LM13700

www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

LM13700 Dual Operational Transconductance Amplifiers with Linearizing Diodes and

Buffers
Check for Samples: LM13700

1FEATURES DESCRIPTION
•
2 gm Adjustable over 6 Decades The LM13700 series consists of two current
controlled transconductance amplifiers, each with
• Excellent gm Linearity differential inputs and a push-pull output. The two
• Excellent Matching between Amplifiers amplifiers share common supplies but otherwise
• Linearizing Diodes operate independently. Linearizing diodes are
provided at the inputs to reduce distortion and allow
• High Impedance Buffers
higher input levels. The result is a 10 dB signal-to-
• High Output Signal-to-Noise Ratio noise improvement referenced to 0.5 percent THD.
High impedance buffers are provided which are
APPLICATIONS especially designed to complement the dynamic
range of the amplifiers. The output buffers of the
• Current-Controlled Amplifiers
LM13700 differ from those of the LM13600 in that
• Current-Controlled Impedances their input bias currents (and hence their output DC
• Current-Controlled Filters levels) are independent of IABC. This may result in
• Current-Controlled Oscillators performance superior to that of the LM13600 in audio
applications.
• Multiplexers
• Timers
• Sample-and-Hold circuits

Connection Diagram

Figure 1. PDIP and SOIC Packages-Top View

See Package Number D0016A or NFG0016E

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

(1)
Absolute Maximum Ratings
Supply Voltage
LM13700 36 VDC or ±18V
(2)
Power Dissipation TA = 25°C
LM13700N 570 mW
Differential Input Voltage ±5V
Diode Bias Current (ID) 2 mA
Amplifier Bias Current (IABC) 2 mA
Output Short Circuit Duration Continuous
(3)
Buffer Output Current 20 mA
Operating Temperature Range
LM13700N 0°C to +70°C
DC Input Voltage +VS to −VS
Storage Temperature Range −65°C to +150°C
Soldering Information
PDIP Package
Soldering (10 sec.) 260°C
SOIC Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C

(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W.
(3) Buffer output current should be limited so as to not exceed package dissipation.

2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

(1)
Electrical Characteristics
LM13700
Parameter Test Conditions Units
Min Typ Max
Input Offset Voltage (VOS) Over Specified Temperature Range 0.4 4
mV
IABC = 5 μA 0.3 4
VOS Including Diodes Diode Bias Current (ID) = 500 μA 0.5 5 mV
Input Offset Change 5 μA ≤ IABC ≤ 500 μA 0.1 3 mV
Input Offset Current 0.1 0.6 μA
Input Bias Current Over Specified Temperature Range 0.4 5 μA
1 8
Forward Transconductance (gm) 6700 9600 13000 μmho
Over Specified Temperature Range 5400
gm Tracking 0.3 dB
Peak Output Current RL = 0, IABC = 5 μA 5 μA
RL = 0, IABC = 500 μA 350 500 650
RL = 0, Over Specified Temp Range 300
Peak Output Voltage
Positive RL = ∞, 5 μA ≤ IABC ≤ 500 μA +12 +14.2 V
Negative RL = ∞, 5 μA ≤ IABC ≤ 500 μA −12 −14.4 V
Supply Current IABC = 500 μA, Both Channels 2.6 mA
VOS Sensitivity
Positive ΔVOS/ΔV+ 20 150 μV/V
Negative ΔVOS/ΔV− 20 150 μV/V
CMRR 80 110 dB
Common Mode Range ±12 ±13.5 V
(2)
Crosstalk Referred to Input
100 dB
20 Hz < f < 20 kHz
Differential Input Current IABC = 0, Input = ±4V 0.02 100 nA
Leakage Current IABC = 0 (Refer to Test Circuit) 0.2 100 nA
Input Resistance 10 26 kΩ
Open Loop Bandwidth 2 MHz
Slew Rate Unity Gain Compensated 50 V/μs
(2)
Buffer Input Current 0.5 2 μA
(2)
Peak Buffer Output Voltage 10 V

(1) These specifications apply for VS = ±15V, TA = 25°C, amplifier bias current (IABC) = 500 μA, pins 2 and 15 open unless otherwise
specified. The inputs to the buffers are grounded and outputs are open.
(2) These specifications apply for VS = ±15V, IABC = 500 μA, ROUT = 5 kΩ connected from the buffer output to −VS and the input of the
buffer is connected to the transconductance amplifier output.

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Schematic Diagram

Figure 2. One Operational Transconductance Amplifier

Typical Application

Figure 3. Voltage Controlled Low-Pass Filter

4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Typical Performance Characteristics

Input Offset Voltage Input Offset Current

Figure 4. Figure 5.

Input Bias Current Peak Output Current

Figure 6. Figure 7.

Peak Output Voltage and

Common Mode Range Leakage Current

Figure 8. Figure 9.

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Typical Performance Characteristics (continued)

Input Leakage Transconductance

Figure 10. Figure 11.

Amplifier Bias Voltage vs.

Input Resistance Amplifier Bias Current

Figure 12. Figure 13.

Input and Output Capacitance Output Resistance

Figure 14. Figure 15.

6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Typical Performance Characteristics (continued)

Distortion Voltage
vs. vs.
Differential Amplifier
Input Voltage Bias Current

Figure 16. Figure 17.

Output Noise
vs.
Frequency

Figure 18.

Figure 19. Unity Gain Follower

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Typical Performance Characteristics (continued)

Figure 20. Leakage Current Test Circuit Figure 21. Differential Input Current Test Circuit

Circuit Description

The differential transistor pair Q4 and Q5 form a transconductance stage in that the ratio of their collector currents
is defined by the differential input voltage according to the transfer function:

(1)
where VIN is the differential input voltage, kT/q is approximately 26 mV at 25°C and I5 and I4 are the collector
currents of transistors Q5 and Q4 respectively. With the exception of Q12 and Q13, all transistors and diodes are
identical in size. Transistors Q1 and Q2 with Diode D1 form a current mirror which forces the sum of currents I4
and I5 to equal IABC:
I4 + I5 = IABC (2)
where IABC is the amplifier bias current applied to the gain pin.
For small differential input voltages the ratio of I4 and I5 approaches unity and the Taylor series of the In function
can be approximated as:

(3)

(4)
Collector currents I4 and I5 are not very useful by themselves and it is necessary to subtract one current from the
other. The remaining transistors and diodes form three current mirrors that produce an output current equal to I5
minus I4 thus:

(5)
The term in brackets is then the transconductance of the amplifier and is proportional to IABC.

Linearizing Diodes

For differential voltages greater than a few millivolts, Equation 3 becomes less valid and the transconductance
becomes increasingly nonlinear. Figure 22 demonstrates how the internal diodes can linearize the transfer
function of the amplifier. For convenience assume the diodes are biased with current sources and the input
signal is in the form of current IS. Since the sum of I4 and I5 is IABC and the difference is IOUT, currents I4 and I5
can be written as follows:

(6)
Since the diodes and the input transistors have identical geometries and are subject to similar voltages and
temperatures, the following is true:

8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

(7)
Notice that in deriving Equation 7 no approximations have been made and there are no temperature-dependent
terms. The limitations are that the signal current not exceed ID/2 and that the diodes be biased with currents. In
practice, replacing the current sources with resistors will generate insignificant errors.

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

APPLICATIONS

Voltage Controlled Amplifiers

Figure 23 shows how the linearizing diodes can be used in a voltage-controlled amplifier. To understand the
input biasing, it is best to consider the 13 kΩ resistor as a current source and use a Thevenin equivalent circuit
as shown in Figure 24. This circuit is similar to Figure 22 and operates the same. The potentiometer in Figure 23
is adjusted to minimize the effects of the control signal at the output.

Figure 22. Linearizing Diodes

For optimum signal-to-noise performance, IABC should be as large as possible as shown by the Output Voltage
vs. Amplifier Bias Current graph. Larger amplitudes of input signal also improve the S/N ratio. The linearizing
diodes help here by allowing larger input signals for the same output distortion as shown by the Distortion vs.
Differential Input Voltage graph. S/N may be optimized by adjusting the magnitude of the input signal via RIN
(Figure 23) until the output distortion is below some desired level. The output voltage swing can then be set at
any level by selecting RL.
Although the noise contribution of the linearizing diodes is negligible relative to the contribution of the amplifier's
internal transistors, ID should be as large as possible. This minimizes the dynamic junction resistance of the
diodes (re) and maximizes their linearizing action when balanced against RIN. A value of 1 mA is recommended
for ID unless the specific application demands otherwise.

Figure 23. Voltage Controlled Amplifier

10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 24. Equivalent VCA Input Circuit

Stereo Volume Control

The circuit of Figure 25 uses the excellent matching of the two LM13700 amplifiers to provide a Stereo Volume
Control with a typical channel-to-channel gain tracking of 0.3 dB. RP is provided to minimize the output offset
voltage and may be replaced with two 510Ω resistors in AC-coupled applications. For the component values
given, amplifier gain is derived for Figure 23 as being:

(8)
If VC is derived from a second signal source then the circuit becomes an amplitude modulator or two-quadrant
multiplier as shown in Figure 26, where:

(9)
The constant term in the above equation may be cancelled by feeding IS × IDRC/2(V− + 1.4V) into IO. The circuit
of Figure 27 adds RM to provide this current, resulting in a four-quadrant multiplier where RC is trimmed such that
VO = 0V for VIN2 = 0V. RM also serves as the load resistor for IO.

Figure 25. Stereo Volume Control

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 26. Amplitude Modulator

Figure 27. Four-Quadrant Multiplier

Noting that the gain of the LM13700 amplifier of Figure 24 may be controlled by varying the linearizing diode
current ID as well as by varying IABC, Figure 28 shows an AGC Amplifier using this approach. As VO reaches a
high enough amplitude (3VBE) to turn on the Darlington transistors and the linearizing diodes, the increase in ID
reduces the amplifier gain so as to hold VO at that level.

Voltage Controlled Resistors

An Operational Transconductance Amplifier (OTA) may be used to implement a Voltage Controlled Resistor as
shown in Figure 29. A signal voltage applied at RX generates a VIN to the LM13700 which is then multiplied by
the gm of the amplifier to produce an output current, thus:

(10)
where gm ≈ 19.2IABC at 25°C. Note that the attenuation of VO by R and RA is necessary to maintain VIN within the
linear range of the LM13700 input.
Figure 30 shows a similar VCR where the linearizing diodes are added, essentially improving the noise
performance of the resistor. A floating VCR is shown in Figure 31, where each “end” of the “resistor” may be at
any voltage within the output voltage range of the LM13700.

12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 28. AGC Amplifier

Figure 29. Voltage Controlled Resistor, Single-Ended

Figure 30. Voltage Controlled Resistor with Linearizing Diodes

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Voltage Controlled Filters

OTA's are extremely useful for implementing voltage controlled filters, with the LM13700 having the advantage
that the required buffers are included on the I.C. The VC Lo-Pass Filter of Figure 32 performs as a unity-gain
buffer amplifier at frequencies below cut-off, with the cut-off frequency being the point at which XC/gm equals the
closed-loop gain of (R/RA). At frequencies above cut-off the circuit provides a single RC roll-off (6 dB per octave)
of the input signal amplitude with a −3 dB point defined by the given equation, where gm is again 19.2 × IABC at
room temperature. Figure 33 shows a VC High-Pass Filter which operates in much the same manner, providing a
single RC roll-off below the defined cut-off frequency.
Additional amplifiers may be used to implement higher order filters as demonstrated by the two-pole Butterworth
Lo-Pass Filter of Figure 34 and the state variable filter of Figure 35. Due to the excellent gm tracking of the two
amplifiers, these filters perform well over several decades of frequency.

Figure 31. Floating Voltage Controlled Resistor

Figure 32. Voltage Controlled Low-Pass Filter

14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 33. Voltage Controlled Hi-Pass Filter

Figure 34. Voltage Controlled 2-Pole Butterworth Lo-Pass Filter

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 35. Voltage Controlled State Variable Filter

Voltage Controlled Oscillators

The classic Triangular/Square Wave VCO of Figure 36 is one of a variety of Voltage Controlled Oscillators which
may be built utilizing the LM13700. With the component values shown, this oscillator provides signals from 200
kHz to below 2 Hz as IC is varied from 1 mA to 10 nA. The output amplitudes are set by IA × RA. Note that the
peak differential input voltage must be less than 5V to prevent zenering the inputs.
A few modifications to this circuit produce the ramp/pulse VCO of Figure 37. When VO2 is high, IF is added to IC
to increase amplifier A1's bias current and thus to increase the charging rate of capacitor C. When VO2 is low, IF
goes to zero and the capacitor discharge current is set by IC.
The VC Lo-Pass Filter of Figure 32 may be used to produce a high-quality sinusoidal VCO. The circuit of
Figure 37 employs two LM13700 packages, with three of the amplifiers configured as lo-pass filters and the
fourth as a limiter/inverter. The circuit oscillates at the frequency at which the loop phase-shift is 360° or 180° for
the inverter and 60° per filter stage. This VCO operates from 5 Hz to 50 kHz with less than 1% THD.

Figure 36. Triangular/Square-Wave VCO

16 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 37. Ramp/Pulse VCO

Figure 38. Sinusoidal VCO

Figure 39 shows how to build a VCO using one amplifier when the other amplifier is needed for another function.

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 39. Single Amplifier VCO

Additional Applications
Figure 40 presents an interesting one-shot which draws no power supply current until it is triggered. A positive-
going trigger pulse of at least 2V amplitude turns on the amplifier through RB and pulls the non-inverting input
high. The amplifier regenerates and latches its output high until capacitor C charges to the voltage level on the
non-inverting input. The output then switches low, turning off the amplifier and discharging the capacitor. The
capacitor discharge rate is speeded up by shorting the diode bias pin to the inverting input so that an additional
discharge current flows through DI when the amplifier output switches low. A special feature of this timer is that
the other amplifier, when biased from VO, can perform another function and draw zero stand-by power as well.

Figure 40. Zero Stand-By Power Timer

The operation of the multiplexer of Figure 41 is very straightforward. When A1 is turned on it holds VO equal to
VIN1 and when A2 is supplied with bias current then it controls VO. CC and RC serve to stabilize the unity-gain
configuration of amplifiers A1 and A2. The maximum clock rate is limited to about 200 kHz by the LM13700 slew
rate into 150 pF when the (VIN1–VIN2) differential is at its maximum allowable value of 5V.
The Phase-Locked Loop of Figure 42 uses the four-quadrant multiplier of Figure 27 and the VCO of Figure 39 to
produce a PLL with a ±5% hold-in range and an input sensitivity of about 300 mV.

18 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 41. Multiplexer

Figure 42. Phase Lock Loop

The Schmitt Trigger of Figure 43 uses the amplifier output current into R to set the hysteresis of the comparator;
thus VH = 2 × R × IB. Varying IB will produce a Schmitt Trigger with variable hysteresis.

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 43. Schmitt Trigger

Figure 44 shows a Tachometer or Frequency-to-Voltage converter. Whenever A1 is toggled by a positive-going

input, an amount of charge equal to (VH–VL) Ct is sourced into Cf and Rt. This once per cycle charge is then
balanced by the current of VO/Rt. The maximum FIN is limited by the amount of time required to charge Ct from
VL to VH with a current of IB, where VL and VH represent the maximum low and maximum high output voltage
swing of the LM13700. D1 is added to provide a discharge path for Ct when A1 switches low.
The Peak Detector of Figure 45 uses A2 to turn on A1 whenever VIN becomes more positive than VO. A1 then
charges storage capacitor C to hold VO equal to VIN PK. Pulling the output of A2 low through D1 serves to turn
off A1 so that VO remains constant.

Figure 44. Tachometer

Figure 45. Peak Detector and Hold Circuit

20 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

The Ramp-and-Hold of Figure 47 sources IB into capacitor C whenever the input to A1 is brought high, giving a
ramp-rate of about 1V/ms for the component values shown.
The true-RMS converter of Figure 48 is essentially an automatic gain control amplifier which adjusts its gain such
that the AC power at the output of amplifier A1 is constant. The output power of amplifier A1 is monitored by
squaring amplifier A2 and the average compared to a reference voltage with amplifier A3. The output of A3
provides bias current to the diodes of A1 to attenuate the input signal. Because the output power of A1 is held
constant, the RMS value is constant and the attenuation is directly proportional to the RMS value of the input
voltage. The attenuation is also proportional to the diode bias current. Amplifier A4 adjusts the ratio of currents
through the diodes to be equal and therefore the voltage at the output of A4 is proportional to the RMS value of
the input voltage. The calibration potentiometer is set such that VO reads directly in RMS volts.

Figure 46. Sample-Hold Circuit

Figure 47. Ramp and Hold

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 21

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 48. True RMS Converter

The circuit of Figure 49 is a voltage reference of variable Temperature Coefficient. The 100 kΩ potentiometer
adjusts the output voltage which has a positive TC above 1.2V, zero TC at about 1.2V, and negative TC below
1.2V. This is accomplished by balancing the TC of the A2 transfer function against the complementary TC of D1.
The wide dynamic range of the LM13700 allows easy control of the output pulse width in the Pulse Width
Modulator of Figure 50.
For generating IABC over a range of 4 to 6 decades of current, the system of Figure 51 provides a logarithmic
current out for a linear voltage in.
Since the closed-loop configuration ensures that the input to A2 is held equal to 0V, the output current of A1 is
equal to I3 = −VC/RC.
The differential voltage between Q1 and Q2 is attenuated by the R1,R2 network so that A1 may be assumed to
be operating within its linear range. From Equation 5, the input voltage to A1 is:

(11)
The voltage on the base of Q1 is then

(12)
The ratio of the Q1 and Q2 collector currents is defined by:

(13)
Combining and solving for IABC yields:

(14)
This logarithmic current can be used to bias the circuit of Figure 25 to provide temperature independent stereo
attenuation characteristic.

22 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

Figure 49. Delta VBE Reference

Figure 50. Pulse Width Modulator

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 23

Product Folder Links: LM13700
LM13700
SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com

Figure 51. Logarithmic Current Source

24 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated

Product Folder Links: LM13700

 LM13700
www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013

REVISION HISTORY

Changes from Revision D (March 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 24

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: LM13700
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM13700M NRND SOIC D 16 48 TBD Call TI Call TI 0 to 70 LM13700M

LM13700M/NOPB ACTIVE SOIC D 16 48 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM13700M
& no Sb/Br)
LM13700MX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 LM13700M
LM13700MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM13700M
& no Sb/Br)
LM13700N NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 LM13700N
LM13700N/NOPB ACTIVE PDIP NFG 16 25 Pb-Free CU SN Level-1-NA-UNLIM 0 to 70 LM13700N
(RoHS)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM13700MX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1
LM13700MX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM13700MX SOIC D 16 2500 367.0 367.0 35.0
LM13700MX/NOPB SOIC D 16 2500 367.0 367.0 35.0

Pack Materials-Page 2
 MECHANICAL DATA
N0016E
NFG0016E

N16E (Rev G)

www.ti.com
 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated