Flash Memory Migration Guide
Flash Memory Migration Guide
S29GL256N
S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash
Featuring 110 nm MirrorBit
This product family has been retired and is not recommended for designs. For new and current designs, S29GL128S, S29GL256S,
and S29GL512T supersede the S29GL128N, S29GL256N, and S29GL512N respectively. These are the factory-recommended
migration paths. Please refer to the S29GL-S and S29GL-T Family data sheets for specifications and ordering information.
Distinctive Characteristics
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Manufactured on 110 nm MirrorBit Process Technology
programming operation is completed
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Secured Silicon Sector Region
– Erase Suspend and Resume: read/program other sectors before
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– 128-word/256-byte sector for permanent, secure identification
an erase operation is completed
through an 8-word/16-byte random Electronic Serial Number,
– Data# polling and toggle bits provide status
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accessible through a command sequence
– Unlock Bypass Program command reduces overall multiple-word
– May be programmed and locked at the factory or by the customer
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programming time
Flexible Sector Architecture
– CFI (Common Flash Interface) compliant: allows host system to
– S29GL512N: Five hundred twelve 64 Kword (128 Kbyte) sectors
identify and accommodate multiple flash devices
– S29GL256N: Two hundred fifty-six 64 Kword (128 Kbyte) sectors
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Hardware Features
– S29GL128N: One hundred twenty-eight 64 Kword (128 Kbyte)
– Advanced Sector Protection
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sectors
– WP#/ACC input accelerates programming time (when high
Compatibility with JEDEC Standards voltage is applied) for greater throughput during system
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– Provides pinout and software compatibility for single-power supply production. Protects first or last sector regardless of sector
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20-year Data Retention typical – Ready/Busy# output (RY/BY#) detects program or erase cycle
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completion
Performance Characteristics
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– 100 ns (S29GL512N)
110 ns Full Now
– 8-word/16-byte page read buffer 512 Mb
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Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-01522 Rev. *B Revised January 08, 2016
S29GL512N
S29GL256N
S29GL128N
General Description
The S29GL512/256/128N family of devices are 3.0V single power flash memory manufactured using 110 nmMirrorBit technology.
The S29GL512N is a 512 Mbit, organized as 33,554,432 words or 67,108,864 bytes. The S29GL256N is a 256 Mbit, organized as
16,777,216 words or 33,554,432 bytes. The S29GL128N is a 128 Mbit, organized as 8,388,608 words or 16,777,216 bytes. The
devices have a 16-bit wide data bus that can also function as an 8-bit wide data bus by using the BYTE# input. The device can be
programmed either in the host system or in standard EPROM programmers.
Access times as fast as 90 ns (S29GL128N, S29GL256N), 100 ns (S29GL512N) are available. Note that each access time has a
specific operating voltage range (VCC) and an I/O voltage range (VIO), as specified in the Product Selector Guide on page 4 and the
Ordering Information on page 9. The devices are offered in a 56-pin TSOP or 64-ball Fortified BGA package. Each device has
separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.
Each device requires only a single 3.0 volt power supply for both read and write functions. In addition to a VCC input, a high-
voltage accelerated program (WP#/ACC) input provides shorter programming times through increased current. This feature is
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intended to facilitate factory throughput during system production, but may also be used in the field if desired.
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The devices are entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to
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the device using standard microprocessor write timing. Write cycles also internally latch addresses and data needed for the
programming and erase operations.
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The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other
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sectors. The device is fully erased when shipped from the factory.
Device programming and erasure are initiated through command sequences. Once a program or erase operation has begun, the
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host system need only poll the DQ7 (Data# Polling) or DQ6 (toggle) status bits or monitor the Ready/Busy# (RY/BY#) output to
determine whether the operation is complete. To facilitate programming, an Unlock Bypass mode reduces command sequence
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overhead by requiring only two write cycles to program data instead of four.
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The Enhanced VersatileI/O™ (VIO) control allows the host system to set the voltage levels that the device generates and tolerates
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on all input levels (address, chip control, and DQ input levels) to the same voltage level that is asserted on the VIO pin. This allows
the device to operate in a 1.8 V or 3 V system environment as required.
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Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power
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transitions. Persistent Sector Protection provides in-system, command-enabled protection of any combination of sectors using a
single power supply at VCC. Password Sector Protection prevents unauthorized write and erase operations in any combination of
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program any other sector and then complete the erase operation. The Program Suspend/Program Resume feature enables the
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host system to pause a program operation in a given sector to read any other sector and then complete the program operation.
The hardware RESET# pin terminates any operation in progress and resets the device, after which it is then ready for a new
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operation. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the
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host system to read boot-up firmware from the Flash memory device.
The device reduces power consumption in the standby mode when it detects specific voltage levels on CE# and RESET#, or when
addresses have been stable for a specified period of time.
The Secured Silicon Sector provides a 128-word/256-byte area for code or data that can be permanently protected. Once this
sector is protected, no further changes within the sector can occur.
The Write Protect (WP#/ACC) feature protects the first or last sector by asserting a logic low on the WP# pin.
MirrorBit flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality,
reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via hot-hole assisted erase.
The data is programmed using hot electron injection.
Contents
1. Product Selector Guide ............................................... 4 9.15 Secured Silicon Sector Entry Command....................... 54
1.1 S29GL512N ................................................................... 4 9.16 Secured Silicon Sector Exit Command ......................... 54
1.2 S29GL256N, S29GL128N ............................................. 4 9.17 Command Definitions.................................................... 54
2. Block Diagram.............................................................. 5 10. Write Operation Status ............................................... 59
10.1 DQ7: Data# Polling ....................................................... 59
3. Connection Diagrams.................................................. 6
10.2 RY/BY#: Ready/Busy#.................................................. 60
3.1 Special Package Handling Instructions.......................... 7
10.3 DQ6: Toggle Bit I .......................................................... 60
4. Pin Description............................................................. 7 10.4 DQ2: Toggle Bit II ......................................................... 62
10.5 Reading Toggle Bits DQ6/DQ2..................................... 62
5. Logic Symbol ............................................................... 7
10.6 DQ5: Exceeded Timing Limits ...................................... 62
6. Ordering Information ................................................... 9 10.7 DQ3: Sector Erase Timer.............................................. 63
7. Device Bus Operations.............................................. 10 10.8 DQ1: Write-to-Buffer Abort............................................ 63
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7.1 Word/Byte Configuration.............................................. 10 11. Absolute Maximum Ratings....................................... 64
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7.2 VersatileIOTM (VIO) Control .......................................... 10
12. Operating Ranges ....................................................... 65
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7.3 Requirements for Reading Array Data......................... 10
7.4 Writing Commands/Command Sequences.................. 11 13. DC Characteristics...................................................... 65
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7.5 Standby Mode.............................................................. 11 13.1 CMOS Compatible ........................................................ 65
7.6 Automatic Sleep Mode................................................. 12
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14. Test Conditions ........................................................... 66
7.7 RESET#: Hardware Reset Pin..................................... 12
14.1 Key to Switching Waveforms ........................................ 67
7.8 Output Disable Mode ................................................... 13 rN
7.9 Autoselect Mode .......................................................... 34 15. AC Characteristics...................................................... 68
7.10 Sector Protection ......................................................... 34 15.1 Read-Only Operations .................................................. 68
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7.11 Advanced Sector Protection ........................................ 35 15.2 Hardware Reset (RESET#)........................................... 69
7.12 Lock Register ............................................................... 35 15.3 Erase and Program Operations .................................... 71
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7.13 Persistent Sector Protection ........................................ 36 15.4 Alternate CE# Controlled Erase and Program Operations:
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7.14 Persistent Protection Mode Lock Bit ............................ 37 S29GL128N, S29GL256N, S29GL512N....................... 75
7.15 Password Sector Protection......................................... 38
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7.17 64-bit Password ........................................................... 38 17. TSOP Pin and BGA Package Capacitance................ 77
7.18 Persistent Protection Bit Lock (PPB Lock Bit).............. 38
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9. Command Definitions................................................
9.1 Reading Array Data ..................................................... 43
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1.1 S29GL512N
Part Number S29GL512N
VIO = 2.7–3.6 V 10 11
Speed Option VCC = 2.7–3.6 V
VIO = 1.65–3.6 V 11
Max. Access Time (ns) 100 110 110
Max. CE# Access Time (ns) 100 110 110
Max. Page access time (ns) 25 25 30
Max. OE# Access Time (ns) 25 35 35
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1.2 S29GL256N, S29GL128N
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Part Number S29GL256N, S29GL128N
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VIO = 2.7–3.6 V 10 11
VCC = 2.7–3.6 V
Speed Option VIO = 1.65–3.6 V rN 11
VCC = Regulated (3.0–3.6 V) VIO = Regulated (3.0–3.6 V) 90
Max. Access Time (ns) 90 100 110 110
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2. Block Diagram
RY/BY# DQ15–DQ0 (A-1)
VCC
Sector Switches
VSS
VIO
Erase Voltage Input/Output
Generator Buffers
RESET#
WE#
State
WP#/ACC Control
BYTE#
Command
Register
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PGM Voltage
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Generator
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Chip Enable Data
Output Enable STB Latch
CE#
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Logic
OE#
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Y-Decoder Y-Gating
STB
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AMax**–A0
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Note
** AMax GL512N = A24, AMax GL256N = A23, AMax GL128N = A22
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3. Connection Diagrams
Figure 3.1 56-Pin Standard TSOP
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A21 15 42 DQ11
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WP#/ACC 16 41 DQ3
RY/BY# 17 40 DQ10
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A18 18 39 DQ2
A17 19 38 DQ9
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A7 20 37 DQ1
A6 21 36 DQ8
A5 22 35 DQ0
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A4 23 34 OE#
A3 24 33 VSS
A2
A1
25
26
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31
CE#
A0
NC 27 30 NC
NC 28 29 VIO
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A8 B8 C8 D8 E8 F8 G8 H8
NC A22 A231 VIO VSS A242 NC NC
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A7 B7 C7 D7 E7 F7 G7 H7
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A6 B6 C6 D6 E6 F6 G6 H6
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A5 B5 C5 D5 E5 F5 G5 H5
WE# RESET# A21 A19 DQ5 DQ12 VCC DQ4
A4 B4 C4 D4 E4 F4 G4 H4
RY/BY# WP#/ACC A18 A20 DQ2 DQ10 DQ11 DQ3
A3 B3 C3 D3 E3 F3 G3 H3
A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1
A2 B2 C2 D2 E2 F2 G2 H2
A3 A4 A2 A1 A0 CE# OE# VSS
A1 B1 C1 D1 E1 F1 G1 H1
NC NC NC NC NC VIO NC NC
Notes
1. Ball C8 is NC on S29GL128N
2. Ball F8 is NC on S29GL256N and S29GL128N
4. Pin Description
A24–A0 25 Address inputs (512 Mb)
A23–A0 24 Address inputs (256 Mb)
A22–A0 23 Address inputs (128 Mb)
DQ14–DQ0 15 Data inputs/outputs
DQ15/A-1 DQ15 (Data input/output, word mode), A-1 (LSB Address input, byte mode)
CE# Chip Enable input
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OE# Output Enable input
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WE# Write Enable input
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WP#/ACC Hardware Write Protect input; Acceleration input
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RESET# Hardware Reset Pin input
BYTE# Selects 8-bit or 16-bit mode
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RY/BY# Ready/Busy output
3.0 volt-only single power supply rN
VCC
(see Product Selector Guide on page 4 for speed options and voltage supply tolerances)
VIO Output Buffer power
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5. Logic Symbol
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25
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A24–A0 16 or 8
DQ15–DQ0
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CE# (A-1)
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OE#
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WE#
WP#/ACC
RESET#
VIO RY/BY#
BYTE#
DQ15–DQ0
CE# (A-1)
OE#
WE#
WP#/ACC
RESET#
VIO RY/BY#
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BYTE#
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Figure 5.3 S29GL128N
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A22–A0 16 or 8
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DQ15–DQ0
CE# (A-1)
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OE#
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WE#
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WP#/ACC
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RESET#
VIO
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RY/BY#
BYTE#
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This product family has been retired and is not recommended for designs. For new and current designs, S29GL128P, S29GL256P,
and S29GL512P supersede S29GL128N, S29GL256N, and S29GL512N respectively. These are the factory-recommended
migration paths. Please refer to the S29GL-P Family data sheets for specifications and ordering information.
6. Ordering Information
The ordering part number is formed by a valid combination of the following:
S29GL512N 11 F F I 01 0
PACKING TYPE
0 = Tray (standard; see note 1)
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (VIO range, protection when WP# =VIL)
01 = VIO = VCC = 2.7 to 3.6 V, highest address sector protected
02 = VIO = VCC = 2.7 to 3.6 V, lowest address sector protected
V1 = VIO = 1.65 to 3.6 V, VCC = 2.7 to 3.6 V, highest address sector protected
V2 = VIO = 1.65 to 3.6 V, VCC = 2.7 to 3.6 V, lowest address sector protected
R1 = VIO = VCC = 3.0 to 3.6 V, highest address sector protected
R2 = VIO = VCC = 3.0 to 3.6 V, lowest address sector protected
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TEMPERATURE RANGE
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I = Industrial (–40°C to +85°C)
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PACKAGE MATERIALS SET
A = SnPb
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F = Pb-free (Recommended)
PACKAGE TYPE
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T = Thin Small Outline Package (TSOP) Standard Pinout (TS056)
F = Fortified Ball Grid Array, 1.0 mm pitch package (LAA064)
SPEED OPTION
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90 = 90 ns (Note 4)
10 = 100 ns (Note 4)
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11 = 110 ns (Recommended)
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DEVICE NUMBER/DESCRIPTION
S29GL128N, S29GL256N, S29GL512N
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3.0 Volt-only, 512 Megabit (32 M x 16-Bit/64 M x 8-Bit) Page-Mode Flash Memory
Manufactured on 110 nm MirrorBit process technology
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Valid Combinations
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Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm
availability of specific valid combinations and to check on newly released combinations.
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Base Part
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Notes
1. Type 0 is standard. Specify other options as required. TSOP can be packed in Types 0 and 3; BGA can be packed in Types 0, 2, 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading “S29” and packing type designator from ordering part number.
4. Contact a local sales representative for availability.
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Write (Program/Erase) L H L H (Note 2) AIN (Note 3) (Note 3) = High-Z,
DQ15 = A-1
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Accelerated Program L H L H VHH AIN (Note 3) (Note 3)
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VCC ± VCC ±
Standby X X H X High-Z High-Z High-Z
0.3 V 0.3 V
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Output Disable L H H H X X High-Z High-Z High-Z
Reset X X X L X X High-Z High-Z High-Z
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Legend
L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 11.5–12.5V, X = Don’t Care, SA = Sector Address, AIN = Address In,
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DIN = Data In, DOUT = Data Out
Notes
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1. Addresses are AMax:A0 in word mode; AMax:A-1 in byte mode. Sector addresses are AMax:A16 in both modes.
2. If WP# = VIL, the first or last sector group remains protected. If WP# = VIH, the first or last sector is protected or unprotected as determined by the method described in
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“Write Protect (WP#)”. All sectors are unprotected when shipped from the factory (The Secured Silicon Sector may be factory protected depending on version
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ordered.)
3. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm (see Figure 9.2 on page 48, Figure 9.4 on page 50, and Figure 10.1
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on page 60).
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The BYTE# pin controls whether the device data I/O pins operate in the byte or word configuration. If the BYTE# pin is set at logic
‘1’, the device is in word configuration, DQ0–DQ15 are active and controlled by CE# and OE#.
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If the BYTE# pin is set at logic ‘0’, the device is in byte configuration, and only data I/O pins DQ0–DQ7 are active and controlled by
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CE# and OE#. The data I/O pins DQ8–DQ14 are tri-stated, and the DQ15 pin is used as an input for the LSB (A-1) address function.
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See Reading Array Data on page 43 for more information. Refer to the AC Read-Only Operations table for timing specifications and
to Figure 15.1 on page 68 for the timing diagram. Refer to the DC Characteristics table for the active current specification on reading
array data.
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7.4 Writing Commands/Command Sequences
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To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the
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system must drive WE# and CE# to VIL, and OE# to VIH.
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The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the Unlock Bypass mode,
only two write cycles are required to program a word or byte, instead of four. The “Word Program Command Sequence” section has
details on programming data to the device using both standard and Unlock Bypass command sequences.
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An erase operation can erase one sector, multiple sectors, or the entire device. Table on page 13, Table on page 31, and Table
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on page 34 indicate the address space that each sector occupies.
Refer to the DC Characteristics table for the active current specification for the write mode. The AC Characteristics section contains
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Write Buffer Programming allows the system write to a maximum of 16 words/32 bytes in one programming operation. This results in
faster effective programming time than the standard programming algorithms. See Write Buffer on page 11 for more information.
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pin. This function is primarily intended to allow faster manufacturing throughput at the factory.
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If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass mode, temporarily
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unprotects any protected sector groups, and uses the higher voltage on the pin to reduce the time required for program operations.
The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the
WP#/ACC pin returns the device to normal operation. Note that the WP#/ACC pin must not be at VHH for operations other than
accelerated programming, or device damage may result. WP# has an internal pull-up; when unconnected, WP# is at VIH.
but the standby current is greater. The device requires standard access time (tCE) for read access when the device is in either of
these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation is completed.
Refer to DC Characteristics on page 65 for the standby current specification.
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The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for
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at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/
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write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The
operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data
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integrity.
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Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device draws CMOS standby
current (ICC5). If RESET# is held at VIL but not within VSS±0.3 V, the standby current is greater.
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The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the
system to read the boot-up firmware from the Flash memory.
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Refer to the AC Characteristics tables for RESET# parameters and to Figure 15.3 on page 70 for the timing diagram.
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SA6 0 0 0 0 0 0 1 1 0 128/64 00C0000–00DFFFF 0060000–006FFFF
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SA7 0 0 0 0 0 0 1 1 1 128/64 00E0000–00FFFFF 0070000–007FFFF
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SA8 0 0 0 0 0 1 0 0 0 128/64 0100000–011FFFF 0080000–008FFFF
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SA9 0 0 0 0 0 1 0 0 1 128/64 0120000–013FFFF 0090000–009FFFF
SA10 0 0 0 0 0 1 0 1 0 128/64 0140000–015FFFF 00A0000–00AFFFF
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SA11 0 0 0 0 0 1 0 1 1 128/64 0160000–017FFFF 00B0000–00BFFFF
SA12 0 0 0 0 0 1 1 0 0 128/64 0180000–019FFFF
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SA13 0 0 0 0 0 1 1 0 1 128/64 01A0000–01BFFFF 00D0000–00DFFFF
SA14 0 0 0 0 0 1 1 1 0 128/64 01C0000–01DFFFF 00E0000–00EFFFF
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SA51 0 0 0 1 1 0 0 1 1 128/64 0660000–067FFFF 0330000–033FFFF
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SA52 0 0 0 1 1 0 1 0 0 128/64 0680000–069FFFF 0340000–034FFFF
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SA53 0 0 0 1 1 0 1 0 1 128/64 06A0000–06BFFFF 0350000–035FFFF
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SA54 0 0 0 1 1 0 1 1 0 128/64 06C0000–06DFFFF 0360000–036FFFF
SA55 0 0 0 1 1 0 1 1 1 128/64 06E0000–06FFFFF 0370000–037FFFF
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SA56 0 0 0 1 1 1 0 0 0 128/64 0700000–071FFFF 0380000–038FFFF
SA57 0 0 0 1 1 1 0 0 1 128/64 0720000–073FFFF 0390000–039FFFF
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SA58 0 0 0 1 1 1 0 1 0 128/64 0740000–075FFFF 03A0000–03AFFFF
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SA59 0 0 0 1 1 1 0 1 1 128/64 0760000–077FFFF 03B0000–03BFFFF
SA60 0 0 0 1 1 1 1 0 0 128/64 0780000–079FFFF 03C0000–03CFFFF
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SA96 0 0 1 1 0 0 0 0 0 128/64 0C00000–0C1FFFF 0600000–060FFFF
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SA97 0 0 1 1 0 0 0 0 1 128/64 0C20000–0C3FFFF 0610000–061FFFF
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SA98 0 0 1 1 0 0 0 1 0 128/64 0C40000–0C5FFFF 0620000–062FFFF
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SA99 0 0 1 1 0 0 0 1 1 128/64 0C60000–0C7FFFF 0630000–063FFFF
SA100 0 0 1 1 0 0 1 0 0 128/64 0C80000–0C9FFFF 0640000–064FFFF
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SA101 0 0 1 1 0 0 1 0 1 128/64 0CA0000–0CBFFFF 0650000–065FFFF
SA102 0 0 1 1 0 0 1 1 0 128/64 0CC0000–0CDFFFF 0660000–066FFFF
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SA103 0 0 1 1 0 0 1 1 1 128/64 0CE0000–0CFFFFF 0670000–067FFFF
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SA104 0 0 1 1 0 1 0 0 0 128/64 0D00000–0D1FFFF 0680000–068FFFF
SA105 0 0 1 1 0 1 0 0 1 128/64 0D20000–0D3FFFF 0690000–069FFFF
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SA141 0 1 0 0 0 1 1 0 1 128/64 11A0000–11BFFFF 08D0000–08DFFFF
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SA142 0 1 0 0 0 1 1 1 0 128/64 11C0000–11DFFFF 08E0000–08EFFFF
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SA143 0 1 0 0 0 1 1 1 1 128/64 11E0000–11FFFFF 08F0000–08FFFFF
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SA144 0 1 0 0 1 0 0 0 0 128/64 1200000–121FFFF 0900000–090FFFF
SA145 0 1 0 0 1 0 0 0 1 128/64 1220000–123FFFF 0910000–091FFFF
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SA146 0 1 0 0 1 0 0 1 0 128/64 1240000–125FFFF 0920000–092FFFF
SA147 0 1 0 0 1 0 0 1 1 128/64 1260000–127FFFF 0930000–093FFFF
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SA148 0 1 0 0 1 0 1 0 0 128/64 1280000–129FFFF 0940000–094FFFF
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SA149 0 1 0 0 1 0 1 0 1 128/64 12A0000–12BFFFF 0950000–095FFFF
SA150 0 1 0 0 1 0 1 1 0 128/64 12C0000–12DFFFF 0960000–096FFFF
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SA186 0 1 0 1 1 1 0 1 0 128/64 1740000–175FFFF 0BA0000–0BAFFFF
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SA187 0 1 0 1 1 1 0 1 1 128/64 1760000–177FFFF 0BB0000–0BBFFFF
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SA188 0 1 0 1 1 1 1 0 0 128/64 1780000–179FFFF 0BC0000–0BCFFFF
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SA189 0 1 0 1 1 1 1 0 1 128/64 17A0000–17BFFFF 0BD0000–0BDFFFF
SA190 0 1 0 1 1 1 1 1 0 128/64 17C0000–17DFFFF 0BE0000–0BEFFFF
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SA191 0 1 0 1 1 1 1 1 1 128/64 17E0000–17FFFFF 0BF0000–0BFFFFF
SA192 0 1 1 0 0 0 0 0 0 128/64 1800000–181FFFF 0C00000–0C0FFFF
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SA193 0 1 1 0 0 0 0 0 1 128/64 1820000–183FFFF 0C10000–0C1FFFF
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SA194 0 1 1 0 0 0 0 1 0 128/64 1840000–185FFFF 0C20000–0C2FFFF
SA195 0 1 1 0 0 0 0 1 1 128/64 1860000–187FFFF 0C30000–0C3FFFF
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SA231 0 1 1 1 0 0 1 1 1 128/64 1CE0000–1CFFFFF 0E70000–0E7FFFF
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SA232 0 1 1 1 0 1 0 0 0 128/64 1D00000–1D1FFFF 0E80000–0E8FFFF
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SA233 0 1 1 1 0 1 0 0 1 128/64 1D20000–1D3FFFF 0E90000–0E9FFFF
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SA234 0 1 1 1 0 1 0 1 0 128/64 1D40000–1D5FFFF 0EA0000–0EAFFFF
SA235 0 1 1 1 0 1 0 1 1 128/64 1D60000–1D7FFFF 0EB0000–0EBFFFF
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SA236 0 1 1 1 0 1 1 0 0 128/64 1D80000–1D9FFFF 0EC0000–0ECFFFF
SA237 0 1 1 1 0 1 1 0 1 128/64 1DA0000–1DBFFFF 0ED0000–0EDFFFF
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SA238 0 1 1 1 0 1 1 1 0 128/64 1DC0000–1DDFFFF 0EE0000–0EEFFFF
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SA239 0 1 1 1 0 1 1 1 1 128/64 1DE0000–1DFFFFF 0EF0000–0EFFFFF
SA240 0 1 1 1 1 0 0 0 0 128/64 1E00000–1E1FFFF 0F00000–0F0FFFF
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SA276 1 0 0 0 1 0 1 0 0 128/64 2280000–229FFFF 1140000–114FFFF
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SA277 1 0 0 0 1 0 1 0 1 128/64 22A0000–22BFFFF 1150000–115FFFF
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SA278 1 0 0 0 1 0 1 1 0 128/64 22C0000–22DFFFF 1160000–116FFFF
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SA279 1 0 0 0 1 0 1 1 1 128/64 22E0000–22FFFFF 1170000–117FFFF
SA280 1 0 0 0 1 1 0 0 0 128/64 2300000–231FFFF 1180000–118FFFF
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SA281 1 0 0 0 1 1 0 0 1 128/64 2320000–233FFFF 1190000–119FFFF
SA282 1 0 0 0 1 1 0 1 0 128/64 2340000–235FFFF 11A0000–11AFFFF
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SA283 1 0 0 0 1 1 0 1 1 128/64 2360000–237FFFF 11B0000–11BFFFF
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SA284 1 0 0 0 1 1 1 0 0 128/64 2380000–239FFFF 11C0000–11CFFFF
SA285 1 0 0 0 1 1 1 0 1 128/64 23A0000–23BFFFF 11D0000–11DFFFF
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SA321 1 0 1 0 0 0 0 0 1 128/64 2820000–283FFFF 1410000–141FFFF
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SA322 1 0 1 0 0 0 0 1 0 128/64 2840000–285FFFF 1420000–142FFFF
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SA323 1 0 1 0 0 0 0 1 1 128/64 2860000–287FFFF 1430000–143FFFF
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SA324 1 0 1 0 0 0 1 0 0 128/64 2880000–289FFFF 1440000–144FFFF
SA325 1 0 1 0 0 0 1 0 1 128/64 28A0000–28BFFFF 1450000–145FFFF
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SA326 1 0 1 0 0 0 1 1 0 128/64 28C0000–28DFFFF 1460000–146FFFF
SA327 1 0 1 0 0 0 1 1 1 128/64 28E0000–28FFFFF 1470000–147FFFF
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SA328 1 0 1 0 0 1 0 0 0 128/64 2900000–291FFFF 1480000–148FFFF
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SA329 1 0 1 0 0 1 0 0 1 128/64 2920000–293FFFF 1490000–149FFFF
SA330 1 0 1 0 0 1 0 1 0 128/64 2940000–295FFFF 14A0000–14AFFFF
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SA366 1 0 1 1 0 1 1 1 0 128/64 2DC0000–2DDFFFF 16E0000–16EFFFF
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SA367 1 0 1 1 0 1 1 1 1 128/64 2DE0000–2DFFFFF 16F0000–16FFFFF
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SA368 1 0 1 1 1 0 0 0 0 128/64 2E00000–2E1FFFF 1700000–170FFFF
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SA369 1 0 1 1 1 0 0 0 1 128/64 2E20000–2E3FFFF 1710000–171FFFF
SA370 1 0 1 1 1 0 0 1 0 128/64 2E40000–2E5FFFF 1720000–172FFFF
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SA371 1 0 1 1 1 0 0 1 1 128/64 2E60000–2E7FFFF 1730000–173FFFF
SA372 1 0 1 1 1 0 1 0 0 128/64 2E80000–2E9FFFF 1740000–174FFFF
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SA373 1 0 1 1 1 0 1 0 1 128/64 2EA0000–2EBFFFF 1750000–175FFFF
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SA374 1 0 1 1 1 0 1 1 0 128/64 2EC0000–2EDFFFF 1760000–176FFFF
SA375 1 0 1 1 1 0 1 1 1 128/64 2EE0000–2EFFFFF 1770000–177FFFF
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SA411 1 1 0 0 1 1 0 1 1 128/64 3360000–337FFFF 19B0000–19BFFFF
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SA412 1 1 0 0 1 1 1 0 0 128/64 3380000–339FFFF 19C0000–19CFFFF
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SA413 1 1 0 0 1 1 1 0 1 128/64 33A0000–33BFFFF 19D0000–19DFFFF
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SA414 1 1 0 0 1 1 1 1 0 128/64 33C0000–33DFFFF 19E0000–19EFFFF
SA415 1 1 0 0 1 1 1 1 1 128/64 33E0000–33FFFFF 19F0000–19FFFFF
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SA416 1 1 0 1 0 0 0 0 0 128/64 3400000–341FFFF 1A00000–1A0FFFF
SA417 1 1 0 1 0 0 0 0 1 128/64 3420000–343FFFF 1A10000–1A1FFFF
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SA418 1 1 0 1 0 0 0 1 0 128/64 3440000–345FFFF 1A20000–1A2FFFF
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SA419 1 1 0 1 0 0 0 1 1 128/64 3460000–347FFFF 1A30000–1A3FFFF
SA420 1 1 0 1 0 0 1 0 0 128/64 3480000–349FFFF 1A40000–1A4FFFF
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SA456 1 1 1 0 0 1 0 0 0 128/64 3900000–391FFFF 1C80000–1C8FFFF
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SA457 1 1 1 0 0 1 0 0 1 128/64 3920000–393FFFF 1C90000–1C9FFFF
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SA458 1 1 1 0 0 1 0 1 0 128/64 3940000–395FFFF 1CA0000–1CAFFFF
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SA459 1 1 1 0 0 1 0 1 1 128/64 3960000–397FFFF 1CB0000–1CBFFFF
SA460 1 1 1 0 0 1 1 0 0 128/64 3980000–399FFFF 1CC0000–1CCFFFF
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SA461 1 1 1 0 0 1 1 0 1 128/64 39A0000–39BFFFF 1CD0000–1CDFFFF
SA462 1 1 1 0 0 1 1 1 0 128/64 39C0000–39DFFFF 1CE0000–1CEFFFF
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SA463 1 1 1 0 0 1 1 1 1 128/64 39E0000–39FFFFF 1CF0000–1CFFFFF
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SA464 1 1 1 0 1 0 0 0 0 128/64 3A00000–3A1FFFF 1D00000–1D0FFFF
SA465 1 1 1 0 1 0 0 0 1 128/64 3A20000–3A3FFFF 1D10000–1D1FFFF
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SA501 1 1 1 1 1 0 1 0 1 128/64 3EA0000–3EBFFFF 1F50000–1F5FFFF
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SA502 1 1 1 1 1 0 1 1 0 128/64 3EC00000–3EDFFFF 1F60000–1F6FFFF
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SA503 1 1 1 1 1 0 1 1 1 128/64 3EE0000–3EFFFFF 1F70000–1F7FFFF
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SA504 1 1 1 1 1 1 0 0 0 128/64 3F00000–3F1FFFF 1F80000–1F8FFFF
SA505 1 1 1 1 1 1 0 0 1 128/64 3F20000–3F3FFFF 1F90000–1F9FFFF
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SA506 1 1 1 1 1 1 0 1 0 128/64 3F40000–3F5FFFF 1FA0000–1FAFFFF
SA507 1 1 1 1 1 1 0 1 1 128/64 3F60000–3F7FFFF 1FB0000–1FBFFFF
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SA508 1 1 1 1 1 1 1 0 0 128/64 3F80000–3F9FFFF 1FC0000–1FCFFFF
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SA509 1 1 1 1 1 1 1 0 1 128/64 3FA0000–3FBFFFF 1FD0000–1FDFFFF
SA510 1 1 1 1 1 1 1 1 0 128/64 3FC0000–3FDFFFF 1FE0000–1FEFFFF
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SA9 0 0 0 0 1 0 0 1 128/64 0120000–013FFFF 0090000–009FFFF
SA10 0 0 0 0 1 0 1 0 128/64 0140000–015FFFF 00A0000–00AFFFF
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SA11 0 0 0 0 1 0 1 1 128/64 0160000–017FFFF 00B0000–00BFFFF
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SA12 0 0 0 0 1 1 0 0 128/64 0180000–019FFFF 00C0000–00CFFFF
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SA13 0 0 0 0 1 1 0 1 128/64 01A0000–01BFFFF 00D0000–00DFFFF
SA14 0 0 0 0 1 1 1 0 128/64 01C0000–01DFFFF 00E0000–00EFFFF
SA15 0 0 0 0 1 1 1 1 128/64
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01E0000–01FFFFF 00F0000–00FFFFF
SA16 0 0 0 1 0 0 0 0 128/64 0200000–021FFFF 0100000–010FFFF
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SA17 0 0 0 1 0 0 0 1 128/64 0220000–023FFFF 0110000–011FFFF
SA18 0 0 0 1 0 0 1 0 128/64 0240000–025FFFF 0120000–012FFFF
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SA53 0 0 1 1 0 1 0 1 128/64 06A0000–06BFFFF 0350000–035FFFF
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SA54 0 0 1 1 0 1 1 0 128/64 06C0000–06DFFFF 0360000–036FFFF
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SA55 0 0 1 1 0 1 1 1 128/64 06E0000–06FFFFF 0370000–037FFFF
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SA56 0 0 1 1 1 0 0 0 128/64 0700000–071FFFF 0380000–038FFFF
SA57 0 0 1 1 1 0 0 1 128/64 0720000–073FFFF 0390000–039FFFF
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SA58 0 0 1 1 1 0 1 0 128/64 0740000–075FFFF 03A0000–03AFFFF
SA59 0 0 1 1 1 0 1 1 128/64 0760000–077FFFF 03B0000–03BFFFF
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SA60 0 0 1 1 1 1 0 0 128/64 0780000–079FFFF 03C0000–03CFFFF
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SA61 0 0 1 1 1 1 0 1 128/64 07A0000–7BFFFF 03D0000–03DFFFF
SA62 0 0 1 1 1 1 1 0 128/64 07C0000–07DFFFF 03E0000–03EFFFF
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SA98 0 1 1 0 0 0 1 0 128/64 0C40000–0C5FFFF 0620000–062FFFF
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SA99 0 1 1 0 0 0 1 1 128/64 0C60000–0C7FFFF 0630000–063FFFF
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SA100 0 1 1 0 0 1 0 0 128/64 0C80000–0C9FFFF 0640000–064FFFF
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SA101 0 1 1 0 0 1 0 1 128/64 0CA0000–0CBFFFF 0650000–065FFFF
SA102 0 1 1 0 0 1 1 0 128/64 0CC0000–0CDFFFF 0660000–066FFFF
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SA103 0 1 1 0 0 1 1 1 128/64 0CE0000–0CFFFFF 0670000–067FFFF
SA104 0 1 1 0 1 0 0 0 128/64 0D00000–0D1FFFF 0680000–068FFFF
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SA105 0 1 1 0 1 0 0 1 128/64 0D20000–0D3FFFF 0690000–069FFFF
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SA106 0 1 1 0 1 0 1 0 128/64 0D40000–0D5FFFF 06A0000–06AFFFF
SA107 0 1 1 0 1 0 1 1 128/64 0D60000–0D7FFFF 06B0000–06BFFFF
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SA143 1 0 0 0 1 1 1 1 128/64 11E0000–11FFFFF 08F0000–08FFFFF
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SA144 1 0 0 1 0 0 0 0 128/64 1200000–121FFFF 0900000–090FFFF
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SA145 1 0 0 1 0 0 0 1 128/64 1220000–123FFFF 0910000–091FFFF
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SA146 1 0 0 1 0 0 1 0 128/64 1240000–125FFFF 0920000–092FFFF
SA147 1 0 0 1 0 0 1 1 128/64 1260000–127FFFF 0930000–093FFFF
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SA148 1 0 0 1 0 1 0 0 128/64 1280000–129FFFF 0940000–094FFFF
SA149 1 0 0 1 0 1 0 1 128/64 12A0000–12BFFFF 0950000–095FFFF
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SA150 1 0 0 1 0 1 1 0 128/64 12C0000–12DFFFF 0960000–096FFFF
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SA151 1 0 0 1 0 1 1 1 128/64 12E0000–12FFFFF 0970000–097FFFF
SA152 1 0 0 1 1 0 0 0 128/64 1300000–131FFFF 0980000–098FFFF
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SA188 1 0 1 1 1 1 0 0 128/64 1780000–179FFFF 0BC0000–0BCFFFF
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SA189 1 0 1 1 1 1 0 1 128/64 17A0000–17BFFFF 0BD0000–0BDFFFF
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SA190 1 0 1 1 1 1 1 0 128/64 17C0000–17DFFFF 0BE0000–0BEFFFF
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SA191 1 0 1 1 1 1 1 1 128/64 17E0000–17FFFFF 0BF0000–0BFFFFF
SA192 1 1 0 0 0 0 0 0 128/64 1800000–181FFFF 0C00000–0C0FFFF
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SA193 1 1 0 0 0 0 0 1 128/64 1820000–183FFFF 0C10000–0C1FFFF
SA194 1 1 0 0 0 0 1 0 128/64 1840000–185FFFF 0C20000–0C2FFFF
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SA195 1 1 0 0 0 0 1 1 128/64 1860000–187FFFF 0C30000–0C3FFFF
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SA196 1 1 0 0 0 1 0 0 128/64 1880000–189FFFF 0C40000–0C4FFFF
SA197 1 1 0 0 0 1 0 1 128/64 18A0000–18BFFFF 0C50000–0C5FFFF
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SA233 1 1 1 0 1 0 0 1 128/64 1D20000–1D3FFFF 0E90000–0E9FFFF
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SA234 1 1 1 0 1 0 1 0 128/64 1D40000–1D5FFFF 0EA0000–0EAFFFF
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SA235 1 1 1 0 1 0 1 1 128/64 1D60000–1D7FFFF 0EB0000–0EBFFFF
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SA236 1 1 1 0 1 1 0 0 128/64 1D80000–1D9FFFF 0EC0000–0ECFFFF
SA237 1 1 1 0 1 1 0 1 128/64 1DA0000–1DBFFFF 0ED0000–0EDFFFF
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SA238 1 1 1 0 1 1 1 0 128/64 1DC0000–1DDFFFF 0EE0000–0EEFFFF
SA239 1 1 1 0 1 1 1 1 128/64 1DE0000–1DFFFFF 0EF0000–0EFFFFF
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SA240 1 1 1 1 0 0 0 0 128/64 1E00000–1E1FFFF 0F00000–0F0FFFF
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SA241 1 1 1 1 0 0 0 1 128/64 1E20000–1E3FFFF 0F10000–0F1FFFF
SA242 1 1 1 1 0 0 1 0 128/64 1E40000–1E5FFFF 0F20000–0F2FFFF
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SA8 0 0 0 1 0 0 0 128/64 0100000–011FFFF 0080000–008FFFF
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SA9 0 0 0 1 0 0 1 128/64 0120000–013FFFF 0090000–009FFFF
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SA10 0 0 0 1 0 1 0 128/64 0140000–015FFFF 00A0000–00AFFFF
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SA11 0 0 0 1 0 1 1 128/64 0160000–017FFFF 00B0000–00BFFFF
SA12 0 0 0 1 1 0 0 128/64 0180000–019FFFF 00C0000–00CFFFF
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SA13 0 0 0 1 1 0 1 128/64 01A0000–01BFFFF 00D0000–00DFFFF
SA14 0 0 0 1 1 1 0 128/64 01C0000–01DFFFF 00E0000–00EFFFF
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SA15 0 0 0 1 1 1 1 128/64 01E0000–01FFFFF 00F0000–00FFFFF
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SA16 0 0 1 0 0 0 0 128/64 0200000–021FFFF 0100000–010FFFF
SA17 0 0 1 0 0 0 1 128/64 0220000–023FFFF 0110000–011FFFF
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SA52 0 1 1 0 1 0 0 128/64 0680000–069FFFF 0340000–034FFFF
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SA53 0 1 1 0 1 0 1 128/64 06A0000–06BFFFF 0350000–035FFFF
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SA54 0 1 1 0 1 1 0 128/64 06C0000–06DFFFF 0360000–036FFFF
SA55 0 1 1 0 1 1 1 128/64 06E0000–06FFFFF 0370000–037FFFF
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SA56 0 1 1 1 0 0 0 128/64 0700000–071FFFF 0380000–038FFFF
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SA57 0 1 1 1 0 0 1 128/64 0720000–073FFFF 0390000–039FFFF
SA58 0 1 1 1 0 1 0 128/64 0740000–075FFFF
rN 03A0000–03AFFFF
SA59 0 1 1 1 0 1 1 128/64 0760000–077FFFF 03B0000–03BFFFF
SA60 0 1 1 1 1 0 0 128/64 0780000–079FFFF 03C0000–03CFFFF
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SA96 1 1 0 0 0 0 0 128/64 0C00000–0C1FFFF 0600000–060FFFF
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SA97 1 1 0 0 0 0 1 128/64 0C20000–0C3FFFF 0610000–061FFFF
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SA98 1 1 0 0 0 1 0 128/64 0C40000–0C5FFFF 0620000–062FFFF
SA99 1 1 0 0 0 1 1 128/64 0C60000–0C7FFFF 0630000–063FFFF
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SA100 1 1 0 0 1 0 0 128/64 0C80000–0C9FFFF 0640000–064FFFF
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SA101 1 1 0 0 1 0 1 128/64 0CA0000–0CBFFFF 0650000–065FFFF
SA102 1 1 0 0 1 1 0 128/64 0CC0000–0CDFFFF
rN 0660000–066FFFF
SA103 1 1 0 0 1 1 1 128/64 0CE0000–0CFFFFF 0670000–067FFFF
SA104 1 1 0 1 0 0 0 128/64 0D00000–0D1FFFF 0680000–068FFFF
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Autoselect Codes (High Voltage Method)
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DQ8 to DQ15
A22t A14 A8 A5 A3
o to to to to BYTE#= BYTE#
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Description CE# OE# WE# A15 A10 A9 A7 A6 A4 A2 A1 A0 VIH = VIL DQ7 to DQ0
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Manufacturer ID:
L L H X X VID X L X L L L 00 X 01h
Spansion Product
Cycle 1 L L H 22 X 7Eh
S29GL128N S29GL256N S29GL512N
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Device ID
Cycle 1 L L H 22 X 7Eh
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Device ID
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Cycle 3 H H H 22 X 01h
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Cycle 1 L L H 22 X 7Eh
Device ID
Cycle 3 H H H 22 X 01h
L L H SA X VID X L X L H L X X
Verification 00h (unprotected)
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sector
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Legend
L = Logic Low = VIL
H = Logic High = VIH
SA = Sector Address
X = Don’t care
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customer decides to use the password method, they must set the Password Mode Locking Bit. This permanently sets the part to
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operate only using password sector protection.
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It is important to remember that setting either the Persistent Sector Protection Mode Locking Bit or the Password Mode
Locking Bit permanently selects the protection mode. It is not possible to switch between the two methods once a locking bit is set.
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It is important that one mode is explicitly selected when the device is first programmed, rather than relying on the default
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mode alone. This is so that it is not possible for a system program or virus to later set the Password Mode Locking Bit, which would
cause an unexpected shift from the default Persistent Sector Protection Mode into the Password Protection Mode.
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The device is shipped with all sectors unprotected. The factory offers the option of programming and protecting sectors at the factory
prior to shipping the device through the ExpressFlash™ Service. Contact your sales representative for details.
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It is possible to determine whether a sector is protected or unprotected. See Autoselect Command Sequence on page 44 for details.
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Advanced Sector Protection features several levels of sector protection, which can disable both the program and erase operations in
certain sectors.
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Persistent Sector Protection is a method that replaces the old 12V controlled protection method.
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Password Sector Protection is a highly sophisticated protection method that requires a password before changes to certain
sectors are permitted.
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The Lock Register consists of 3 bits (DQ2, DQ1, and DQ0). These DQ2, DQ1, DQ0 bits of the Lock Register are programmable by
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the user. Users are not allowed to program both DQ2 and DQ1 bits of the Lock Register to the 00 state. If the user tries to program
DQ2 and DQ1 bits of the Lock Register to the 00 state, the device aborts the Lock Register back to the default 11 state. The
programming time of the Lock Register is same as the typical word programming time without utilizing the Write Buffer of the device.
During a Lock Register programming sequence execution, the DQ6 Toggle Bit I toggles until the programming of the Lock Register
has completed to indicate programming status. All Lock Register bits are readable to allow users to verify Lock Register statuses.
The Customer Secured Silicon Sector Protection Bit is DQ0, Persistent Protection Mode Lock Bit is DQ1, and Password Protection
Mode Lock Bit is DQ2 are accessible by all users. Each of these bits are non-volatile. DQ15-DQ3 are reserved and must be 1's when
the user tries to program the DQ2, DQ1, and DQ0 bits of the Lock Register. The user is not required to program DQ2, DQ1 and DQ0
bits of the Lock Register at the same time. This allows users to lock the Secured Silicon Sector and then set the device either
permanently into Password Protection Mode or Persistent Protection Mode and then lock the Secured Silicon Sector at separate
instances and time frames.
Secured Silicon Sector Protection allows the user to lock the Secured Silicon Sector area
Persistent Protection Mode Lock Bit allows the user to set the device permanently to operate in the Persistent Protection Mode
Password Protection Mode Lock Bit allows the user to set the device permanently to operate in the Password Protection Mode
Lock Register
DQ15-3 DQ2 DQ1 DQ0
Password Protection Mode Lock Persistent Protection Mode Lock Secured Silicon Sector
Don’t Care
Bit Bit Protection Bit
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In order to achieve these states, three types of “bits” are going to be used:
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7.13.1 Dynamic Protection Bit (DYB)
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A volatile protection bit is assigned for each sector. After power-up or hardware reset, the contents of all DYB bits are in the
“unprotected state”. Each DYB is individually modifiable through the DYB Set Command and DYB Clear Command. When the parts
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are first shipped, all of the Persistent Protect Bits (PPB) are cleared into the unprotected state. The DYB bits and PPB Lock bit are
defaulted to power up in the cleared state or unprotected state - meaning the all PPB bits are changeable.
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The Protection State for each sector is determined by the logical OR of the PPB and the DYB related to that sector. For the sectors
that have the PPB bits cleared, the DYB bits control whether or not the sector is protected or unprotected. By issuing the DYB Set
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and DYB Clear command sequences, the DYB bits is protected or unprotected, thus placing each sector in the protected or
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unprotected state. These are the so-called Dynamic Locked or Unlocked states. They are called dynamic states because it is very
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easy to switch back and forth between the protected and un-protected conditions. This allows software to easily protect sectors
against inadvertent changes yet does not prevent the easy removal of protection when changes are needed.
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The DYB bits maybe set or cleared as often as needed. The PPB bits allow for a more static, and difficult to change, level of
protection. The PPB bits retain their state across power cycles because they are Non-Volatile. Individual PPB bits are set with a
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program command but must all be cleared as a group through an erase command.
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The PPB Lock Bit adds an additional level of protection. Once all PPB bits are programmed to the desired settings, the PPB Lock Bit
may be set to the “freeze state”. Setting the PPB Lock Bit to the “freeze state” disables all program and erase commands to the Non-
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Volatile PPB bits. In effect, the PPB Lock Bit locks the PPB bits into their current state. The only way to clear the PPB Lock Bit to the
“unfreeze state” is to go through a power cycle, or hardware reset. The Software Reset command does not clear the PPB Lock Bit to
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the “unfreeze state”. System boot code can determine if any changes to the PPB bits are needed e.g. to allow new system code to
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be downloaded. If no changes are needed then the boot code can set the PPB Lock Bit to disable any further changes to the PPB
bits during system operation.
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The WP# write protect pin adds a final level of hardware protection. When this pin is low it is not possible to change the contents of
the WP# protected sectors. These sectors generally hold system boot code. So, the WP# pin can prevent any changes to the boot
code that could override the choices made while setting up sector protection during system initialization.
It is possible to have sectors that have been persistently locked, and sectors that are left in the dynamic state. The sectors in the
dynamic state are all unprotected. If there is a need to protect some of them, a simple DYB Set command sequence is all that is
necessary. The DYB Set and DYB Clear commands for the dynamic sectors switch the DYB bits to signify protected and
unprotected, respectively. If there is a need to change the status of the persistently locked sectors, a few more steps are required.
First, the PPB Lock Bit must be disabled to the “unfreeze state” by either putting the device through a power-cycle, or hardware
reset. The PPB bits can then be changed to reflect the desired settings. Setting the PPB Lock Bit once again to the “freeze state”
locks the PPB bits, and the device operates normally again.
To achieve the best protection, execute the PPB Lock Bit Set command early in the boot code, and protect the boot code by holding
WP# = VIL.
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7.13.3 Persistent Protection Bit Lock (PPB Lock Bit)
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A global volatile bit. When set to the “freeze state”, the PPB bits cannot be changed. When cleared to the “unfreeze state”, the PPB
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bits are changeable. There is only one PPB Lock Bit per device. The PPB Lock Bit is cleared to the “unfreeze state” after power-up
or hardware reset. There is no command sequence to unlock or “unfreeze” the PPB Lock Bit.
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Configuring the PPB Lock Bit to the freeze state requires approximately 100ns. Reading the PPB Lock Status bit requires the initial
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access time of the device.
Table contains all possible combinations of the DYB bit, PPB bit, and PPB Lock Bit relating to the status of the sector. In summary,
if the PPB bit is set, and the PPB Lock Bit is set, the sector is protected and the protection cannot be removed until the next power
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cycle or hardware reset clears the PPB Lock Bit to “unfreeze state”. If the PPB bit is cleared, the sector can be dynamically locked or
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unlocked. The DYB bit then controls whether or not the sector is protected or unprotected. If the user attempts to program or erase a
protected sector, the device ignores the command and returns to read mode. A program command to a protected sector enables
status polling for approximately 1 µs before the device returns to read mode without having modified the contents of the protected
sector. An erase command to a protected sector enables status polling for approximately 50 µs after which the device returns to read
mode without having erased the protected sector. The programming of the DYB bit, PPB bit, and PPB Lock Bit for a given sector can
be verified by writing a DYB Status Read, PPB Status Read, and PPB Lock Status Read commands to the device.
The Autoselect Sector Protection Verification outputs the OR function of the DYB bit and PPB bit per sector basis. When the OR
function of the DYB bit and PPB bit is a 1, the sector is either protected by DYB or PPB or both. When the OR function of the DYB bit
and PPB bit is a 0, the sector is unprotected through both the DYB and PPB.
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unfreezed state, and the PPB bits can be altered. If they do not match, the flash device does nothing. There is a built-in 2 µs delay
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for each password check after the valid 64-bit password is entered for the PPB Lock Bit to be cleared to the “unfreezed state”. This
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delay is intended to thwart any efforts to run a program that tries all possible combinations in order to crack the password.
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7.16 Password and Password Protection Mode Lock Bit
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In order to select the Password Sector Protection method, the customer must first program the password. The factory recommends
that the password be somehow correlated to the unique Electronic Serial Number (ESN) of the particular flash device. Each ESN is
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different for every flash device; therefore each password should be different for every flash device. While programming in the
password region, the customer may perform Password Read operations. Once the desired password is programmed in, the
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customer must then set the Password Protection Mode Lock Bit. This operation achieves two objectives:
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1. It permanently sets the device to operate using the Password Protection Mode. It is not possible to reverse this function.
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2. It also disables all further commands to the password region. All program, and read operations are ignored.
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Both of these objectives are important, and if not carefully considered, may lead to unrecoverable errors. The user must be sure that
the Password Sector Protection method is desired when programming the Password Protection Mode Lock Bit. More importantly,
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the user must be sure that the password is correct when the Password Protection Mode Lock Bit is programmed. Due to the fact that
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read operations are disabled, there is no means to read what the password is afterwards. If the password is lost after programming
the Password Protection Mode Lock Bit, there is no way to clear and unfreeze the PPB Lock Bit. The Password Protection Mode
Lock Bit, once programmed, prevents reading the 64-bit password on the DQ bus and further password programming. The
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Password Protection Mode Lock Bit is not erasable. Once Password Protection Mode Lock Bit is programmed, the Persistent
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Protection Mode Lock Bit is disabled from programming, guaranteeing that no changes to the protection scheme are allowed.
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The 64-bit Password is located in its own memory space and is accessible through the use of the Password Program and Password
Read commands. The password function works in conjunction with the Password Protection Mode Lock Bit, which when
programmed, prevents the Password Read command from reading the contents of the password on the pins of the device.
the “unfreeze state” is by issuing a hardware or power-up reset. The Password Unlock command is ignored in Persistent Protection
Mode.
Reading the PPB Lock Bit requires a 200ns access time.
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Secured Silicon Sector Indicator Bit permanently set to a 0. The factory-locked version is always protected when shipped from the
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factory, and has the Secured Silicon Sector Indicator Bit permanently set to a 1. Thus, the Secured Silicon Sector Indicator Bit
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prevents customer-lockable devices from being used to replace devices that are factory locked.
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The Secured Silicon sector address space in this device is allocated as follows:
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Secured Silicon Sector Address ExpressFlash
Range Customer Lockable ESN Factory Locked
rN Factory Locked
ESN or determined by
000000h–000007h ESN
Determined by customer customer
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000008h–00007Fh Unavailable Determined by customer
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The system accesses the Secured Silicon Sector through a command sequence (see Write Protect (WP#) on page 40). After the
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system has written the Enter Secured Silicon Sector command sequence, it may read the Secured Silicon Sector by using the
addresses normally occupied by the first sector (SA0). This mode of operation continues until the system issues the Exit Secured
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Silicon Sector command sequence, or until power is removed from the device. On power-up, or following a hardware reset, the
device reverts to sending commands to sector SA0.
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Unless otherwise specified, the device is shipped such that the customer may program and protect the 256-byte Secured Silicon
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sector.
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The system may program the Secured Silicon Sector using the write-buffer, accelerated and/or unlock bypass methods, in addition
to the standard programming command sequence. See Command Definitions on page 43.
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Programming and protecting the Secured Silicon Sector must be used with caution since, once protected, there is no procedure
available for unprotecting the Secured Silicon Sector area and none of the bits in the Secured Silicon Sector memory space can be
modified in any way.
The Secured Silicon Sector area can be protected using one of the following procedures:
Write the three-cycle Enter Secured Silicon Sector Region command.
To verify the protect/unprotect status of the Secured Silicon Sector, follow the algorithm.
Once the Secured Silicon Sector is programmed, locked and verified, the system must write the Exit Secured Silicon Sector Region
command sequence to return to reading and writing within the remainder of the array.
7.19.2 Factory Locked: Secured Silicon Sector Programmed and Protected At the
Factory
In devices with an ESN, the Secured Silicon Sector is protected when the device is shipped from the factory. The Secured Silicon
Sector cannot be modified in any way. An ESN Factory Locked device has an 16-byte random ESN at addresses 000000h–000007h.
Please contact your sales representative for details on ordering ESN Factory Locked devices.
Customers may opt to have their code programmed by the factory through the ExpressFlash service (Express Flash Factory
Locked). The devices are then shipped from the factory with the Secured Silicon Sector permanently locked. Contact your sales
representative for details on using the ExpressFlash service.
n
ig
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the first or last sector group
independently of whether those sector groups were protected or unprotected using the method described inAdvanced Sector
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Protection on page 35. Note that if WP#/ACC is at VIL when the device is in the standby mode, the maximum input load current is
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increased. See the table in DC Characteristics on page 65.
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If the system asserts VIH on the WP#/ACC pin, the device reverts to whether the first or last sector was previously set to be
protected or unprotected. Note that WP# has an internal pull-up; when unconnected, WP# is at VIH.
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7.21 Hardware Data Protection
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The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent
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writes (refer to Table on page 54 and Table on page 57 for command definitions). In addition, the following hardware data
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protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals
during VCC power-up and power-down transitions, or from system noise.
en
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When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down.
The command register and all internal program/erase circuits are disabled, and the device resets to the read mode. Subsequent
writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent
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Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.
independent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors
can standardize their existing interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h, any time the device
is ready to read array data. The system can read CFI information at the addresses given in Table , Table on page 41, and Table
on page 42. To terminate reading CFI data, the system must write the reset command.
The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query
mode, and the system can read CFI data at the addresses given in Table , Table , Table , and Table on page 42. The system must
write the reset command to return the device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100, available via the World Wide Web at http://
www.amd.com/flash/cfi. Alternatively, contact your sales representative for copies of these documents.
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10h 20h 0051h
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11h 22h 0052h Query Unique ASCII string “QRY”
12h 24h 0059h
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13h 26h 0002h
Primary OEM Command Set
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14h 28h 0000h
15h 2Ah 0040h
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Address for Primary Extended Table
16h 2Ch 0000h
17h 2Eh 0000h
Alternate OEM Command Set (00h = none exists)
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18h 30h 0000h
19h 32h 0000h
Address for Alternate OEM Extended Table (00h = none exists)
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1Ah 34h 0000h
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1Dh 3Ah 0000h VPP Min. voltage (00h = no VPP pin present)
1Eh 3Ch 0000h VPP Max. voltage (00h = no VPP pin present)
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20h 40h 0007h Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h 42h 000Ah Typical timeout per individual block erase 2N ms
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22h 44h 0000h Typical timeout for full chip erase 2N ms (00h = not supported)
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23h 46h 0003h Max. timeout for byte/word write 2N times typical
24h 48h 0005h Max. timeout for buffer write 2N times typical
25h 4Ah 0004h Max. timeout per individual block erase 2N times typical
26h 4Ch 0000h Max. timeout for full chip erase 2N times typical (00h = not supported)
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30h 60h 000xh
007Fh, 0000h, 0000h, 0002h = 128 Mb
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31h 62h 0000h
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32h 64h 0000h
Erase Block Region 2 Information (refer to CFI publication 100)
33h 66h 0000h
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34h 68h 0000h
35h 6Ah 0000h
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36h 6Ch 0000h
Erase Block Region 3 Information (refer to CFI publication 100)
37h 6Eh 0000h
38h 70h 0000h
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39h 72h 0000h
3Ah 74h 0000h
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Erase Block Region 4 Information (refer to CFI publication 100)
3Bh 76h 0000h
3Ch 78h 0000h
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Erase Suspend
46h 8Ch 0002h
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9. Command Definitions
Writing specific address and data commands or sequences into the command register initiates device operations. Table on page 54
and Table on page 57 define the valid register command sequences. Writing incorrect address and data values or writing them in
the improper sequence may place the device in an unknown state. A reset command is then required to return the device to reading
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array data.
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All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE#
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or CE#, whichever happens first. Refer to the AC Characteristics section for timing diagrams.
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9.1 Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device
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is ready to read array data after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the device enters the erase-suspend-read mode, after which the system can
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read data from any non-erase-suspended sector. After completing a programming operation in the Erase Suspend mode, the
system may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for
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more information.
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The system must issue the reset command to return the device to the read (or erase-suspend-read) mode if DQ5 goes high during
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an active program or erase operation, or if the device is in the autoselect mode. See the next section, Reset Command, for more
information.
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See also Requirements for Reading Array Data on page 10 for more information. The Read-Only Operations subsection in the AC
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Characteristics on page 68 section provides the read parameters, and Figure 15.1 on page 68 shows the timing diagram.
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Writing the reset command resets the device to the read or erase-suspend-read mode. Address bits are don’t cares for this
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command.
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The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This
resets the device to the read mode. Once erasure begins, however, the device ignores reset commands until the operation is
complete.
The reset command may be written between the sequence cycles in a program command sequence before programming begins.
This resets the device to the read mode. If the program command sequence is written while the device is in the Erase Suspend
mode, writing the reset command returns the device to the erase-suspend-read mode. Once programming begins, however, the
device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect
mode, the reset command must be written to return to the read mode. If the device entered the autoselect mode while in the Erase
Suspend mode, writing the reset command returns the device to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation, writing the reset command returns the device to the read mode (or erase-
suspend-read mode if the device was in Erase Suspend).
Note that if DQ1 goes high during a Write Buffer Programming operation, the system must write the Write-to-Buffer-Abort Reset
command sequence to reset the device for the next operation.
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The system must write the reset command to return to the read mode (or erase-suspend-read mode if the device was previously in
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Erase Suspend).
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9.4 Enter Secured Silicon Sector/Exit Secured Silicon
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Sector Command Sequence rN
The Secured Silicon Sector region provides a secured data area containing an 8-word/16-byte random Electronic Serial Number
(ESN). The system can access the Secured Silicon Sector region by issuing the three-cycle Enter Secured Silicon Sector command
sequence. The device continues to access the Secured Silicon Sector region until the system issues the four-cycle Exit Secured
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Silicon Sector command sequence. The Exit Secured Silicon Sector command sequence returns the device to normal operation.
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Table on page 54 shows the address and data requirements for both command sequences. See also “Secured Silicon Sector Flash
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Memory Region” for further information. Note that the ACC function and unlock bypass modes are not available when the Secured
Silicon Sector is enabled.
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Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed
by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program
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algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated
program pulses and verifies the programmed cell margin. Table on page 54 and Table on page 57 show the address and data
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When the Embedded Program algorithm is complete, the device then returns to the read mode and addresses are no longer latched.
The system can determine the status of the program operation by using DQ7 or DQ6. Refer to the Write Operation Status section for
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Write Buffer Programming allows the system write to a maximum of 16 words/32 bytes in one programming operation. This results in
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faster effective programming time than the standard programming algorithms. The Write Buffer Programming command sequence is
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initiated by first writing two unlock cycles. This is followed by a third write cycle containing the Write Buffer Load command written at
the Sector Address in which programming occurs. The fourth cycle writes the sector address and the number of word locations,
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minus one, to be programmed. For example, if the system programs six unique address locations, then 05h should be written to the
device. This tells the device how many write buffer addresses are loaded with data and therefore when to expect the Program Buffer
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to Flash command. The number of locations to program cannot exceed the size of the write buffer or the operation aborts.
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The fifth cycle writes the first address location and data to be programmed. The write-buffer-page is selected by address bits AMAX–
A4. All subsequent address/data pairs must fall within the selected-write-buffer-page. The system then writes the remaining address/
data pairs into the write buffer. Write buffer locations may be loaded in any order.
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The write-buffer-page address must be the same for all address/data pairs loaded into the write buffer. (This means Write Buffer
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Programming cannot be performed across multiple write-buffer pages. This also means that Write Buffer Programming cannot be
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performed across multiple sectors. If the system attempts to load programming data outside of the selected write-buffer page, the
operation aborts.)
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Note that if a Write Buffer address location is loaded multiple times, the address/data pair counter is decremented for every data
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load operation. The host system must therefore account for loading a write-buffer location more than once. The counter decrements
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for each data load operation, not for each unique write-buffer-address location. Note also that if an address location is loaded more
than once into the buffer, the final data loaded for that address is programmed.
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Once the specified number of write buffer locations have been loaded, the system must then write the Program Buffer to Flash
command at the sector address. Any other address and data combination aborts the Write Buffer Programming operation. The
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device then begins programming. Data polling should be used while monitoring the last address location loaded into the write buffer.
DQ7, DQ6, DQ5, and DQ1 should be monitored to determine the device status during Write Buffer Programming.
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The write-buffer programming operation can be suspended using the standard program suspend/resume commands. Upon
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successful completion of the Write Buffer Programming operation, the device is ready to execute the next command.
The Write Buffer Programming Sequence can be aborted in the following ways:
Load a value that is greater than the page buffer size during the Number of Locations to Program step.
Write to an address in a sector different than the one specified during the Write-Buffer-Load command.
Write an Address/Data pair to a different write-buffer-page than the one selected by the Starting Address during the write buffer
data loading stage of the operation.
Write data other than the Confirm Command after the specified number of data load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 = DATA# (for the last address location loaded), DQ6 = toggle, and DQ5=0. A
Write-to-Buffer-Abort Reset command sequence must be written to reset the device for the next operation.
Write buffer programming is allowed in any sequence. Note that the Secured Silicon sector, autoselect, and CFI functions are
unavailable when a program operation is in progress. This flash device is capable of handling multiple write buffer programming
operations on the same write buffer address range without intervening erases. Any bit in a write buffer address range cannot be
programmed from 0 back to a 1. Attempting to do so may cause the device to set DQ5 = 1, or cause the DQ7 and DQ6 status bits
to indicate the operation was successful. However, a succeeding read shows that the data is still 0. Only erase operations can
convert a 0 to a 1.
n
ig
es
D
ew
rN
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d
de
en
m
om
ec
R
ot
N
Yes
WC = 0 ?
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No Write to a different
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sector address
Abort Write to Yes
es
Buffer Operation?
Write to buffer ABORTED.
Must write “Write-to-buffer
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No
Abort Reset” command
(Note 1) Write next address/data pair sequence to return
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to read mode.
WC = WC - 1 rN
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Write program buffer to
flash sector address
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Yes
DQ7 = Data?
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No No
No
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DQ1 = 1? DQ5 = 1?
ot
Yes Yes
N
Yes
(Note 2) DQ7 = Data?
No
Notes
1. When Sector Address is specified, any address in the selected sector is acceptable. However, when loading Write-Buffer address locations with data, all addresses
must fall within the selected Write-Buffer Page.
2. DQ7 may change simultaneously with DQ5. Therefore, DQ7 should be verified.
3. If this flowchart location was reached because DQ5= 1, then the device FAILED. If this flowchart location was reached because DQ1= 1, then the Write to Buffer
operation was ABORTED. In either case, the proper reset command must be written before the device can begin another operation. If DQ1=1, write the Write-Buffer-
Programming-Abort-Reset command. if DQ5=1, write the Reset command.
4. See Table on page 54 and Table on page 57 for command sequences required for write buffer programming.
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
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Verify Data?
No
es
Yes
D
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No
Increment Address Last Address?
rN
Yes
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Programming
Completed
d
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Note
See Table on page 54 and Table on page 57 for program command sequence.
en
m
The Program Suspend command allows the system to interrupt a programming operation or a Write to Buffer programming
operation so that data can be read from any non-suspended sector. When the Program Suspend command is written during a
programming process, the device halts the program operation within 15 µs maximum (5µs typical) and updates the status bits.
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Addresses are not required when writing the Program Suspend command.
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After the programming operation is suspended, the system can read array data from any non-suspended sector. The Program
Suspend command may also be issued during a programming operation while an erase is suspended. In this case, data may be
ot
read from any addresses not in Erase Suspend or Program Suspend. If a read is needed from the Secured Silicon Sector area
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(One-time Program area), then user must use the proper command sequences to enter and exit this region. Note that the Secured
Silicon Sector autoselect, and CFI functions are unavailable when program operation is in progress.
The system may also write the autoselect command sequence when the device is in the Program Suspend mode. The system can
read as many autoselect codes as required. When the device exits the autoselect mode, the device reverts to the Program Suspend
mode, and is ready for another valid operation. See Autoselect Command Sequence on page 44 for more information.
After the Program Resume command is written, the device reverts to programming. The system can determine the status of the
program operation using the DQ7 or DQ6 status bits, just as in the standard program operation. See Write Operation Status
on page 59 for more information.
The system must write the Program Resume command (address bits are don’t care) to exit the Program Suspend mode and
continue the programming operation. Further writes of the Resume command are ignored. Another Program Suspend command can
be written after the device has resume programming.
Program Operation
or Write-to-Buffer
Sequence in Progress
n
required
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Data cannot be read from erase- or
program-suspended sectors
es
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No Done
reading?
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Yes rN
Write Program Resume
Write address/data Command Sequence
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XXXh/30h
d
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Device reverts to
operation prior to
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Program Suspend
m
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set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the
Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm
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automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not
required to provide any controls or timings during these operations. Table on page 54 and Table on page 57 show the address and
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When the Embedded Erase algorithm is complete, the device returns to the read mode and addresses are no longer latched. The
system can determine the status of the erase operation by using DQ7, DQ6, or DQ2. Refer to Write Operation Status on page 59 for
information on these status bits.
Any commands written during the chip erase operation are ignored, including erase suspend commands. However, note that a
hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be reinitiated
once the device has returned to reading array data, to ensure data integrity.
Figure 9.4 on page 50 illustrates the algorithm for the erase operation. Note that the Secured Silicon Sector, autoselect, and CFI
functions are unavailable when an erase operation in is progress. Refer to Erase and Program Operations on page 71 for
parameters, and Figure 15.6 on page 73 for timing diagrams.
n
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Suspend during the time-out period resets the device to the read mode. Note that the Secured Silicon Sector, autoselect,
and CFI functions are unavailable when an erase operation in is progress. The system must rewrite the command sequence
es
and any additional addresses and commands.
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The system can monitor DQ3 to determine if the sector erase timer has timed out (See DQ3: Sector Erase Timer on page 63.). The
time-out begins from the rising edge of the final WE# pulse in the command sequence.
ew
When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched.
rN
The system can determine the status of the erase operation by reading DQ7, DQ6, or DQ2 in the erasing sector. Refer to the Write
Operation Status section for information on these status bits.
fo
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However,
note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should
d
be reinitiated once the device has returned to reading array data, to ensure data integrity.
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Figure 9.4 illustrates the algorithm for the erase operation. Refer to Erase and Program Operations on page 71 for parameters, and
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START
R
Write Erase
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Command Sequence
(Notes 1, 2)
N
Yes
Erasure Completed
Notes
1. See Table on page 54 and Table on page 57 for program command sequence.
2. See the section on DQ3 for information on the sector erase timer.
n
After an erase-suspended program operation is complete, the device returns to the erase-suspend-read mode. The system can
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determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard word program operation.
es
Refer to Write Operation Status on page 59 for more information.
In the erase-suspend-read mode, the system can also issue the autoselect command sequence. Refer to the Autoselect Mode
D
on page 34 section and Autoselect Command Sequence on page 44 for details.
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To resume the sector erase operation, the system must write the Erase Resume command. The address of the erase-suspended
sector is required when writing this command. Further writes of the Resume command are ignored. Another Erase Suspend
rN
command can be written after the chip has resumed erasing. It is important to allow an interval of at least 5 ms between Erase
Resume and Erase Suspend.
fo
d
The Lock Register Command Set permits the user to one-time program the Secured Silicon Sector Protection Bit, Persistent
en
Protection Mode Lock Bit, and Password Protection Mode Lock Bit. The Lock Register bits are all readable after an initial access
delay.
m
The Lock Register Command Set Entry command sequence must be issued prior to any of the following commands listed, to
om
The Lock Register Command Set Exit command must be issued after the execution of the commands to reset the device to read
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mode. Otherwise the device hangs. If this happens, the flash device must be reset. Please refer to RESET# for more information. It
is important to note that the device is in either Persistent Protection mode or Password Protection mode depending on the mode
selected prior to the device hang.
For either the Secured Silicon Sector to be locked, or the device to be permanently set to the Persistent Protection Mode or the
Password Protection Mode, the associated Lock Register bits must be programmed. Note that only the Persistent Protection Mode
Lock Bit or the Password Protection Mode Lock Bit can be programmed. The Lock Register Program operation aborts if there is an
attempt to program both the Persistent Protection Mode and the Password Protection Mode Lock bits.
The Lock Register Command Set Exit command must be initiated to re-enable reads and writes to the main memory.
n
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Once the Password is written and verified, the Password Protection Mode Lock Bit in the Lock Register must be programmed in
order to prevent verification. The Password Program command is only capable of programming 0s. Programming a 1 after a cell is
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programmed as a 0 results in a time-out by the Embedded Program AlgorithmTM with the cell remaining as a 0. The password is all
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F’s when shipped from the factory. All 64-bit password combinations are valid as a password.
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The Password Read command is used to verify the Password. The Password is verifiable only when the Password Protection Mode
Lock Bit in the Lock Register is not programmed. If the Password Protection Mode Lock Bit in the Lock Register is programmed and
the user attempts to read the Password, the device always drives all F’s onto the DQ data bus.
rN
The lower two address bits (A1–A0) for word mode and (A1–A-1) for by byte mode are valid during the Password Read, Password
fo
Program, and Password Unlock commands. Writing a 1 to any other address bits (AMAX-A2) aborts the Password Read and
Password Program commands.
d
The Password Unlock command is used to clear the PPB Lock Bit to the unfreeze state so that the PPB bits can be modified. The
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exact password must be entered in order for the unlocking function to occur. This 64-bit Password Unlock command sequence takes
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at least 2 µs to process each time to prevent a hacker from running through the all 64-bit combinations in an attempt to correctly
match the password. If another password unlock is issued before the 64-bit password check execution window is completed, the
m
command is ignored. If the wrong address or data is given during password unlock command cycle, the device may enter the write-
to-buffer abort state. In order to exit the write-to-abort state, the write-to-buffer-abort-reset command must be given. Otherwise the
om
device hangs.
The Password Unlock function is accomplished by writing Password Unlock command and data to the device to perform the clearing
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of the PPB Lock Bit to the unfreeze state. The password is 64 bits long. A1 and A0 are used for matching in word mode and A1, A0,
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A-1 in byte mode. Writing the Password Unlock command does not need to be address order specific. An example sequence is
starting with the lower address A1-A0=00, followed by A1-A0=01, A1-A0=10, and A1-A0=11 if the device is configured to operate in
ot
word mode.
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Approximately 2 µs is required for unlocking the device after the valid 64-bit password is given to the device. It is the responsibility of
the microprocessor to keep track of the entering the portions of the 64-bit password with the Password Unlock command, the order,
and when to read the PPB Lock bit to confirm successful password unlock. In order to re-lock the device into the Password
Protection Mode, the PPB Lock Bit Set command can be re-issued.
Note: The Password Protection Command Set Exit command must be issued after the execution of the commands listed previously
to reset the device to read mode. Otherwise the device hangs.
Note: Issuing the Password Protection Command Set Exit command re-enables reads and writes for the main memory.
Note that issuing the Non-Volatile Sector Protection Command Set Entry command disables reads and writes for the main
memory.
PPB Program Command
The PPB Program command is used to program, or set, a given PPB bit. Each PPB bit is individually programmed (but is bulk
erased with the other PPB bits). The specific sector address (A24-A16 for S29GL512N, A23-A16 for S29GL256N, A22-A16 for
S29GL128N) is written at the same time as the program command. If the PPB Lock Bit is set to the freeze state, the PPB
Program command does not execute and the command times-out without programming the PPB bit.
All PPB Erase Command
The All PPB Erase command is used to erase all PPB bits in bulk. There is no means for individually erasing a specific PPB bit.
Unlike the PPB program, no specific sector address is required. However, when the All PPB Erase command is issued, all Sector
PPB bits are erased in parallel. If the PPB Lock Bit is set to freeze state, the ALL PPB Erase command does not execute and the
command times-out without erasing the PPB bits.
The device preprograms all PPB bits prior to erasing when issuing the All PPB Erase command. Also note that the total number
n
of PPB program/erase cycles has the same endurance as the flash memory array.
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PPB Status Read Command
es
The programming state of the PPB for a given sector can be verified by writing a PPB Status Read Command to the device. This
D
requires an initial access time latency.
ew
The Non-Volatile Sector Protection Command Set Exit command must be issued after the execution of the commands listed
previously to reset the device to read mode. rN
Note that issuing the Non-Volatile Sector Protection Command Set Exit command re-enables reads and writes for the main
memory.
fo
d
The Global Volatile Sector Protection Freeze Command Set permits the user to set the PPB Lock Bit and reading the logic state of
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Reads and writes from the main memory are not allowed.
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Password Unlock command was successfully executed. There is no PPB Lock Bit Clear command. Once the PPB Lock Bit is set
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to the freeze state, it cannot be cleared unless the device is taken through a power-on clear (for Persistent Protection Mode) or
the Password Unlock command is executed (for Password Protection Mode). If the Password Protection Mode Lock Bit is
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programmed, the PPB Lock Bit status is reflected as set to the freeze state, even after a power-on reset cycle.
PPB Lock Bit Status Read Command
The programming state of the PPB Lock Bit can be verified by executing a PPB Lock Bit Status Read command to the device.
The Global Volatile Sector Protection Freeze Command Set Exit command must be issued after the execution of the commands
listed previously to reset the device to read mode.
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9.15 Secured Silicon Sector Entry Command
es
The Secured Silicon Sector Entry command allows the following commands to be executed
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Read from Secured Silicon Sector
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Program to Secured Silicon Sector
Once the Secured Silicon Sector Entry Command is issued, the Secured Silicon Sector Exit command has to be issued to exit
rN
Secured Silicon Sector Mode.
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The Secured Silicon Sector Exit command may be issued to exit the Secured Silicon Sector Mode.
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en
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Mode
Cycles
First Second Third Fourth Fifth Sixth
Command Sequence
(Notes) Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Sector Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 SA 30
Erase/Program Suspend (15) 1 XXX B0
Erase/Program Resume (16) 1 XXX 30
Entry 3 555 AA 2AA 55 555 88
Secured
Legend
n
X = Don’t care.
ig
RA = Read Address.
RD = Read Data.
es
PA = Program Address. Addresses latch on the falling edge of WE# or CE# pulse, whichever occurs later.
PD = Program Data. Data latches on the rising edge of WE# or CE# pulse, whichever occurs first.
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SA = Sector Address. Any address that falls within a specified sector. See Tables – for sector address ranges.
WBL = Write Buffer Location. Address must be within the same write buffer page as PA.
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WC = Word Count. Number of write buffer locations to load minus 1.
Notes rN
1. See Table on page 10 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells indicate read cycles.
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4. Address and data bits not specified in table, legend, or notes are don’t cares (each hex digit implies 4 bits of data).
5. Writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. The system must write the reset
d
10. If DQ7 = 1, region is factory serialized and protected. If DQ7 = 0, region is unserialized and unprotected when shipped from factory. See Secured Silicon Sector Flash
om
13. Command sequence resets device for next command after write-to-buffer operation.
14. Requires Entry command sequence prior to execution. Unlock Bypass Reset command is required to return to reading array data.
R
15. System may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only
during a sector erase operation.
ot
16. Erase Resume command is valid only during the Erase Suspend mode.
N
17. Requires Entry command sequence prior to execution. Secured Silicon Sector Exit Reset command is required to exit this mode; device may otherwise be placed in an
unknown state.
Cycles
First Second Third Fourth Fifth Sixth Seventh
Command Sequence Add Add Add
(Notes) Addr Data Addr Data Addr Data Addr Data r Data r Data r Data
Command Set Entry (5) 3 555 AA 2AA 55 555 40
Lock Program (6) 2 XX A0 XXX Data
Register
Bits Read (6) 1 00 Data
Command Set Exit (7) 2 XX 90 XX 00
Command Set Entry (5) 3 555 AA 2AA 55 555 60
Program (8) 2 XX A0 PWAx PWDx
PWD PWD PWD
Password Read (9) 4 XXX 01 PWD1 02 03
0 2 3
n
Protection
ig
PWD PWD PWD PWD
Unlock (10) 7 00 25 00 03 00 01 02 03 00 29
0 1 2 3
es
Command Set Exit (7) 2 XX 90 XX 00
D
Command Set Entry (5) 3 555 AA 2AA 55 555 C0
Non-Volatile PPB Program (11) 2 XX A0 SA 00
ew
Sector
All PPB Erase (11, 12) 2 XX 80 00 30
Protection
(PPB) PPB Status Read 1 SA RD(0)
rN
Command Set Exit (7) 2 XX 90 XX 00
fo
Global Command Set Entry (5) 3 555 AA 2AA 55 555 50
Volatile Sector PPB Lock Bit Set 2 XX A0 XX 00
d
Protection
Freeze PPB Lock Bit Status Read 1 XXX RD(0)
de
(DYB)
DYB Status Read 1 SA RD(0)
Command Set Exit (7) 2 XX 90 XX 00
ec
Legend
X = Don’t care.
R
SA = Sector Address. Any address that falls within a specified sector. See Tables – for sector address ranges.
PWA = Password Address. Address bits A1 and A0 are used to select each 16-bit portion of the 64-bit entity.
N
Cycles
First Second Third Fourth Fifth Sixth
Command Sequence
(Notes) Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Asynchronous Read (6) 1 RA RD
Reset (7) 1 XXX F0
Manufacturer ID 4 AAA AA 555 55 AAA 90 X00 01
Device ID (8) 6 AAA AA 555 55 AAA 90 X02 XX7E X1C Data X1E Data
select
Auto-
n
Write to Buffer (12) 6 AAA AA 555 55 PA 25 SA WC PA PD WBL PD
ig
Program Buffer to Flash 1 SA 29
es
Write to Buffer Abort Reset (13) 3 AAA AA PA 55 555 F0
D
Entry 3 AAA AA 555 55 AAA 20
Program (14) 2 XXX A0 PA PD
ew
Bypass
Unlock
Mode
Legend
ec
X = Don’t care.
RA = Read Address.
R
RD = Read Data.
PA = Program Address. Addresses latch on the falling edge of WE# or CE# pulse, whichever occurs later.
ot
PD = Program Data. Data latches on the rising edge of WE# or CE# pulse, whichever occurs first.
N
SA = Sector Address. Any address that falls within a specified sector. See Tables – for sector address ranges.
WBL = Write Buffer Location. Address must be within the same write buffer page as PA.
WC = Word Count. Number of write buffer locations to load minus 1.
Notes
1. See Table on page 10 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells indicate read cycles.
4. Address and data bits not specified in table, legend, or notes are don’t cares (each hex digit implies 4 bits of data).
5. Writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. The system must write the reset
command to return reading array data.
6. No unlock or command cycles required when bank is reading array data.
7. Reset command is required to return to reading array data in certain cases. See Reset Command on page 43 for details.
8. Data in cycles 5 and 6 are listed in Table on page 34.
9. The data is 00h for an unprotected sector and 01h for a protected sector. PPB Status Read provides the same data but in inverted form.
10. If DQ7 = 1, region is factory serialized and protected. If DQ7 = 0, region is unserialized and unprotected when shipped from factory. See Secured Silicon Sector Flash
Memory Region on page 39 for more information.
11. Command is valid when device is ready to read array data or when device is in autoselect mode.
12. Total number of cycles in the command sequence is determined by the number of words written to the write buffer.
13. Command sequence resets device for next command after write-to-buffer operation.
14. Requires Entry command sequence prior to execution. Unlock Bypass Reset command is required to return to reading array data.
15. System may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only
during a sector erase operation.
16. Erase Resume command is valid only during the Erase Suspend mode.
17. Requires Entry command sequence prior to execution. Secured Silicon Sector Exit Reset command is required to exit this mode; device may otherwise be placed in an
unknown state.
n
ig
Command Set Entry (5) 3 AAA AA 555 55 AAA 60
es
Program (8) 2 XXX A0 PWAx PWDx
PWD PWD PWD PWD PWD PWD
00 01 PWD1 02 03 04 05 06
D
0 2 3 4 5 6
Read (9) 8
PWD
ew
Password 07
7
Protection
rN PWD PWD PWD PWD PWD
00 25 00 03 00 01 02 03 04
1 0 1 2 3 4
Unlock (10)
1 PWD PWD
05 06 PWD6 07 00 29
fo
5 7
Command Set Exit (7) 2 XX 90 XX 00
d
(PPB Lock)
Command Set Exit (7) 2 XXX 90 XX 00
ot
Legend
X = Don’t care.
RA = Address of the memory location to be read.
SA = Sector Address. Any address that falls within a specified sector. See Tables – for sector address ranges.
PWA = Password Address. Address bits A1 and A0 are used to select each 16-bit portion of the 64-bit entity.
PWD = Password Data.
RD(0) = DQ0 protection indicator bit. If protected, DQ0 = 0. If unprotected, DQ0 = 1.
Notes
1. All values are in hexadecimal.
2. Shaded cells indicate read cycles.
3. Address and data bits not specified in table, legend, or notes are don’t cares (each hex digit implies 4 bits of data).
4. Writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. The system must write the reset
command to return the device to reading array data.
5. Entry commands are required to enter a specific mode to enable instructions only available within that mode.
n
ig
10.1 DQ7: Data# Polling
es
The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or
D
completed, or whether the device is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the
command sequence.
ew
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7
status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs
rN
the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program
address falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then the device returns to the read
fo
mode.
d
During the Embedded Erase algorithm, Data# Polling produces a 0 on DQ7. When the Embedded Erase algorithm is complete, or if
de
the device enters the Erase Suspend mode, Data# Polling produces a 1 on DQ7. The system must provide an address within any of
the sectors selected for erasure to read valid status information on DQ7.
en
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on DQ7 is active for
m
approximately 100 µs, then the device returns to the read mode. If not all selected sectors are protected, the Embedded Erase
algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at
om
Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid data on DQ7.
R
Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the
program or erase operation and DQ7 has valid data, the data outputs on DQ0–DQ6 may be still invalid. Valid data on DQ0–DQ7
ot
Table on page 63 shows the outputs for Data# Polling on DQ7. Figure 10.1 on page 60 shows the Data# Polling algorithm.
Figure 15.4 on page 72 shows the Data# Polling timing diagram.
START
Read DQ15–DQ0
Addr = VA
No
n
No
DQ5 = 1
ig
es
Yes
D
Read DQ15–DQ0
ew
Addr = VA
rN
Yes
DQ7 = Data?
fo
d
No
de
FAIL PASS
en
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid
m
2. DQ7 should be rechecked even if DQ5 = 1 because DQ7 may change simultaneously with DQ5.
ec
The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The
RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output,
ot
several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC.
N
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.)
If the output is high (Ready), the device is in the read mode, the standby mode, or in the erase-suspend-read mode. Table
on page 63 shows the outputs for RY/BY#.
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the
device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase
Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-
suspended. Alternatively, the system can use DQ7 (see the subsection on DQ7: Data# Polling).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is
written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete.
Table on page 63 shows the outputs for Toggle Bit I on DQ6. Figure 10.2 shows the toggle bit algorithm. Figure 15.8 on page 74
shows the toggle bit timing diagrams. Figure 15.9 on page 74 shows the differences between DQ2 and DQ6 in graphical form. See
also DQ2: Toggle Bit II on page 62.
n
ig
START
es
D
Read DQ7–DQ0
ew
Read DQ7–DQ0
rN
fo
Toggle Bit No
d
= Toggle?
de
Yes
en
m
No DQ5 = 1?
om
Yes
ec
R
Read DQ7–DQ0
Twice
ot
N
Toggle Bit No
= Toggle?
Yes
Program/Erase
Operation Not Program/Erase
Complete, Write Operation Complete
Reset Command
Note
The system should recheck the toggle bit even if DQ5 = 1 because the toggle bit may stop toggling as DQ5 changes to 1. See the subsections on DQ6 and DQ2 for more
information.
n
ig
es
10.5 Reading Toggle Bits DQ6/DQ2
Refer to Figure 10.2 on page 61 and Figure 15.9 on page 74 for the following discussion. Whenever the system initially begins
D
reading toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the
ew
system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new
value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The
system can read array data on DQ7–DQ0 on the following read cycle.
rN
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note
fo
whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again whether the toggle bit is
toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has
d
successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully,
de
and the system must write the reset command to return to reading array data.
en
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system
may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous
m
paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the operation (top of Figure 10.2 on page 61).
om
ec
DQ5 indicates whether the program, erase, or write-to-buffer time has exceeded a specified internal pulse count limit. Under these
conditions DQ5 produces a 1, indicating that the program or erase cycle was not successfully completed.
ot
The device may output a 1 on DQ5 if the system tries to program a 1 to a location that was previously programmed to 0. Only an
N
erase operation can change a 0 back to a 1. Under this condition, the device halts the operation, and when the timing limit is
exceeded, DQ5 produces a 1.
In all these cases, the system must write the reset command to return the device to the reading the array (or to erase-suspend-read
if the device was previously in the erase-suspend-program mode).
n
ig
10.8 DQ1: Write-to-Buffer Abort
es
DQ1 indicates whether a Write-to-Buffer operation was aborted. Under these conditions DQ1 produces a 1. The system must issue
D
the Write-to-Buffer-Abort-Reset command sequence to return the device to reading array data. See Write Buffer on page 11 for
more details.
ew
Write Operation Status rN
DQ7 DQ5 DQ2
Status (Note 2) DQ6 (Note 1) DQ3 (Note 2) DQ1 RY/BY#
fo
Program-Suspended
Program Program- Invalid (not allowed) 1
Sector
Suspend Suspend
en
Erase-Suspended
Erase- 1 No toggle 0 N/A Toggle N/A 1
om
Sector
Erase Suspend
Read Non-Erase Suspended
Suspend Data 1
Sector
ec
Mode
Erase-Suspend-Program
DQ7# Toggle 0 N/A N/A N/A 0
(Embedded Program)
R
Notes
1. DQ5 switches to 1 when an Embedded Program, Embedded Erase, or Write-to-Buffer operation has exceeded the maximum timing limits. Refer to the section on DQ5
for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
3. The Data# Polling algorithm should be used to monitor the last loaded write-buffer address location.
4. DQ1 switches to 1 when the device has aborted the write-to-buffer operation
Notes
1. Minimum DC voltage on input or I/Os is –0.5 V. During voltage transitions, inputs or I/Os may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 11.1.
Maximum DC voltage on input or I/Os is VCC + 0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC + 2.0 V for periods up to 20 ns. See
Figure 11.2.
n
ig
2. Minimum DC input voltage on pins A9 and ACC is –0.5 V. During voltage transitions, A9 and ACC may overshoot VSS to –2.0 V for periods of up to 20 ns. See
Figure 11.1. Maximum DC input voltage on pin A9 and ACC is +12.5 V which may overshoot to +14.0V for periods up to 20 ns.
es
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
4. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
D
device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum
rating conditions for extended periods may affect device reliability.
ew
Figure 11.1 Maximum Negative Overshoot Waveform
rN
20 ns 20 ns
fo
+0.8 V
d
de
–0.5 V
en
–2.0 V
m
20 ns
om
20 ns
R
VCC
ot
+2.0 V
N
VCC
+0.5 V
2.0 V
20 ns 20 ns
Supply Voltages
VCC +2.7 V to +3.6 V or +3.0 V to 3.6 V
VIO (Note 2) +1.65 V to 1.95 V or VCC
Notes
1. Operating ranges define those limits between which the functionality of the device is guaranteed.
2. See Product Selector Guide on page 4.
13. DC Characteristics
n
ig
es
13.1 CMOS Compatible
D
Parameter Parameter Description
Symbol (Notes) Test Conditions Min Typ Max Unit
ew
VIN = VSS to VCC, WP/ACC: ±2.0
ILI Input Load Current (1) µA
VCC = VCC max rN Others: ±1.0
ILIT A9 Input Load Current VCC = VCC max; A9 = 12.5 V 35 µA
ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC max ±1.0 µA
fo
f = 10 MHz
ICC2 VCC Intra-Page Read Current (1) mA
CE# = VIL, OE# = VIH, VCC = VCCmax;
5 20
f=33 MHz
ec
(2, 3)
VCC = VCCmax; VIO = VCC; OE# = VIH;
ot
Notes
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH.
2. ICC active while Embedded Erase or Embedded Program or Write Buffer Programming is in progress.
3. Not 100% tested.
4. Automatic sleep mode enables the lower power mode when addresses remain stable tor tACC + 30 ns.
5. VIO = 1.65–1.95 V or 2.7–3.6 V
6. VCC = 3 V and VIO = 3V or 1.8V. When VIO is at 1.8V, I/O pins cannot operate at 3V.
n
ig
14. Test Conditions
es
Figure 14.1 Test Setup
D
3.3 V
ew
rN 2.7 k
Device
Under
fo
Test
d
CL 6.2 k
de
en
m
om
Note
ec
Test Specifications
N
Note
If VIO < VCC, the reference level is 0.5 VIO.
Steady
Changing from H to L
Changing from L to H
n
ig
Figure 14.2 Input Waveforms and Measurement Levels
es
VIO
Input 0.5 VIO Measurement Level 0.5 VIO V Output
D
0.0 V
ew
Note
If VIO < VCC, the input measurement reference level is 0.5 VIO.
rN
fo
d
de
en
m
om
ec
R
ot
N
15. AC Characteristics
n
VIO = 1.8 V, VCC = 3 V 110
ig
tPACC Page Access Time Max 25 25 25 30 ns
es
tGLQV tOE Output Enable to Output Delay Max 25 25 35 35 ns
tEHQZ tDF Chip Enable to Output High Z (Note 1) Max 20 ns
D
tGHQZ tDF Output Enable to Output High Z (Note 1) Max 20 ns
ew
Output Hold Time From Addresses, CE# or
tAXQX tOH Min 0 ns
OE#, Whichever Occurs First
Notes
de
3. OE# = VIL
4. See Figure 14.1 on page 66 and Table on page 66 for test specifications.
m
5. Unless otherwise indicated, AC specifications for 90 ns, 100 ns, and 110 ns speed options are tested with VIO = VCC = 3 V. AC specifications for 110 ns speed options
om
tRC
ot
tACC
CE# tCEH
tRH
tRH tDF
tOE
OE#
tOEH
WE# tCE
tOH
HIGH Z HIGH Z
Outputs Output Valid
RESET#
RY/BY#
0V
A2-A0* Aa Ab Ac Ad
tPACC tPACC tPACC
tACC
Data Bus Qa Qb Qc Qd
CE#
OE#
Note
n
* Figure shows word mode. Addresses are A2–A-1 for byte mode.
ig
es
15.2 Hardware Reset (RESET#)
D
Parameter
ew
JEDEC Std. Description Speed (Note 2) Unit
RESET# Pin Low (During Embedded Algorithms) to
tReady Max 20 ns
Read Mode (Note 1)
rN
RESET# Pin Low (NOT During Embedded Algorithms)
tReady Max 500 ns
fo
to Read Mode (Note 1)
tRP RESET# Pulse Width Min 500 ns
d
Notes
m
1. Not 100% tested. If ramp rate is equal to or faster than 1V/100µs with a falling edge of the RESET# pin initiated, the RESET# pin needs to be held low only for 100µs
om
for power-up.
2. Next generation devices may have different reset speeds. To increase system design considerations, please refer to Advance Information on S29GL-P Hardware
Reset (RESET#) and Power-up Sequence on page 80 for advance reset speeds on S29GL-P devices.
ec
R
ot
N
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady
n
Reset Timings during Embedded Algorithms
ig
tReady
es
RY/BY#
D
tRB
ew
CE#, OE#
rN
RESET#
fo
tRP tRH
d
de
en
m
om
ec
R
ot
N
n
tCEPH CE# High during toggle bit polling Min 20
ig
tOEPH Output Enable High during toggle bit polling Min 20 ns
es
Read Recovery Time Before Write
tGHWL tGHWL Min 0 ns
(OE# High to WE# Low)
D
tELWL tCS CE# Setup Time Min 0 ns
ew
tWHEH tCH CE# Hold Time Min 0 ns
tWLWH tWP Write Pulse Width Min rN 35 ns
tWHDL tWPH Write Pulse Width High Min 30 ns
Write Buffer Program Operation (Notes 2, 3) Typ 240 µs
fo
Word Typ 54 µs
(Note 2)
om
Notes
ot
tWC tAS
Addresses 555h PA PA PA
tAH
CE#
tCH
OE#
tWP tWHWH1
WE#
tWPH
tCS
n
tDS
ig
tDH
es
Data A0h PD Status DOUT
D
tBUSY tRB
ew
RY/BY#
VCC
rN
tVCS
fo
Notes
1. PA = program address, PD = program data, DOUT is the true data at the program address.
d
VHH
om
ec
tVHH tVHH
Notes
ot
3. OE# = VIL
4. See Figure 14.1 on page 66 and Table on page 66 for test specifications.
tWC tAS
Addresses 2AAh SA VA VA
555h for chip erase
tAH
CE#
OE# tCH
tWP
WE#
tWPH tWHWH2
tCS
tDS
n
tDH
ig
In
Data 55h 30h Progress Complete
es
10 for Chip Erase
tBUSY tRB
D
RY/BY#
ew
tVCS
VCC rN
Notes
fo
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 59).
2. These waveforms are for the word mode.
d
de
tRC
om
Addresses VA VA VA
tACC
ec
tCE
CE#
R
tCH
tOE
ot
OE#
tOEH tDF
N
WE#
tOH
High Z
DQ7 Complement Complement True Valid Data
High Z
DQ6–DQ0 Status Data Status Data True Valid Data
tBUSY
RY/BY#
Notes
1. VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle.
2. tOE for data polling is 45 ns when VIO = 1.65 to 2.7 V and is 35 ns when VIO = 2.7 to 3.6 V.
Addresses
tAHT
tASO
CE#
tCEPH
tOEH
WE#
tOEPH
OE#
tDH
tOE
n
Valid Valid Valid
ig
DQ2 and DQ6 Valid Data Valid Data
Status Status Status
es
(first read) (second read) (stops toggling)
D
RY/BY#
ew
Notes
VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle
rN
fo
Enter
Erase Enter Erase
de
Embedded Erase
Erasing Suspend Suspend Program Resume
en
Program
om
DQ6
ec
R
DQ2
ot
Note
DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6.
N
n
tEHDX tDH Data Hold Time Min 0 ns
ig
tCEPH CE# High during toggle bit polling Min 20 ns
es
tOEPH OE# High during toggle bit polling Min 20 ns
Read Recovery Time Before Write
D
tGHEL tGHEL Min 0 ns
(OE# High to WE# Low)
ew
tWLEL tWS WE# Setup Time Min 0 ns
tEHWH tWH WE# Hold Time Min 0 ns
tELEH tCP CE# Pulse Width Min
rN 35 ns
tEHEL tCPH CE# Pulse Width High Min 30 ns
fo
Write Buffer Program Operation (Notes 2, 3) Typ 240 µs
Effective Write Buffer Program Operation
d
Notes
ec
4. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
N
5. Unless otherwise indicated, AC specifications for 90 ns, 100ns, and 110 ns speed options are tested with VIO = VCC = 3 V. AC specifications for 110 ns speed options
are tested with VIO = 1.8 V and VCC = 3.0 V.
6. 90 ns speed option only applicable to S29GL128N and S29GL256N.
Addresses PA
tWC tAS
tAH
tWH
WE#
tGHEL
OE#
tCP tWHWH1 or 2
n
ig
CE#
tWS tCPH
es
tBUSY
tDS
D
tDH
ew
DQ7# DOUT
Data
tRH A0 for program PD for program rN
55 for erase 30 for sector erase
10 for chip erase
fo
RESET#
d
de
RY/BY#
en
Notes
1. Figure indicates last two bus cycles of a program or erase operation.
m
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
ec
R
ot
N
n
S29GL512N 492
ig
Notes
es
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 10,000 cycles, checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 3.0 V, 100,000 cycles.
D
3. Effective write buffer specification is based upon a 16-word write buffer operation.
4. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure.
ew
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table on page 54 and Table on page 57
for further information on command definitions.
rN
fo
TSOP 8.5 12 pF
COUT Output Capacitance VOUT = 0
om
Notes
R
n
ig
es
D
ew
rN
fo
d
de
en
m
om
ec
NOTES:
PACKAGE TS 56
JEDEC MO-142 (B) EC 1 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
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SYMBOL MIN. NOM. MAX. (DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
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A --- --- 1.20 2 PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A1 0.05 --- 0.15 3 TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
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A2 0.95 1.00 1.05 DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
b1 0.17 0.20 0.23
4 DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
b 0.17 0.22 0.27 MOLD PROTUSION IS 0.15 mm PER SIDE.
c1 0.10 --- 0.16
5 DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
c 0.10 --- 0.21 DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
D 19.80 20.00 20.20 DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
D1 18.30 18.40 18.50
6 THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
E 13.90 14.00 14.10 0.10 mm AND 0.25 mm FROM THE LEAD TIP.
e 0.50 BASIC
7 LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
L 0.50 0.60 0.70 SEATING PLANE.
O 0˚ - 8˚ 8 DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
R 0.08 --- 0.20
N 56
3160\38.10A
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NOTES:
PACKAGE LAA 064
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A --- --- 1.40 PROFILE HEIGHT 5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
A1 0.40 --- --- STANDOFF "D" DIRECTION.
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A2 0.60 --- --- BODY THICKNESS SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
D 13.00 BSC. BODY SIZE
N IS THE TOTAL NUMBER OF SOLDER BALLS.
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E1 7.00 BSC. MATRIX FOOTPRINT 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
MD 8 MATRIX SIZE D DIRECTION A AND B AND DEFINE THE POSITION OF THE CENTER
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3354 \ 16-038.12d
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tRB RY/BY# Recovery Time Min 0 ns
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Note
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CE#, OE# and WE# must be at logic high during Reset Time.
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Figure 19.1 Reset Timings
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RY/BY#
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CE#, OE#
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tRH
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RESET#
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tRP
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tReady
tReady
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RY/BY#
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tRB
CE#, OE#
RESET#
tRP tRH
Notes
1. VIO < VCC + 200 mV.
2. VIO and VCC ramp must be in sync during power up. If RESET# is not stable for 35 µs, the following conditions may occur: the device does not permit any read and
write operations, valid read operations return FFh, and a hardware reset is required.
3. Maximum VCC power up current is 20 mA (RESET# =VIL).
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Figure 19.2 Power-On Reset Timings
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Vcc_min
VCC
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Vio_min
VIO
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t RH
CE# rN
t VIOS
t VCS
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RESET#
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Note
CE#, OE# and WE# must be at logic high during Reset Time.
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Figure 20.1 Reset Timings
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tRP
RESET#
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tRH
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tRPH
CE#
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Note
The sum of tRP and tRH must be equal to or greater than tRPH.
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tRH Time between RESET# (high) and CE# (low) Min 200 ns
Notes
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2. VIO and VCC ramp must be in sync during power-up. If RESET# is not stable for 300 µs, the following conditions may occur: the device does not permit any read and
write operations, valid read operations return FFh, and a hardware reset is required.
3. Maximum VCC power up current is 20 mA (RESET# =VIL).
VCC
V IO
t VIOS
t VCS
t RP
RESET#
t RH
t RPH
CE#
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Note
The sum of tRP and tRH must be equal to or greater than tRPH.
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Added RTSOP to Package Options.
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Distinctive Characteristics, Software and Hardware Features
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Clarified Password Sector Protection to Advanced Sector Protection
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Connection Diagrams
Removed Note.
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Ordering Information
Modified Package codes
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Device Bus Operations, Table 1
Modified Table, removed Note.
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Sector Protection
Lock Register: Corrected text to reflect 3 bits instead of 4.
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(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 01/22/2004 A2:Lock Register
Corrected and added new text for Secured Silicon Sector Protection Bit,
Persistent Protection Mode Lock Bit,
and Password Protection Mode Lock Bit.
Persistent Sector Protection
Persistent Protection Bit (PPB): Added the second paragraph text about
programming the PPB bit.
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Persistent Protection Bit Lock (PPB Lock Bit): Added the second paragraph
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text about configuring the PPB
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Lock Bit, and fourth paragraph on Autoselect Sector Protection Verification.
Added PPB Lock Bit requirement of 200ns access time.
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Password Sector Protection
Corrected 1 μs (built-in delay for each password check) to 2 μs.
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Lock Register Command Set Definitions
Added new information for this section.
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Password Protection Command Set Definitions
Added new information for this section.
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Ordering Information
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(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 05/13/2004 A4:Global
Removed references to RTSOP.
Distinctive Characteristics
Removed 16-word/32-byte page read buffer from Performance
Characteristics.
Changed Low power consumption to 25 mA typical active read current and
removed 10 mA typical intrapage
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active read current.
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Ordering Information
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Changed formatting of pages.
Changed model numbers from 00,01,02,03 to 01, 02, V1, V2.
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Table Device Bus Operations
Combined WP# and ACC columns.
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Tables CFI Query Identification String, System Interface String,
Device Geometry
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Definition, and Primary Vendor-Specific Extended Query
Added Address (x8) column.
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(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 05/13/2004 Figure Page Read Timings
Change A1-A0 to A2-A0.
Erase and Program Operations
Updated tWHWH1 and tWHWH2 with values.
Figure Chip/Sector Erase Operation Timings
Changed 5555h to 55h and 3030h to 30h.
Figure Data# Polling Timings (During Embedded Algorithms)
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Removed DQ15 and DQ14-DQ8
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Added Note 2
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Figure Toggle Bit Timings (During Embedded Algorithms)
Changed DQ6 & DQ14/DQ2 & DQ10 to DQ2 and DQ6.
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Alternate CE# Controlled Erase and Program Operations
Updated tWHWH1 and tWHWH2 with values.
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Latchup Characteristics
Removed Table.
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Erase and Programming Performance
Updated TBD with values.
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Physical Dimensions
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Removed 80 ns.
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Operating Ranges
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Updated VIO.
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CMOS Characteristics
Created a family table.
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Read-Only Operations
Created a family table.
Hardware Reset (RESET#)
Created a family table.
Figure 13, “Reset Timings,”
Added tRH to waveform.
Erase and Program Operations
Created a family table.
Alternate CE# Controlled Erase and Program Operations
Created a family table.
Erase and Programming Performance
Created a family table.
(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 01/24/2005 A6:Global
Updated access times for S29GL512N.
Product Selector Guides
All tables updated.
Valid Combinations Tables
All tables updated.
AC Characteristics Read-Only Options Table
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Added note for 90 ns speed options.
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AC Characteristics Erase and Programming Performance Table
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Added note for 90 ns speed options.
Figure Data# Polling Timings (During Embedded Algorithms)
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Updated timing diagram.
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AC Characteristics Alternate CE# Controlled Erase and Program
Operations Table
Added note for 90 ns speed options.
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** - RYSU 02/14/2005 A7:Distinctive Characteristics
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Added Product Availability Table
Ordering Information
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Under Model Numbers, changed VIO voltage values for models V1 and V2.
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Physical Dimensions
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DC Characteristics table
Added VIO = VCC test condition to ICC4, ICC5, ICC6 specifications.
Corrected unit of measure on ICC4 to μA.
Changed maximum specifications for IACC (on ACC pin) and ICC3 to 90
mA.
Tables Memory Array Commands (x16) to Sector Protection
Commands (x8), Memory Array
and Sector Protection (x8 & x16)
Re-formatted command definition tables for easier reference.
Advance Information on S9GL-P AC Characteristics
Changed speed specifications and units of measure for tREADY, tRP, tRH,
and tRPD. Changed specifications on
tREADY from maximum to minimum.
(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 06/15/2005 A9:Ordering Information table
Added note to temperature range.
Valid Combinations table
Replaced table.
DC Characteristics table
Replaced VIL lines for ICC4, ICC5, ICC6.
Connection Diagrams
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Modified 56-Pin Standard TSOP. Modified 64-ball Fortified BGA.
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Advance Information on S9GL-P AC Characteristics
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Added second table.
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(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 04/22/2006 B0:Global
Changed document status to Full Production.
Ordering Information
Changed description of “A” for Package Materials Set. Modified
S29GL128N Valid Combinations table.
S29GL128N Sector Address Table
Corrected bit range values for A22–A16.
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Persistent Protection Bit (PPB)
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Corrected typo in second sentence, second paragraph.
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Secured Silicon Sector Flash Memory Region
Deleted note at end of second paragraph.
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Customer Lockable: Secured Silicon Sector NOT Programmed or
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Protected At the Factory
Modified 1st bullet text.
Write Protect (WP#)
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Modified third paragraph.
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Device Geometry Definition table
Changed 1st x8 address for Erase Block Region 2.
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(Continued)
Document Title:S29GL512N, S29GL256N, S29GL128N
512, 256, 128 Mbit, 3 V, Page Flash Featuring 110 nm MirrorBit
Document Number: 002-01522
Orig. of Submission
Rev. ECN No. Description of Change
Change Date
** - RYSU 01/19/2007 B4:Global
Added obsolescence and migration notice.
Product Selector Guide
Changed manimum VIO for VCC = 2.7–3.6V and VIO = 1.65 V minimum.
** - RYSU 02/06/2007 B5:Global
Revised obsolescence and migration notice.
** - RYSU 11/08/2007 B6:Advance Information on S29GL-R 65nm MirrorBit Hardware Reset
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(RESET#) and Power-up
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Sequence
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Added advanced information
** - RYSU 02/12/2008 B7:Erase And Programming Performance
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Chip Program Time: removed comment
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Advance Information on S29GL-R 65nm MirrorBit Hardware Reset
(RESET#) and Power-up
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Sequence
Power-Up Sequence Timings table: reduced timing from 500 μs to 300 μs
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*B 5074572 RYSU 01/08/2016 Updated the suggested replacement parts in the note in blue font in page 1.
Removed Spansion Revision History
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USB Controllers....................................cypress.com/go/USB
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Wireless/RF .................................... cypress.com/go/wireless
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© Cypress Semiconductor Corporation, 2003-2016. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
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