Nanoporous CrN Thin Films for Supercapacitors
Nanoporous CrN Thin Films for Supercapacitors
h i g h l i g h t s g r a p h i c a l a b s t r a c t
a r t i c l e i n f o a b s t r a c t
Article history: Transition metal nitrides (TMN) have received widespread consideration as supercapacitor materials for a
Received 27 March 2021 variety of energy storage applications. An important requirement to such electrode materials is a very
Revised 26 June 2021 high specific surface area, which is typically obtained through a percolating pore-network. Here, we
Accepted 28 June 2021
use arc ion plating to prepare CrN-Ni composite coatings with 0, 30.4, 54.2, and 77.6 at.% Ni. Detailed
Available online 29 June 2021
X-ray diffraction and X-ray photoelectron spectroscopy showed that the coatings consist of CrN phases
next to metallic Ni. Post-deposition treatments with HCl solutions lead to selective leaching, causing a
Keywords:
porous nanostructure for the Ni-containing CrN coatings. From there, the coating with 54.2 at.% Ni in
PVD thin film
Nanoporous supercapacitor
its as-deposited state provided the highest (electrode-geometric-area)-specific capacitance after the
Specific capacitance HCl treatment, giving 58.5 mFcm2 at 1.0 mAcm2 in a 0.5 M H2SO4 aqueous electrolyte. This value
porous CrN is about 80 times higher than for the as-deposited coatings or the Ni-free CrN. Consequently, our strategy
to combine TMNs with metallic Ni and its subsequent treatment with HCl is highly effective in enlarging
the specific surface area and adsorption sites. It allows to significantly enhance the energy storage per-
formance of TMN thin film supercapacitors.
Ó 2021 Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://
[Link]/licenses/by-nc-nd/4.0/).
1. Introduction
[Link]
0264-1275/Ó 2021 Published by Elsevier Ltd.
This is an open access article under the CC BY-NC-ND license ([Link]
Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
nation with other energy storage options – to offer improved bination of CrN with Ni a faster formation of the porous structure
power efficiency and enhanced cycle life. Therefore, SCs are avail- can be obtained (3 h in 3 M HCl) allowing for a specific capacitance
able for many energy storage applications, such as regenerative of even 58.5 mFcm2. All these Ca values refer to a current density
braking, short-term energy storage, miniaturized energy storage of 1.0 mAcm2 or a scanning rate of 100 mVs1, further data of
devices, and emergency power supplies [1–4]. Typically, there some literature values are given in the Table S1.
are two storage mechanisms for SCs: 1) electrochemical double- Previously reported works have been mainly focusing on the
layer capacitors (EDLC, electrochemical adsorption/desorption only optimization of material selection, composition, and deposition
occur on the surface of the electrodes, like carbons) and 2) pseudo- parameters of the thin films, while in this study, a novel
capacitor (electrosorption, reduction–oxidation reactions, and microstructure design strategy was applied to synthesize nanopor-
intercalation processes, like oxides). Thus, an ideal SC should have ous thin film electrodes through PVD and subsequent selective
a high specific surface area for charge adsorption and/or chemical chemical etching processes. This combined procedure for CrN-Ni
reaction [5,6]. As the most important constituent of SCs, various thin films showed a remarkably enhanced capacitive performance
electrode materials have been extensively developed in recent as compared with other reported thin film systems. Generally, the
years, both in their compositional and morphological design. The combination of nitride coatings with Cu [48–52], Ni [53–55], Ta
most common one is shaping high conductive carbon-based mate- [56], or Ag [57,58], is warmly welcome for reducing the friction
rials to specific morphologies (such as, nanotube, nanofiber, nano- coefficient, enhancing the toughness, increasing plastic deforma-
wire, nanoflower, and nanorods [7,8]), which are then covered with tion and corrosion resistance. The ductile metallic phase is perco-
transition metal oxides (TMO, such as Co3O4, MnO2, Nb2O5, TiO2, lating throughout the typically brittle, but corrosion resistant
TiO3, HfO2,and RuO2) [9–19] to obtain their combinations as TMN matrix [59]. Here, we used arc ion plating to prepare a CrN
TMO@C or TMO/C. The other option is to dope the shaped carbon matrix – CrN combines high strength [60] with excellent corrosion
with N/O/S/P [20–26]. This is a mutually beneficial cooperation [61] and oxidation resistance [62], and specific capacitance [34] –
of EDLC and pseudocapacitor, getting a massively increased speci- in which metallic Ni is uniformly distributed. After the deposition,
fic surface area for chemical reactions and charge absorptions, and the Ni is thoroughly etched away using an HCl solution, to prepare
greatly increasing energy density [27]. The comparison of their a sponge-like CrN coating. A schematic illustration of the fabrica-
specific capacitance is depicted in the supplementary data, in tion process of the porous CrN thin films is shown in Fig. 1. We pro-
Table S1. However, their fabrication is quite complicated and vide a detailed study on how the Ni content and the chemical
sometimes not eco-friendly, involving hydrofluoric acid etching etching parameters influence the microstructure, morphology,
and annealing. and electrochemical properties of these CrN-Ni thin films. The
Except for carbons and oxides, there are also lots of other SC maximum (electrode-geometric-area)-specific capacitance value
electrodes, such as carbides (e.g., TiC [28]), sulfides (e.g., TiS for the porous (after etching) CrN–Ni thin films exceeds those of
[29]), nitrides (e.g., TiN [30]), and borocarbonitrides [31]. Among the as-deposited CrN–Ni and CrN by a factor of ~ 80. The strategy
them, the physical vapor deposited (PVD) transition metal nitride outlined here, can be universally applied for modifying the surface
(TMN) thin films are very promising [32]. The reported TMN elec- and cross-sectional morphology of TMN films and enlarge their
trodes, such as CrN [33–35], TiN [30,36,37], VN [38,39], Mo2N [40– specific surface area and adsorption sites. This procedure shows
42], and TiNbN [43] have exhibited good performance in service great potential for optimizing the energy storage performance of
life, as a result of their high conductivity, high structural and chem- TMN thin film supercapacitors.
ical stability, and have found also their position for supercapacitor
applications. PVD techniques, especially magnetron sputtering and
arc ion plating, are widely used in high-quality TMN coating fabri-
cation [44,45]. PVD-produced transition metal nitride (TMN) film
electrodes have many advantages over traditional powder-type
electrode materials, including binder-free fabrication, good adhe-
sion, uniformity, and easily controlled composition and thickness.
This makes them promising candidates for flexible thin-film super-
capacitors and on-chip micro-supercapacitors. The specific capaci-
tance of TMN electrode materials is based on the high-speed
electrostatic adsorption. Storing the charge on the electrodes and
the interface of active materials at the electrolyte, requires a very
large relative ion-accessible surface area. Therefore, the main work
of the present study focuses on how to obtain a sufficiently porous
structure and rough surface of PVD TMN thin films. Recently we
showed that the (electrode-geometric-area)-specific capacitance
Ca of magnetron sputtered ~ 1-mm-thin HfN can be improved from
0.7 to 5.6 mFcm2 by a post-deposition etching with Ar plus Kr ion
beams, enlarging its specific surface area [46]. This is in the range
of magnetron sputtered TiN, exhibiting a Ca value of ~ 3 mFcm2
for the ~ 1-mm-thin film, increasing to 8.8 mFcm2 for the 2.2-
mm-thin film [36]. CrN (1.1 mm thin) provides already in its as-
deposited state – by conventional magnetron sputtering – a much
higher Ca value of 12.8 mFcm2 [34], which further can be
improved to 17.7 mFcm2 [33] or even 35.4 mFcm2 [35] using
glancing angle deposition. When preparing a porous CrN out of a
magnetron co-sputtered CrN-Cu coating – by a subsequent selec-
tive chemical etching for 3–4 days with an 0.5 M HNO3 – the speci-
fic capacitance can also be improved to 31.3 mFcm2 [47]. Here, Fig. 1. Schematic illustration of the fabrication process for porous CrN thin films:
we use a corresponding technique, but show that through the com- (a) as-deposited CrN, (b) as-deposited CrN–Ni, and (c) porous CrN films.
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
Table 1
Target currents, etching time, and compositions of the CrN–Ni thin films in the as-deposited state and after the treatment in a 3.0 mol·l1 HCl bath (indicated with an asterisk).
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
from 0 to 90 A and simultaneously decreasing the current at the Cr coating – basically a Ni matrix with CrN precipitates is formed –
target from 90 to 0 A, see Table 1. Therefore, their Cr and N con- chemical etching with the 3.0 M HCl would require significantly
tents decreased continuously from around 50 to 10 at.%. longer times for a more pronounced dissolution. The removal of
Detailed studies on the effect of the HCl solution concentration Ni from the CrN-Ni30 and CrN-Ni54 coatings is promoted by their
over the potential range from 0.2 and 0.8 V showed best results in high fraction of phase-boundaries between Ni and CrN supporting
current density for the CrN-Ni54 thin film (as measured by the cyc- access of the HCl solution.
lic voltammetry (CV) at a scan rate of 100 mVs1 and galvanostatic XRD investigations of the as-deposited coatings show the face
charge–discharge (GCD) at a current density of 1.0 mAcm2), centered cubic (fcc) CrN phase, see their (1 1 1) and (2 0 0) diffrac-
when using a 3.0 mol·l1 concentration (the curves for the individ- tion peaks at 37.5 and 43.7° in Fig. 3a. The small peak at the left-
ual HCl concentrations are provided in the supplementary data hand shoulder of the (2 0 0) fcc CrN peak for the CrN-Ni54 coating
Fig. S1). The area-specific capacitance Ca of the Ni-containing sam- might indicate the presence of a small fraction of the hexagonal
ples CrN-Ni30, CrN-Ni54, and CrN-Ni78 peaked with 11 h, 3 h, and Cr2N phase. For the other coatings, this is probably hidden behind
4 h of dissolution time within the 3.0 M HCl bath, respectively, their relatively broader XRD peaks. With increasing Ni-content, the
see Fig. 2a (and supplementary data Fig. S2). The samples providing XRD peaks at 44.5 and 51.8° (indicative for the (1 1 1) and (2 0 0)
the Ca peak-values are indicated with an asterisk: CrN-Ni30* (11 h lattice plane distances of fcc-Ni) increase in intensity. No nickel
treatment time), CrN-Ni54* (3 h treatment time), and CrN-Ni78* nitride phase could be detected, in agreement to the known weak
(4 h treatment time). As expected, there is no change for the Ni- nitride forming tendency of Ni [63]. After the HCl solution treat-
free CrN thin film, but the sample CrN* refers to the maximum ment, almost no crystalline Ni phase can be detected anymore
treatment time of 18 h in the 3.0 M HCl solution. Fig. 2b shows for CrN-Ni30* and CrN-Ni54*, see Fig. 3b. Contrary, the CrN-Ni78*
the Ca peak-values for our samples with respect to the Ca values coating still shows a pronounced crystalline Ni phase content in
in their as-deposited state, obtained at a current density of agreement with the chemical investigations, see Table 1. The pro-
1.0 mAcm2. This comparison clearly shows that the highest Ca file of the XRD peaks from the CrN phase did not change due to the
value with ~ 58.5 mFcm2 is obtained with the CrN-Ni54 coating HCl solution treatment (please compare Fig. 3a and b), especially
(54.2 at.% Ni), followed by ~ 18.0 mFcm2 for the CrN-Ni78 coating when considering the changed contribution from the Ni phase. This
(77.6 at.% Ni). When compared to their as-deposited condition, the furthermore indicates the excellent chemical stability and corro-
CrN-Ni30, CrN-Ni54, and CrN-Ni78 coatings experienced an increase sion resistance of CrN.
in their Ca values by a factor of ~ 16, 80, and 11, respectively, clearly SEM top view investigations of the coatings clearly show the
highlighting the massive improvement in Ca due to the HCl treat- formation of a porous structure due to the HCl solution treatment,
ment. This is because, by the HCl treatment a porous structure is when Ni was present in the as-deposited state. The Ni-free CrN
formed, which will be presented later. The Ni content of the sam- thin film exhibits a dense and smooth surface before and after
ples massively decreased due to the HCl solution treatment, from etching, see Fig. 4a and b, respectively, again underlining the excel-
30.4 to 8.2 at.% for CrN-Ni30, from 54.2 to 7.1 at.% for CrN-Ni54, lent corrosion resistance of CrN [64]. The 30.4 at.% Ni containing
and from 77.6 to 54.0 at.% for CrN-Ni78, see Table 1. As expected, sample (CrN-Ni30) shows some small particles at the surface
the chemical composition of the Ni-free CrN sample shows no (Fig. 4c), which were removed by the etching treatment (CrN-
obvious difference before and after 18 h of HCl etching, indicating Ni30*, Fig. 4d). The sensitivity to the HCl solution treatment sug-
the excellent chemical stability of CrN. Due to the etching proce- gests these particles to be metallic Ni. Independent on the HCl
dure – as most of the Ni is etched away especially for the CrN- solution treatment-time, the surface of this sample always was
Ni30 and CrN-Ni54 coatings – also their overall Cr content increased rather smooth, indicating that the Ni content of this sample
to 41.8 and 43.5 at.%, respectively, Table 1. The HCl solution nicely (CrN-Ni30) is too low to allow its complete percolation throughout
changed its color into green, due to Ni dissolution (Fig. S3, supple- the matrix. In other words, the metallic Ni phase is not intercon-
mentary data). Due to the very high Ni content of the CrN-Ni78 nected but rather present as pockets encapsulated by the
corrosion-resistant ceramic CrN.
Fig. 2. (a) Comparison of specific capacitance of the coatings CrN, CrN-Ni30, CrN-
Ni54, and CrN-Ni78 after different immersion times in HCl solution (current density:
1.0 mAcm2). (b) Comparison of the peak-values in specific capacitance of these Fig. 3. XRD patterns of (a) as-deposited coatings and (b) coatings after the HCl
samples to their as-deposited state (current density: 1.0 mAcm2). treatment for various times to obtain their highest specific capacitance (Fig. 2).
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
Fig. 4. Top-view SEM images of CrN (a and b), CrN-Ni30 (c and d), CrN-Ni54 (e and f), and CrN-Ni78 (g and h) coatings in their as-deposited state and after the HCl treatment
to obtain their highest specific capacitance (Fig. 2), respectively. The white horizontal line has the same length in all SEM images and represents the scale bar of 1 mm.
The CrN-Ni54 coating (54.2 at.% Ni) shows much larger particles enced by the HCl treatment for 18 h (Fig. 5b). In agreement with
at the surface already in its as-deposited state, Fig. 4e. After the 3 h the plan-view SEM investigations (Fig. 4), also the cross-sectional
treatment in the HCl bath, the SEM top-view investigations already morphology of the CrN-Ni30 coating is only slightly influenced by
indicate for a sponge-like morphology with a high porosity (CrN- the HCl solution treatment. Considering the noticeable change in
Ni54*, Fig. 4f). Consequently, here the Ni content was sufficiently Ni content (from 30.4 down to 8.2 at.%) this is somehow surprising
high to allow for the formation of an interconnected Ni-network and suggests the formation of rather small pores. Contrary, the
in the as-deposited state. Our data furthermore show that the CrN-Ni54 coating shows a significant change in cross-sectional
HCl solution treatment-time needs to be controlled, to allow that morphology across the entire thickness of the Ni-containing part,
most of the Ni-phase is dissolved, leading to a maximization of due to the HCl solution treatment. Already in its as-deposited state,
the porosity. However, if the treatment time is too long, the this coating is characterized by a rather rough cross-sectional mor-
remaining CrN-skeleton may be separated from the CrN adhesion phology due to the competitive growth of the Ni and CrN phases.
layer and influence the electrodes’ service life. These SEM studies nicely show that the generated pores (due to
The impressions from the top-view SEM investigations are in- the dissolution of most of the Ni-phase, please remember that here
line with detailed AFM analysis (supplementary data Fig. S4, scan- the Ni-content decreased from 54.2 to 7.1 at.%) percolate through-
ning over a surface area of 20 20 mm2) yielding root mean square out the entire outer CrN–Ni layer (Fig. 5f). The highest Ni contain-
roughness (Rq) values of 7.8 and 152.0 nm for the coatings CrN and ing coating, CrN-Ni78, reveals a smoother appearance especially of
CrN-Ni54, respectively. By the HCl solution treatment for 3 h, the Rq the surface-near region in the as-deposited state (Fig. 5g), with
value of the CrN-Ni54 coating increased further to 185.0 nm. The even some pores present underneath this area. However, after
SEM top-view investigations already indicated the increased sur- the HCl solution treatment, no percolating pore-network formed
face roughness by this HCl solution treatment (compare Fig. 4e (Fig. 5h). The studies furthermore show that all samples have
and f). nearly the same entire coating thickness of ~ 1.0 mm.
Further increasing the Ni content to 77.6 at.% leads to a coating Based on these SEM top-view (Fig. 4) and SEM fracture cross-
(CrN-Ni78) that shows already in the as-deposited state (Fig. 4g) a section (Fig. 5) studies, we can conclude that the most effective
less promising surface quality than the CrN-Ni54 coating. The sur- form of a fully percolating pore-network, due to the HCl solution
face is characterized by fewer homogenously distributed particles, treatment, is obtained for the 54.2 at.% Ni containing coating,
but some very large ones as well. After a 4 h treatment in the HCl CrN-Ni54. This coating exhibits a high porosity after the HCl treat-
bath, ring-shaped holes formed at the surface, suggesting that ment (considering that the coating thickness remained the same,
especially at the CrN–Ni interfaces the dissolution kinetic is faster. but its Ni content decreased from 54.2 to 7.1 at.%), with well-
In general, these SEM investigations indicate that for this sample distributed pore-sizes (Fig. 6), where ~ 30-nm-sized ones build
the Ni content is too high. Thus, out of the three Ni-containing the highest fraction. According to Huang et al. [65], the most ideal
CrN samples, the CrN-Ni54 coating showed the most promising for- pore size for providing aqueous electrolyte pools and fast ionic
mation of a porous material after the HCl solution treatment, based transport channels for supercapacitor electrodes is in the range
on these SEM top-view investigations. 2–50 nm. Smaller pores (<2 nm) – smaller than the size of solvated
Whether the formed pores also expand throughout the coating electrolyte ions – do not contribute to energy storage, and larger
thickness was studied by SEM fracture cross-sections, Fig. 5. The pores (>50 nm) do not provide a sufficient specific surface.
Ni-free CrN thin film shows the most compact cross-sectional mor- Although the CrN-Ni78* is also very porous (Fig. 4h), the pore size
phology in the as-deposited state (Fig. 5a), which is only a bit influ- is not nicely distributed. CrN-Ni54* offers the highest area-
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
Fig. 5. Fracture cross-sectional SEM images of CrN (a and b), CrN-Ni30 (c and d), CrN-Ni54 (e and f), and CrN-Ni78 (g and h) coatings in their as-deposited state and after the
3.0 M HCl treatment to obtain their highest specific capacitance (Fig. 2), respectively. The solid and dashed white horizontal lines have the same length in all SEM images and
represent the scale bar of 1 mm. The dashed line indicates the interface between CrN adhesion layer and CrN-Ni coating, the solid line indicates the interface between Si
substrate and CrN adhesion layer.
Fig. 7. XPS core-level spectra of (a and b) N 1 s, (c and d) Cr 2p, and (e and f) Ni 2p3/2 energy regions for the CrN-Ni54 coating in its as-deposited state (CrN-Ni54) and after the
3.0 M HCl treatment (CrN-Ni54*) to obtain its highest specific capacitance (Fig. 2), respectively.
Fig. 8. (a) CV curves (scan rate: 100 mVs1) and (b) GCD curves (current density: 1.0 mAcm2) of CrN, CrN-Ni30, CrN-Ni54, and CrN-Ni78 in their as-deposited state. (c) CV
curves (scan rate: 100 mVs1) and (d) GCD curves (current density: 1.0 mAcm2) of these coatings after 3.0 M HCl treatment to obtain their highest specific capacitance
(CrN*, CrN-Ni30*, CrN-Ni54*, and CrN-Ni78*).
Electrochemical impedance spectroscopy (EIS) was conducted high-frequency region, and the equivalent circuit diagram for these
to study the charge transfer and ion diffusion properties of the EIS measurements is given in Fig. 9c. Just for a brief recall: in such
electrode materials. Fig. 9a and b show the Nyquist plots obtained Nyquist plots, Z’ and Z’’ represent the real and imaginary part of
by these EIS measurements of our samples in their as-deposited impedance, respectively. At the left side of these diagrams (close
state and after the HCl solution treatment leading to their Ca to 0 of Z’ and Z’’, the high-frequency side) a semicircle followed
peak-values, respectively. The insets show a detailed view of the by a straight line indicates capacitive behavior. Their small impe-
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Fig. 10. (a) CV curves at different scan rates (in mVs1), (b) GCD curves at different current densities (at mAcm2), (c) CV curves of the 1st, 300th, 1000th and 2000th cycle
and (d) cycling performance at a scan rate of 100 mVs1, for the CrN-Ni54 coating after the 3 h treatment time in a 3.0 M HCl bath (after which this coating reached its peak
area specific capacitance, Fig. 2, due to the formation of a fine porous morphology, Figs. 4 and 5).
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
which still 88.5 ± 0.5% of the initial capacitance remains. The initial Acknowledgements
decrease in capacitance comes from the irreversible consumption
of the electrode (basically remaining Ni) in the electrolyte. This This work was supported by the projects of the National Natural
leaves room to further optimize the pre-treatment procedure. Science Foundation of China (Grant No. 51875109), and Natural
However, the cycling performance is better than that of nitride- Science Foundation of Guangdong Province of China (Grant No.
based electrodes prepared from nitridation of metal oxides, such 2020A1515010968), and the National Key Research and Develop-
as VN@CF (which exhibit 82% capacitance retention after 1000 ment Project of China (Grant No. 2017YFE0125400). ZG thanks
cycles) [71]. Still, it seems to be slightly less stable than that of the support of the State Scholarship Fund of China (No.
other nitride-based electrodes prepared by PVD, such as CrN 201908440933) during her PhD at TU Wien.
(92.1% retention after 20,000 cycles) [34], TiVN (99% retention after
10,000 cycles) [72], and CrCuN (94% capacitance retention over Appendix A. Supplementary material
20,000 cycles) [47]. However, our data suggest that after the
‘‘running-in” period (for the first 600 cycles), a steady state behav- Supplementary data to this article can be found online at
ior is obtained during which the area-specific capacitance of the [Link]
CrN-Ni54* film electrode is unchanged at 88.5 ± 0.5% (Ca ffi 50.0
mFcm2) of its initial value (58.5 mFcm2). References
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Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
[18] J.H. Sung, J.H. Park, D.S. Jeon, D. Kim, M.J. Yu, A.C. Khot, T.D. Dongale, T.G. Kim, [40] G. Ma, Z. Wang, B. Gao, T. Ding, Q. Zhong, X. Peng, J. Su, B. Hu, L. Yuan, P.K. Chu,
Retention enhancement through capacitance-dependent voltage division J. Zhou, K. Huo, Multilayered paper-like electrodes composed of alternating
analysis in 3D stackable TaOx/HfO2-based selectorless memristor, Mater. stacked mesoporous Mo2N nanobelts and reduced graphene oxide for flexible
Des. 207 (2021), [Link] 109845. all-solid-state supercapacitors, J. Mater. Chem. A 3 (2015) 14617–14624,
[19] Y. Wei, N. Zhang, C. Jin, J. Shen, J. Xie, Z. Dai, L. Hu, Y. Zeng, Z. Jian, A Bi1/2K1/ [Link]
2TiO3-based ergodic relaxor ceramic for temperature-stable energy storage [41] L. Chen, C. Liu, Z. Zhang, Novel (111) oriented c-Mo2N thin films deposited by
applications, Mater. Des. 207 (2021), [Link] magnetron sputtering as an anode for aqueous micro-supercapacitors,
[Link].2021.109887 109887. Electrochim. Acta 245 (2017) 237–248, [Link]
[20] W.R. Cai, R.K. Kankala, M.T. Xiao, N. Zhang, X.Q. Zhang, Three-dimensional [Link].2017.05.102.
hollow N-doped ZIF-8-derived carbon@MnO2 composites for supercapacitors, [42] F.F. Klimashin, H. Euchner, P.H. Mayrhofer, Computational and experimental
Appl. Surf. Sci. 528 (2020), [Link] studies on structure and mechanical properties of Mo-Al-N, Acta Mater. 107
[21] Y. Ding, Y.C. Li, Y.J. Dai, X.H. Han, B. Xing, L.J. Zhu, K.Z. Qiu, S.R. Wang, A novel (2016) 273–278, [Link]
approach for preparing in-situ nitrogen doped carbon via pyrolysis of bean [43] B.B. Wei, F.W. Ming, H.F. Liang, Z.B. Qi, W.S. Hu, Z.C. Wang, All nitride
pulp for supercapacitors, Energy 216 (2021), [Link] asymmetric supercapacitors of niobium titanium nitride-vanadium nitride, J.
energy.2020.119227. Power Sources 481 (2021), [Link]
[22] Y. Liang, Y.H. Lu, G.Y. Xiao, J.H. Zhang, H.J. Chi, Y. Dong, Hierarchical porous [44] B. Peng, H.Q. Li, Q. Zhang, Y.X. Xu, T.F. Wei, Q.M. Wang, F.G. Zhang, K.H. Kim,
nitrogen-doped carbon microspheres after thermal rearrangement as high High-temperature thermal stability and oxidation resistance of Cr and Ta co-
performance electrode materials for supercapacitors, Appl. Surf. Sci. 529 alloyed Ti - Al - N coatings deposited by cathodic arc evaporation, Corrosion
(2020), [Link] Science 167 (2020), [Link]
[23] J.H. Zhang, H. Chen, J.B. Bai, M. Xu, C.L. Luo, L.X. Yang, L.J. Bai, D.L. Wei, W.X. [45] O. Ostrovskaya, C. Badini, S.M. Deambrosis, E. Miorin, S. Biamino, E. Padovano,
Wang, H.W. Yang, N-doped hierarchically porous carbon derived from grape Protection from oxidation of second and third generation TiAl intermetallic
marcs for high-performance supercapacitors, J. Power Sources 854 (2021), alloys by magnetron sputtering deposition of a TiAl/TiAlN coating, Mater. Des.
[Link] 208 (2021), [Link] 109905.
[24] Z.H. Pan, X.H. Ji, Facile synthesis of nitrogen and oxygen co-doped C@Ti3C2 [46] Z. Gao, Z. Wu, S. Zhao, T. Zhang, Q. Wang, Enhanced capacitive property of HfN
MXene for high performance symmetric supercapacitors, J. Power Sources 439 film electrode by plasma etching for supercapacitors, Materials Letters 235
(2019), [Link] (2019) 148–152, [Link]
[25] S.Q. Wu, D.H. Wei, Y.B. Yin, Q.Q. Li, H.S. Wang, W.T. Chen, Y.F. Jiang, X.Q. Tao, N, [47] B. Wei, G. Mei, H. Liang, Z. Qi, D. Zhang, H. Shen, Z. Wang, Porous CrN thin films
S co-doped activated carbon with porous architecture derived from partial by selectively etching CrCuN for symmetric supercapacitors, J. Power Sources
poly (2, 2 ’-dithiodianiline) for supercapacitors, J. Energy Storage 33 (2021), 385 (2018) 39–44, [Link]
[Link] [48] Y.J. Kim, T.J. Byun, H.Y. Lee, J.G. Han, Effect of bilayer period on CrN/Cu
[26] G.F. Zheng, Z.C. Huang, Z. Liu, Cooperative utilization of beet pulp and nanoscale multilayer thin films, Surf. Coat. Technol. 202 (2008) 5508–5511,
industrial waste fly ash to produce N/P/O self-co-doped hierarchically porous [Link]
carbons for high-performance supercapacitors, J. Power Sources 482 (2021), [49] J. Musil, P. Zeman, H. Hruby, P.H. Mayrhofer, ZrN/Cu nanocomposite film - a
[Link] novel superhard material, Surf. Coat. Technol. 120 (1999) 179–183, [Link]
[27] Y. Feng, S. Chen, J. Wang, B. Lu, Carbon foam with microporous structure for org/10.1016/S0257-8972(99)00482-X.
high performance symmetric potassium dual-ion capacitor, J. Energy Chem. 43 [50] P. Zeman, R. Cerstvy, P.H. Mayrhofer, C. Mitterer, J. Musil, Structure and
(2020) 129–138, [Link] properties of hard and superhard Zr-Cu-N nanocomposite coatings, Mater. Sci.
[28] X.H. Xia, Y.Q. Zhang, D.L. Chao, Q.Q. Xiong, Z.X. Fan, X.L. Tong, J.P. Tu, H. Zhang, Eng. Struct. Mater. Properties Microstruct. Process. 289 (2000) 189–197,
H.J. Fan, Tubular TiC fibre nanostructures as supercapacitor electrode [Link]
materials with stable cycling life and wide-temperature performance, [51] J. Musil, H. Hruby, P. Zeman, H. Zeman, R. Cerstvy, P.H. Mayrhofer, C. Mitterer,
Energy Environ. Sci. 8 (2015) 1559–1568, [Link] Hard and superhard nanocomposite Al-Cu-N films prepared by magnetron
[29] J. Feng, X. Sun, C.Z. Wu, L.L. Peng, C.W. Lin, S.L. Hu, J.L. Yang, Y. Xie, Metallic sputtering, Surf. Coat. Technol. 142 (2001) 603–609, [Link]
Few-Layered VS2 Ultrathin Nanosheets: High Two-Dimensional Conductivity S0257-8972(01)01200-2.
for In-Plane Supercapacitors, J. Am. Chem. Soc. 133 (2011) 17832–17838, [52] H. Zeman, J. Musil, J. Vlcek, P.H. Mayrhofer, C. Mitterer, Thermal annealing of
[Link] sputtered Al-Si-Cu-N films, Vacuum 72 (2003) 21–28, [Link]
[30] B. Wei, H. Liang, D. Zhang, Z. Qi, H. Shen, Z. Wang, Magnetron sputtered TiN S0042-207x(03)00094-0.
thin films toward enhanced performance supercapacitor electrodes, Mater. [53] A. Akbari, C. Templier, M.F. Beaufort, D. Eyidi, J.P. Riviere, Ion beam assisted
Renew. Sustain. Energy 7 (2018) 11, [Link] deposition of TiN–Ni nanocomposite coatings, Surf. Coat. Technol. 206 (2011)
0117-9. 972–975, [Link]
[31] C.N.R. Rao, K. Pramoda, Borocarbonitrides, BxCyNz, 2D Nanocomposites with [54] Z.R. Liu, Y.X. Xu, B. Peng, W. Wei, L. Chen, Q.M. Wang, Structure and property
Novel Properties, B. Chem. Soc. Jpn. 92 (2019) 441–468, [Link] optimization of Ni-containing AlCrSiN coatings by nano-multilayer
10.1246/bcsj.20180335. construction, J. Power Sources 808 (2019), [Link]
[32] J. Shi, B.L. Jiang, C. Li, F.Y. Yan, D. Wang, C. Yang, J.J. Wan, Review of Transition [Link].2019.07.342.
Metal Nitrides and Transition Metal Nitrides/Carbon nanocomposites for [55] A.V. Chernogor, F.F. Klimashin, A.O. Volkhonskii, I.V. Blinkov, P.H. Mayrhofer,
supercapacitor electrodes, Mater. Chem. Phys. 245 (2020), [Link] The impact of Ni and Mo on growth-morphology and mechanical properties of
10.1016/[Link].2019.122533. arc evaporated Ti-Cr-N hard coatings, Surf. Coat. Technol. 377 (2019), https://
[33] Z. Qi, B. Wei, J. Wang, Y. Yang, Z. Wang, Nanostructured porous CrN thin films [Link]/10.1016/[Link].2019.124917.
by oblique angle magnetron sputtering for symmetric supercapacitors, J. [56] C. Hu, Y.X. Xu, L. Chen, F. Pei, Y. Du, Mechanical properties, thermal stability
Power Sources 806 (2019) 953–959, [Link] and oxidation resistance of Ta-doped CrAlN coatings, Surf. Coat. Technol. 368
[Link].2019.07.325. (2019) 25–32, [Link]
[34] B. Wei, H. Liang, D. Zhang, Z. Wu, Z. Qi, Z. Wang, CrN thin films prepared by [57] S. Calderon Velasco, A. Cavaleiro, S. Carvalho, Functional properties of ceramic-
reactive DC magnetron sputtering for symmetric supercapacitors, J. Mater. Ag nanocomposite coatings produced by magnetron sputtering, Prog. Mater.
Chem. A 5 (2017) 2844–2851, [Link] Sci. 84 (2016) 158–191, [Link]
[35] E. Haye, A. Achour, A. Guerra, F. Moulaï, T. Hadjersi, R. Boukherroub, A. [58] S.M. Aouadi, D.P. Singh, D.S. Stone, K. Polychronopoulou, F. Nahif, C. Rebholz, C.
Panepinto, T. Brousse, J.-J. Pireaux, S. Lucas, Achieving on chip micro- Muratore, A.A. Voevodin, Adaptive VN/Ag nanocomposite coatings with
supercapacitors based on CrN deposited by bipolar magnetron sputtering at lubricious behavior from 25 to 1000°C, Acta Mater. 58 (2010) 5326–5331,
glancing angle, Electrochim. Acta 324 (2019), [Link] [Link]
[Link].2019.134890 134890. [59] H. Li, C. Zhang, C. Liu, M. Huang, Improvement in corrosion resistance of CrN
[36] A. Achour, R.L. Porto, M.-A. Soussou, M. Islam, M. Boujtita, K.A. Aissa, L. Le coatings, Surf. Coat. Technol. (2018), [Link]
Brizoual, A. Djouadi, T. Brousse, Titanium nitride films for micro- [Link].2018.07.018.
supercapacitors: Effect of surface chemistry and film morphology on the [60] P.H. Mayrhofer, G. Tischler, C. Mitterer, Microstructure and mechanical/
capacitance, J. Power Sources 300 (2015) 525–532, [Link] thermal properties of Cr–N coatings deposited by reactive unbalanced
jpowsour.2015.09.012. magnetron sputtering, Surf. Coat. Technol. 142–144 (2001) 78–84, https://
[37] X. Lu, G. Wang, T. Zhai, M. Yu, S. Xie, Y. Ling, C. Liang, Y. Tong, Y. Li, Stabilized [Link]/10.1016/S0257-8972(01)01090-8.
TiN Nanowire Arrays for High-Performance and Flexible Supercapacitors, Nano [61] J.-Z. Kong, C. Li, X.-Y. Sun, Y. Xuan, H.-F. Zhai, A.-D. Li, Q.-Z. Wang, F. Zhou,
Lett. 12 (2012) 5376–5381, [Link] Improved tribological properties and corrosion protection of CrN coating by
[38] R. Lucio-Porto, S. Bouhtiyya, J.F. Pierson, A. Morel, F. Capon, P. Boulet, T. ultrathin composite oxide interlayer, Appl. Surf. Sci. 541 (2021), [Link]
Brousse, VN thin films as electrode materials for electrochemical capacitors, org/10.1016/[Link].2020.148606 148606.
Electrochim. Acta 141 (2014) 203–211, [Link] [62] P.H. Mayrhofer, H. Willmann, C. Mitterer, Oxidation kinetics of sputtered Cr-N
[Link].2014.07.056. hard coatings, Surf. Coat. Technol. 146 (2001) 222–228, [Link]
[39] K. Robert, C. Douard, A. Demortière, F. Blanchard, P. Roussel, T. Brousse, C. 10.1016/s0257-8972(01)01471-2.
Lethien, On Chip Interdigitated Micro-Supercapacitors Based on Sputtered [63] J. Jin, D. Zheng, S. Han, J. Ma, Z. Zhu, Effect of Ni content on the electrical and
Bifunctional Vanadium Nitride Thin Films with Finely Tuned Inter- and corrosion properties of CrNiN coating in simulated proton exchange
Intracolumnar Porosities, Adv. Mater. Technol. 3 (2018) 1800036, [Link] membrane fuel cell, Int. J. Hydrogen. Energ 42 (2017) 1142–1153, https://
org/10.1002/admt.201800036. [Link]/10.1016/[Link].2016.11.007.
10
Z. Gao, Z. Wan, Z. Wu et al. Materials & Design 209 (2021) 109949
[64] A. Ruden, E. Restrepo-Parra, A.U. Paladines, F. Sequeda, Corrosion supercapacitors, Adv. Sci. 2 (2015) 1500126, [Link]
resistance of CrN thin films produced by dc magnetron sputtering, advs.201500126.
Appl. Surf. Sci. 270 (2013) 150–156, [Link] [69] L. Wang, H. Ji, S. Wang, L. Kong, X. Jiang, G. Yang, Preparation of Fe3O4 with
apsusc.2012.12.148. high specific surface area and improved capacitance as a supercapacitor,
[65] J. Huang, B.G. Sumpter, V. Meunier, A Universal Model for Nanoporous Carbon Nanoscale 5 (2013) 3793–3799, [Link]
Supercapacitors Applicable to Diverse Pore Regimes, Carbon Materials, and [70] Y. Xie, D. Wang, Supercapacitance performance of polypyrrole/titanium
Electrolytes,, Chem. AEuropean J. 14 (2008) 6614–6626, [Link] nitride/polyaniline coaxial nanotube hybrid, J. Power Sources 665 (2016)
10.1002/chem.200800639. 323–332, [Link]
[66] P.C. Wo, P.R. Munroe, Z.-T. Jiang, Z. Zhou, K.Y. Li, Z. Xie, Enhancing toughness of [71] Y. Wang, M. Jiang, Y. Yang, F. Ran, Hybrid electrode material of vanadium
CrN coatings by Ni addition for safety-critical applications, Mater. Sci. Eng. A nitride and carbon fiber with cigarette butt/metal ions wastes as the precursor
596 (2014) 264–274, [Link] for supercapacitors, Electrochimica Acta 222 (2016) 1914–1921, [Link]
[67] W.L. Cheng, Z.F. Zhou, P.W. Shum, K.Y. Li, Effect of Ni addition on the structure org/10.1016/[Link].2016.12.003.
and properties of Cr–Ni–N coatings deposited by closed-field unbalanced [72] A. Achour, M. Chaker, H. Achour, A. Arman, M. Islam, M. Mardani, M. Boujtita,
magnetron sputtering ion plating, Surf. Coat. Technol. 229 (2013) 84–89, L. Le Brizoual, M.A. Djouadi, T. Brousse, Role of nitrogen doping at the surface
[Link] of titanium nitride thin films towards capacitive charge storage enhancement,
[68] H. Cui, G. Zhu, X. Liu, F. Liu, Y. Xie, C. Yang, T. Lin, H. Gu, F. Huang, Niobium J. Power Sources 359 (2017) 349–354, [Link]
nitride Nb4N5 as a new high-performance electrode material for jpowsour.2017.05.074.
11
The difference in etching behavior between CrN-Ni78 and CrN-Ni54 coatings is primarily due to their Ni content and phase distribution. CrN-Ni54 has a higher phase boundary fraction facilitating Ni removal and resulting in a percolating porous network. Meanwhile, CrN-Ni78, with a Ni matrix embedding CrN precipitates, shows resistance to etching as the Ni phase is more interconnected and less accessible, requiring longer etching times .
The HCl treatment significantly decreases the Ni content in CrN-Ni coatings, leading to the formation of a porous structure. Specifically, the Ni content reduces from 30.4 to 8.2 at.% in CrN-Ni30, from 54.2 to 7.1 at.% in CrN-Ni54, and from 77.6 to 54.0 at.% in CrN-Ni78 . This treatment also promotes the development of a sponge-like morphology, especially for CrN-Ni54, which exhibits high porosity after treatment .
The CrN-Ni54 coating facilitates an interconnected Ni network through its initial high Ni content, aiding pore connectivity when HCl etches away Ni. This connectivity is significant as it creates a sponge-like structure enhancing surface area and ion accessibility, crucial for high specific capacitance in supercapacitors . The interconnected Ni phase supports effective electron transport pathways, improving electrode performance .
The CrN-Ni54 coating achieves the highest specific capacitance of ~58.5 mF/cm² due to its optimal porosity and interconnectivity after the HCl treatment. The significant reduction of Ni content from 54.2 to 7.1 at.% creates a well-distributed pore network ideal for supercapacitor applications, allowing for efficient ionic transport . The maintained coating thickness despite reduction in Ni content suggests effective pore formation, enhancing electrolyte access and charge storage capability .
SEM results show that HCl treatment affects CrN-Ni coatings differently depending on their nickel content. CrN-Ni30 forms a smooth surface with small non-interconnected Ni pockets, resulting in limited porosity. CrN-Ni54 exhibits a pronounced porous network due to sufficient Ni content allowing interconnected Ni phases, significantly enhancing surface area. CrN-Ni78 remains less porous as the Ni phase requires longer etching to dissolve due to its high content and matrix formation .
SEM investigations show that CrN coatings exhibit excellent corrosion resistance post-HCl treatment. Unlike Ni-embedded coatings which form porous structures, the Ni-free CrN thin films maintain a dense and smooth surface, indicating minimal corrosion impact . This stability is further confirmed by unchanged XRD profiles of the CrN phase before and after treatment .
XRD findings reveal that the CrN phase remains stable post-HCl treatment without significant changes to its diffraction peaks. This indicates the robust chemical stability and corrosion resistance of CrN as the Ni phases mostly dissolve, while the CrN structure is retained . The absence of detectable crystalline Ni phases in CrN-Ni30* and CrN-Ni54* further highlights the stability of CrN amidst the etching process .
The pore size distribution in CrN-Ni54* coatings is crucial for its performance as supercapacitor electrodes. The pores range from 30 nm, falling within the ideal size for aqueous electrolyte pools and fast ionic transport, thus maximizing specific capacitance. Pores smaller than 2 nm wouldn't store energy effectively, and larger than 50 nm wouldn't provide enough surface area for capacitance . This optimal porosity ensures efficient ionic transport and charge distribution .
The identical XPS core-level spectra of CrN-Ni54 before and after HCl treatment suggest high stability of chemical bonding within the CrN phase. The consistent binding energies for CrN and Cr2N across treatments indicate that key chemical bonds are preserved, supporting the compound's resistance to chemical alteration despite the Ni phase removal .
The CrN-Ni30* coating's specific capacitance change is less pronounced than CrN-Ni54*, showing an increase by a factor of ~16. The lower Ni content (30.4 at.% initially) results in insufficient porosity for extensive electrolyte access, contrasting with CrN-Ni54* which increases by a factor of ~80 due to optimal porosity and interconnected Ni network formation post-HCl treatment .