Composites Brochure
Composites Brochure
COMPOSITES
APPLICATIONS
01
YD143 - 45-60 130-140 Single component hot melt system, provides long
shelf life at ambient conditions.
YD565 / TH7252 100 : 20 15-20 115-125 Low mix viscosity, solvent free system.
YDL5522EK70 / 100 : 5 30-45 115-125 Solvent based system designed exclusively for sports
TA7760 & recreational goods.
YD565 / TH7353 / 100 : 7.5 : 8.5 10 - 15 110-120 3k prepreg system with high mechanical strength
TA7760 and stiffness, ideal for sheet molding compound
process to manufacture structural auto-composite
parts.
NOTE: 1 Part by weight (pbw), 2 in days @15°C, 3 Glass Transition Temperature (°C)
YDM441 / TH7451_2 100 : 45 18-25 220-260 Elevated temperature cure epoxy systems based
on tetrafunctional epoxy resin and aromatic
YDM441 / TH7455 100 : 35 20-25 230-250 amine curing agents (hardener TH7455 is
liquid).
YDM450 / TH7455 100 : 40 15-20 220-240 Elevated temperature cure epoxy system based
on trifunctional epoxy resins and liquid aromatic
YDM451 / TH7455 100 : 45 20-30 208-213 amine curing agent. Resin YDM451 has high
purity.
NOTE: 1 Part by weight (pbw), 2 in minutes @ 150°C, 3 Glass transition temperature (°C)
02
YDL535 / TH7354 100:35 500-1,000 8 - 10 145-155 Low viscosity, long pot life system suitable to cure at
ambient temperature, post curing above 120ºC is
required.
YDL582 / TH7255 100:35 500-750 25-355 80-90 Low viscosity, fast, ambient cure system for small
components.
YDL582 / TH7256 100:35 500-650 80-1005 80-90 Ambient temperature cure, low viscosity system for
small components with medium reactivity.
YDL582 / TH7257 100:35 200-500 4.5 - 5.5 80-90 Ambient temperature cure, slow reactive system with
very low viscosity for fairly large components.
YDL5532 / TH7171 100:35 2,500-3,500 2-3 65-75 Ambient cured, moderately reactive system designed
for composite tanks and vessels.
YDL5515 / TH9259 100:30 200-400 80-90 Low viscosity, ambient cured system with long pot
8-10 life. Designed for composite pressure vessels, type 3
and 4.
YDL670 / TH8651 / 100:90:1 500-800 >10 140-150 Elevated cure, high temperature resistant system.
TA7755 Designed for composite pressure vessels, type 3 and
4.
YDL680 / TH7682 / 100:95:7 800-1,200 >8 110-120 Elevated temperature cure, three component system
TR 25 with internal mold release.
YDL598 / TH7657 / 100:85:1 700-1,000 >10 75-85 Halogen free fire retardant system designed to cure at
TA7852 elevated temperatures.
YDL598 / TH7694 / 100:85:10 500-800 >8 100-110 Elevated temperature cure three component, halogen
TR 25 free fire retardant system with internal mold release.
YDL660 / TH7455 100:25 1,500-3,500 >16 170-200 Very slow reactive, ambient cure system for high
glass transition temperature (Tg). Requires post
curing above 160°C.
YDL670 / TH7353 100:22 1,000-2,000 1-3 140-170 High temperature resistance, medium viscosity
system for ambient curing, post curing above120ºC is
required to achieve full strength.
YDL670 / TH7354 100:33 500-1,000 8-10 140-170 Long pot life, high temperature resistant system. Post
curing above 120ºC is required.
YDL680 / TH7652 / 100:80:1-2 400-1,000 >10 120-140 Low viscosity, long pot life, elevated temperature cure
TA7851 system for high thermal resistance.
YDL680 / TH7661 / 100:90:1-2 1,000-2,000 >10 160-180 Low viscosity, long pot life, elevated temperature cure
TA7851 system for large components.
YDL5533 / TH7683 / 100:110:1 700 -1,400 >10 180 -190 Elevated cure, high temperature resistant system
TA7851 suitable for pultruded profiles.
YDL690 / TH7661 P1 100:90 500-1000 >10 180-200 Low viscosity, hot cure epoxy system, with glass
transition temperature around 180°C. Guarantees
complete impregnation of reinforcing fibers such as
glass, carbon, and polyaramide.
YDL680 / TH7661SP 100:90:0.25 2,000-2,5005 >1.5 165 - 180 Exhibits a low mix viscosity and long pot life at
/ TA7755 ambient temperature. The system shows excellent
fiber impregnation properties and easy to process.
YDL5532SP / TH7171 100:35:00 1500 -1900 30 -406 65 - 75 Reactive system designed for composite tanks and
vessels.
YDL549CM / TH8666 100:98 600-900 45-55* 110-130 Elevated cure, toughened epoxy system for filament
winding & RTM process.
YDL549CM / 100:90 500-900 10-15# 110-120 Elevated cure, low processing viscosity and provides
TH8664CM long working time at ambient temperature enabling
improved fiber impregnation and ease of processing
for filament winding & pultrusion process.
YDL680 / TH8657 / 100:100:1-1.5 400-1,000 8-12$ 95-100 Elevated cure, suitable for pultrusion and filament
TA7860 winding processes.
NOTE: 1 Part by weight (pbw), 2 Brookfield Viscosity @ 25°C (cP), 3 in hours @ 25°C (100 grams mix), 4 Glass Transition Temperature (°C),
5 in minutes @ 25°C (100 grams mix) | $ in minute @ 120°C (12 gm mix) | # in minute @ 100°C (12 gm mix) | * in minute @ 80°C (12 gm mix)
6 in minutes @ 65°C (12 grams mix)
03
Laminating Resin Systems for RTM, Hand lay-up and Infusion/ VARTM
Epotec® laminating resin Systems for Resin transfer molding (RTM), hand lay-up and Infusion include ambient as
well as elevated cure systems designed for optimum processing viscosity and reactivity varying from few minutes to
several hours at ambient temperature. The choice can be made depending on process conditions, geometry of the
component and end use requirements.
YD535 / TH7253-8 100 : 35 800-1,400 8 (TH7253) 75-90 One resin-six hardener system with fast to slow
> 105 (TH7258 ) reactivity.
YD580SP / TH9253_4 100 : 33 900-1,300 15-60 75-90 One resin-two hardener system with fast and
moderate reactivity. Resin and hardeners are based
on non T-labelled components.
YD580C / 100 : 33 800-1,400 8 (TH7253C) > 75-90 One resin-six hardener system with fast to slow
TH7253C-8C 105 ( TH7258C ) reactivity, designed for fast strength built-up & high
mechanical stiffness.
100 : 35 200-300 8 (TH7253) > 75-85 One resin-six hardener system with fast to slow
YD535LV / TH7253-8 105 ( TH7258C ) reactivity.
100 : 32 200-300 40-400 75-85 One resin-two hardener system, fast hardener has
YD585 / TH7255-7E low viscosity
100 : 34 200-300 >105 75-85 Slow reacting system, faster strength built-up in
YD535SP / TH8257SP comparison to systems of similar reactivity.
100 : 33 200-300 >125 75-85 Ultra Slow-Fast Cure system based on proprietary
YDL5540 / TH9292 technology.Recommended for large to extra-large
components.
100 : 95 200-300 8-126 80-90 Latent cure infusion system based on proprietary
YDL590 / TH7675 technology.
100 : 38 500-700 100-150 110-130 Fast strength build-up with high thermal stability,
YDL505 / TH7377 excellent dynamicmechanical properties.
100 : 30 800-1,500 120-140 110-130 Low viscosity, slow reactive system for high thermal
YDL535 / TH7295 resistance and mechanical property retention at
elevated temperatures.
100 : 25 600-1,000 90-130 80-90 Low viscosity ambient cure system for small
YDL547 / TH8278 components where high wetting and fast strength
build-up is required.
100 : 35 500-1,000 12-60 75-90 General purpose laminating system with one
YDL586 / TH8280-1 resin-two hardeners of different reactivity.
100 : 35 1,000-1,400 30-50 90-110 Medium viscosity system for small components
YDL660 / TH7255 providing moderate thermal resistance.
100 : 33 250-350 60-90 75-85 Low viscosity, fast cure system, designed exclusively
YDL5540 / TH9291 for light RTM process.
100 : 25 1,000-2,000 30-90 130-140 One resin-two hardener system designed for fast
YDL583 / TH8272-4 productivity in manufacturing auto-components by
RTM process.
YD535LV / TH8651 / 100 : 95 : 1 200-300 >105 130-140 Low viscosity, moderate temperature resistant
TA7755 elevated cure system suitable for infusion and RTM
processes.
YDL567 / TH 8287 100 : 38 500-1,000 50-70 65-75 Clear, low colour laminating resin system with
exceptional UV resistance.
YD510 / TH7284 100 : 27 500-1,000 45-55 70-80 Laminating system designed exclusively for solar
panels.
YDL660 / TH7257 100 : 35 500-1,000 300-360 90-110 Low viscosity, slow reactive system for FRP
components with high ultimate elongation.
YDL670 / TH7652 / 100 : 80 : 1-2 500-1,000 >105 130-160 Elevated temperature cure, low viscosity standard
TA7851 system for good mechanical and thermal properties
YDL670 / TH7661 / 100 : 90 : 3 1,000-2,500 >105 160-180 Elevated temperature cure, low viscosity system for
TA7851 excellent thermal resistance at elevated temperature.
YDL680 / TH7354 100 : 35 2,000-4,000 >85 130-180 Medium viscosity, slow reactive, ambient cure system
for excellent thermal resistance.
NOTE: 1 Part by weight (pbw), 2 Brookfield Viscosity @ 25ºC (cP), 3 in minutes @ 250C (100 grams mix), 4 Glass Transition Temperature (0C),
5 in hours @ 250C (100 grams mix), 6 in hours @ 400C (100 grams mix)
04
Laminating Resin Systems for RTM, Hand lay-up and Infusion/ VARTM
YD595 / TH7295 100 : 30 500-1,000 210-240 115-125 Laminating resin system for tooling& molds, provides
moderate reactivity and temperature resistance.
YD535LV / TH7353 100 : 30 350-400 150-200 130-140 Laminating resin system for tooling& molds, provides
moderate reacting and high temperature resistance.
YDL574 / TH7363 100 : 30 250-300 180-220 115-125 Laminating system to make tools & molds by infusion
process (<20m).
YDL594 / TH7365 100 : 35 200-300 380-420 115-125 Laminating system to make tools& molds by infusion
process (>20m).
YDL5551 / TH9297 100 : 32 250-320 240-300 150-160 Low viscosity, high temperature resistant laminating
system to make tools & molds by infusion process.
YDH6000 / TH7652 100 :115 : 1 100-200 7-116 200-210 Low viscosity, high temperature resistant elevated
/ TA7755 cure system.
YDL5514 / 100 : 33 200-300 > 250 75-85 Extra slow reacting system, enables faster strength
TH9258SP development in comparison to systems of similar
reactivity.
YDL5557 / 100 : 27-28 180-250 - 80-90 Recylable epoxy system based on Recyclamine
THR9357_8 technology. Comprises of one resin and two
hardeners with standard and extra slow reactivity.
NOTE: 1 Part by weight (pbw), 2 Brookfield Viscosity @ 25ºC (cP), 3 in minutes @ 250C (100 grams mix), 4 Glass Transition Temperature (0C),
5 in hours @ 250C (100 grams mix), 6 in hours @ 400C (100 grams mix)
YD593-TH8285 100:100 3-54 40-60 Instant cure, mercaptan based adhesive for general purpose bonding.
YDAC1540-TH8265 100:35 3-54 40-60 Instant cure, mercaptan free adhesive for general purpose bonding.
YD1556-TH9283SP 100:100 60-80 70-80 Thixotropic adhesive providing excellent sagging resistance during
application on vertical surfaces. Suitable for glass fiber wetting.
YD553-TH7165 100 : 80 50-80 50-70 Moderately reactive adhesive , suitable for joining wide variety of substrates.
YD1565-TH7175 100 : 40 25-35 60-70 Fast reacting adhesive, provides moderate temperature resistance, excellent
electrical insulation and thermal shock resistance.
YD1561-TH9298 100 : 25 30-40 135-145 High temperature and chemical resistant adhesive.
YD1535G/ TH7254G 100 : 45 15-30 75-85 Thixotropic adhesive, characterized by fast curing and strength development.
YD1535G/ TH7256G 100 : 45 50-80 75-85 Moderately reactive thixotropic adhesive for small to medium size
components.
YD1535G/ TH7257G 100 : 45 90-110 75-85 Thixotropic toughened system for joining large structural parts such as wind
rotor blades, designed for fast strength built-up.
YD1581/ TH9281 100 : 45 80-100 75-85 New Generation Bonding Paste based on Instant Thixotropy Concept.
Designed for improved m/c dispensability and defect reduction.
YD1560/ TH9289 100 : 45 125-150 80-90 High strength-stiffness toughened system with long open time. Ideal for
bonding large to extra large components.
YD1563/ TH9290 100 : 37 90-120 80-90 Low density-glass fiber free adhesive system, designed for higher resilience
and ductility.
NOTE: 1 Part by weight (pbw), 2 in minutes @ 25°C (100 grams mix), 3 Glass transition temperature (°C), 4 in minutes @ 25°C (1 gram mix)
05
YD1100 / TH7152 100 : 27 15-20 115-125 180-220 Closed cell in-situ non CFC
foam system with density
YD1106250..D350 100 : 40 20-30 115-125 250-500 130-700kg/m3
/ TH 7161
NOTE: 1 Part by weight (pbw), 2 50gms mix @ 250C(in minutes), 3 Glass transition temperature (°C)
YD135 / TH7202 100 : 19 1,500-2,000 25-30 Fast curing system providing flexibility at
lower thickness.
YD135 / TH8279 100 : 33 1,500-2,000 50-70 Low color, blush-free system with good
flexibility.
NOTE: 1 Part by weight (pbw), 2 Brookfield Viscosity @ 250C( cP ), 3 Glass transition temperature (°C)
06
AM XP 140 A/B / 100 : 25 140-200 40-60 Established one resin - 2 hardener epoxy binder system for
AM XP 141 B large cast machine basis. Summer and winter hardener
available.
AM 3641 A/B 100 : 25 150-200 >40 Epoxy binder system for cast machine basis with low
exothermic heat as well as minimal shrinkage and creeping
properties.
AM XP 340 A/B / 100 : 25 170-450 15-260 1 resin - 3 hardener mineral casting resin system suitable for
VP 1241-14 H / small parts with low component thickness up to extra large
1570-29 H machine bases with 15 - 20 tons.
NOTE: 1 Part by weight (pbw), 2 Viscosity @ 250C( cP ), 3 in minutes @ 250C (100 grams mix)
AM 4055 R Powder 80-100 Non-reactive preformbinder for rotor blade applications and automotive
applications requiring medium softering range.
AM XP 187 Powder 100-140 Preferred non-reactive preformbinder for RTM applications requiring
high softerning range.
AM XP 182-3 Powder 130-160 Reactive high performance preformbinder with very short activation
time (<3 min) and enhanced preform stability when ejected at high
temperatures.
AM 1010 Liquid 60-90 EP based spray adhesive with superior preform stability at elevated
temperatures up to 45 °C. Suitable for application in countries with high
ambient temperature.
AM 1011 Liquid 60-90 Modified EP based spray adhesive with good preform stability at
elevated temperatures up to 35 °C. Suitable for application in countries
with low-medium ambient temperature.
FabFix Blue / Cans 60-90 Modified EP based spray adhesive with good preform stability at
Clear elevated temperatures up to 35 °C. Ready to use in spray cans. No
additional spray equipment required.
AM 1020 Liquid Ambient temp High performance UV reactive spray adhesive with persistent and
stable tack. Requires suitable UV equipment!
Disclaimer
This brochure is designed to provide you with information to the Epotec® range of Products referred to, and should be
read in conjunction with the latest Technical Data Sheets (TDS) and Material Safety Data Sheets (MSDS), and may
not be construed as legally binding. Nothing contained herein constitutes an offer for the sale of any product. The
Company makes no warranties, either expressed or implied, with respect to its product or the results of its use, or
with respect to any information provided by the Company.
Because of changes in conditions and circumstances the Company reserves the right, subject to all applicable laws,
at any time, at its discretion, and without notice, to discontinue or change the specifications and the prices of their
products, and to either permanently or temporarily withdraw any such products from the market without incurring
any liability to any prospective purchaser or purchaser. It is the sole responsibility of the user to test our products for
suitability in the intended use. Always consult an authorized Epotec® representative for the latest information with
respect to specifications, prices, and availability.
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& time, resolve challenges, drive innovation and
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