials.
HEALTH AND SAFETY
Refer to the SDS for guidance on safety and health issues.
The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assure legal
responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or
products referred to herein. No warranty of fitness for a particular purpose is made. Properties are typical and not to be used as specifications.
DOC CATEGORY: 3                                                                                   PF – EM#75-315W – 22052017 – REV.B – Page 4 of 4
                                          . China . Malaysia . Singapore