Mitsubishi IGBT Module Specs
Mitsubishi IGBT Module Specs
CM100RX-24A
HIGH POWER SWITCHING USE
CM100RX-24A
sig nd
¡IC ................................................................... 100A
¡VCES ......................................................... 1200V
¡7pack (3-phase Inverter + Brake)
De me
Copper (non-plating) base plate
n
¡RoHS Directive compliant
APPLICATION
ew om
General purpose Inverters, Servo Amplifiers
1.15
0.65
(7.4)
φ2.5
(20.5)
LABEL
φ2.1
1.5
(3.81)
0.8
3.5
1.2
r N ec
12.5
0
(7.75)
*15
*18.8
*30.24
*34.04
*45.48
*49.28
*60.72
*64.52
*75.96
*79.76
*91.2
*95
(102.25)
(110)
*114.06
TERMINAL t = 0.8
SECTION A 136.9
121.7 4-φ5.5 MOUNTING HOLES
110 ±0.5
17 99 (20.5)
13 (21.14) 94.5 7
0.8
R
6.5
*54.2
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
(50)
12
17
12
35
11 *34.52
6
*30.72
50 ±0.5
10
57.5
39
62
9
22
39
8
77.1
7
6
*15.48
17
12
6
t
36
5 *11.66
13.64 14
1 2 3 4
0
No
(21.14)
A
(3) (5.4) 6 8.5
6.5
17 +1
-0.5
P(35)
NTC
Jan. 2009
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
sig nd
IC DC, TC = 90°C (Note. 1) 100
Collector current A
ICRM Pulse (Note. 4) 200
PC Maximum collector dissipation TC = 25°C (Note. 1, 5) 625 W
IE (Note.3) Emitter current TC = 25°C (Note. 1) 100
A
IERM(Note.3) (Free wheeling diode forward current) Pulse (Note. 4) 200
De me
BRAKE PART
n
Symbol Parameter Conditions Rating Unit
VCES Collector-emitter voltage G-E Short 1200
V
VGES Gate-emitter voltage C-E Short ±20
IC DC, TC = 97°C (Note. 1) 50
Collector current A
ICRM Pulse (Note. 4) 100
PC Maximum collector dissipation TC = 25°C (Note. 1, 5) 355 W
ew om
VRRM(Note.3) Repetitive peak reverse voltage 1200 V
IF (Note.3) TC = 25°C (Note. 1) 50
Forward current A
IFRM(Note.3) Pulse (Note. 4) 100
MODULE
Symbol Parameter Conditions Rating Unit
Tj Junction temperature –40 ~ +150
r N ec
°C
Tstg Storage temperature –40 ~ +125
Viso Isolation voltage Terminals to base plate, f = 60Hz, AC 1 minute 2500 Vrms
— Base plate flatness On the centerline X, Y (Note. 8) ±0 ~ +100 μm
— Torque strength Main terminals M5 screw 2.5 ~ 3.5
N·m
— Torque strength Mounting M5 screw 2.5 ~ 3.5
— Weight (Typical) 330 g
R
Note. 8: The base plate flatness measurement points are in the following figure.
Heat sink side
Y +:convex
–:concave
+
X
t
No
+
Heat sink side
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Jan. 2009
2
MITSUBISHI IGBT MODULES
CM100RX-24A
sig nd
VGE(th) Gate-emitter threshold voltage IC = 10mA, VCE = 10V 6 7 8 V
IGES Gate leakage current ±VGE = VGES, VCE = 0V — — 0.5 μA
Tj = 25°C — 2.0 2.6
Collector-emitter saturation IC = 100A, VGE = 15V (Note. 6)
VCE(sat) Tj = 125°C — 2.2 — V
voltage
IC = 100A, VGE = 15V Chip — 1.9 —
Cies Input capacitance — — 17.5
VCE = 10V
Coes Output capacitance (Note. 6) — — 1.5 nF
De me
VGE = 0V
Cres Reverse transfer capacitance — — 0.34
n
QG Total gate charge VCC = 600V, IC = 100A, VGE = 15V — 500 — nC
td(on) Turn-on delay time VCC = 600V, IC = 100A — — 100
tr Turn-on rise time VGE = ±15V, RG = 3.0Ω — — 70
td(off) Turn-off delay time Inductive load — — 300 ns
tf Turn-off fall time — — 600
trr (Note.3) Reverse recovery time — — 150
(IE = 100A)
Qrr (Note.3) Reverse recovery charge — 5 — μC
ew om
Tj = 25°C — 2.6 3.4
IE = 100A, VGE = 0V (Note. 6)
VEC(Note.3) Emitter-collector voltage Tj = 125°C — 2.16 — V
IE = 100A, VGE = 0V Chip — 2.5 —
Rth(j-c)Q Thermal resistance per IGBT — — 0.20
(Note. 1) K/W
Rth(j-c)R (Junction to case) per free wheeling diode — — 0.29
RGint Internal gate resistance TC = 25°C, per switch — 0 —
Ω
RG External gate resistance 3 — 31
r N ec
BRAKE PART
Limits
Symbol Parameter Conditions Unit
Min. Typ. Max.
ICES Collector cutoff current VCE = VCES, VGE = 0V — — 1 mA
VGE(th) Gate-emitter threshold voltage IC = 5mA, VCE = 10V 6 7 8 V
R
Jan. 2009
3
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
sig nd
B(25/50) B constant Approximate by equation (Note. 7) — 3375 — K
P25 Power dissipation TC = 25°C — — 10 mW
MODULE
Limits
Symbol Parameter Conditions Unit
Min. Typ. Max.
Contact thermal resistance Thermal grease applied
De me
Rth(c-f) (Note. 2) — 0.015 — K/W
(Case to fin) (Note. 1) per 1 module
n
Note.1: Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips. (Refer to the figure of the chip location.)
2: Typical value is measured by using thermally conductive grease of λ = 0.9W/(m·K).
3: IE, IERM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
IF, IFRM, VF, VRRM and IRRM represent ratings and characteristics of the Clamp diode of Brake part.
4: Pulse width and repetition rate should be such that the device junction temperature (Tj) dose not exceed Tjmax rating.
5: Junction temperature (Tj) should not increase beyond 150°C.
6: Pulse width and repetition rate should be such as to cause negligible temperature rise.
(Refer to the figure of the test circuit for VCE(sat) and VEC)
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7: B(25/50) = In( R25 )/( 1 1
)
R50 T25 T50
R25: resistance at absolute temperature T25 [K]; T25 = 25 [°C]+273.15 = 298.15 [K]
R50: resistance at absolute temperature T50 [K]; T50 = 50 [°C]+273.15 = 323.15 [K]
55.9 (Di/VN)
44.9 (Di/VP)
LABEL SIDE
r N ec
100.2
101.2
105.8
22.4
34.3
45.3
56.3
79.8
91.8
0
0 0
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
16.9 Tr Tr Tr Di
UP VP WP 12 18.4
Tr Br
35
R
23.9 Tr Tr 11
27.6
Di UN Di VN Di WN Th 10
26.8
(62)
(50)
UP VP WP 9
34.6 Di Di Di 8
(77.1)
UN VN WN Tr 7
6 40.8
36 Br 5
1 2 3 4
t
No
(110)
(121.7)
(136.9)
Each mark points the center position of each chip. Tr**: IGBT, Di**: FWDi (DiBr: Clamp diode), Th: NTC thermistor
fo
Jan. 2009
4
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
P P P
sig nd
EuP EuP
U U B
De me
EuN EuN N EB N
N
n
P side Inverter part Tr N side Inverter part Tr Br Tr
(example of U arm) (example of U arm)
VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, VGE = 0V(GuP-EuP, GvP-EvP, GwP-EwP,
GwN-EwN, GB-EB) GwN-EwN, GB-EB) GuN-EuN, GvN-EvN, GwN-EwN)
V VGE = 0V IE VGE = 0V V IF
GuP GuP
r N ec
EuP EuP
B
U U
EB
N
R
EuN EuN
N N
VGE 90% IE
IE
Arm
0V 0% trr
Load
–VGE
fo
+ VCC IC
0A t
90%
+VGE RG
VCE
0V Irr 1/2 ✕ Irr
VGE IC
–VGE 0A 10% Qrr = 1/2 ✕ Irr ✕ trr
tr tf
td(on) td(off)
Switching time test circuit and waveforms trr, Qrr test waveform
Jan. 2009
5
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
OUTPUT CHARACTERISTICS VOLTAGE CHARACTERISTICS
(TYPICAL) Inverter part (TYPICAL) Inverter part
200 4
sig nd
20V
COLLECTOR CURRENT IC (A)
13 3.5
COLLECTOR-EMITTER
150 3
12 2.5
100 2
11 1.5
De me
50 1
n
10
0.5 Tj = 25°C
9 Tj = 125°C
0 0
0 1 2 3 4 5 6 7 8 9 10 0 50 100 150 200
Tj = 25°C 7
5
EMITTER CURRENT IE (A)
8 3
COLLECTOR-EMITTER
102
r N ec
6 7
5
3
2
4
IC = 200A 101
7
IC = 100A 5
2
R
3
IC = 40A 2 Tj = 25°C
Tj = 125°C
0 100
6 8 10 12 14 16 18 20 0 0.5 1 1.5 2 2.5 3 3.5 4
HALF-BRIDGE
No
101 2
CAPACITANCE (nF)
7
5 102
fo
3 Coes 7
2 5
100 3 td(on)
7
5 2
3 Conditions:
2 Cres 101 VCC = 600V
7
10–1
7 5 VGE = ±15V
5 3 RG = 3.0Ω tr
3 2 Tj = 125°C
2
VGE = 0V Inductive load
10–2 –1 100 0
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 10 2 3 5 7 101 2 3 5 7 102
Jan. 2009
6
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
HALF-BRIDGE HALF-BRIDGE
SWITCHING CHARACTERISTICS SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part (TYPICAL) Inverter part
103 102
7 7Conditions:
sig nd
5 5VCC = 600V
De me
101 VCC = 600V 100 Eon
7 7
VGE = ±15V
n
5 5
3 IC = 100A 3
2 Tj = 125°C 2
Inductive load
100 0 10–1 0
10 2 3 5 7 101 2 3 5 7 102 10 2 3 5 7 101 2 3 5 7 102
5 VGE = ±15V 3
Eon 2
3 IC, IE = 100A
Tj = 125°C 102
r N ec
lrr (A), trr (ns)
2 Irr
Inductive load 7
5
Eoff trr
101 3
7 2
Conditions:
5 Err 101 VCC = 600V
7
3 5 VGE = ±15V
RG = 3.0Ω
R
2 3
2 Tj = 25°C
Inductive load
100 0 100 0
10 2 3 5 7 101 2 3 5 7 102 10 2 3 5 7 101 2 3 5 7 102
TRANSIENT THERMAL
No
5 TC = 25°C
NORMALIZED TRANSIENT
VCC = 400V 3
15 2
7
5
10 3
2
10–2
7
5 5 Inverter IGBT part : Per unit base = Rth(j–c) = 0.20K/W
3 Inverter FWDi part : Per unit base = Rth(j–c) = 0.29K/W
2 Brake IGBT part : Per unit base = Rth(j–c) = 0.35K/W
Brake Clamp-Di part : Per unit base = Rth(j–c) = 0.48K/W
0 10–3
0 100 200 300 400 500 600 700 10–52 3 5710–42 3 5710–32 3 5710–22 3 5710–12 3 57 100 2 3 57 101
Jan. 2009
7
MITSUBISHI IGBT MODULES
CM100RX-24A
HIGH POWER SWITCHING USE
VGE = 15V
sig nd
7
3.5
3 3
2.5 2
2 101
7
1.5
De me
5
1
n
3
Jan. 2009