Tda 8425
Tda 8425
DATA SHEET
TDA8425
Hi-fi stereo audio processor;
I2C-bus
Product specification October 1988
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
GENERAL DESCRIPTION
The TDA8425 is a monolithic bipolar integrated stereo sound circuit with a loudspeaker channel facility, digitally
controlled via the I2C-bus for application in hi-fi audio and television sound.
Feature:
• Source and mode selector for two stereo channels
• Pseudo stereo, spatial stereo, linear stereo and forced mono switch
• Volume and balance control
• Bass, treble and mute control
• Power supply with power-on reset
PACKAGE OUTLINE
20-lead dual in-line; plastic (SOT146); SOT146-1; 1996 November 26.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
PINNING
FUNCTIONAL DESCRIPTION
Source selector
The input to channel 1 (CH1) and channel 2 (CH2) is determined by the source selector. The selection is made from the
following AF input signals:
• IN 1 L (pin 18); IN1 R (pin 20)
or
• IN2 L (pin 1); IN2 R (pin 3)
Mode selector
The mode selector selects between stereo, sound A and sound B (in the event of bilingual transmission) for OUT R and
OUT L.
Linear stereo, pseudo stereo, spatial stereo and forced mono mode(1)
It is possible to select four modes: linear stereo, pseudo stereo, spatial stereo or forced mono. The pseudo stereo mode
handles mono transmissions, the spatial stereo mode handles stereo transmissions and the forced mono can be used
in the event of stereo signals.
(1) During forced mono mode the pseudo stereo mode cannot be used.
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Philips Semiconductors Product specification
Bass control
The bass control stage can be switched from an emphasis of 15 dB to an attenuation of 12 dB for low frequencies in
steps of 3 dB.
Treble control
The treble control stage can be switched from +12 dB to −12 dB in steps of 3 dB.
Power-on reset
The on-chip power-on reset circuit sets the mute bit to active, which mutes both parts of the treble amplifier. The muting
can be switched by transmission of the mute bit.
Module address
Data transmission to the TDA8425 starts with the module address MAD.
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Philips Semiconductors Product specification
Subaddress
After the module address byte a second byte is used to select the following functions:
• Volume left, volume right, bass, treble and switch functions
The subaddress SAD is stored within the TDA8425. Table 1 defines the coding of the second byte after the module
address MAD.
Table 1 Second byte after module address MAD
128 64 32 16 8 4 2 1
MSB LSB
function 7 6 5 4 3 2 1 0
volume left 0 0 0 0 0 0 0 0
volume right 0 0 0 0 0 0 0 1
bass 0 0 0 0 0 0 1 0
treble 0 0 0 0 0 0 1 1
switch functions 0 0 0 0 1 0 0 0
subaddress SAD
The automatic increment feature of the slave address enables a quick slave receiver initialization, within one
transmission, by the I2C-bus controller (see Fig.5).
MSB LSB
function 7 6 5 4 3 2 1 0
volume left VL 1 1 V05 V04 V03 V02 V01 V00
volume right VR 1 1 V15 V14 V13 V12 V11 V10
bass BA 1 1 1 1 BA3 BA2 BA1 BA0
treble TR 1 1 1 1 TR3 TR2 TR1 TR0
switch functions S1 1 1 MU EFL STL ML1 ML0 IS
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Philips Semiconductors Product specification
Truth tables
Truth tables for the switch functions
Table 3 Source selector
function ML1 ML0 IS channel
stereo 1 1 0 1
stereo 1 1 1 2
sound A 0 1 0 1
sound B 1 0 0 1
sound A 0 1 1 2
sound B 1 0 1 2
Table 5 Mute
mute MU
active; automatic
after POR(2) 1
not active 0
Notes
1. Pseudo stereo function is not possible in this mode.
2. Where: POR = Power-ON Reset.
Truth tables for the volume, bass and treble controls
Table 6 Volume control
2 dB/step
V×5 V×4 V×3 V×2 V×1 V×0
(dB)
6 1 1 1 1 1 1
4 1 1 1 1 1 0
−62 0 1 1 1 0 1
−64 0 1 1 1 0 0
≤ −80 0 1 1 0 1 1
≤ −80 0 0 0 0 0 0
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Philips Semiconductors Product specification
3 dB/step
TR3 TR2 TR2 TR0
(dB)
12 1 1 1 1
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
12 1 0 1 0
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
0 0 1 1 0
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
−12 0 0 1 0
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅ ⋅⋅
−12 0 0 0 0
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Philips Semiconductors Product specification
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER SYMBOL MIN. MAX. UNIT
Supply voltage VCC 0 16 V
Voltage range for pins with external capacitors Vcap 0 VCC V
Voltage range for pins 11 and 12 VSDA, SCL 0 VCC V
Voltage range at pins 1, 3, 9, 11, 12, 13, 18 and 20 VI/O 0 VCC V
Output current at pins 9 and 13 IO − 45 mA
Total power dissipation at Tamb < 70 °C Ptot − 450 mW
Operating ambient temperature range Tamb 0 70 °C
Storage temperature range Tstg −25 +150 °C
Electrostatic handling, classification A(1)
Note
1. Human body model: C = 100 pF, R = 1.5 kΩ and V ≥ 4 kV;
charge device model: C = 200 pF, R = 0 Ω and V ≥ 500 V.
DC CHARACTERISTICS
VCC = 12 V; Tamb = 25 °C; unless otherwise specified
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Philips Semiconductors Product specification
AC CHARACTERISTICS (1)
VCC = 12 V; bass/treble in linear position; pseudo and spatial stereo off; RL > 10 kΩ; CL < 1000 pF;
Tamb = 25 °C; unless otherwise specified
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tSU; STA = start code set-up time. tBUF = bus free time.
tHD; STA = start code hold time. tSU; DAT = data set-up time.
tSU; STO = stop code set-up time. tHD; DAT = data hold time.
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Philips Semiconductors Product specification
pin 17 pin 19
curve effect
(nF) (nF)
1 15 15 normal
2 5.6 47 intensified
3 5.6 68 more intensified
Fig.9 Input signal handling capability; gain = −10 dB; RS = 600 Ω; RL = 10kΩ; bass/treble = 0 dB; VCC = 12 V.
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Philips Semiconductors Product specification
Fig.10 Input signal handling capability plotted against gain setting; THD = −60 dB; f = 1 kHz; RS = 600 Ω;
RL = 10 kΩ; bass/treble = 0 dB; VCC = 12 V.
Fig.11 Output signal handling capability; gain = 6 dB; RS = 600 Ω; RL = 10 kΩ, bass/treble = 0 dB, VCC = 12 V.
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Philips Semiconductors Product specification
Fig.12 Source selector separation (channel 2 and channel 1); gain = 0 dB; Vi1 = 0 V; Vi2 = 1 V, RS = 0 Ω;
RL = 10 kΩ; bass/treble = 0 dB; VCC = 12 V.
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Philips Semiconductors Product specification
Fig.14 Mute signal rejection as a function of frequency; gain = 0 dB; Vi = 1.0 V; RS = 0 Ω; RL = 10 kΩ;
bass/treble = 0 dB; VCC = 12 V.
Fig.15 Ripple rejection as a function of frequency; voltage ripple = 0.3 V (rms); RS = 0 Ω; RL = 10 kΩ;
bass/treble = 0 dB; VCC = 12 V.
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Philips Semiconductors Product specification
Fig.16 Noise output voltage as a function of gain; weighted CCIR468 quasi peak gain, + 6 dB to −64 dB;
Vi = 0 V, RS = 0 Ω; RL = 10 kΩ; bass/treble = 0 dB; VCC = 12 V.
Fig.17 Frequency response of bass and treble control; bass and treble gain settings = −12 to +15 dB;
gain is 0 dB; Vi = 0.1 V; RS9 = 600 Ω; RL = 10 kΩ; VCC = 12 V.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Fig.20 Turn-on behaviour; C = 2.2 µF; RL = 10 kΩ. Fig.21 Turn-off behaviour; without modulation.
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Philips Semiconductors Product specification
ICC = 25 mA
Iload = 239 mA
ton = 15 ms
toff = 110 ms
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
PACKAGE OUTLINE
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b
20 11 MH
pin 1 index
E
1 10
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D
(1)
E
(1)
e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 0.36 26.92 6.40 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.0
1.30 0.38 0.23 26.54 6.22 3.05 7.80 8.3
0.068 0.021 0.014 1.060 0.25 0.14 0.32 0.39
inches 0.17 0.020 0.13 0.10 0.30 0.01 0.078
0.051 0.015 0.009 1.045 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
92-11-17
SOT146-1 SC603
95-05-24
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Philips Semiconductors Product specification
SOLDERING with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
Introduction 5 seconds.
There is no soldering method that is ideal for all IC The device may be mounted up to the seating plane, but
packages. Wave soldering is often preferred when the temperature of the plastic body must not exceed the
through-hole and surface mounted components are mixed specified maximum storage temperature (Tstg max). If the
on one printed-circuit board. However, wave soldering is printed-circuit board has been pre-heated, forced cooling
not always suitable for surface mounted ICs, or for may be necessary immediately after soldering to keep the
printed-circuits with high population densities. In these temperature within the permissible limit.
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. Repairing soldered joints
A more in-depth account of soldering ICs can be found in
Apply a low voltage soldering iron (less than 24 V) to the
our “IC Package Databook” (order code 9398 652 90011).
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in
The maximum permissible temperature of the solder is contact for up to 10 seconds. If the bit temperature is
260 °C; solder at this temperature must not be in contact between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
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