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 DATA SHEET

BIPOLAR ANALOG INTEGRATED CIRCUIT

μ PC494
SWITCHING REGULATOR CONTROL CIRCUIT

<R> DESCRIPTION
The μ PC494 is a PWM type switching regulator control circuit.
Included in this device are a 5 V voltage reference, dual error amplifiers, a variable frequency sawtooth-wave
generating oscillator, a comparator for dead-time control, a flip flop, dual alternating output switches, and a buffer to
output source and sink currents.
Error amplifiers have wide common mode input voltage capability, and circuits for voltage feedback and over current
protection are easy to configure. The μ PC494 can be applied to all types of switching regulators, including chopper
type regulators.

<R> FEATURES

• 250 mA output buffer to output sink and source currents

• Switchable operation mode between a single-end mode and a push-pull mode
• No double pulsing during transient condition
• Adjustable dead-time (0 to 100%)
• Internal 5 V output voltage reference circuit
• Error amplifiers with phase-compensating function
• Providing master-slave operation (synchronizing multiple ICs)
• With malfunction prevention circuit for low level supply voltage
• Package variations available for different applications

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.

Document No. G12649EJ5V0DS00 (5th edition) 1988, 2000, 2008

Date Published August 2008 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
 μ PC494

<R> ORDERING INFORMATION

Part Number Package Package Type

μ PC494C 16-pin plastic DIP (7.62 mm (300)) • plastic magazine

μ PC494GS 16-pin plastic SOP (7.62 mm (300)) • plastic magazine
μ PC494GS-E1 16-pin plastic SOP (7.62 mm (300)) • embossed taping
• Pin 1 on draw-out side
• 2500 pcs/reel
μ PC494GS-E2 16-pin plastic SOP (7.62 mm (300)) • embossed taping
• Pin 1 at take-up side
• 2500 pcs/reel
Note
μ PC494GT-A 16-pin plastic SOP (9.53 mm (375)) • plastic magazine
Note
μ PC494GT-E1-A 16-pin plastic SOP (9.53 mm (375)) • embossed taping
• Pin 1 on draw-out side
• 1500 pcs/reel
Note
μ PC494GT-E2-A 16-pin plastic SOP (9.53 mm (375)) • embossed taping
• Pin 1 at take-up side
• 1500 pcs/reel
Note
μ PC494GS-A 16-pin plastic SOP (7.62 mm (300)) • plastic magazine
Note
μ PC494GS-E1-A 16-pin plastic SOP (7.62 mm (300)) • embossed taping
• Pin 1 on draw-out side
• 2500 pcs/reel
Note
μ PC494GS-E2-A 16-pin plastic SOP (7.62 mm (300)) • embossed taping
• Pin 1 at take-up side
• 2500 pcs/reel

Note Pb-free (This product does not contain Pb in the external electrode and other parts.)

2 Data Sheet G12649EJ5V0DS00

 μ PC494

BLOCK DIAGRAM

VCC 12 13 Output Control

Reference Low Voltage
Ref Out 14 Regulator Stop

GND 7 F 8 C1
T/ 9 E1
F 11 C2
RT 6
Oscillator
CT 5 10 E2
Dead-Time
+ Comparator
Dead-Time
Control 4
–
+
EA I –
Non-Inv. Input 1 +
PWM
Inv. Input 2 – Comparator
EA II
Non-Inv. Input 16 +

Inv. Input 15 –

Feed-Back 3

PIN CONFIGURATION (Top View)

<R> • μ PC494C, 494GS, 494GT-A, 494GS-A

Non-Inv. Input 1 16 Non-Inv. Input

Inv. Input 2 15 Inv. Input

Feed-Back 3 14 Ref Out

Dead-Time
4 13 Output Control
Control
CT 5 12 VCC

RT 6 11 C2

GND 7 10 E2

C1 8 9 E1

Data Sheet G12649EJ5V0DS00 3

 μ PC494

<R> ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise noted)

Characteristics Symbol μ PC494C μ PC494GS μ PC494GT-A μ PC494GS-A Unit

Supply Voltage VCC −0.3 to +41 V

Error Amplifier Input Voltage VICM −0.3 to VCC +0.3 V

Dead-time Comparator Input VDTC −0.3 to +5.25 V

Voltage

Output Voltage VCER −0.3 to +41 V

Output Current IC 250 mA

Note Note Note
Total Power Dissipation PT 1000 650 780 650 mW

Operating Ambient Temperature TA −20 to +85 °C

Storage Temperature Tstg −65 to +150 °C

Note With 5 cm x 5 cm x 1.6 mmt glass-epoxy substrate.

Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.

RECOMMENDED OPERATING CONDITIONS

Characteristics Symbol MIN. TYP. MAX. Unit

Supply Voltage VCC 7 40 V

Output Voltage VCER −0.3 +40 V

<R> Output Current (per output stage) IC 200 mA

Error Amplifier Sink Current IOAMP −0.3 mA

Timing Capacitor CT 0.47 10000 nF

Timing Resistance RT 1.8 500 kΩ

Oscillation Frequency fOSC 1 300 kHz

Operating Ambient Temperature TA −20 +70 °C

Caution The recommended operating range may be exceeded without causing any problems provided that
the absolute maximum ratings are not exceeded. However, if the device is operated in a way that
exceeds the recommended operating conditions, the margin between the actual conditions of use
and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The
recommended operating conditions do not imply that the device can be used with all values at their
maximum values.

4 Data Sheet G12649EJ5V0DS00

 μ PC494

ELECTRICAL SPECIFICATIONS (VCC = 15 V, f = 10 kHz, −20°C ≤ TA ≤ +70°C, unless otherwise noted)

(1/2)
Note1
Block Characteristics Symbol Conditions MIN. TYP. MAX. Unit
Reference Output Voltage VREF IREF = 1 mA, TA = 25°C 4.75 5 5.25 V
Section Line Regulation REGIN 7 V ≤ VCC ≤ 40 V, 8 25 mV
IREF = 1 mA, TA = 25°C
Load Regulation REGL 1 mA ≤ IREF ≤ 10 mA, 1 15 mV
TA = 25°C
Temperature Coefficient ΔVREF /ΔT −20°C ≤ TA ≤ +85°C, 0.01 0.03 %/°C
IREF = 1 mA
Note2
Short Circuit Output Current ISHORT VREF = 0 V 50 mA
Oscillator Frequency fOSC CT = 0.01 μF, 10 kHz
Section RT = 12 kΩ
Note3
Standard Deviation of Frequency 7 V ≤ VCC ≤ 40 V, 10 %
TA = 25°C, under
recommended operating
conditions of CT and RT
constants.
Frequency Change with Voltage 7 V ≤ VCC ≤ 40 V, 1 %
TA = 25°C,
CT = 0.01 μF, RT = 12 kΩ
Frequency Change with Temperature 0°C ≤ TA ≤ 70°C, 1 2 %
CT = 0.01 μF,
RT = 12 kΩ
Dead- Time Input Bias Current 0 V ≤ VDTC ≤ 5.25 V −2 −10 μA
Control Maximum Duty Cycle (Each Output) VDTC = 0 V 45 49 %
Section Input Threshold Voltage 1 VTH1 Output pulse 0% duty cycle 3 3.3 V

Input Threshold Voltage 2 VTH2 Output pulse maximum duty 0 V

cycle
Error Input Offset Voltage VIO VOAMP = 2.5 V 2 10 mV
Amplifier 1, 2 Input Offset Current IIO VOAMP = 2.5 V 25 250 nA
Section Input Bias Current VOAMP = 2.5 V 0.2 1 μA
Common Mode Low level VICM 7 V ≤ VCC ≤ 40 V −0.3 V
Input Voltage
High level VCC − 2

Open Loop Voltage Gain AV VOAMP = 0.5 to 3.5 V, 60 80 dB

TA = 25°C
Unity Gain Bandwidth TA = 25°C 500 830 kHz
Common Mode Rejection Ratio CMR VCC = 40 V, TA = 25°C 65 80 dB
Output Sink Current VOAMP = 0.7 V 0.3 0.7 mA
Output Source Current VOAMP = 3.5 V −2 −10 mA
PWM Input Threshold Voltage (Pin 3) Output pulse 0% duty cycle, 4 4.5 V
Section see Figure 1.
Input Sink Current V(Pin 3) = 0.7 V 0.3 0.7 mA
Notes 1. The TYP. values are values at TA = 25°C, except for the characteristics of temperature.
2. The short circuit output current flow must be terminated within 1 second.
Repeated operations are allowed while internal heat accumulation is within a safe range.
3. Standard deviation is a measure of the statistical distribution about the mean as derived from the formula;
N
σ= ∑ (Xn − X)2
n=1
N−1

Calculation expression of frequency fOSC is as follows ;

1
fOSC ≅ (Hz) [RT] = Ω, [CT] = F
0.817 RT • CT + 1.42 • 10−6

Data Sheet G12649EJ5V0DS00 5

 μ PC494

(2/2)
Note
Block Characteristics Symbol Conditions MIN. TYP. MAX. Unit

Output Collector Cut-off Current ICER VCE = 40 V, VCC = 40 V, 100 μA

Section Common Emitter
Emitter Cut-off Current VCC = VC = 40 V, VE = 0 V, −100 μA
Emitter Follower
Collector Saturation Common VCE(sat) IC = 200 mA, VE = 0 V 0.95 1.3 V
Voltage Emitter
Emitter VCE(ON) IE = −200 mA, VC = 15 V 1.6 2.5 V
Follower
Output Voltage Rise Time Common tr1 VCC = 15 V, RL = 150 Ω, 100 200 ns
Emitter IC ≅ 100 mA, TA = 25°C,
Output Voltage Fall Time tf1 70 200 ns
see Figure 1.

Output Voltage Rise Time Emitter tr2 VC = 15 V, RL = 150 Ω, 100 200 ns

Follower IE ≅ 100 mA, TA = 25°C,
Output Voltage Fall Time tf2 70 200 ns
see Figure 1.

Total Standby Current ICC(S.B) VCC = 15 V, 8 12.5 mA

Device all other pins open.
Bias Current ICC(BI) V(Pin 4) = 2 V, see Figure 1. 10 mA

Note The TYP. values are values at TA = 25°C, except for the characteristics of temperature.

6 Data Sheet G12649EJ5V0DS00

 μ PC494

TEST CIRCUIT AND WAVEFORM CHARACTERISTICS

Figure1. Test Circuit

VCC = 15 V

(12) RL RL
V CC 150 Ω 150 Ω
(4) Dead-Time
(8) 2 W 2W
Test Input (3) Control C1 (9) Output 1
Feed-Back E1
12 kΩ (6) (11)
R T C2 (10) Output 2
0.01 μFNote (5) E2
CT
(1)
Non-Inv. Input
(2)
Inv. Input
(16)
(15) Non-Inv. Input
Inv. Input
(13)
Output Control (14)
Ref Out
50 kΩ GND
(7)

Note Recommend film capacitor.

Caution When the emitter follower is output, connect C1 and C2 to VCC and E1 and E2 to GND via RL.

Figure2. Voltage Waveform

VCC
C1 Output Voltage
0V
VCC
C2 Output Voltage
0V
CT Voltage
sawtooth-wave
oscillation output

Threshold Voltage
Dead-Time Control
Input Voltage
0% MAX.
Threshold Voltage
0%
Feed-Back Input
(E.A. Output) 0.7 V

Connection of Output Control Pin (Pin 13)

Output Control Input (Pin 13) Operation Mode

Ref Out push-pull

GND Single-ended operation (common-mode output of C1, C2)

Data Sheet G12649EJ5V0DS00 7

 μ PC494

TYPICAL PERFORMANCE CHARACTERISTICS

(Unless otherwise specified, TA = 25°C, VCC = 15 V, Reference)

MISS-OPERATION PREVENTION
<R> MAXIMUM POWER DISSIPATION CIRCUIT CHARACTERISTICS
1.2 6
Note With 5 cm x 5 cm x 1.6 mmt Test Circuit
PT - Total Power Dissipation - W

5V
glass-epoxy substrate
1.0 5 430 Ω

VCE - Output Voltage - V

μPC494C 8
Thermal Resistance 9 VCE
0.8 Rth(J-A)125°C/W 4
16
0
192 °C/W
0.6 °C/ 3
μPC494GS, W
494GS-A Note
0.4 2
μPC494GT-A Note

0.2 1

0 0
25 50 75 100 125 4 5 6 7
TA - Operating Ambient Temperature - °C VCC - Supply Voltage - V

REFERENCE VOLTAGE vs. REFERENCE VOLTAGE vs.

SUPPLY VOLTAGE OPERATING AMBIENT TEMPERATURE

Δ VREF - Reference Voltage Change - mV

6 40
VCC = 15 V
VREF - Reference Voltage - V

5 IREF = 1 mA
20

4
0
3
–20
2

–40
1

0 –60
5 10 15 20 25 30 35 40 –25 0 25 50 75 100
VCC - Supply Voltage - V TA - Operating Ambient Temperature - °C

FREQUENCY vs.
FREQUENCY vs. RT AND CT OPERATING AMBIENT TEMPERATURE
4
VCC = 15 V VCC = 15 V
Δ f/fOSC - Frequency Change - %

500 RT = 12 kΩ
2
CT = 0.01 μF
fOSC - Frequency - kHz

200
100 0
50 CT
= –2
10 47
20 00 0 p
pF F
10 0. –4
01
5 0. μF
04 –6
7
2 μF
1
2 5 10 20 50 100 200 500 –25 0 25 50 75 100
RT - Timing Resistance - kΩ TA - Operating Ambient Temperature - °C

8 Data Sheet G12649EJ5V0DS00

 μ PC494

DUTY CYCLE vs. DEAD-TIME OPEN-LOOP VOLTAGE GAIN vs.

CONTROL INPUT VOLTAGE FREQUENCY
120

AV - Open-Loop Voltage Gain - dB

0 100

°C
°C
85
25
C
0°
Duty Cycle - %

10 80

–2
=
TA
20 60

30 40

VCC = 15 V
40 20
RT = 12 kΩ
CT = 0.01 μF
50 0
0 1 2 3 1 10 100 1 k 10 k 100 k 1 M 10 M
VDTC - Dead-Time Control Input Voltage - V f - Frequency - Hz
(Common Emitter) - V

(Emitter Follower) - V

COLLECTOR SATURATION VOLTAGE STANDBY AND BIAS CURRENT vs.

vs. OUTPUT CURRENT SUPPLY VOLTAGE
2.0 12
ICC (BI)
VCE (ON) - Collector Saturation Voltage
VCE (sat) - Collector Saturation Voltage

ICC (S.B) - Standby Current - mA

1.8
10

ICC (BI) - Bias Current - mA

1.6 VCE (ON) ICC (S.B)
8
1.4
1.2 6
1.0
4
VCE (sat) ICC (S.B)
0.8 VCC Terminal Biased.
2 Other Terminal Open.
0.6 ICC (BI)
VDTC = 2 V (Pin 4)

0.4 0
0 40 80 120 160 200 10 20 30 40
IC, IE - Output Current - mA VCC - Supply Voltage - V

Data Sheet G12649EJ5V0DS00 9

 μ PC494

BASIC APPLICATION CIRCUIT

VOUT

Switching regulator JP2

output pin
rsense GND

VCC 12 V
VR3
R13 +
100 Ω C1 C6 R12 R11
7.5 kΩ 5 kΩ JP1 47 μF
–Iosense R14 110 Ω 110 Ω
R15 C2
+Iosense
0.01 μF 100 Ω E2
E1
C2 16 15 14 13 12 11 10 9 C1
Vosense
+ –
REFERENCE
R9 R10
110 Ω 110 Ω
ERROR

R17 AMP
2 REGULATOR

R16
R3 C7 100 kΩ
3.9 kΩ R1 F/F
5.1 kΩ
ERROR
AMP
+ – OSCILLATOR
VR1 1

0.1 V
2 kΩ 1 2 3 4 5 6 7 8

R4 240 kΩ 2 kΩ C5 R8
R2 5.1 kΩ
5.1 kΩ
R5 VR2 24 kΩ

C3 R6 C4
+ R7 7.5 kΩ
0.01 μF 24 kΩ
10 μF
+5 V (VREF)

Remark fOSC ≅ 40 kHz, C5 = 1000 pF (Recommend film capacitor)

10 Data Sheet G12649EJ5V0DS00

 μ PC494

CONNECTION DIAGRAM

Output Control Input

Operation Mode Output Mode Output Voltage Waveform
(Pin 13)

Push-pull Ref Out (Pin 14) Sink (R9, R10 short) C1

(JP1 Wired) C2

Source (R11, R12 short) E1

E2

Single-ended operation GND (Pin 7) Sink (R9, R10 short) C1, C2

(JP2 Wired) Source (R11, R12 short) E1, E2

Data Sheet G12649EJ5V0DS00 11

 μ PC494

TYPICAL EXAMPLE OF APPLICATION CIRCUITS

1) Forward Type

+VCC +
+
+12 V VOUT
–
(12)
VCC
(8)
C1
(13) Output
Control To EA II To EA I
(9) (Over Current (Vosense)
E1
Protection )
(14) (7) GND
Ref Out GND

2) Push-pull Type

(Isolated)

+VCC
+
+
VOUT
GND –

+12 V

To EA II To EA I
(12)
(11)
C2 VCC
(10)
E2
(9)
E1
(8)
C1 Output
(7) (13)
GND Control
(14)
Ref Out

(Non Isolated)

+VCC (40 V MAX.)

(12)
VCC (11)
C2 +
(10) +
E2 VOUT
(13) Output (9) –
E1
Control
(14) (8)
Ref Out C1
GND
(7)

GND To EA II To EA I

12 Data Sheet G12649EJ5V0DS00

 μ PC494

3) Step-down Chopper

+VCC (40 V MAX.) +

(12) +
VCC (11) VOUT
C2
(10) –
E2
(9)
E1
(13) Output (8)
Control C1
GND
To EA II To EA I
(7) (Over Current
Protection)

Remark The dotted line indicates the connection in case of large current.

EXAMPLE OF MASTER-SLAVE CONNECTION

To synchronize μ PC494 ICs, connect the pin 6 (RT) of a slave IC to pin 14 (Ref Out) of the same IC, and connect
both CT pins of master and slave ICs after confirming oscillator of slave IC is stopped.

+VCC

(12) (14)
VCC Ref Out
(6) RT
(M) RT
(7) CT
(5)
GND CT

(12) (14)
VCC Ref Out
(6)
(S) RT
(M) : Master
(7) (5)
GND CT (S) : Slave

Data Sheet G12649EJ5V0DS00 13

 μ PC494

PACKAGE DRAWINGS (Unit : mm)

μ PC494C

16-PIN PLASTIC DIP (7.62mm(300))

16 9

1 8

J K
I P L

F C B
H
M R
G D N M

NOTES ITEM MILLIMETERS

1. Each lead centerline is located within 0.25 mm of A 20.32 MAX.
its true position (T.P.) at maximum material condition. B 1.27 MAX.
C 2.54 (T.P.)
2. Item "K" to center of leads when formed parallel. D 0.50±0.10
F 1.1 MIN.
G 3.5±0.3
H 0.51 MIN.
I 4.31 MAX.
J 5.08 MAX.
K 7.62 (T.P.)
L 6.5

M 0.25 +0.10
−0.05
N 0.25
P 1.1 MIN.
R 0∼15°
P16C-100-300B-2

14 Data Sheet G12649EJ5V0DS00

 μ PC494

<R> μ PC494GT-A

16-PIN PLASTIC SOP (9.53 mm (375))

16 9

detail of lead end

1 8
A
H
F
G I J

C B L
N S
K
D M M

NOTE ITEM MILLIMETERS

Each lead centerline is located within 0.12 mm of A 10.2±0.26
its true position (T.P.) at maximum material condition. B 0.805 MAX.
C 1.27 (T.P.)

D 0.42 +0.08
−0.07
E 0.125±0.075
F 2.9 MAX.
G 2.50±0.2
H 10.3±0.3
I 7.2±0.2
J 1.6±0.2

K 0.17 +0.08
−0.07
L 0.8±0.2
M 0.12
N 0.10

P 3° +7°
−3°
P16GT-50-375B-2

Data Sheet G12649EJ5V0DS00 15

 μ PC494

μ PC494GS, 494GS-A

16-PIN PLASTIC SOP (7.62 mm (300))

16 9

detail of lead end

1 8

F H
G I J

B L
N S K
C
D M M

NOTE ITEM MILLIMETERS

Each lead centerline is located within 0.12 mm of A 10.2±0.2
its true position (T.P.) at maximum material condition. B 0.78 MAX.
C 1.27 (T.P.)

D 0.42 +0.08
−0.07
E 0.1±0.1
F 1.65±0.15
G 1.55
H 7.7±0.3
I 5.6±0.2
J 1.1±0.2

K 0.22 +0.08
−0.07
L 0.6±0.2
M 0.12
N 0.10

P 3° +7°
−3°
P16GM-50-300B-6

16 Data Sheet G12649EJ5V0DS00

 μ PC494

<R> RECOMMENDED SOLDERING CONDITIONS

The μ PC494 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Through-hole Device

μ PC494C: 16-pin plastic DIP (7.62 mm (300))

Process Conditions Symbol

Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less WS60-00
(only to leads)
Partial Heating Method Pin temperature: 300°C or below, P300
Heat time: 3 seconds or less (Per each side of the device)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.

Type of Surface Mount Device

μ PC494GS: 16-pin plastic SOP (7.62 mm (300))

Process Conditions Symbol

Infrared Ray Reflow Maximum temperature (package’s surface temperature): 235°C or below, IR35-00-3
Time at maximum temperature: 10 seconds or less,
Time at temperature higher than 210°C: 30 seconds or less,
Preheating time at 100 to 160°C: 30 to 60 seconds, Times: 3 times,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Vapor Phase Soldering Maximum temperature (package’s surface temperature): 215°C or below, VP15-00-3
Reflow time: 25 to 40 seconds or less (at 200°C or higher),
Preheating time at 120 to 150°C: 30 to 60 seconds, Times: 3 times,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1
Maximum number of flow processes: 1 time,
Preheating temperature: 120°C MAX. (Package surface temperature).
Partial Heating Method Pin temperature: 350°C or below, P350
Heat time: 3 seconds or less (Per each side of the device),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.

Data Sheet G12649EJ5V0DS00 17

 μ PC494

Note1
μ PC494GT-A : 16-pin plastic SOP (9.53 mm (375))
Process Conditions Symbol

Infrared Ray Reflow Maximum temperature (package’s surface temperature): 260°C or below, IR60-207-3
Time at maximum temperature: 10 seconds or less,
Time at temperature higher than 220°C: 60 seconds or less,
Preheating time at 160 to 180°C: 60 to 120 seconds, Times: 3 times,
Note2
Exposure limit: 7 days (after that, prebake at 125°C for 20 hours),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-207-1
Maximum number of flow processes: 1 time,
Preheating temperature: 120°C MAX. (Package surface temperature),
Note2
Exposure limit: 7 days (after that, prebake at 125°C for 20 hours).

Partial Heating Method Pin temperature: 350°C or below, P350

Heat time: 3 seconds or less (Per each side of the device),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

Notes 1. Pb-free (This product does not contain Pb in the external electrode and other parts.)
2. After opening the dry pack, store it a 25°C or less and 65% RH or less for the allowable storage period.

Note
μ PC494GS-A : 16-pin plastic SOP (7.62 mm (300))
Process Conditions Symbol

Infrared Ray Reflow Maximum temperature (package’s surface temperature): 260°C or below, IR60-00-3
Time at maximum temperature: 10 seconds or less,
Time at temperature higher than 220°C: 60 seconds or less,
Preheating time at 160 to 180°C: 60 to 120 seconds, Times: 3 times,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1
Maximum number of flow processes: 1 time,
Preheating temperature: 120°C MAX. (Package surface temperature).
Partial Heating Method Pin temperature: 350°C or below, P350
Heat time: 3 seconds or less (Per each side of the device),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

Note Pb-free (This product does not contain Pb in the external electrode and other parts.)

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.

18 Data Sheet G12649EJ5V0DS00

 μ PC494

• The information in this document is current as of August, 2008. The information is subject to
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M8E 02. 11-1